A3PE3000-FG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
MPN: A3PE3000-FG324I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1 | $1.00 |
| 10 | $1 | $10.00 |
| 100 | $1 | $100.00 |
| 500 | $1 | $500.00 |
| 1,000 | $1 | $1,000.00 |
Drop-in alternatives for A3PE3000-FG324I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3PE3000-FG324
✅ Drop-In✓ In Stock
$112.3 / Unit
View Datasheet →A3PE3000-FGG324I
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →A3PE3000-2FGG324
✅ Drop-In✓ In Stock
$216 / Unit
View Datasheet →A3PE3000L-FGG324I
✅ Drop-In✓ In Stock
$62.65 / Unit
View Datasheet →M1A3PE3000-FG324I
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE3000-1FG324I
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
A3PE3000-FG324I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E |
| Logic Elements | 35K (per distributor listing) |
| System Gates | 3M (3,000,000 gates) |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm flash |
| Core Supply Voltage | 1.5 V |
| Number of I/Os | 221 |
| Configuration Memory | 516096 (internal flash, nonvolatile) |
| Package | 324-BGA (FBGA) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C (industrial) |
| Programming Type | In-System Programmable (flash, nonvolatile) |
A3PE3000-FG324I 324-bga (fbga) Pin Configuration Guide
Complete pinout information for A3PE3000-FG324I (324-bga (fbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000-FG324I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000-FG324I is suitable for 6 applications: Industrial Automation and Control, Communications and Networking Line Cards, Aerospace and Defense Subsystems, Secure Single-Chip Designs, Test and Measurement Instrumentation, Medical and Diagnostic Equipment.
Industrial Automation and Control
The A3PE3000-FG324I fits industrial automation controllers because its flash-based, instant-on fabric eliminates configuration boot delays that PLC and motor-control sequencers cannot tolerate, and its 221 user I/Os consolidate sensor interfaces, encoder inputs, and fieldbus glue logic into one 324-ball FBGA device. With 231 MHz system performance and a 1.5V core, it handles deterministic state machines and high-speed interlocks while dissipating less power than SRAM FPGA alternatives of similar density. Deployed between an industrial CPU module and I/O cards, it adds no configuration-flash failure point on the board - a meaningful reliability gain in factory environments rated -40C to +125C at the device level for industrial temperature zones.
Recommended
Communications and Networking Line Cards
Line cards and network interface boards benefit from the A3PE3000-FG324I's combination of 3M gates, 231 MHz performance, and abundant I/O for bus bridging, framing, and backplane glue logic. The ProASIC3E embedded memory blocks buffer packet fragments and status registers, while the nonvolatile flash configuration lets a card become operational within milliseconds of slot insertion - valuable in hot-swap telecom shelves. Placed between the MAC/PHY devices and the backplane connector, the FPGA absorbs protocol glue and status multiplexing that would otherwise require multiple discrete devices, reducing BOM count and total cost of ownership on 130nm-class designs with mature, proven timing.
Recommended
Aerospace and Defense Subsystems
Defense and avionic subsystems favor the A3PE3000-FG324I because flash-based ProASIC3E devices power up instantly and do not expose configuration bitstreams on an external bus, reducing both boot latency and configuration-readout attack surface. The industrial temperature rating (-40C to +125C) and 324-ball FBGA package with 221 I/Os support conduction-cooled boards processing sensor aggregation, UART/SPI bridges, and safety monitor logic. Microsemi (now Microchip) ProASIC3 devices have a long heritage in space and defense programs, and the single-chip architecture removes the external PROM whose latch-up and seeding concerns complicate radiation-aware designs in this density class.
Recommended
Secure Single-Chip Designs
Designs that must not carry external configuration memory - secure industrial gateways, payment terminals, and protected control modules - use the A3PE3000-FG324I because its 516096-bit internal flash holds the bitstream on-chip. Unlike SRAM FPGAs that load configuration from an exposed SPI flash at every power-up, the ProASIC3E device presents no readable bitstream interface in normal operation, simplifying design security reviews. With 3M gates and 231 MHz performance, it implements AES-style logic hooks, secure boot state machines, and tamper-response glue logic while the 221 I/Os connect protected peripherals, all within the industrial temperature envelope for field-deployed hardware.
