A3PE3000L-1FGG484I - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
N.º da peça: A3PE3000L-1FGG484I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $133.5 | $1.335,00 |
| 100 | $121 | $12.100,00 |
| 500 | $112 | $56.000,00 |
| 1.000 | $104.5 | $104.500,00 |
A3PE3000L-1FGG484I Visão geral
A Field Programmable Gate Array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks and programmable interconnects that designers configure after manufacturing. FPGAs sit within the broader programmable logic hierarchy: FPGA -> programmable logic device -> digital integrated circuit -> semiconductor. Unlike SRAM-based FPGAs, ProASIC3L devices use a flash-based fabric that is non-volatile, single-chip, and instantly-on at power-up with no external configuration device required.
Key features of the A3PE3000L include a core supply range of 1.14V to 1.575V (1.2V nominal, up to 1.5V operation), FlashFreeze technology that dramatically reduces dynamic power by roughly 40% and static power by roughly 50% versus the standard ProASIC3 family, and reprogrammability supporting in-system updates. The low-power L variant targets battery-powered and thermally constrained systems where leakage and dynamic power dominate the power budget.
Technically, the device is fabricated on a 130 nm flash process and belongs to the ProASIC3L family derived from Actel/Microsemi architecture. It integrates abundant advanced features such as embedded RAM blocks totaling 516096 bits and up to 341 user-accessible I/O pins, supporting both single-chip solutions and small-footprint designs with low total cost of ownership.
Typical applications include portable and battery-operated instrumentation, industrial automation and control, communications line cards requiring power-gated standby modes, and medical monitoring equipment where the FlashFreeze mode preserves state while cutting power consumption.
When designing with this device, verify core voltage sequencing and exploit FlashFreeze entry/exit timing in the power budget analysis; I/O bank voltage selection must match adjacent-board logic standards before PCB release.
This page synthesizes distributor pricing, drop-in alternatives, design notes, and FAQ content not found in the manufacturer datasheet.
Alternativas drop-in para A3PE3000L-1FGG484I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3PE3000L-1FGG484I (mesmo formato e footprint) — diferindo em Package, Family, System Gates, Configuration, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3PE3000L-1FGG484
✅ Drop-In✓ Em estoque
$134 / unidade
Ver ficha técnica →A3PE3000L-FGG484
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →A3PE3000-1FGG484I
✅ Drop-In✓ Em estoque
$1336.6 / unidade
Ver ficha técnica →A3PE3000-2FGG484
✅ Drop-In✓ Em estoque
$28.9 / unidade
Ver ficha técnica →A3PE3000L-2FGG484I
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
A3PE3000L-1FGG484I Classificações máximas e características elétricas
| Family | ProASIC3L |
| Number of Gates | 3000000 |
| Total RAM Bits | 516096 |
| Number of I/O | 341 |
| Tensão de alimentação | 1.14 V to 1.575 V |
| Core Voltage (Nominal) | 1.2 V |
| Core Voltage Range (per datasheet) | 1.2 V to 1.5 V |
| Speed Grade | -1 |
| Encapsulamento / Caixa | 484-BGA |
| Supplier Device Package | 484-FPBGA (23x23) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +100C (TJ) |
| Technology | 130 nm Flash |
| Programmable Type | In System Programmable (flash-based, non-volatile) |
| Packaging | Tray |
| Status RoHS | ROHS3 Compliant |
| Manufacturer Lead Time | 8 weeks |
| Product Status | Active |
Guia de Configuração de Pinos do A3PE3000L-1FGG484I 484-fpbga (23x23)
Configuração de pinos para A3PE3000L-1FGG484I (pacote 484-fpbga (23x23)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A3PE3000L-1FGG484I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A3PE3000L-1FGG484I é adequado para 6 aplicaçãos: Portable and Battery-Powered Instrumentation, Industrial Automation and Control, Communications Line Cards, Medical Monitoring Equipment, Aerospace and Defense Subsystems, IoT Gateways and Smart Edge Nodes.
Portable and Battery-Powered Instrumentation
The A3PE3000L-1FGG484I fits portable instrumentation because its 1.2V nominal core cuts dynamic power roughly in proportion to V-squared, while FlashFreeze technology reduces static power about 50% versus the standard ProASIC3 family per Microchip's datasheet. In handheld data loggers and field test instruments, the FPGA bridges sensors to processors between measurement bursts, entering FlashFreeze standby while preserving register and RAM state. With 341 user I/Os in a 23x23 mm 484-ball package, it replaces multiple glue-logic devices, and its flash fabric removes the external configuration flash, saving board area and boot energy.
Recomendado
Industrial Automation and Control
Industrial controllers benefit from the A3PE3000L-1FGG484I's industrial temperature rating of -40C to +100C junction and its 3 million gate fabric, which implements motion sequencing, safety interlocks, and multi-protocol I/O handling. The flash-based, non-volatile configuration means machines power up instantly without bitstream reload - critical for line restart after outages. Its 516096 RAM bits buffer sensor data locally, while the 1.14V to 1.575V supply tolerance rides through industrial rail sag. FlashFreeze mode keeps remote I/O nodes in low-power standby between polling cycles, cutting cabinet thermal load and extending service life of convection-cooled enclosures.
Recomendado
Communications Line Cards
In telecom and networking line cards, the A3PE3000L-1FGG484I performs framing, grooming, and board management with 341 user I/Os interfacing PHY devices and backplane connectors. The -1 speed grade supports the moderate internal clock rates of management-plane logic, while the low 1.2V core keeps thermal budgets within sealed rack enclosures. FlashFreeze enables rapid standby when cards are powered down but must hold state for fast reactivation. The single-chip flash design also improves configuration security in carrier equipment by eliminating the external bitstream flash that SRAM FPGAs require, reducing the board's attack surface.
