A3PE3000-FG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
N.º da peça: A3PE3000-FG324I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1 | $1,00 |
| 10 | $1 | $10,00 |
| 100 | $1 | $100,00 |
| 500 | $1 | $500,00 |
| 1.000 | $1 | $1.000,00 |
A3PE3000-FG324I Visão geral
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory cells rather than SRAM, so it powers up instantly without an external configuration PROM and is inherently single-chip. Within the programmable logic hierarchy, the A3PE3000 sits in the mid-density range of the ProASIC3/ProASIC3E family, which is part of the broader FPGA -> programmable logic -> semiconductor taxonomy from Microsemi (now Microchip Technology).
Key features include nonvolatile flash programming that eliminates boot-time configuration and improves secure operation, support for high-performance 32-bit soft processors, low total cost of ownership through single-chip integration, and reprogrammability in-system. The 324-ball FBGA footprint with 221 available user I/Os provides substantial interface density for a mid-density device.
Technically, the device is manufactured on a 130nm flash process operating from a 1.5V core supply. The ProASIC3E architecture combines VersTiles logic elements with embedded block RAM and abundant advanced features such as on-chip PLLs and I/O standards support for common single-ended and differential signaling, enabling glue logic consolidation, bus bridging, and control-plane designs.
Typical applications include industrial automation control, communications and networking line cards, aerospace and defense subsystems requiring instant-on operation, and secure single-chip designs where external boot flash is undesirable. The industrial grade I suffix targets extended-temperature environments.
When designing with this device, verify power sequencing and supply rail design against the manufacturer datasheet, and use Libero SoC design software for synthesis and place-and-route.
This page synthesizes verified distributor data, drop-in alternatives from the same ProASIC3E family, and practical design guidance not consolidated on the manufacturer page.
Alternativas drop-in para A3PE3000-FG324I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3PE3000-FG324I (mesmo formato e footprint) — diferindo em Package, RoHS Status, Family, Operating Temperature, System Gates.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3PE3000-FG324
✅ Drop-In✓ Em estoque
$112.3 / unidade
Ver ficha técnica →A3PE3000-FGG324I
✅ Drop-In✓ Em estoque
$198 / unidade
Ver ficha técnica →A3PE3000-2FGG324
✅ Drop-In✓ Em estoque
$216 / unidade
Ver ficha técnica →A3PE3000L-FGG324I
✅ Drop-In✓ Em estoque
$62.65 / unidade
Ver ficha técnica →M1A3PE3000-FG324I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3PE3000-1FG324I
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$196 / unidade
Ver ficha técnica →A3PE3000-FG324I Classificações máximas e características elétricas
| Family | ProASIC3E |
| Logic Elements | 35K (per distributor listing) |
| System Gates | 3M (3,000,000 gates) |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm flash |
| Core Supply Voltage | 1.5 V |
| Number of I/Os | 221 |
| Configuration Memory | 516096 (internal flash, nonvolatile) |
| Encapsulamento | 324-BGA (FBGA) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +125C (industrial) |
| Programming Type | In-System Programmable (flash, nonvolatile) |
Guia de Configuração de Pinos do A3PE3000-FG324I 324-bga (fbga)
Configuração de pinos para A3PE3000-FG324I (pacote 324-bga (fbga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para A3PE3000-FG324I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
A3PE3000-FG324I é adequado para 6 aplicaçãos: Industrial Automation and Control, Communications and Networking Line Cards, Aerospace and Defense Subsystems, Secure Single-Chip Designs, Test and Measurement Instrumentation, Medical and Diagnostic Equipment.
Industrial Automation and Control
The A3PE3000-FG324I fits industrial automation controllers because its flash-based, instant-on fabric eliminates configuration boot delays that PLC and motor-control sequencers cannot tolerate, and its 221 user I/Os consolidate sensor interfaces, encoder inputs, and fieldbus glue logic into one 324-ball FBGA device. With 231 MHz system performance and a 1.5V core, it handles deterministic state machines and high-speed interlocks while dissipating less power than SRAM FPGA alternatives of similar density. Deployed between an industrial CPU module and I/O cards, it adds no configuration-flash failure point on the board - a meaningful reliability gain in factory environments rated -40C to +125C at the device level for industrial temperature zones.
Recomendado
Communications and Networking Line Cards
Line cards and network interface boards benefit from the A3PE3000-FG324I's combination of 3M gates, 231 MHz performance, and abundant I/O for bus bridging, framing, and backplane glue logic. The ProASIC3E embedded memory blocks buffer packet fragments and status registers, while the nonvolatile flash configuration lets a card become operational within milliseconds of slot insertion - valuable in hot-swap telecom shelves. Placed between the MAC/PHY devices and the backplane connector, the FPGA absorbs protocol glue and status multiplexing that would otherwise require multiple discrete devices, reducing BOM count and total cost of ownership on 130nm-class designs with mature, proven timing.
