A3PE3000-1FGG484I - Flash FPGA, 3M Gates | Microchip Technology
N.º da peça: A3PE3000-1FGG484I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1782.14 | $1.782,14 |
| 10 | $1603.93 | $16.039,30 |
| 100 | $1514.82 | $151.482,00 |
| 500 | $1425.71 | $712.855,00 |
| 1.000 | $1336.6 | $1.336.600,00 |
A3PE3000-1FGG484I Visão geral
A field-programmable gate array (FPGA) is a semiconductor device whose logic fabric is configured by the designer after manufacturing rather than being fixed at the foundry. FPGAs implement parallel hardware data paths using configurable logic blocks, embedded memory, and programmable routing. ProASIC3E belongs to the flash-based FPGA hypernym, which contrasts with SRAM-based FPGAs that require external configuration memory. Because the configuration is stored in flash cells, the A3PE3000-1FGG484I is live at power-up and offers higher security against readback, simplifying system design and reducing bill-of-materials cost.
Key features include a 130-nm, seven-layer-metal (six copper) CMOS process, 1.5 V core supply, system performance up to 231 MHz, and up to 616 user I/O across the family. The 504 Kbit true dual-port SRAM supports simultaneous read/write for FIFOs and multi-clock domain buffering. Flash-based security features and the green FGG finish support lead-free assembly while making the configuration nonvolatile and more resistant to unauthorized readback.
Architecturally, the device implements Microsemi/Microchip VersaTile logic elements surrounded by embedded SRAM blocks and programmable I/O. The flash switch fabric is configured in-system via JTAG using Microchip's FlashPro programmer. Since configuration memory is nonvolatile, no boot flash or FPGA configuration controller is required. The part also supports optional soft ARM processor cores for SoC-style designs, per the ProASIC3E datasheet description.
Typical applications include industrial motor control, communications line cards, video capture/processing, medical equipment, automotive infotainment, and aerospace interfaces where low cost, low power, and secure flash configuration are needed. With 341 user I/O, it can interface to parallel ADC/DACs, SDRAM controllers, Ethernet PHYs, and custom backplanes.
When designing, provide a clean 1.5 V core supply with adequate decoupling at the many VCC balls, and use Microchip Libero SoC software for timing closure and power estimation. For FGG484, thermal relief and ground plane design are important because the BGA has no exposed pad; route the 1.0 mm pitch with microvias or fine trace widths.
This page combines distributor-verified pricing, drop-in FBGA-484 alternatives, package diagrams, and practical design notes not printed in the manufacturer datasheet, helping engineers make faster, more confident replacement and procurement decisions.
Alternativas drop-in para A3PE3000-1FGG484I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3PE3000-1FGG484I (mesmo formato e footprint) — diferindo em Package, Family, RoHS Status, Process Technology, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3PE3000-2FGG484I
✅ Drop-In✓ Em estoque
$89.4 / unidade
Ver ficha técnica →A3PE3000L-1FGG484I
✅ Drop-In✓ Em estoque
$104.5 / unidade
Ver ficha técnica →A3PE3000-1FGG484
✅ Drop-In✓ Em estoque
$1425.71 / unidade
Ver ficha técnica →A3PE3000-1FG484I
✅ Drop-In✓ Em estoque
$125 / unidade
Ver ficha técnica →M1A3PE3000-FG484
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3PE3000-2FG484I
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$59.6 / unidade
Ver ficha técnica →A3PE3000-1FGG484I Classificações máximas e características elétricas
| Product Family | ProASIC3E |
| System Gates | 3,000,000 (3M) |
| Logic Elements | 35,000 |
| Embedded SRAM | 504 Kbits (516,096 bits) |
| User I/O (FGG484) | 341 |
| Total Balls | 484 |
| Encapsulamento | 484-ball FBGA, 1.0 mm pitch (FGG484) |
| Logic Family | CMOS |
| Tensão de alimentação | 1.5 V |
| System Performance | 231 MHz |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS |
| Temperatura de operação | 0 to 70 C (per Digchip listing; confirm I-grade limits) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant (FGG green package) |
| Speed Grade | -1 |
| Max User I/O (Family) | 616 |
Guia de Configuração de Pinos do A3PE3000-1FGG484I 484-ball fbga, 1.0 mm pitch (fgg484)
Configuração de pinos para A3PE3000-1FGG484I (pacote 484-ball fbga, 1.0 mm pitch (fgg484)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A3PE3000-1FGG484I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A3PE3000-1FGG484I é adequado para 6 aplicaçãos: Industrial Motor Control, Communications Line Card, Video Capture and Processing, Medical Equipment, Aerospace and Defense Interfaces, Automotive Infotainment.
Industrial Motor Control
The A3PE3000-1FGG484I fits industrial motor control by providing 341 user I/O for multiple encoder interfaces, PWM channels, and isolated gate-driver signals. At a 1.5V core and 130-nm flash CMOS process, the FPGA can execute parallel time-critical loops without the overhead of an MCU. The 504 Kbit dual-port SRAM serves as a circular buffer for current and position data, while flash-based configuration ensures deterministic startup without external configuration memory. Its industrial temperature grade allows operation in cabinets with limited cooling, and the 3M system gates are sufficient for dual-axis or multi-axis feedback algorithms. Using Microchip Libero, designers can implement a custom motor-control SoC with soft ARM cores and hardware comparators, reducing BOM count compared to a DSP-plus-FPGA partition.
