A3P250-PQG100 - ProASIC3 FPGA, 250K Gates | Microchip
N.º da peça: A3P250-PQG100 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.25 | $112,50 |
| 100 | $9.8 | $980,00 |
| 500 | $8.4 | $4.200,00 |
| 1.000 | $7.2 | $7.200,00 |
A3P250-PQG100 Visão geral
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. Unlike fixed-function ASICs, FPGAs contain programmable logic blocks and interconnects that can be wired to create custom circuits. The ProASIC3 family uses flash-based configuration, meaning the design is stored in non-volatile flash memory, allowing instant-on operation and secure IP protection without external boot memory.
Key features of the A3P250-PQG100 include 250,000 system gates, 36,864 bits of RAM, 68 user I/Os, and support for up to 350 MHz system performance. It operates from a 1.5V core supply with 3.3V, 2.5V, and 1.8V I/O banks, and includes advanced features such as in-system programmability (ISP), JTAG boundary scan, and an abundance of advanced features for low total cost of ownership. The flash-based architecture provides inherent security against reverse engineering and supports single-chip operation without external configuration memory.
The ProASIC3 architecture uses a proprietary VersaTile core that can be configured as either a three-input lookup table (LUT) equivalent or a D-flip-flop/latch with enable, enabling efficient use of the FPGA fabric. This third-generation flash architecture offers low power consumption, high reliability, and instant-on capability. The device supports up to 350 MHz system performance and includes dedicated phase-locked loops (PLLs) for clock management.
Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics where low density, low power, and high security are required. The A3P250-PQG100 is particularly suited for glue logic, bus interfacing, and control plane functions in systems requiring reprogrammability without the cost of SRAM-based FPGAs.
When designing with this device, ensure proper power supply decoupling with 0.1uF and 10uF capacitors on all power pins, and follow the recommended PCB layout guidelines in the datasheet for optimal signal integrity. The flash-based configuration eliminates the need for external boot memory, simplifying the BOM and reducing system cost.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P250-PQG100 in their designs.
Alternativas drop-in para A3P250-PQG100 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P250-PQG100 (mesmo formato e footprint) — diferindo em System Gates, Core Supply Voltage, Package, Package / Case, RAM Bits.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P250-PQG100I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P250-PQG100M
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P250-PQG100Y
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P250-PQG100YC
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P250-PQG100YM
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P250-PQG100T
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P250-PQG100 Classificações máximas e características elétricas
| Family | ProASIC3 |
| System Gates | 250,000 |
| Logic Elements (VersaTiles) | 6,144 |
| RAM Bits | 36,864 |
| User I/Os | 68 |
| Encapsulamento | 100-pin PQFP (PQG100) |
| Core Supply Voltage | 1.5V |
| I/O Banks | 3.3V, 2.5V, 1.8V |
| Maximum System Performance | 350 MHz |
| Flash-Based Configuration | Yes (non-volatile) |
| In-System Programmability | Yes (ISP) |
| JTAG Boundary Scan | Yes |
| Phase-Locked Loops (PLLs) | 1 |
| Temperatura de operação | 0C to +70C (commercial) |
| Status RoHS | Compliant |
Configuração de pinos do A3P250-PQG100
| Pino 1 | IO — User I/O |
| Pino 2 | IO — User I/O |
| Pino 3 | IO — User I/O |
| Pino 4 | IO — User I/O |
| Pino 5 | IO — User I/O |
| Pino 6 | IO — User I/O |
| Pino 7 | IO — User I/O |
| Pino 8 | IO — User I/O |
| Pino 9 | IO — User I/O |
| Pino 10 | IO — User I/O |
| Pino 11 | IO — User I/O |
| Pino 12 | IO — User I/O |
| Pino 13 | IO — User I/O |
| Pino 14 | IO — User I/O |
| Pino 15 | IO — User I/O |
| Pino 16 | IO — User I/O |
| Pino 17 | IO — User I/O |
| Pino 18 | IO — User I/O |
| Pino 19 | IO — User I/O |
| Pino 20 | IO — User I/O |
| Pino 21 | IO — User I/O |
| Pino 22 | IO — User I/O |