Recomendado
Medical Monitoring Equipment
Patient monitors and diagnostic devices exploit the A3PE3000L-1FGG484I's low static power and FlashFreeze standby to meet strict thermal limits for skin-adjacent enclosures. The flash FPGA's instant-on behavior means monitoring channels are live immediately at power-up, essential in emergency-care equipment where boot delay is unacceptable. Its 3 million gates integrate multi-channel biopotential front-end sequencing, alarm logic, and display interfaces in one device, while the industrial -40C to +100C junction range covers transport and storage extremes. ROHS3 compliance per Microchip data supports medical RoHS directives for manufactured assemblies.
Recomendado
Aerospace and Defense Subsystems
The ProASIC3L architecture originates from Actel/Microsemi, a supplier with a long aerospace heritage, and the flash fabric is inherently more SEU-tolerant for configuration storage than SRAM cells, making the A3PE3000L-1FGG484I attractive for avionics housekeeping, telemetry formatting, and payload interface logic. The wide -40C to +100C junction range handles unconditioned equipment bays, and single-chip non-volatile configuration avoids bootloader complexity in systems where power-up predictability is verified. Designers should perform programmatic radiation assessment for their specific mission profile, as this industrial-grade device is not inherently radiation-hardened.
Recomendado
IoT Gateways and Smart Edge Nodes
Edge gateways use the A3PE3000L-1FGG484I as a deterministic protocol bridge between field buses and host processors. Its 1.14V to 1.575V supply tolerance accommodates noisy shared rails, and FlashFreeze mode lets the node idle between radio wake intervals with design state intact, extending battery-backup holdup time. With 516096 RAM bits, the FPGA preprocesses sensor streams before handing data to the MCU, offloading real-time tasks. Because the fabric is flash-based, field firmware updates reprogram the device in-system without a separate configuration flash, and the ROHS3-compliant 484-ball BGA supports standard lead-free reflow assembly in volume production.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3PE3000L-1FGG484I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3PE3000L-1FGG484 | A3PE3000L-FGG484 | A3PE3000-1FGG484I | A3PE3000-2FGG484 |
|---|---|---|---|---|---|
| Package | 484-BGA (FGG484, 23x23 mm) | 484-BGA (FGG484) - same | 484-BGA (FGG484) - same | 484-BGA (FGG484) - same | 484-BGA (FGG484) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Gate Density | 3000000 | 3000000 | 3000000 | 3000000 | 3000000 |
| Total RAM Bits | 516096 | 516096 | 516096 | 516096 | 516096 |
| User I/O | 341 | 341 | 341 | 341 | 341 |
| Supply Voltage | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.14 V to 1.575 V | 1.425 V to 1.575 V (1.5 V core) | 1.425 V to 1.575 V (1.5 V core) |
| Power Profile | Low power (FlashFreeze, ~40% lower dynamic, ~50% lower static) | Same low-power profile | Same low-power profile | Standard ProASIC3E power (higher) | Standard ProASIC3E power (higher) |
| Speed Grade | -1 | -1 | Base grade | -1 | -2 (faster) |
Principais diferenciais
- Lowest power in the 3M-gate class via FlashFreeze technology (vs A3PE3000-1FGG484I)
- Non-volatile single-chip configuration (vs Xilinx XC6SLX9 (Spartan-6))
- Industrial temperature at same footprint (vs A3PE3000L-1FGG484)
Notas de projeto
Estimate the core rail budget before selecting regulators: the A3PE3000L-1FGG484I runs a 1.2V nominal core (1.14V to 1.575V range per distributor data), and dynamic power scales with V^2, so regulating at 1.2V instead of 1.5V saves roughly 36% core dynamic power. Use Microchip's Libero power calculator with your actual switching activity for accurate estimates, and reserve margin for FlashFreeze entry/exit transients.
The 484-ball FGG484 package (1.0 mm pitch, 23x23 mm) requires a fine-pitch BGA footprint with via-in-pad or dogbone escape routing; plan for at least 4 signal layers plus dedicated core and I/O ground planes. Group I/O banks so each bank's VCCI rail matches the adjacent-chip logic standard, and place bank decoupling capacitors within 2 mm of the ball. Per the ProASIC3L datasheet layout guidance, follow the recommended power-plane segmentation for core versus I/O rails.
Estimated: with the rated -40C to +100C junction limit, a design dissipating 1.5 W in the 484-FPBGA needs theta-JA low enough to hold TJ below 100C at the worst-case ambient; for example, at 60C ambient the allowable theta-JA is about (100-60)/1.5 = 26.7 C/W, typically requiring solid ground-plane copper and possibly airflow. Verify with Microchip's thermal application notes and your measured switching activity rather than worst-case toggle assumptions.
Do not substitute the FG484 package variant for the FGG484: the pitch codes differ and footprints are not interchangeable, a frequent sourcing error in the secondary market. Also confirm the temperature suffix - the commercial grade A3PE3000L-1FGG484 is drop-in only for 0C to +70C applications. Finally, since the flash fabric is one-time-programmable per security key unless reprogram mode is enabled, plan your reprogramming flow in Libero before production programming.
Informações de conformidade
ROHS3 Compliant per Microchip USA product listing. REACH, halogen-free, and conflict minerals status not stated in provided data.