5M1270ZF256C4N - 980 Macrocell MAX V CPLD, 256-FBGA | Intel
MPN: 5M1270ZF256C4N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $23.62 | $23.62 |
| 10 | $21.2 | $212.00 |
| 100 | $18.85 | $1,885.00 |
| 500 | $16.5 | $8,250.00 |
| 1,000 | $14.95 | $14,950.00 |
Drop-in alternatives for 5M1270ZF256C4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
5M1270ZF256A5N
β Drop-Inβ In Stock
$24.1 / Unit
View Datasheet β5M1270ZF324C5N
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$7.5 / Unit
View Datasheet β5M1270ZF256I7N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
5M570ZF256C5N
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
5M1270ZF256C4N Maximum Ratings & Electrical Characteristics
| Family | MAX V |
| Series | 5M1270Z |
| Device Type | CPLD - Complex Programmable Logic Device |
| Number of Macrocells | 980 |
| Number of Logic Array Blocks (LABs) | 127 |
| Number of User I/Os | 211 |
| Maximum Operating Frequency | 304 MHz |
| Propagation Delay (tPD) | 6.2 ns (max) |
| Supply Voltage - Internal | 1.71 V to 1.89 V (nominal 1.8 V) |
| Programmability | In-System Programmable (ISP) via JTAG |
| Operating Temperature | 0C to +70C (commercial, TJ) |
| Package | 256-FBGA (17 x 17 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
5M1270ZF256C4N 256-fbga (17 x 17 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for 5M1270ZF256C4N (256-fbga (17 x 17 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5M1270ZF256C4N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5M1270ZF256C4N is suitable for 6 applications: I/O Expansion and Voltage-Level Translation, Power-Sequencing and Reset Distribution Controller, Bus-Interface Bridge (Width and Protocol Conversion), Industrial Control and Factory-Automation Glue Logic, LED Display Scan and Refresh Driver, Legacy Peripheral Replacement and Custom I/O Decoding.
I/O Expansion and Voltage-Level Translation
The 5M1270ZF256C4N is widely used to expand the limited I/O count of an ASIC, SoC, or microcontroller and to translate between mismatched voltage domains (1.5/1.8/2.5/3.3 V). Its 211 user I/Os and MultiVolt I/O bank architecture allow direct interfacing to LVCMOS and LVTTL peripherals without external level shifters. With 6.2 ns tPD and 980 macrocells, the part can implement multiple bidirectional bus bridges in a single device, reducing board area and BOM cost versus discrete logic.
Recommended
Power-Sequencing and Reset Distribution Controller
The 5M1270ZF256C4N's instant-on, non-volatile flash-based configuration makes it ideal for power-sequencing and reset-distribution roles in multi-rail systems. The device can monitor PG (power-good) inputs from multiple DC-DC converters and generate sequenced enable signals to downstream loads, satisfying strict processor power-up requirements. With 211 I/Os the CPLD can service many rails simultaneously, and the 6.2 ns deterministic delay ensures sub-microsecond sequencing accuracy.
Recommended
Bus-Interface Bridge (Width and Protocol Conversion)
The 5M1270ZF256C4N can bridge between asynchronous parallel buses of differing widths - for example converting a 32-bit local bus to a 16-bit peripheral interface - with deterministic single-cycle latency. The 980 macrocells comfortably absorb wide state machines, FIFOs, and address-decode logic, while 211 I/Os expose enough pins for both bus sides plus status LEDs. MultiVolt I/O banks permit direct connection to legacy 5 V-tolerant buses when configured appropriately.
Recommended
Industrial Control and Factory-Automation Glue Logic
The 5M1270ZF256C4N provides deterministic glue logic for PLCs, motor controllers, and sensor aggregation nodes in factory-automation systems. Its 211 user I/Os can directly drive opto-isolated inputs and outputs, encoder interfaces, and PWM-control lines. The 304 MHz internal performance and 6.2 ns tPD support high-speed encoder decoding and protocol conversion (e.g., incremental-quadrature to BiSS). For harsher -40C to +100C environments, the I7N industrial variant is recommended instead.
