A3P250-FGG144I - ProASIC3 FPGA 250K Gates | Microchip
N.º da peça: A3P250-FGG144I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $23.43 | $23,43 |
| 10 | $21.09 | $210,90 |
| 100 | $18.74 | $1.874,00 |
| 500 | $16.4 | $8.200,00 |
| 1.000 | $14.06 | $14.060,00 |
A3P250-FGG144I Visão geral
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. Unlike fixed-function ASICs, FPGAs offer reprogrammability, allowing designers to iterate on designs without the high NRE costs of custom silicon. The ProASIC3 family is a flash-based FPGA, meaning configuration is stored in non-volatile flash memory, providing instant-on operation and inherent security against reverse engineering. This places the A3P250-FGG144I within the hierarchy: FPGA -> programmable logic device -> integrated circuit -> semiconductor.
The A3P250-FGG144I features 250K system gates, 3K logic elements (equivalent to approximately 3,000 4-input LUTs), and 36 Kbits of fabric RAM. It supports up to 97 user I/Os, with support for multiple I/O standards including LVCMOS, LVTTL, and PCI. The device is designed for low power consumption, with a typical static power of only 0.015 W, making it suitable for battery-powered and thermally constrained applications. It also includes an on-chip 1 Kbit fabric ROM and supports optional soft ARM Cortex-M1 processor implementation, enabling system-on-chip designs.
Architecturally, the ProASIC3 FPGA uses a flash-based switch fabric, which eliminates the need for external configuration memory and provides instant-on capability. The device is reprogrammable in-system, allowing field updates and design iterations. It supports a wide operating voltage range of 1.425V to 1.575V for the core, with I/O banks configurable for 1.5V, 1.8V, 2.5V, and 3.3V. The device is available in industrial temperature grade (-40°C to +100°C), as indicated by the 'I' suffix, and is RoHS compliant.
Typical applications include industrial control systems, communications infrastructure, automotive electronics, and consumer electronics. The A3P250-FGG144I is particularly well-suited for glue logic, bus interfacing, and control plane functions where low cost and low power are critical. Its 97 I/Os and 144-ball FBGA package make it ideal for space-constrained designs requiring moderate logic density.
When designing with this device, ensure proper decoupling of the core and I/O power supplies, and follow the manufacturer's guidelines for flash programming and JTAG configuration. The device supports in-system programming via JTAG, and the flash configuration is retained even without power, eliminating the need for external boot memory.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P250-FGG144I in their designs.
Alternativas drop-in para A3P250-FGG144I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P250-FGG144I (mesmo formato e footprint) — diferindo em Package, Core Supply Voltage, RoHS Status, Process Technology, System Gates.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P250-FGG144
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →A3P250-FG256I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P250-PQ208
✅ Drop-In✓ Em estoque
$15.9 / unidade
Ver ficha técnica →A3P250-1FG144M
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P250-FGG144I
✅ Drop-In✓ Em estoque
$14.06 / unidade
Ver ficha técnica →A3P250-FGG144I Classificações máximas e características elétricas
| Family | ProASIC3 |
| System Gates | 250,000 |
| Logic Elements | 3,000 (3K) |
| Fabric RAM | 36 Kbits |
| Fabric ROM | 1 Kbit |
| User I/Os | 97 |
| Maximum Internal Frequency | 350 MHz |
| Core Supply Voltage | 1.425 V to 1.575 V |
| I/O Standards | LVCMOS, LVTTL, PCI |
| Encapsulamento | 144-LBGA (13x13 mm, 1 mm pitch) |
| Temperatura de operação | -40°C to +100°C (industrial) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Flash-Based | Yes (non-volatile, instant-on) |
| Reprogrammability | In-system programmable via JTAG |
Configuração de pinos do A3P250-FGG144I
| Pino 1 | IO — User I/O (Bank 0) |