Recomendado
Aerospace and Defense Subsystems
Defense and avionic subsystems favor the A3PE3000-FG324I because flash-based ProASIC3E devices power up instantly and do not expose configuration bitstreams on an external bus, reducing both boot latency and configuration-readout attack surface. The industrial temperature rating (-40C to +125C) and 324-ball FBGA package with 221 I/Os support conduction-cooled boards processing sensor aggregation, UART/SPI bridges, and safety monitor logic. Microsemi (now Microchip) ProASIC3 devices have a long heritage in space and defense programs, and the single-chip architecture removes the external PROM whose latch-up and seeding concerns complicate radiation-aware designs in this density class.
Recomendado
Secure Single-Chip Designs
Designs that must not carry external configuration memory - secure industrial gateways, payment terminals, and protected control modules - use the A3PE3000-FG324I because its 516096-bit internal flash holds the bitstream on-chip. Unlike SRAM FPGAs that load configuration from an exposed SPI flash at every power-up, the ProASIC3E device presents no readable bitstream interface in normal operation, simplifying design security reviews. With 3M gates and 231 MHz performance, it implements AES-style logic hooks, secure boot state machines, and tamper-response glue logic while the 221 I/Os connect protected peripherals, all within the industrial temperature envelope for field-deployed hardware.
Recomendado
Test and Measurement Instrumentation
Bench instruments and modular test hardware use the A3PE3000-FG324I as the timing, trigger, and bus-interface fabric: 3M gates implement trigger state machines and timestamping counters at up to 231 MHz, while the 221 user I/Os front-panel connectors, relay drivers, and host interfaces. Flash configuration means the instrument is measuring immediately at power-on with no boot sequencing from external memory, and reprogrammability via Libero SoC supports field firmware updates. The 1.5V core keeps on-card power budgets manageable in fanless enclosures, and the industrial temperature grade accommodates marginally rated rack environments without derating the host design.
Recomendado
Medical and Diagnostic Equipment
Diagnostic imaging interfaces and patient-adjacent control boards choose the A3PE3000-FG324I for its deterministic instant-on behavior and single-chip integration: sensor array multiplexing, motor/solenoid sequencing, and host bus bridging all fit within 3M gates, reducing component count on boards that must pass design-history documentation. The nonvolatile flash configuration avoids external boot devices that complicate IEC-style risk analyses, and the industrial temperature range covers sterilizer-adjacent bays. With 221 I/Os in a 0.5mm-class 324-ball FBGA footprint around 23x23mm-class dimensions per the package family, dense multi-board stacks remain feasible while the 1.5V core limits local heating.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3PE3000-FG324I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3PE3000-FG324 | A3PE3000-FGG324I | A3PE3000L-FGG324I | M1A3PE3000-FG324I |
|---|---|---|---|---|---|
| Package | 324-BGA (FBGA) | 324-BGA (FBGA) - same | 324-BGA (FBGA) - same | 324-BGA (FBGA) - same | 324-BGA (FBGA) - same |
| Brand | Microchip Technology (Microsemi/Actel legacy) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Temperature Grade | Industrial (-40C to +125C) | Commercial (0C to +70C) | Industrial (-40C to +125C) | Industrial (-40C to +125C) | Industrial (-40C to +125C) |
| System Gates | 3M | 3M | 3M | 3M | 3M |
| User I/Os | 221 | 221 | 221 | 221 | 221 |
| Soft Processor Support | Generic soft cores | Generic soft cores | Generic soft cores | Generic soft cores | ARM Cortex-M1 optimized |
| Speed Grade Options | Standard (-1 class) | Standard | Standard | L-family speed bins | Standard / -2 options |
Principais diferenciais
- Industrial temperature range in the 324-ball footprint (vs A3PE3000-FG324)
- Lower dynamic power at same density (vs A3PE3000-FGG324I)
- ARM Cortex-M1 soft processor option (vs A3PE3000-2FGG324)
Notas de projeto
Design the power tree around a 1.5V core rail plus the bank-dependent I/O rails for the FG324 package; each I/O bank takes one VCCI determined by the standard assigned in Libero SoC. Flash-based ProASIC3E devices draw inrush only for I/O activation, not configuration load, so power supply inrush sizing is simpler than SRAM FPGAs - but still verify per-bank hot-socket limits against the manufacturer datasheet before hot-swap backplane use.
The 324-ball FBGA requires controlled-impedance breakout with via-in-pad or dog-bone escapes on roughly 0.8mm-class ball pitch; follow Microchip's ProASIC3E PCB layout guidelines in the family user documentation. Place 100nF ceramic decoupling at the four corners plus center of the package and bulk capacitance near the regulators. Reserve one or two spare balls routed to test pads for future I/O redefinition - FPGA ball assignment is software-defined, so spare routing preserves layout reuse across speed and temperature grade variants.
Do not substitute commercial-grade A3PE3000-FG324 into an industrial enclosure: the 'I' suffix parts are qualified to -40C to +125C while the non-I parts are 0C to +70C. Also remember the L-family parts use a different core voltage, so although the footprint matches, an A3PE3000L drop-in requires power rail verification and bitstream recompilation. Verify supply voltage bands and MSL handling (bake if floor-life exceeded) before reflow of any FBGA package.
Informações de conformidade
Verified web data does not state RoHS/REACH status for this exact ordering code. The FGG324 variants denote lead-free ball metallurgy per Microchip naming conventions; obtain official material declarations from Microchip before qualification.
