ADC1415S125HN-C18 - 14-bit, 125 Msps ADC w/ Input Buffer | Renesas
N.º da peça: ADC1415S125HN-C18 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $43.2 | $432,00 |
| 100 | $36.4 | $3.640,00 |
| 500 | $32.1 | $16.050,00 |
| 1.000 | $28.75 | $28.750,00 |
ADC1415S125HN-C18 Visão geral
An ADC (Analog-to-Digital Converter) is a data-acquisition component that converts real-world analog signals into discrete digital codes at a specified sample rate, sitting between a sensor/frontend and a DSP, FPGA, or microprocessor. Pipelined ADCs such as the ADC1415S125HN-C18 use a multi-stage architecture to balance high sample rates (tens to hundreds of Msps) with low power and small die area; they are widely adopted in communications infrastructure, instrumentation, and radar/medical imaging. The 14-bit resolution places this part in the mainstream tier used for high-SNR baseband digitisation rather than the 16/18-bit precision tier or the 8/10/12-bit high-speed tier.
Key headline specifications include a 14-bit resolution, 125 Msps maximum sample rate, integrated input buffer to ease front-end matching, and selectable CMOS or LVDS DDR digital outputs. The serial SPI interface allows in-system configuration of output mode and operating modes without external hardware straps. The 40-VFQFPN exposed-pad package provides a low thermal-resistance path, supporting continuous operation at high sampling rates.
Architecturally, the ADC1415S125HN-C18 combines an internal bandgap reference, a high-bandwidth input buffer, a multi-stage pipelined core, and digital error-correction logic to deliver calibrated 14-bit outputs. The pipelined topology yields one conversion per clock cycle at full throughput, while the on-chip buffer relaxes the demanding RF/impedance-matching requirements otherwise imposed on the driving amplifier chain.
Typical applications include multi-carrier communication receivers (LTE/5G baseband digitisation), cable infrastructure head-end equipment, radar and lidar front-ends, medical imaging systems, and high-speed industrial data acquisition. Designers select this part where a 14-bit envelope at 125 Msps plus a buffered input is required.
A key design consideration is the need to drive the buffered input with a low-noise differential amplifier to preserve SNR; the LVDS DDR output mode also requires tight PCB trace-length matching on the data lanes (typically within ±150 ps skew at 125 Msps) to maintain timing margins at the receiving FPGA/ASIC.
This page synthesises distributor pricing, package-level drop-in alternatives from within the same family, and practical design notes not collected in a single location by the manufacturer datasheet.
Alternativas drop-in para ADC1415S125HN-C18 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ADC1415S125HN-C18 (mesmo formato e footprint) — diferindo em Package, Input Type, Resolution, Data Interface, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ADC1415S105HN-C18
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →ADC1415S080HN-C18
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →ADC1415S065HN-C18
✅ Drop-In✓ Em estoque
$14.25 / unidade
Ver ficha técnica →ADC1412D065HN-C18
✅ Drop-In✓ Em estoque
$23.1 / unidade
Ver ficha técnica →ADC1015S125HN/C1
✅ Drop-In✓ Em estoque
$10.4 / unidade
Ver ficha técnica →ADC1213S125HN-C1
✅ Drop-In✓ Em estoque
$18.45 / unidade
Ver ficha técnica →ADC1415S125HN-C18 Classificações máximas e características elétricas
| Resolução | 14 bit |
| Number of Channels | 1 |
| Architecture | Pipelined |
| Maximum Sample Rate | 125 Msps |
| Input Buffer | Integrated (on-chip) |
| Digital Output Interface | CMOS or LVDS DDR (selectable) |
| Configuration Interface | Serial, SPI |
| Input Type | Single-ended (buffered) |
| Faixa de temperatura de operação | -40C to +85C |
| Encapsulamento | 40-VFQFPN Exposed Pad (6x6 mm) |
| Tipo de montagem | Surface Mount |
| Packaging | Tray |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do ADC1415S125HN-C18 40-vfqfpn exposed pad (6x6 mm)
Configuração de pinos para ADC1415S125HN-C18 (pacote 40-vfqfpn exposed pad (6x6 mm)). Este componente analógico possui pinos de entrada, saída e alimentação. Consulte o datasheet do fabricante para configurações de offset null, compensação e pino de enable. Ideal para circuitos de condicionamento de sinal e amplificadores.