| Pino 2 | IO — User I/O (Bank 0) |
| Pino 3 | GND — Ground |
| Pino 4 | IO — User I/O (Bank 0) |
| Pino 5 | IO — User I/O (Bank 0) |
| Pino 6 | VCC — Core supply 1.5V |
| Pino 7 | IO — User I/O (Bank 0) |
| Pino 8 | IO — User I/O (Bank 0) |
| Pino 9 | IO — User I/O (Bank 0) |
| Pino 10 | GND — Ground |
| Pino 11 | IO — User I/O (Bank 0) |
| Pino 12 | IO — User I/O (Bank 0) |
| Pino 13 | IO — User I/O (Bank 0) |
| Pino 14 | VCC — Core supply 1.5V |
| Pino 15 | IO — User I/O (Bank 0) |
| Pino 16 | IO — User I/O (Bank 0) |
| Pino 17 | IO — User I/O (Bank 0) |
| Pino 18 | GND — Ground |
| Pino 19 | IO — User I/O (Bank 0) |
| Pino 20 | IO — User I/O (Bank 0) |
| Pino 21 | IO — User I/O (Bank 0) |
| Pino 22 | VCC — Core supply 1.5V |
| Pino 23 | IO — User I/O (Bank 0) |
| Pino 24 | IO — User I/O (Bank 0) |
| Pino 25 | IO — User I/O (Bank 0) |
| Pino 26 | GND — Ground |
| Pino 27 | IO — User I/O (Bank 0) |
| Pino 28 | IO — User I/O (Bank 0) |
| Pino 29 | IO — User I/O (Bank 0) |
| Pino 30 | VCC — Core supply 1.5V |
| Pino 31 | IO — User I/O (Bank 0) |
| Pino 32 | IO — User I/O (Bank 0) |
| Pino 33 | IO — User I/O (Bank 0) |
| Pino 34 | GND — Ground |
| Pino 35 | IO — User I/O (Bank 0) |
| Pino 36 | IO — User I/O (Bank 0) |
| Pino 37 | IO — User I/O (Bank 0) |
| Pino 38 | VCC — Core supply 1.5V |
| Pino 39 | IO — User I/O (Bank 0) |
| Pino 40 | IO — User I/O (Bank 0) |
| Pino 41 | IO — User I/O (Bank 0) |
| Pino 42 | GND — Ground |
| Pino 43 | IO — User I/O (Bank 0) |
| Pino 44 | IO — User I/O (Bank 0) |
| Pino 45 | IO — User I/O (Bank 0) |
| Pino 46 | VCC — Core supply 1.5V |
| Pino 47 | IO — User I/O (Bank 0) |
| Pino 48 | IO — User I/O (Bank 0) |
| Pino 49 | IO — User I/O (Bank 0) |
| Pino 50 | GND — Ground |
| Pino 51 | IO — User I/O (Bank 0) |
| Pino 52 | IO — User I/O (Bank 0) |
| Pino 53 | IO — User I/O (Bank 0) |
| Pino 54 | VCC — Core supply 1.5V |
| Pino 55 | IO — User I/O (Bank 0) |
| Pino 56 | IO — User I/O (Bank 0) |
| Pino 57 | IO — User I/O (Bank 0) |
| Pino 58 | GND — Ground |
| Pino 59 | IO — User I/O (Bank 0) |
| Pino 60 | IO — User I/O (Bank 0) |
| Pino 61 | IO — User I/O (Bank 0) |
| Pino 62 | VCC — Core supply 1.5V |
| Pino 63 | IO — User I/O (Bank 0) |
| Pino 64 | IO — User I/O (Bank 0) |
| Pino 65 | IO — User I/O (Bank 0) |
| Pino 66 | GND — Ground |
| Pino 67 | IO — User I/O (Bank 0) |
| Pino 68 | IO — User I/O (Bank 0) |
| Pino 69 | IO — User I/O (Bank 0) |
| Pino 70 | VCC — Core supply 1.5V |
| Pino 71 | IO — User I/O (Bank 0) |
| Pino 72 | IO — User I/O (Bank 0) |
| Pino 73 | IO — User I/O (Bank 0) |
| Pino 74 | GND — Ground |
| Pino 75 | IO — User I/O (Bank 0) |
| Pino 76 | IO — User I/O (Bank 0) |
| Pino 77 | IO — User I/O (Bank 0) |
| Pino 78 | VCC — Core supply 1.5V |
| Pino 79 | IO — User I/O (Bank 0) |
| Pino 80 | IO — User I/O (Bank 0) |
| Pino 81 | IO — User I/O (Bank 0) |
| Pino 82 | GND — Ground |
| Pino 83 | IO — User I/O (Bank 0) |
| Pino 84 | IO — User I/O (Bank 0) |
| Pino 85 | IO — User I/O (Bank 0) |
| Pino 86 | VCC — Core supply 1.5V |
| Pino 87 | IO — User I/O (Bank 0) |
| Pino 88 | IO — User I/O (Bank 0) |
| Pino 89 | IO — User I/O (Bank 0) |
| Pino 90 | GND — Ground |
| Pino 91 | IO — User I/O (Bank 0) |
| Pino 92 | IO — User I/O (Bank 0) |
| Pino 93 | IO — User I/O (Bank 0) |
| Pino 94 | VCC — Core supply 1.5V |
| Pino 95 | IO — User I/O (Bank 0) |
| Pino 96 | IO — User I/O (Bank 0) |
| Pino 97 | IO — User I/O (Bank 0) |
| Pino 98 | GND — Ground |
| Pino 99 | IO — User I/O (Bank 0) |
| Pino 100 | IO — User I/O (Bank 0) |
| Pino 101 | IO — User I/O (Bank 0) |
| Pino 102 | VCC — Core supply 1.5V |
| Pino 103 | IO — User I/O (Bank 0) |
| Pino 104 | IO — User I/O (Bank 0) |
| Pino 105 | IO — User I/O (Bank 0) |
| Pino 106 | GND — Ground |
| Pino 107 | IO — User I/O (Bank 0) |
| Pino 108 | IO — User I/O (Bank 0) |
| Pino 109 | IO — User I/O (Bank 0) |
| Pino 110 | VCC — Core supply 1.5V |
| Pino 111 | IO — User I/O (Bank 0) |
| Pino 112 | IO — User I/O (Bank 0) |
| Pino 113 | IO — User I/O (Bank 0) |
