AD7575TCHIPS - 8-Bit 5µs CMOS Sampling ADC Die | Analog Devices
N.º da peça: AD7575TCHIPS ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.75 | $167,50 |
| 100 | $14.39 | $1.439,00 |
| 500 | $12.95 | $6.475,00 |
| 1.000 | $11.5 | $11.500,00 |
AD7575TCHIPS Visão geral
An SAR ADC is a type of analog-to-digital converter that uses a successive approximation register and an internal DAC to binary-search the input voltage, delivering deterministic latency and excellent static linearity. As part of the broader data converter hierarchy, SAR ADCs sit between flash converters (fastest, lowest resolution) and sigma-delta ADCs (highest resolution, slowest), and are the dominant architecture for 8–16 bit precision industrial sampling up to a few MSPS. The track/hold front end allows accurate conversion of fast input transients, an advantage over older integrating or flash-only designs.
Key features include 8-bit resolution, 5 µs conversion time, a built-in track/hold amplifier, single +5 V supply operation, low power CMOS design, and latched three-state data outputs. All eight data outputs are latched and three-state, allowing direct connection to an 8-bit microprocessor data bus without external bus drivers. The CHIPS (die) form factor enables miniaturization in hybrid assemblies and is intended for OEM module-level packaging rather than standard PCB mounting.
Architecturally, the AD7575 integrates a capacitive charge-redistribution DAC, comparator, SAR logic, and reference buffer on a single CMOS die. The CMOS process yields low power dissipation (typically tens of milliwatts during conversion) and high noise immunity. The latched three-state outputs also simplify opto-isolated or buffered data acquisition front ends.
Typical applications include process control data acquisition front ends, portable instrumentation, battery monitoring systems, isolated industrial sensor interfaces, and embedded 8-bit microcontroller analog input modules. The die package makes it attractive for size-constrained medical and aerospace hybrid assemblies where standard plastic packages cannot be used.
When designing with this part, allocate die bond-pad layout in advance because bare-die parts cannot accept rework. Provide a stable external reference and adequate decoupling at the supply bond pad to maintain linearity at full conversion rate.
This page synthesizes distributor pricing, lifecycle status, drop-in alternatives, and practical design notes for the AD7575TCHIPS that go beyond the manufacturer datasheet summary.
Alternativas drop-in para AD7575TCHIPS — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com AD7575TCHIPS (mesmo formato e footprint) — diferindo em Architecture, Data Interface, Input Type, Resolution, Supply Voltage.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
AD7575TCHIPS-REEL
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
AD7574TCHIPS
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
AD7575KN
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
AD7575BQ
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
AD7476BRTZ-REEL
✅ Drop-In✓ Em estoque
$2.85 / unidade
Ver ficha técnica →AD7575TCHIPS Classificações máximas e características elétricas
| Resolução | 8 bit |
| Number of Channels | 1 |
| Conversion Time | 5 µs (typical) |
| Taxa de amostragem | 200 kSPS (approx.) |
| Architecture | SAR (Successive Approximation Register) |
| Track/Hold | Built-in (input track/hold amplifier) |
| Input Type | Single-ended analog input |
| Tensão de alimentação | +5 V single supply |
| Data Interface | Parallel, microprocessor-compatible (CS, RD) |
| Data Output | 8-bit latched, three-state |
| Memory Mapping | Configurable as SLOW-MEMORY or ROM |
| Package / Form Factor | Bare Die (CHIPS / wafer form) |
| Process Technology | CMOS |
| Status do ciclo de vida | Not Recommended for New Designs (NRND) |
| List Price (1ku, from product page) | $14.39 starting (as of 2026-10-12) |
Guia de Configuração de Pinos do AD7575TCHIPS bare die (chips / wafer form)
Configuração de pinos para AD7575TCHIPS (pacote bare die (chips / wafer form)). Este componente analógico possui pinos de entrada, saída e alimentação. Consulte o datasheet do fabricante para configurações de offset null, compensação e pino de enable. Ideal para circuitos de condicionamento de sinal e amplificadores.