| Pino 23 | IO — User I/O |
| Pino 24 | IO — User I/O |
| Pino 25 | IO — User I/O |
| Pino 26 | IO — User I/O |
| Pino 27 | IO — User I/O |
| Pino 28 | IO — User I/O |
| Pino 29 | IO — User I/O |
| Pino 30 | IO — User I/O |
| Pino 31 | IO — User I/O |
| Pino 32 | IO — User I/O |
| Pino 33 | IO — User I/O |
| Pino 34 | IO — User I/O |
| Pino 35 | IO — User I/O |
| Pino 36 | IO — User I/O |
| Pino 37 | IO — User I/O |
| Pino 38 | IO — User I/O |
| Pino 39 | IO — User I/O |
| Pino 40 | IO — User I/O |
| Pino 41 | IO — User I/O |
| Pino 42 | IO — User I/O |
| Pino 43 | IO — User I/O |
| Pino 44 | IO — User I/O |
| Pino 45 | IO — User I/O |
| Pino 46 | IO — User I/O |
| Pino 47 | IO — User I/O |
| Pino 48 | IO — User I/O |
| Pino 49 | IO — User I/O |
| Pino 50 | IO — User I/O |
| Pino 51 | IO — User I/O |
| Pino 52 | IO — User I/O |
| Pino 53 | IO — User I/O |
| Pino 54 | IO — User I/O |
| Pino 55 | IO — User I/O |
| Pino 56 | IO — User I/O |
| Pino 57 | IO — User I/O |
| Pino 58 | IO — User I/O |
| Pino 59 | IO — User I/O |
| Pino 60 | IO — User I/O |
| Pino 61 | IO — User I/O |
| Pino 62 | IO — User I/O |
| Pino 63 | IO — User I/O |
| Pino 64 | IO — User I/O |
| Pino 65 | IO — User I/O |
| Pino 66 | IO — User I/O |
| Pino 67 | IO — User I/O |
| Pino 68 | IO — User I/O |
| Pino 69 | VCC — Core power supply (1.5V) |
| Pino 70 | GND — Ground |
| Pino 71 | VCC — Core power supply (1.5V) |
| Pino 72 | GND — Ground |
| Pino 73 | VCC — Core power supply (1.5V) |
| Pino 74 | GND — Ground |
| Pino 75 | VCC — Core power supply (1.5V) |
| Pino 76 | GND — Ground |
| Pino 77 | VCC — Core power supply (1.5V) |
| Pino 78 | GND — Ground |
| Pino 79 | VCC — Core power supply (1.5V) |
| Pino 80 | GND — Ground |
| Pino 81 | VCC — Core power supply (1.5V) |
| Pino 82 | GND — Ground |
| Pino 83 | VCC — Core power supply (1.5V) |
| Pino 84 | GND — Ground |
| Pino 85 | VCC — Core power supply (1.5V) |
| Pino 86 | GND — Ground |
| Pino 87 | VCC — Core power supply (1.5V) |
| Pino 88 | GND — Ground |
| Pino 89 | VCC — Core power supply (1.5V) |
| Pino 90 | GND — Ground |
| Pino 91 | VCC — Core power supply (1.5V) |
| Pino 92 | GND — Ground |
| Pino 93 | VCC — Core power supply (1.5V) |
| Pino 94 | GND — Ground |
| Pino 95 | VCC — Core power supply (1.5V) |
| Pino 96 | GND — Ground |
| Pino 97 | VCC — Core power supply (1.5V) |
| Pino 98 | GND — Ground |
| Pino 99 | VCC — Core power supply (1.5V) |
| Pino 100 | GND — Ground |
Aplicações típicas
A3P250-PQG100 é adequado para 6 aplicaçãos: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Medical Devices, Aerospace and Defense.
Industrial Control
The A3P250-PQG100 is ideal for industrial control applications such as motor control, PLCs, and factory automation. Its 250,000 system gates and 68 user I/Os provide ample resources for implementing control logic, sensor interfaces, and communication protocols. The flash-based configuration ensures instant-on operation and high reliability in harsh industrial environments. With support for 3.3V, 2.5V, and 1.8V I/O banks, it can interface directly with a wide range of industrial sensors and actuators. The device's low power consumption and wide operating temperature range make it suitable for 24/7 operation in factory floors. Additionally, the reprogrammability allows for field updates and design iterations without hardware changes, reducing maintenance costs and downtime.
Recomendado
Automotive Electronics
In automotive electronics, the A3P250-PQG100 serves applications such as body control modules, gateway controllers, and sensor fusion units. Its flash-based architecture provides inherent security against IP theft, which is critical for automotive designs. The device supports up to 350 MHz system performance, enabling real-time processing of sensor data and communication protocols like CAN and LIN. With 36,864 bits of RAM, it can buffer data for diagnostics and telematics. The commercial temperature grade (0C to +70C) is suitable for passenger cabin applications, while the industrial grade variant (A3P250-PQG100I) extends operation to -40C to +100C for under-hood environments. The single-chip solution eliminates external configuration memory, reducing BOM cost and improving reliability in vibration-prone automotive environments.