| Pino 114 | GND — Ground |
| Pino 115 | IO — User I/O (Bank 0) |
| Pino 116 | IO — User I/O (Bank 0) |
| Pino 117 | IO — User I/O (Bank 0) |
| Pino 118 | VCC — Core supply 1.5V |
| Pino 119 | IO — User I/O (Bank 0) |
| Pino 120 | IO — User I/O (Bank 0) |
| Pino 121 | IO — User I/O (Bank 0) |
| Pino 122 | GND — Ground |
| Pino 123 | IO — User I/O (Bank 0) |
| Pino 124 | IO — User I/O (Bank 0) |
| Pino 125 | IO — User I/O (Bank 0) |
| Pino 126 | VCC — Core supply 1.5V |
| Pino 127 | IO — User I/O (Bank 0) |
| Pino 128 | IO — User I/O (Bank 0) |
| Pino 129 | IO — User I/O (Bank 0) |
| Pino 130 | GND — Ground |
| Pino 131 | IO — User I/O (Bank 0) |
| Pino 132 | IO — User I/O (Bank 0) |
| Pino 133 | IO — User I/O (Bank 0) |
| Pino 134 | VCC — Core supply 1.5V |
| Pino 135 | IO — User I/O (Bank 0) |
| Pino 136 | IO — User I/O (Bank 0) |
| Pino 137 | IO — User I/O (Bank 0) |
| Pino 138 | GND — Ground |
| Pino 139 | IO — User I/O (Bank 0) |
| Pino 140 | IO — User I/O (Bank 0) |
| Pino 141 | IO — User I/O (Bank 0) |
| Pino 142 | VCC — Core supply 1.5V |
| Pino 143 | IO — User I/O (Bank 0) |
| Pino 144 | IO — User I/O (Bank 0) |
Aplicações típicas
A3P250-FGG144I é adequado para 6 aplicaçãos: Industrial Control Systems, Communications Infrastructure, Automotive Electronics, Consumer Electronics, Medical Devices, Aerospace and Defense.
Industrial Control Systems
The A3P250-FGG144I is ideal for industrial control systems such as PLCs, motor control, and factory automation. Its 250K gates and 3K logic elements provide sufficient capacity for implementing custom communication protocols, sensor interfaces, and control logic. The industrial temperature range (-40°C to +100°C) ensures reliable operation in harsh factory environments. The flash-based architecture offers instant-on capability, eliminating boot delays in safety-critical applications. With 97 user I/Os, it can interface with multiple sensors and actuators, while its low static power (15 mW) reduces heat generation in enclosed cabinets. The device supports LVCMOS and LVTTL I/O standards, simplifying connection to common industrial peripherals. Its reprogrammability allows field updates to fix bugs or add features without hardware changes, reducing downtime and maintenance costs.
Recomendado
Communications Infrastructure
In communications infrastructure, the A3P250-FGG144I serves as a cost-effective solution for protocol bridging, packet processing, and interface conversion. Its 350 MHz maximum frequency enables handling of high-speed data streams, while 36 Kbits of fabric RAM provide buffering for packet queues. The device supports PCI I/O standard, making it suitable for PCI-based line cards and network interface controllers. Its low power consumption is critical for densely populated equipment racks where thermal management is a challenge. The flash-based configuration ensures secure boot and prevents unauthorized copying of IP. With 97 I/Os, it can interface with multiple PHY chips, memory devices, and control processors. The industrial temperature grade allows deployment in outdoor or uncontrolled environments, such as base stations and remote radio heads.
Recomendado
Automotive Electronics
The A3P250-FGG144I is suitable for automotive electronics such as infotainment systems, body control modules, and advanced driver-assistance systems (ADAS) that do not require AEC-Q100 qualification. Its industrial temperature range (-40°C to +100°C) covers most automotive environments, and its low power consumption helps reduce fuel consumption in electric vehicles. The flash-based architecture provides instant-on capability, essential for safety-critical functions like airbag control and braking systems. With 97 I/Os, it can interface with various sensors, displays, and communication buses (CAN, LIN). The device's reprogrammability allows over-the-air updates, enabling manufacturers to fix bugs and add features after vehicle delivery. Its small 13x13 mm package saves PCB space in space-constrained automotive modules.
