A3P250-2PQG208I - ProASIC3 FPGA 250K Gates | Microchip
N.º da peça: A3P250-2PQG208I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $39.2 | $392,00 |
| 100 | $35.8 | $3.580,00 |
| 500 | $32.4 | $16.200,00 |
| 1.000 | $29.9 | $29.900,00 |
A3P250-2PQG208I Visão geral
A flash-based FPGA is a field-programmable gate array that stores its configuration in on-chip non-volatile flash memory rather than an external configuration ROM. Within the programmable logic hierarchy, the ProASIC3 sits at the low-density end of the FPGA taxonomy, below mid-range SRAM FPGAs, and functions as a single-chip system glue logic, control, and interface device.
Key features include non-volatile flash programming that eliminates the external boot PROM and enables instant-on operation, reprogrammability for in-field updates, 130nm flash process technology, system performance up to 310 MHz, and low total cost of ownership thanks to the single-chip solution and small-footprint package options.
The ProASIC3 architecture uses a sea-of-vanilla-gates (Voic) logic fabric built from VersaTiles, each configurable as a lookup table or D flip-flop, with dedicated flash switches holding the configuration. The -2 speed grade balances timing performance with power, and the low 1.5V core voltage keeps dynamic power low. Live reprogramming via JTAG supports design iteration without soldering changes.
Typical applications include industrial automation control, aerospace and defense secure logic, medical instrumentation, communications bridging, and power-on instant-on embedded control where configuration volatile memory is undesirable.
Design consideration: bond all recommended VCCA, VCCI, and GND pins per the manufacturer datasheet and follow Microchip power-decoupling guidance; use Libero SoC software for synthesis, place-and-route, and timing signoff.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para A3P250-2PQG208I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P250-2PQG208I (mesmo formato e footprint) — diferindo em System Gates, Package, Configuration Memory, Speed Grade, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P250-2PQG208
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$23.71 / unidade
Ver ficha técnica →A3P250-PQG208I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P250-1PQG208I
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$16.19 / unidade
Ver ficha técnica →A3P250L-1PQG208I
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$44.6 / unidade
Ver ficha técnica →A3P125-2PQG208I
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$18.75 / unidade
Ver ficha técnica →A3P400-2PQG208
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$56.9 / unidade
Ver ficha técnica →A3P250-2PQG208I Classificações máximas e características elétricas
| Family | ProASIC3 |
| Number of Gates | 250K |
| Logic Elements (LEs) | 3000 |
| User I/O | 151 |
| User Flash Memory | 36864 bits |
| Maximum Operating Frequency | 310 MHz |
| Process Technology | 130 nm flash |
| Core Supply Voltage | 1.5 V |
| Configuration Memory | Non-volatile flash, single-chip |
| Speed Grade | -2 |
| Temperatura de operação | -40C to +85C (industrial) |
| Encapsulamento | 208-BFQFP (PQG208) |
| Estilo de montagem | SMD/SMT |
| Packaging | Tray |
| Series | A3P250 ProASIC3 |
| Programming | In-system reprogrammable via JTAG |
Guia de Configuração de Pinos do A3P250-2PQG208I 208-bfqfp (pqg208)
Configuração de pinos para A3P250-2PQG208I (pacote 208-bfqfp (pqg208)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A3P250-2PQG208I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A3P250-2PQG208I é adequado para 6 aplicaçãos: Industrial Automation Control, Aerospace and Defense Secure Logic, Medical Instrumentation, Communications Bridging and Glue Logic, Embedded Control and Instant-On Systems, Test and Measurement Equipment.
Industrial Automation Control
The A3P250-2PQG208I fits industrial automation because its 3000 logic elements and 151 user I/Os are sufficient for motor sequencers, sensor-fusion glue logic, and fieldbus interface bridging, while the industrial -40C to +85C rating matches factory-floor environments. Its non-volatile flash configuration means a PLC board powers up instantly with logic active, with no bootloader delay or external configuration PROM to fail in high-vibration installations. The 1.5V core keeps dynamic power low in always-on control panels. Deployed between sensor headers and a host MCU or backplane, it absorbs protocol conversion and timing-critical interlocks; the -2 speed grade supports up to 310 MHz system performance, far above typical industrial clock rates, leaving ample timing margin.
Recomendado
Aerospace and Defense Secure Logic
Flash-based ProASIC3 devices are a mainstay in aerospace and defense electronics because the configuration lives in non-volatile flash switches that are inherently immune to the configuration-upset mechanisms affecting SRAM FPGAs, eliminating scrubbing circuitry. The A3P250-2PQG208I provides 250K gates for secure boot controllers, interface translators, and fault-tolerant voting logic, with a single-chip build that shrinks board area and reduces the supply chain to one programmable device. Instant-on behavior satisfies power-up sequencing requirements in avionics, and JTAG live reprogramming supports controlled design updates in the field. Designers should verify programmatic readback disable and security fuse settings in Libero SoC before flight release.