Nenhum dado detalhado de pinagem disponível para AD7575TCHIPS.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
AD7575TCHIPS é adequado para 7 aplicaçãos: Industrial Process Control Data Acquisition, Portable Battery-Powered Instrumentation, Isolated Industrial Sensor Interface, Medical Diagnostic Hybrid Modules, Aerospace and Defense Avionics Hybrids, Embedded 8-bit Microcontroller Analog Input, Test and Measurement Front Ends.
Industrial Process Control Data Acquisition
The AD7575TCHIPS fits industrial process-control front ends that digitize 0–5 V sensor signals from thermocouples, pressure transducers, and 4–20 mA loops. Its 8-bit resolution and 5 µs conversion time give roughly 200 kSPS, sufficient for multiplexed multi-channel loops updated at 1 kHz per channel. The +5 V single-supply operation simplifies analog rail design, while the built-in track/hold captures fast transient spikes from switching valves or relays. Latched three-state outputs allow direct connection to 8051, PIC, or Z80 microcontrollers without external bus drivers. As of 2026-10-12, this part remains in service for legacy DCS and PLC modules where re-qualification cost outweighs the price premium.
Recomendado
Portable Battery-Powered Instrumentation
The AD7575TCHIPS suits portable handheld instruments powered by 9 V batteries regulated to +5 V, including digital multimeters, data loggers, and field-calibration tools. Its low CMOS standby current keeps quiescent draw low between conversions, while the built-in track/hold lets the system capture transient events without an external sample-and-hold IC. The bare-die form factor supports miniaturized hybrid modules, allowing the data acquisition block to fit inside sealed IP67 enclosures. Engineers should budget decoupling capacitance at the supply bond pad and route analog/digital grounds separately to maintain 8-bit linearity across the operating temperature range.
Recomendado
Isolated Industrial Sensor Interface
The AD7575TCHIPS works well on the field side of an isolated analog front end, where the digital outputs drive an opto-isolator or digital isolator back to a microcontroller on the safe side. The latched three-state outputs simplify bidirectional data transfer through a single optocoupler channel by allowing the MCU to read and then float the bus. With 5 µs conversion, the system can update at 50 kHz with margin for opto-coupler propagation delay. This pattern is common in motor-drive feedback, isolated current sensing, and medical patient-isolation modules where the bare-die form enables integration into a sealed isolation barrier.
Recomendado
Medical Diagnostic Hybrid Modules
In medical diagnostic equipment such as blood analyzers, patient monitors, and benchtop chemistry readers, the AD7575TCHIPS is used inside custom hybrid modules that combine the ADC with signal conditioning, references, and optoisolators. Its bare-die form factor allows assembly into miniaturized hybrid circuits that fit inside sterile disposable cartridges or sealed benchtop analyzer bays. The 8-bit resolution is sufficient for colorimetric, pH, and conductivity readouts, and the 5 µs conversion allows multiplexed sensor panels. Designers should validate biocompatibility of the die-coat and wire-bond materials if the module contacts patient fluids.
Recomendado
Aerospace and Defense Avionics Hybrids
The AD7575TCHIPS appears in legacy aerospace and defense avionics hybrids where qualified bare-die parts are specified and re-qualification cost is prohibitive. Military and aerospace programs often pin-qualified part lists that include the AD7575 die family due to its long heritage and known radiation/EMI behavior. The +5 V CMOS architecture and 8-bit resolution suit flight-control sensor monitoring, navigation aids, and cockpit instrumentation. Aerospace-grade equivalents (e.g. AD7575/883) come with full MIL-STD-883 screening and traceability documentation.
Recomendado
Embedded 8-bit Microcontroller Analog Input
The AD7575TCHIPS was originally designed for direct connection to 8-bit microcontrollers like the 8051, Z80, and 68HC11. Its CS and RD control signals map the ADC as SLOW-MEMORY or ROM, so the CPU reads each conversion with a single MOVX or equivalent instruction. The +5 V supply matches the MCU rail, and the latched three-state outputs tie directly to the data bus without glue logic. This pattern is still used in retro-computing projects, industrial controllers, and educational microcontroller labs where the legacy interface is the design constraint.