Nenhum dado detalhado de pinagem disponível para ADC1415S125HN-C18.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
ADC1415S125HN-C18 é adequado para 6 aplicaçãos: Multi-Carrier LTE/5G Baseband Digitisation, Cable Infrastructure Head-End Receiver, Radar and Lidar Front-End Digitisation, Medical Imaging Ultrasound Receive Path, High-Speed Industrial Data Acquisition, Test & Measurement Instrumentation.
Multi-Carrier LTE/5G Baseband Digitisation
The ADC1415S125HN-C18 fits multi-carrier LTE and sub-6 GHz 5G baseband digitisation because its 125 Msps sample rate comfortably covers 20 MHz LTE carriers with sufficient oversampling margin, while the 14-bit resolution delivers the dynamic range required for crest-factor-heavy OFDMA waveforms. The integrated input buffer eases matching into the upstream IF filter and ADC driver, and the LVDS DDR output mode keeps skew well-controlled across the multi-lane interface to the baseband FPGA. Engineers benefit from the on-chip input buffer because it removes a costly external ADC driver (often a 1.5 W GaAs or SiGe part) from the BOM. The device's -40C to +85C industrial temperature range supports outdoor remote-radio-head deployments.
Recomendado
Cable Infrastructure Head-End Receiver
In DOCSIS 3.1 cable head-end and distribution equipment, the ADC1415S125HN-C18 digitises wideband downstream/upstream spectra (typically 200 MHz to 1 GHz analog IF after the tuner) where its 125 Msps rate and 14-bit envelope support multi-channel aggregation. The buffered input tolerates the long PCB trace plus diplexer network that is common between the tuner and the ADC, eliminating a costly inter-stage matched amplifier. The 40-VFQFPN exposed-pad package supports the densely populated line-card layouts characteristic of head-end chassis, where thermal headroom is constrained. Compared with a 12-bit alternative, the two extra bits add roughly 12 dB of SNR headroom, which directly improves MER in DOCSIS downstream paths.
Recomendado
Radar and Lidar Front-End Digitisation
Phased-array radar and lidar front-ends use the ADC1415S125HN-C18 to digitise IF or baseband signals at per-channel rates up to 125 Msps. The integrated input buffer provides the wideband linearity needed at high analog input frequencies where SFDR preservation matters, while the LVDS DDR digital output is well suited to multi-channel synchronisation across the array. The 14-bit resolution captures the dynamic range of weather-penetrating or foliage-penetrating radar modes where small targets must be resolved alongside large clutter returns. Designers should plan thermal dissipation carefully: at 125 Msps with LVDS output, the device dissipates noticeable power into the exposed pad, so a thermal via array under the e-pad is mandatory.
Recomendado
Medical Imaging Ultrasound Receive Path
Medical ultrasound receive chains deploy the ADC1415S125HN-C18 to digitise the down-converted RF echo signals after the TGC and LNA chain. The 125 Msps sample rate accommodates ultrasound IF frequencies up to ~50 MHz with margin, and the 14-bit resolution preserves the dynamic range required to see low-contrast tissue features. The buffered input is particularly valuable in ultrasound because it allows the ADC to sit on a separate digitiser board from the front-end, simplifying serviceability and reducing cable losses. The -40C to +85C industrial temperature rating covers the operating envelope inside the scanner chassis. Operating the part at lower sample rates (using the slower ADC1415S105/080/065 grades) reduces power dissipation, a key design constraint in dense multi-channel head boards.
Recomendado
High-Speed Industrial Data Acquisition
Automated test equipment and high-speed data-acquisition cards use the ADC1415S125HN-C18 where 14-bit accuracy at 125 Msps must coexist with industrial-grade temperature compliance. The integrated input buffer simplifies the front-end signal conditioning chain, which shortens the design cycle for production ATE platforms and rework-instrumentation modules. The CMOS/LVDS DDR output flexibility means the same part can drop into legacy parallel-CMOS board designs and into newer LVDS-based FPGA mezzanines, easing platform reuse across product generations. The 40-VFQFPN package's exposed pad delivers robust thermal performance in sealed rack-mount chassis where airflow is restricted compared with telecom switches.