Recomendado
Communications Line Card
The A3PE3000-1FGG484I is well-suited to communications line cards because its 341 user I/O can connect to multiple Ethernet PHYs, SERDES devices, and backplane transceivers. The 504 Kbit true dual-port SRAM supports packet buffering and clock-domain crossing FIFOs. The flash configuration makes the FPGA live at power-up, which is important for line cards that must enumerate or forward traffic quickly after reset. The 1.5V core and green FGG484 package help minimize power density in dense chassis designs. System performance up to 231 MHz is adequate for protocol framing, CRC generation, and simple packet classification. For higher-speed interfaces, FPGA I/O banks can be configured for LVDS or HSTL, while the embedded dual-port RAM reduces the need for external FIFOs.
Recomendado
Video Capture and Processing
In video systems, the A3PE3000-1FGG484I can capture parallel pixel data from CMOS sensors or video decoders, perform format conversion, and output to a display controller. The 35,000 logic elements provide enough fabric for line buffers, scalers, and color-space conversion algorithms. The embedded 504 Kbit SRAM can hold several video lines for real-time processing, and the 231 MHz performance is sufficient for standard-resolution video paths. Multiple I/O banks allow mixed-voltage connection to 3.3V sensor interfaces and 1.8V memory interfaces. Designers can implement custom video timing generators in fabric, reducing external components. The flash-based design avoids boot delay so the video pipeline can start immediately after power-up.
Recomendado
Medical Equipment
The A3PE3000-1FGG484I supports medical equipment applications such as patient monitors, imaging sub-systems, and diagnostic instrumentation. Its 3M system gates and 35K logic elements can implement multiple sensor acquisition channels, digital filtering, and display interfaces in parallel. The 1.5V core and flash-based configuration provide low static power and reliable startup, important for battery-backed or bedside devices. The industrial temperature grade ensures operation in equipment that may be exposed to temperature swings. With 341 I/O, designers can interface to ADCs, DACs, and communication transceivers without complex glue logic. Microchip's long-term availability and flash technology make it easier to manage regulatory recertification compared to SRAM FPGAs that change boot memory content.
Recomendado
Aerospace and Defense Interfaces
The A3PE3000-1FGG484I finds use in aerospace and defense systems for bus bridging, discrete I/O, and secure boot applications. The flash-based FPGA offers live-at-power-up behavior and readback protection, which is advantageous in tamper-conscious designs. With 341 user I/O, it can interface to MIL-STD-1553 transceivers, ARINC-429 lines, and custom backplane buses. The 504 Kbit SRAM supports protocol buffers and command-response tables. The green FGG484 package is suitable for lead-free assembly, while the M1A3PE3000-FG484 military variant is available for extended temperature and screening. Designers can use the soft ARM processor option to integrate mission-management logic into a single device, reducing board space and supply-chain complexity.
Recomendado
Automotive Infotainment
The A3PE3000-1FGG484I can be used in automotive infotainment and telematics for display bridging, sensor pre-processing, and policy control. The industrial temperature suffix is better suited than commercial FPGAs for cabin and under-hood environments. The 3M system gates allow integration of CAN or LIN interface logic, video overlay, and dashboard communication. The flash-based configuration eliminates external boot memory, improving reliability against corrupt configuration during power cycling. The 1.5V core and green FGG package help meet thermal and environmental requirements. Although this standard part is not formally AEC-Q100 qualified, designers can perform additional screening for automotive projects. For more complex automotive SoC designs, consider the M1AFS1500 series.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3PE3000-1FGG484I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3PE3000-2FGG484I | A3PE3000L-1FGG484I | A3PE3000-1FGG484 | A3PE3000-1FG484I | M1A3PE3000-FG484 |
|---|---|---|---|---|---|---|
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Logic Elements | 35,000 | 35,000 | 35,000 | 35,000 | 35,000 | 35,000 |
| Embedded SRAM | 504 Kbits | 504 Kbits | 504 Kbits | 504 Kbits | 504 Kbits | 504 Kbits |
| User I/O (FGG484) | 341 | 341 | 341 | 341 | 341 | 341 |
| Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | Industrial (I) | Industrial (I) | Industrial (I) | Commercial | Industrial (I) | Military/Aerospace |
| RoHS / Green Finish | Yes (FGG green) | Yes (FGG green) | Yes (FGG green) | Yes (FGG green) | No (FG non-green) | No (FG non-green) |
Principais diferenciais
- Flash-based live-at-power-up reduces system BOM (vs A3PE3000-2FGG484I)
- Industrial temperature grade (vs A3PE3000-1FGG484)
- Green FGG package with RoHS compliance (vs A3PE3000-1FG484I)
Notas de projeto
Estimated: For a 35KLE ProASIC3E design at 50% toggle rate and 100 MHz, core power can be several hundred milliwatts. Use Microchip Libero power estimator for your specific utilization. Decouple each VCC ball with a 0.1 uF ceramic and provide a 10 uF bulk capacitor per supply group. The 1.5 V core supply must be low-noise; avoid sharing this rail with I/O transients.
The FGG484 package uses 1.0 mm ball pitch and no exposed pad. Route with microvias or fine trace/space of 0.1 mm/0.1 mm. Place decoupling capacitors on the opposite side of the BGA, as close to the power balls as possible. Provide solid ground referencing for the three I/O banks, and do not route high-speed differential pairs under the large BGA body unless there is a continuous ground plane.
Do not omit the JTAG programming header: flash FPGAs are programmed through JTAG with a FlashPro programmer, and the design can be secured with FlashLock. Verify I/O bank supply voltages before configuration; powering a bank at the wrong voltage can damage I/O cells. Follow the datasheet power-up sequence for the 1.5 V core and I/O supplies, especially in multi-rail systems.
Informações de conformidade
FGG484 green package; RoHS=Yes per Xecor comparison. FPGA not AEC-Q100 qualified.