Recommended
LED Display Scan and Refresh Driver
The 5M1270ZF256C4N's deterministic timing and high I/O count make it an effective scan-driver for multi-row, multi-column LED video walls and dot-matrix displays. With 211 outputs it can refresh dozens of rows in parallel, while the flash-based instant-on configuration eliminates the boot-up blanking interval of SRAM-based FPGAs. The 6.2 ns tPD supports high PWM bit-depths without visible flicker, and JTAG-based ISP allows in-field refresh-rate or scan-pattern updates without removing the board.
Recommended
Legacy Peripheral Replacement and Custom I/O Decoding
The 5M1270ZF256C4N can replace aging PAL/GAL devices and discrete 74-series decode logic on legacy boards, consolidating dozens of packages into one BGA. Its 980 macrocells support wide address decoders, chip-select generators, and interrupt controllers for retro-computing, industrial-control, and aerospace retrofit applications. In-system programmability enables rapid re-spin of decode tables during qualification, and 211 I/Os cover most legacy backplanes without multiplexing.
Recommended
Recommended Products Summary
Engineering reference data for 5M1270ZF256C4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5M1270ZF256A5N | 5M1270ZF324C5N | 5M1270ZF256I7N | 5M570ZF256C5N |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) | 324-FBGA (19x19 mm) | 256-FBGA (17x17 mm) | 256-FBGA (17x17 mm) |
| Macrocells | 980 | 980 | 980 | 980 | 570 (-42%) |
| User I/Os | 211 | 211 | [DATA_NEEDED] | 211 | [DATA_NEEDED] |
| Propagation Delay (tPD) | 6.2 ns | 6.2 ns | 6.2 ns | 6.2 ns | [DATA_NEEDED] |
| Max Internal Frequency | 304 MHz | 304 MHz | 304 MHz | 304 MHz | [DATA_NEEDED] |
| Operating Temperature | 0C to +70C (commercial) | Extended/automotive grade | 0C to +70C (commercial) | -40C to +100C (industrial) | 0C to +70C (commercial) |
| Core Voltage | 1.8 V (1.71-1.89 V) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Programmability | In-System (JTAG) | In-System (JTAG) | In-System (JTAG) | In-System (JTAG) | In-System (JTAG) |
Key Differentiators
- Highest-density MAX V CPLD in 256-FBGA package (vs 5M570ZF256C5N)
- Industrial temperature variant available in the same footprint (vs 5M1270ZF256I7N)
- Instant-on, non-volatile flash configuration (vs SRAM-based FPGAs (e.g., Cyclone IV))
Design Notes
Provide a clean 1.8 V core rail with at least 10 uF of bulk ceramic decoupling placed within 25 mm of the FBGA supply balls. Each VCC and VCCIO pin group should be bypassed with a 0.1 uF X7R capacitor located adjacent to the package. According to the manufacturer datasheet, the internal LDO requires the input 1.8 V to be monotonic at power-up; a soft-start ramp slower than 1 ms may cause configuration errors. MultiVolt I/O banks require their own VCCIO rail (1.5/1.8/2.5/3.3 V) - tie unused I/O banks to VCCIO = 1.8 V to minimize leakage.
The 256-FBGA at 1.0 mm pitch demands precise PCB fabrication: use laser-drilled microvias, ENIG or OSP surface finish, and a 0.4 mm solder-mask-defined (SMD) or non-solder-mask-defined (NSMD) pad with via-in-pad. Per the manufacturer datasheet, all balls must be soldered - including the inner power/ground balls - to a continuous ground plane for thermal dissipation. A 4-layer stack-up with 1 oz copper and a dedicated ground plane beneath the BGA is recommended. Allow at least 6 mm of keep-out around the BGA for rework and X-ray inspection.
Do not assume JTAG pins (TCK, TMS, TDI, TDO) are 5 V-tolerant - they are 1.8/2.5/3.3 V LVCMOS only; connecting a 5 V JTAG programmer will damage the device. The nSTATUS, nCONFIG, and CONF_DONE pins used during parallel programming must not be pulled high during JTAG ISP. According to the manufacturer datasheet, leaving the JTAG chain unterminated by omitting the 10 kohm TCK pull-down may cause false clocking; always include the recommended pull-down on TCK and pull-up on TDI/TMS.
Compliance Information
RoHS compliant per manufacturer product listing. Standard commercial part - AEC-Q100 qualification applies to the -A automotive suffix variant, not the C4N commercial part.