Recomendado
Test & Measurement Instrumentation
Bench-top oscilloscope, spectrum-analyser and protocol-analyzer designs use the ADC1415S125HN-C18 as a per-channel digitiser where the integrated input buffer keeps channel-to-channel gain matching tight across the front-end. The 14-bit resolution at 125 Msps offers engineers the headroom needed to characterise RF and high-speed digital signals without sacrificing vertical resolution. The LVDS DDR output carries 14 bits at 125 Msps over a handful of differential pairs, simplifying the routing to the FPGA timing-and-display engine. Designers choosing between ADC1415S grades typically start at the 125 Msps version for headroom and select a slower grade only when power budget or cost demands the trade.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ADC1415S125HN-C18 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ADC1415S105HN-C18 | ADC1415S080HN-C18 | ADC1415S065HN-C18 | ADC1412D065HN-C18 | ADC1015S125HN/C1 |
|---|---|---|---|---|---|---|
| Package | 40-VFQFPN Exposed Pad (6x6 mm) | 40-VFQFPN Exposed Pad (6x6 mm) - same | 40-VFQFPN Exposed Pad (6x6 mm) - same | 40-VFQFPN Exposed Pad (6x6 mm) - same | 40-VFQFPN Exposed Pad (6x6 mm) - same | 40-VFQFPN Exposed Pad (6x6 mm) - same |
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Resolution | 14 bit | 14 bit | 14 bit | 14 bit | 14 bit | 10 bit |
| Maximum Sample Rate | 125 Msps | 105 Msps | 80 Msps | 65 Msps | 65 Msps | 125 Msps |
| Number of Channels | 1 | 1 | 1 | 1 | 2 (dual) | 1 |
| Input Buffer | Integrated | Integrated | Integrated | Integrated | Integrated | Integrated |
| Digital Output | CMOS or LVDS DDR | CMOS or LVDS DDR | CMOS or LVDS DDR | CMOS or LVDS DDR | CMOS or LVDS DDR | CMOS or LVDS DDR |
| Configuration Interface | Serial, SPI | Serial, SPI | Serial, SPI | Serial, SPI | Serial, SPI | Serial, SPI |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principais diferenciais
- Integrated input buffer eliminates a front-end ADC driver stage (vs ADC1415S105HN-C18)
- Highest sample-rate grade in the ADC1415S family (vs ADC1415S065HN-C18)
- Same footprint, lower cost when bandwidth allows (vs ADC1415S105HN-C18)
- 14-bit resolution vs 10-bit sibling (vs ADC1015S125HN/C1)
Notas de projeto
The ADC1415S125HN-C18 dissipates noticeable power at 125 Msps, particularly in LVDS DDR mode. The 40-VFQFPN exposed pad is the primary thermal path; a continuous ground copper pour connected via a thermal via array (typically a 3x3 grid of 0.3 mm vias on 1.0 mm pitch under the pad) is required to keep the junction within the -40C to +85C operating envelope. For multi-ADC boards (radar/lidar arrays), increase the copper area or add forced airflow to maintain margin.
In LVDS DDR output mode, the data, data-clock, and frame-clock LVDS pairs must be routed with controlled differential impedance (100 ohms) and intra-pair length matching held within roughly 150 ps of each other at 125 Msps. Skew mismatches directly erode timing margin at the receiving FPGA/ASIC. Keep LVDS traces length-matched within the pair and use solid reference-plane stitching vias alongside the differential pairs.
Do not assume a slow 125 Msps sample clock edges cleanly through the SPI configuration interface - register settings can be lost if SCK timing or CSN setup/hold is violated. Read the SPI register map in the Renesas datasheet carefully and assert CSN stable HIGH between transactions. When migrating between ADC1415S grade variants (065/080/105/125), remember that lower speed grades may have differing dynamic performance curves; re-validate SNR/SFDR at your analog input frequency.
Place the analog input decoupling (typically 0.1 uF X7R ceramic) and bulk capacitor (1-10 uF) within 2-3 mm of the AVDD pins. Keep the analog and digital grounds separated at the IC, joining them only at the exposed-pad ground pour. Power-rail filtering ferrite beads between the analog and digital supplies reduce switching-noise coupling into the sensitive analog frontend.
Informações de conformidade
RoHS and REACH compliance per Renesas product page. AEC-Q100 not qualified for this industrial-grade variant; check Renesas for AEC-Q100 qualified alternatives for automotive.