Recommended
Test and Measurement Instrumentation
Bench instruments and modular test hardware use the A3PE3000-FG324I as the timing, trigger, and bus-interface fabric: 3M gates implement trigger state machines and timestamping counters at up to 231 MHz, while the 221 user I/Os front-panel connectors, relay drivers, and host interfaces. Flash configuration means the instrument is measuring immediately at power-on with no boot sequencing from external memory, and reprogrammability via Libero SoC supports field firmware updates. The 1.5V core keeps on-card power budgets manageable in fanless enclosures, and the industrial temperature grade accommodates marginally rated rack environments without derating the host design.
Recommended
Medical and Diagnostic Equipment
Diagnostic imaging interfaces and patient-adjacent control boards choose the A3PE3000-FG324I for its deterministic instant-on behavior and single-chip integration: sensor array multiplexing, motor/solenoid sequencing, and host bus bridging all fit within 3M gates, reducing component count on boards that must pass design-history documentation. The nonvolatile flash configuration avoids external boot devices that complicate IEC-style risk analyses, and the industrial temperature range covers sterilizer-adjacent bays. With 221 I/Os in a 0.5mm-class 324-ball FBGA footprint around 23x23mm-class dimensions per the package family, dense multi-board stacks remain feasible while the 1.5V core limits local heating.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000-FG324I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000-FG324 | A3PE3000-FGG324I | A3PE3000L-FGG324I | M1A3PE3000-FG324I |
|---|---|---|---|---|---|
| Package | 324-BGA (FBGA) | 324-BGA (FBGA) - same | 324-BGA (FBGA) - same | 324-BGA (FBGA) - same | 324-BGA (FBGA) - same |
| Brand | Microchip Technology (Microsemi/Actel legacy) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Temperature Grade | Industrial (-40C to +125C) | Commercial (0C to +70C) | Industrial (-40C to +125C) | Industrial (-40C to +125C) | Industrial (-40C to +125C) |
| System Gates | 3M | 3M | 3M | 3M | 3M |
| User I/Os | 221 | 221 | 221 | 221 | 221 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | Lower (low-power core) - [DATA_NEEDED] | 1.5 V |
| Soft Processor Support | Generic soft cores | Generic soft cores | Generic soft cores | Generic soft cores | ARM Cortex-M1 optimized |
| Speed Grade Options | Standard (-1 class) | Standard | Standard | L-family speed bins | Standard / -2 options |
Key Differentiators
- Industrial temperature range in the 324-ball footprint (vs A3PE3000-FG324)
- Lower dynamic power at same density (vs A3PE3000-FGG324I)
- ARM Cortex-M1 soft processor option (vs A3PE3000-2FGG324)
Design Notes
Design the power tree around a 1.5V core rail plus the bank-dependent I/O rails for the FG324 package; each I/O bank takes one VCCI determined by the standard assigned in Libero SoC. Flash-based ProASIC3E devices draw inrush only for I/O activation, not configuration load, so power supply inrush sizing is simpler than SRAM FPGAs - but still verify per-bank hot-socket limits against the manufacturer datasheet before hot-swap backplane use.
The 324-ball FBGA requires controlled-impedance breakout with via-in-pad or dog-bone escapes on roughly 0.8mm-class ball pitch; follow Microchip's ProASIC3E PCB layout guidelines in the family user documentation. Place 100nF ceramic decoupling at the four corners plus center of the package and bulk capacitance near the regulators. Reserve one or two spare balls routed to test pads for future I/O redefinition - FPGA ball assignment is software-defined, so spare routing preserves layout reuse across speed and temperature grade variants.
Do not substitute commercial-grade A3PE3000-FG324 into an industrial enclosure: the 'I' suffix parts are qualified to -40C to +125C while the non-I parts are 0C to +70C. Also remember the L-family parts use a different core voltage, so although the footprint matches, an A3PE3000L drop-in requires power rail verification and bitstream recompilation. Verify supply voltage bands and MSL handling (bake if floor-life exceeded) before reflow of any FBGA package.
Compliance Information
Verified web data does not state RoHS/REACH status for this exact ordering code. The FGG324 variants denote lead-free ball metallurgy per Microchip naming conventions; obtain official material declarations from Microchip before qualification.