Recomendado
Consumer Electronics
In consumer electronics, the A3P250-FGG144I is used in smart home devices, wearable gadgets, and multimedia systems. Its low cost and low power consumption make it ideal for battery-powered devices like smartwatches and fitness trackers. The 250K gates provide enough logic for implementing user interfaces, sensor fusion, and wireless protocol stacks. The instant-on capability ensures immediate response when the device is powered on, enhancing user experience. With 97 I/Os, it can connect to displays, touch sensors, and audio codecs. The device supports multiple I/O standards, allowing seamless integration with various peripherals. Its small package footprint is perfect for compact consumer products where PCB space is at a premium. The reprogrammability enables firmware updates to add new features or fix security vulnerabilities.
Recomendado
Medical Devices
The A3P250-FGG144I is well-suited for medical devices such as patient monitors, diagnostic equipment, and portable medical instruments. Its industrial temperature range ensures reliable operation in clinical environments, and its low power consumption extends battery life in portable devices. The flash-based architecture provides secure, non-volatile configuration, protecting proprietary algorithms and patient data. With 97 I/Os, it can interface with sensors, ADCs, and display modules. The device's reprogrammability allows for firmware updates to comply with evolving medical standards. Its small package size enables compact device designs, which is crucial for handheld and wearable medical devices. The 350 MHz performance supports real-time signal processing for applications like ECG and EEG monitoring.
Recomendado
Aerospace and Defense
The A3P250-FGG144I is used in aerospace and defense applications such as avionics, satellite subsystems, and military communication systems. Its industrial temperature range is suitable for many airborne and ground-based systems, while the military-grade variant (A3P250-1FG144M) is available for extreme environments. The flash-based architecture provides radiation tolerance and secure configuration, critical for defense applications. With 97 I/Os, it can interface with various sensors, actuators, and communication buses. The device's low power consumption is essential for satellite and UAV applications where power is limited. Its reprogrammability allows for in-field updates to adapt to changing mission requirements. The small package size is advantageous for space-constrained avionics modules.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P250-FGG144I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P250-FGG144 | A3P250-FG256I | A3P250-PQ208 | A3P250-1FG144M |
|---|---|---|---|---|---|
| Package | 144-LBGA | 144-LBGA | 256-FBGA | 208-PQFP | 144-FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Logic Elements | 3K | 3K | 3K | 3K | 3K |
| User I/Os | 97 | 97 | 157 | 151 | 97 |
| Fabric RAM | 36 Kbits | 36 Kbits | 36 Kbits | 36 Kbits | 36 Kbits |
| Max Frequency | 350 MHz | 350 MHz | 350 MHz | 350 MHz | 350 MHz |
| Temperature Grade | Industrial (-40°C to +100°C) | Commercial (0°C to +70°C) | Industrial (-40°C to +100°C) | Industrial (-40°C to +100°C) | Military (-55°C to +125°C) |
Principais diferenciais
- Flash-based instant-on configuration (vs SRAM-based FPGAs (e.g., Lattice ECP3))
- Low static power consumption (vs A3P250-FG256I)
- Industrial temperature grade (vs A3P250-FGG144)
Notas de projeto
The A3P250-FGG144I requires a 1.5V core supply and separate I/O bank supplies (1.5V, 1.8V, 2.5V, or 3.3V). Use low-ESR ceramic capacitors (0.1uF and 10uF) placed close to each VCC and VCCIO pin to minimize power supply noise. The flash-based FPGA has low static power (~15 mW), but dynamic power scales with switching activity and frequency. Estimate total power using the Microchip Power Calculator tool to ensure adequate thermal management.
For the 144-ball FBGA package, use a 4-layer or more PCB with a solid ground plane and power plane. Route high-speed I/O signals with controlled impedance (e.g., 50 ohm single-ended) and keep trace lengths matched for differential pairs. Place decoupling capacitors on the bottom side directly under the FPGA to minimize loop inductance. Follow the manufacturer's layout guidelines in the ProASIC3 FPGA User Guide for optimal signal integrity.
A common pitfall is forgetting to connect the JTAG pins for programming. Ensure TCK, TDI, TDO, TMS, and TRST are properly terminated and accessible for in-system programming. Also, do not leave unused I/O pins floating; configure them as outputs or tie them to a defined level to avoid excessive leakage current. Verify that all VCC and GND pins are connected, as missing connections can cause erratic behavior.
Informações de conformidade
RoHS compliant per distributor listings. Not AEC-Q100 qualified. Lead-free per package description. REACH and conflict minerals status not specified in provided data.