Recomendado
Medical Instrumentation
In medical diagnostic and monitoring equipment, the A3P250-2PQG208I serves as deterministic interface and control logic between analog front ends, ADCs, and a host processor. Its 151 user I/Os comfortably bond out parallel ADC data buses, and the 310 MHz-capable -2 fabric implements real-time filtering triggers with certainty that software cannot match. Non-volatile configuration guarantees that instrument calibration glue logic is active the moment power is applied, an important property for devices that must pass power-on self-test before patient use. The industrial temperature rating covers cold-storage and sterilization-adjacent environments, and the 1.5V core limits internal heating inside sealed enclosures with restricted airflow.
Recomendado
Communications Bridging and Glue Logic
The A3P250-2PQG208I is well suited to bridging legacy and modern interfaces in networking and telecom line cards. Its 3000 LEs implement dual-UART aggregators, bus width converters, PCI-style handshaking, and custom serial framing, while 151 I/Os support wide parallel buses at 3.3V-tolerant VCCI banks. Because configuration is flash-resident, a line card resumes traffic forwarding instantly after hot replacement, with no bitstream load window. The -2 speed grade supplies ample setup/hold margin at typical backplane clock rates up to 100 MHz-plus, and the low-cost PQFP-208 keeps the total bill of materials competitive against SRAM FPGA plus configuration-flash alternatives for medium-volume communication equipment.
Recomendado
Embedded Control and Instant-On Systems
For embedded systems that must be functional within milliseconds of power application, such as power-supply sequencing controllers, security interlocks, and automotive-adjacent test rigs, the A3P250-2PQG208I's flash configuration removes the SRAM-FPGA boot penalty entirely. The 36864 bits of user flash can also store board IDs, calibration constants, or a small firmware table, consolidating functions that would otherwise need an external EEPROM. Designers pair it with a small MCU for supervisory tasks and use the FPGA fabric for cycle-accurate I/O timing; the JTAG interface supports in-system updates during manufacturing without desoldering. The tray-packed PQFP-208 suits both hand assembly of prototypes and automated production lines.
Recomendado
Test and Measurement Equipment
Bench and automated test instruments use the A3P250-2PQG208I as a timing and control fabric for stimulus/response subsystems. The -2 speed grade's 310 MHz system performance supports high-resolution edge generation, while the large I/O count fans out to relay matrices, connector breakpoints, and per-channel comparators. Flash configuration means a warmed-up instrument can be power-cycled during calibration with logic immediately operational, cutting test-station cycle time. Deterministic fabric timing gives reproducible channel-to-channel skew that software-timed MCU solutions cannot achieve, and the industrial temperature rating tolerates unventilated rack environments. Libero SoC timing reports document margins for calibration certificates.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P250-2PQG208I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P250-2PQG208 | A3P250-PQG208I | A3P250-1PQG208I | A3P125-2PQG208I | A3P400-2PQG208 |
|---|---|---|---|---|---|---|
| Package | PQFP-208 (PQG208) | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same | PQFP-208 - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Gate Density | 250K | 250K | 250K | 250K | 125K | 400K |
| User I/O | 151 | 151 | 151 | 151 | 151 | 202 |
| Speed Grade | -2 | -2 | standard | -1 | -2 | -2 |
| Operating Temperature | -40C to +85C (I) | 0C to +70C (C) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | 0C to +70C (C) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Configuration Memory | On-chip flash, non-volatile | On-chip flash, non-volatile | On-chip flash, non-volatile | On-chip flash, non-volatile | On-chip flash, non-volatile | On-chip flash, non-volatile |
Principais diferenciais
- Industrial temperature range in a cost-optimized PQFP (vs A3P250-2PQG208)
- Fastest -2 timing grade of the PQ208 industrial family (vs A3P250-1PQG208I)
- Single-chip flash configuration (vs SRAM FPGAs of similar density)
- In-place density migration on the same footprint (vs A3P400-2PQG208)
Notas de projeto
The A3P250-2PQG208I requires separate 1.5V core (VCCA), 2.5V (VPTB/programming), and per-bank I/O supplies (VCCI) per the ProASIC3 datasheet. Estimated: dynamic power scales with clock frequency and toggle rate; at 310 MHz maximum system performance with a fully active fabric, budget for the datasheet power calculator (available in Libero SoC SmartPower) rather than worst-case tables, which are pessimistic. Decouple each supply pin with 0.1uF ceramic capacitors placed within 2 mm of the pin, plus bulk 10uF per rail.
The PQFP-208 fine-pitch package (0.5 mm lead pitch) requires a careful land pattern per the manufacturer's recommended footprint and solder-mask-defined pads for reliable reflow. Use a minimum 4-layer stackup with a solid ground plane to control return paths for the 151 I/O signals; route the JTAG chain (TDI, TDO, TMS, TCK) with series termination close to the driver to prevent ringing at programming frequencies. Keep the exposed PQFP center region clear for probe access during in-system programming.
Do not substitute the commercial A3P250-2PQG208 into an industrial -40C application: timing derating below 0C is not guaranteed and field failures are common in cold-start environments. Also confirm the speed grade suffix (-1, -2, standard) matches your Libero SoC timing constraints; a slower grade may pass place-and-route but fail post-layout timing at temperature. Finally, use VCCI bank voltages consistent with the devices connected to each I/O bank before programming to avoid latch-up.
Informações de conformidade
Compliance status not explicitly stated in the provided web data; verify on the Microchip product page or distributor compliance documentation before production release.