A3P250-2PQG208 - ProASIC3 Flash FPGA, 250K Gates | Microchip
N.º da peça: A3P250-2PQG208 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $29.63 | $29,63 |
| 10 | $28.15 | $281,50 |
| 100 | $26.67 | $2.667,00 |
| 500 | $25.19 | $12.595,00 |
| 1.000 | $23.71 | $23.710,00 |
A3P250-2PQG208 Visão geral
A flash-based FPGA is a programmable logic device that stores its configuration in non-volatile on-chip flash memory rather than the volatile SRAM cells used by most mainstream FPGAs. Because configuration data is retained in the device itself, a flash FPGA powers up instantly as a single-chip solution with no external boot PROM, no configuration controller, and no configuration-time window that could be disturbed in radiation-prone or security-sensitive environments. Within the programmable logic hierarchy, the ProASIC3 family sits in the low-to-mid density class, bridging CPLDs and larger SRAM FPGAs.
Key features of the A3P250 include single-chip, reprogrammable flash fabric with low total cost of ownership, system performance up to 310 MHz, and an abundance of advanced features including optional soft ARM support per the ProASIC3 family datasheet. The 151 available user I/O support common single-ended standards, enabling glue logic, bus bridging, and control-plane designs.
Technically, the ProASIC3 fabric is built on a 130nm flash process with a sea-of-modules architecture of versatile logic elements; the -2 speed grade denotes the faster of the commercial speed grades for this density. The non-volatile fabric eliminates configuration storage and improves board-level reliability and security relative to SRAM FPGAs.
Typical applications include industrial automation control, aerospace and defense subsystems, secure embedded controllers, power sequencing and board management, and communications line-card glue logic - all use cases that benefit from instant-on, low-profile, single-chip programmable logic.
Design consideration: plan the 1.5V core and I/O bank supplies with proper decoupling, and verify I/O banking rules in Microchip Libero SoC before fixing pin assignments on the 208-pin PQFP footprint.
This page synthesizes distributor pricing, drop-in alternatives within the same 208-pin PQFP footprint, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para A3P250-2PQG208 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P250-2PQG208 (mesmo formato e footprint) — diferindo em System Gates, Package, Configuration Memory, Speed Grade, User I/O.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P250-1PQG208I
✅ Drop-In✓ Em estoque
$16.19 / unidade
Ver ficha técnica →A3P250L-1PQG208I
✅ Drop-In✓ Em estoque
$44.6 / unidade
Ver ficha técnica →A3P250-PQ208
✅ Drop-In✓ Em estoque
$15.9 / unidade
Ver ficha técnica →A3P600-2PQG208
✅ Drop-In✓ Em estoque
$55.87 / unidade
Ver ficha técnica →A3P600-1PQG208I
✅ Drop-In✓ Em estoque
$68 / unidade
Ver ficha técnica →A3P250-2PQG208 Classificações máximas e características elétricas
| Family | ProASIC3 |
| System Gates | 250000 gates |
| Logic Elements | 6144 |
| Maximum Operating Frequency | 310 MHz |
| User I/O | 151 |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm flash |
| Configuration Memory | Non-volatile Flash (single-chip, instant-on) |
| Speed Grade | -2 |
| Encapsulamento | 208-BFQFP (PQFP-208) |
| Tipo de montagem | Surface Mount |
| Packaging | Tray |
| Soft ARM Support | Supported (per ProASIC3 family datasheet) |
Guia de Configuração de Pinos do A3P250-2PQG208 208-bfqfp (pqfp-208)
Configuração de pinos para A3P250-2PQG208 (pacote 208-bfqfp (pqfp-208)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A3P250-2PQG208.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A3P250-2PQG208 é adequado para 6 aplicaçãos: Industrial Automation and Control, Secure Embedded Controllers, Aerospace and Defense Subsystems, Board Power Management and Sequencing, Communications Line-Card Glue Logic, Test and Measurement Instrumentation.
Industrial Automation and Control
The A3P250-2PQG208 fits industrial automation because its 6,144 logic elements and 151 user I/O absorb sensor interfacing, motor-control sequencing, and fieldbus glue logic in one chip, while the 310 MHz-class fabric handles deterministic control loops. As a flash FPGA it powers up functional in microseconds - critical on factory lines that must resume production instantly after power cycling, with no configuration PROM to program or corrupt. In a typical PLC or I/O module, the device sits between the backplane connector and local microcontroller, bridging parallel I/O banks and implementing safety interlocks in fabric. The single-chip, non-volatile architecture also removes the configuration-time window that SRAM FPGAs expose, improving uptime metrics in 24/7 environments.
Recomendado
Secure Embedded Controllers
Security-oriented designs benefit from the A3P250-2PQG208's non-volatile flash configuration: unlike SRAM FPGAs, the bitstream resides in on-chip flash with no external boot device to intercept and no configuration readback path during power-up. With 250K gates and 6,144 logic elements, designers can implement authentication engines, encrypted bus bridges, and anti-tamper sequencing alongside the application logic. The 1.5V core on the 130nm flash process keeps dynamic power modest for fanless secure enclosures, while the 151 user I/O support isolated interfaces and GPIO supervision. The -2 speed grade provides headroom for iterative cryptographic rounds. Combined with a secure MCU host, the device forms a two-chip root-of-trust architecture with instant-on behavior and single-chip BOM simplicity.