Recomendado
Test and Measurement Front Ends
In benchtop test equipment such as logic analyzers, oscilloscope digitizer plug-ins, and bench DMMs, the AD7575TCHIPS provides a compact 8-bit digitizer channel that integrates into hybrid front-end modules. The built-in track/hold captures single-shot transients, while the 5 µs conversion supports digitizer sampling rates up to 200 kSPS per channel. Because the die can be co-packaged with input protection, attenuation, and reference circuitry, designers can build highly integrated probe heads and front-end modules that would be impractical with discrete packaged parts. Always allocate die-bond layout early in the mechanical design.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para AD7575TCHIPS — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | AD7575TCHIPS-REEL | AD7574TCHIPS | AD7575KN | AD7575BQ | AD7476BRTZ-REEL |
|---|---|---|---|---|---|---|
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Package / Form Factor | Bare Die (CHIPS) | Bare Die (CHIPS) - same | Bare Die (CHIPS) - same | Plastic DIP (N-18) | Ceramic DIP (Q-18) | SOT-23 / Bare Die option |
| Resolution | 8 bit | 8 bit | 8 bit | 8 bit | 8 bit | 12 bit |
| Conversion Time | 5 µs | 5 µs | 15 µs (slower) | 5 µs | 5 µs | 1 µs (faster) |
| Approx Sampling Rate | 200 kSPS | 200 kSPS | 66 kSPS | 200 kSPS | 200 kSPS | 1 MSPS |
| Built-in Track/Hold | Yes | Yes | No | Yes | Yes | Yes |
| Supply Voltage | +5 V single | +5 V single | +5 V single | +5 V single | +5 V single | +2.35 V to +5.25 V |
| Interface | Parallel (CS, RD) | Parallel (CS, RD) | Parallel (CS, RD) | Parallel (CS, RD) | Parallel (CS, RD) | SPI/QSPI/MICROWIRE serial |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | Active (recommended for new designs) |
Principais diferenciais
- Bare-die form factor for hybrid module integration (vs AD7575KN (plastic DIP))
- Built-in track/hold amplifier (vs AD7574TCHIPS)
- Simple microprocessor SLOW-MEMORY/ROM interface (vs AD7476BRTZ-REEL (modern 12-bit successor))
Notas de projeto
Because the AD7575TCHIPS is bare die, allocate die-bond pad layout, substrate traces, and wire-bond diagram early in the mechanical design. The bond-pad coordinates and function names must be implemented per the Analog Devices AD7575 datasheet mechanical section. Provide solid analog and digital ground planes on the substrate, with separate bond pads for AGND and DGND that join only at the ADC's ground bond pad. Add a 10 µF tantalum plus 0.1 µF ceramic decoupling capacitor within 5 mm of the +5 V bond pad to maintain linearity at full conversion rate.
Do not confuse the AD7575TCHIPS with the slower AD7574 - both are 8-bit SAR ADCs but the AD7574 lacks the built-in track/hold and runs at 15 µs conversion time. For multiplexed fast-signal acquisition above 50 kHz, only the AD7575 family is suitable. Also note that the CHIPS suffix indicates bare die; customers expecting a packaged plastic or ceramic part must order the AD7575KN or AD7575BQ instead. Mixing bare die and packaged parts on the same hybrid module introduces mechanical and qualification mismatches.
Route the analog input bond pad and reference bond pad with short, guarded traces on the substrate to minimize kickback from the internal capacitive DAC. Add a buffer amplifier (e.g. AD8628 or AD7450) in front of the analog input if the source impedance exceeds 1 kΩ, otherwise the track/hold acquisition time will degrade. Keep digital control signals (CS, RD) routed away from the analog input bond pad to avoid digital noise coupling during conversion. According to the AD7575 datasheet, hold CS low only for the duration of the read cycle to avoid bus contention.
Estimated: at +5 V supply and 200 kSPS continuous conversion, the CMOS architecture dissipates approximately 15–25 mW. Because the AD7575TCHIPS is bare die without a heatsink, thermal management must come from the substrate's thermal vias and metal pour. Bond-pad power dissipation is small compared with the substrate copper area's heat-spreading capacity, so a 25 × 25 mm copper landing pad keeps junction temperature within 10 °C of substrate temperature. For sealed hybrid modules, validate junction temperature against the qualified die maximum (typically 150 °C or 175 °C for MIL-STD-883).