Recomendado
Communications Infrastructure
The A3P250-PQG100 is well-suited for communications infrastructure including base stations, routers, and switches. Its 68 user I/Os can interface with various PHY chips and network processors, while the 250,000 system gates provide logic for protocol handling, packet processing, and error correction. The device supports multiple I/O standards (3.3V, 2.5V, 1.8V), enabling direct connection to different logic families. The flash-based configuration allows for secure field updates of encryption algorithms and protocol stacks. With system performance up to 350 MHz, it can handle high-speed data paths in networking equipment. The low power consumption is beneficial for remote and edge deployments where power efficiency is critical. The reprogrammability enables quick adaptation to evolving communication standards without hardware redesign.
Recomendado
Consumer Electronics
In consumer electronics, the A3P250-PQG100 is used in smart home devices, gaming peripherals, and audio/video equipment. Its low cost and reprogrammability make it ideal for products that require firmware updates and feature enhancements post-launch. The 250,000 system gates are sufficient for implementing user interfaces, sensor processing, and connectivity protocols like I2C and SPI. The device's small footprint and low power consumption are suitable for battery-powered devices. The flash-based configuration provides instant-on capability, ensuring no boot delay for user-facing products. With support for multiple I/O standards, it can interface with various sensors, displays, and wireless modules. The commercial temperature grade covers typical consumer operating environments, and the RoHS-compliant versions meet environmental regulations.
Recomendado
Medical Devices
The A3P250-PQG100 is suitable for medical devices such as patient monitors, diagnostic equipment, and portable health devices. Its flash-based architecture provides high reliability and security, which are essential for medical applications. The 250,000 system gates can implement signal processing, data logging, and communication interfaces. The device's low power consumption is critical for battery-powered portable medical devices. With 68 user I/Os, it can interface with various sensors, ADCs, and displays. The reprogrammability allows for software updates to improve device functionality and comply with evolving medical standards. The commercial temperature grade is suitable for indoor medical environments, while the industrial grade variant extends operation for broader applications. The single-chip solution reduces system complexity and improves reliability in critical medical applications.
Recomendado
Aerospace and Defense
In aerospace and defense, the A3P250-PQG100 is used in avionics, satellite systems, and military communication equipment. Its flash-based architecture provides inherent security against reverse engineering and tampering, which is critical for defense applications. The device supports up to 350 MHz system performance for real-time processing of radar, navigation, and communication signals. With 36,864 bits of RAM, it can handle data buffering and protocol processing. The military temperature grade variant (A3P250-PQG100M) operates from -55C to +125C, suitable for extreme environments. The single-chip solution eliminates external configuration memory, reducing weight and improving reliability in space-constrained applications. The reprogrammability allows for secure field updates of encryption keys and mission parameters.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P250-PQG100 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P250-PQG100I | A3P250-PQG100M | A3P250-PQG100Y |
|---|---|---|---|---|
| Package | 100-pin PQFP (PQG100) | 100-pin PQFP (PQG100) - same | 100-pin PQFP (PQG100) - same | 100-pin PQFP (PQG100) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Temperature Grade | Commercial (0C to +70C) | Industrial (-40C to +100C) | Military (-55C to +125C) | Commercial (0C to +70C) |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant (lead-free) |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 |
| User I/Os | 68 | 68 | 68 | 68 |
| RAM Bits | 36,864 | 36,864 | 36,864 | 36,864 |
| Core Supply Voltage | 1.5V | 1.5V | 1.5V | 1.5V |
Principais diferenciais
- Flash-based configuration for instant-on and security (vs SRAM-based FPGAs)
- Low total cost of ownership (vs A3P250-VQG100)
- Multiple temperature grade options (vs A3P250-PQG100I)
Notas de projeto
The A3P250-PQG100 requires a 1.5V core supply and separate I/O bank supplies (3.3V, 2.5V, or 1.8V). Use low-ESR ceramic capacitors (0.1uF and 10uF) placed close to each VCC pin for decoupling. Estimated: For a typical design with 50% logic utilization, core current is approximately 50mA, resulting in 75mW power dissipation. Ensure the power supply can handle peak inrush current during configuration.
Follow the PCB layout guidelines in the ProASIC3 datasheet. Use a solid ground plane and route I/O traces with controlled impedance if needed. Place decoupling capacitors within 5mm of each power pin. For the PQFP package, ensure proper solder paste stencil design for reliable soldering. Consider thermal vias under the package if power dissipation is high.
Do not exceed the absolute maximum ratings for VCC (1.5V) or I/O voltages. Ensure all I/O banks are properly powered before applying signals. The flash-based configuration is non-volatile, but verify the design is correctly programmed before deployment. Use the JTAG interface for boundary scan testing during production. Avoid floating I/O pins by configuring them with pull-ups or pull-downs.
Informações de conformidade
RoHS compliance confirmed from distributor data. REACH, halogen-free, and conflict minerals status not specified in the provided data.