Recomendado
Aerospace and Defense Subsystems
The ProASIC3 family has a heritage in aerospace and defense because flash FPGAs tolerate radiation environments better than SRAM-based fabrics (no configuration upset from a boot-time window, fewer SEU-sensitive configuration cells) and simplify obsolescence-managed single-chip designs. The A3P250-2PQG208's 250K gates suit payload housekeeping, telemetry formatting, and sensor aggregation, while its 208-pin ceramic-compatible PQFP-style footprint eases board-level qualification. The 310 MHz system performance supports real-time telemetry pipelines, and instant-on flash configuration removes the external PROM from the reliability calculation. For programs requiring the industrial temperature range, the same-footprint A3P250-1PQG208I substitutes directly without PCB rework.
Recomendado
Board Power Management and Sequencing
The A3P250-2PQG208 is frequently used as a board-management FPGA: it sequences power rails, monitors supervisor ICs, fans out resets, and logs fault events, all in one flash-based chip that is alive within microseconds of power application. With 151 user I/O it can poll dozens of enable, power-good, and temperature-alarm lines that would overwhelm a microcontroller's pin budget. The 310 MHz-class fabric implements arbitrary state machines for complex multi-rail sequencing without firmware-level timing jitter, and the non-volatile configuration means sequencing logic never waits for a bitstream load. Recommended companions include TI supervisors and power monitors that the FPGA polls over I2C/SMBus.
Recomendado
Communications Line-Card Glue Logic
In telecom and datacom line cards, the A3P250-2PQG208 serves as the classic instant-on glue device between a processor complex and line-interface ASICs or PHYs: bus width conversion, interrupt aggregation, LED/status multiplexing, and hot-swap control all fit in its 6,144 logic elements. The 151 user I/O cover wide parallel buses plus management interfaces, and the -2 speed grade sustains 310 MHz-class internal pipelines for retiming. Because the fabric is flash based, the line card is fully functional before a host CPU finishes booting - important for systems that must signal presence to a shelf manager immediately at power-up. The 208-PQFP footprint also simplifies rework on high-layer-count backplane cards.
Recomendado
Test and Measurement Instrumentation
Bench and rack instruments use the A3P250-2PQG208 as trigger logic, timing generators, and instrument-backplane interfaces. The 6,144-element fabric implements deterministic state machines with the 310 MHz-class performance needed for repeatable trigger timing, while 151 user I/O connect front-panel controls, display buses, and measurement front ends. Flash configuration gives instant-on readiness so the instrument passes self-test as soon as power settles, and single-chip programming simplifies manufacturing over PROM-based designs. Designers commonly pair the FPGA with precision analog front ends; the FPGA handles digital control and calibration sequencing. The same-footprint A3P600 upgrade protects the layout investment if logic grows across product revisions.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P250-2PQG208 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P250-1PQG208I | A3P250L-1PQG208I | A3P600-2PQG208 |
|---|---|---|---|---|
| Package | 208-BFQFP (PQG208) | 208-PQFP (PQG208) - same | 208-PQFP (PQG208) - same | 208-PQFP (PQG208) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250,000 | 250,000 | 250,000 | ~600,000 |
| Speed Grade | -2 (310 MHz class) | -1 | -1 | -2 |
| User I/O | 151 | 151 | 151 | 188 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Range | Commercial | Industrial (I) | Industrial (I) | Commercial |
| Configuration Memory | Non-volatile flash (single-chip) | Non-volatile flash (single-chip) | Non-volatile flash (single-chip) | Non-volatile flash (single-chip) |
Principais diferenciais
- Fastest commercial speed grade in this density/package (vs A3P250-1PQG208I)
- Lower dynamic power than standard A3P250 (vs A3P250L-1PQG208I)
- Right-sized density at lowest cost within the footprint (vs A3P600-2PQG208)
Notas de projeto
The A3P250-2PQG208 requires a 1.5V core supply plus independent I/O bank supplies. Decouple the core with a network of at least 22uF bulk plus 0.1uF/0.01uF ceramics at each supply pin per the ProASIC3 power guidelines in the family datasheet. Because flash FPGAs draw no configuration current at power-up, inrush is dominated by I/O charging and core ramp - still sequence supplies or hold I/O tri-stated until VCORE is valid to prevent latch-up on the 151 I/O.
The 208-PQFP has 0.5mm-pitch gull-wing leads. Specify a 4-mil solder-mask-defined footprint per the Microchip package outline, and place JTAG (FlashPro) header pins within 15cm of the device for programming access. Fan out the 8 signal layers or use 2 signal + 2 plane layers minimum; assign high-toggle-rate I/O near ground vias. Reserve the ability to substitute A3P250-1PQG208I or A3P600-2PQG208 - they share the footprint, so do not silkscreen the speed grade on the board.
Three recurring pitfalls: (1) treating the part like an SRAM FPGA and adding an unnecessary configuration PROM - the flash fabric is single-chip and self-booting; (2) fixing pin assignments before running IOT banker checks in Libero SoC, forcing a costly respin of the 208-pin footprint; (3) substituting a -1 speed grade to save cost without re-running static timing - the -2 grade offers measurably faster fabric and a -1 swap can fail timing. Always verify with Libero timing reports before any grade change.
Informações de conformidade
The 'G' in PQG208 denotes Microchip/Microsemi Pb-free (green) packaging, indicating lead-free construction. Formal RoHS/REACH certificates must be requested from Microchip; not asserted from distributor data alone.