ADSP-BF607BBCZ-5 - Dual-Core Blackfin DSP 500MHz | Analog Devices
N.º da peça: ADSP-BF607BBCZ-5 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $39.2 | $392,00 |
| 100 | $35.8 | $3.580,00 |
| 500 | $32.4 | $16.200,00 |
| 1.000 | $28.9 | $28.900,00 |
ADSP-BF607BBCZ-5 Visão geral
A Blackfin Digital Signal Processor is a member of the MSA (Micro Signal Architecture) family jointly developed by Analog Devices and Intel. Blackfin processors unify DSP and microcontroller functionality on a single deterministic core, which is why they are widely chosen for embedded applications that must execute both a real-time OS and computationally intense audio, video or control algorithms simultaneously. Within the broader taxonomy, the ADSP-BF607 sits at the same level as other embedded DSPs and microcontrollers and belongs to the integrated-circuits category of semiconductors.
Key features of the ADSP-BF607BBCZ-5 include a 500 MHz core clock per core, dual 16-bit or single 32-bit MAC per cycle, hardware video ports (PPI), USB 2.0 HS OTG, two CAN 2.0B controllers, a 10/100 Ethernet MAC, DDR/LPDDR memory controller, and rich peripheral integration for industrial networking. The device targets -40C to +85C operation with a 1.25 V internal core supply and is supplied in a 349-ball 19x19 mm Chip-Scale-BGA (CSPBGA). This "-5" speed grade variant runs the cores at the maximum 500 MHz frequency and is pin-compatible with the slower -4 (400 MHz) and -3 (300 MHz) grades of the ADSP-BF607 family.
Typical use cases include industrial motor control and Condition Monitoring, multi-channel audio processing and beam-forming, portable medical instrumentation, automotive audio and driver-assistance preprocessing, image processing pipelines, and networked smart-grid metering. The dual-core architecture lets one core run the control loop while the other core handles signal conditioning, freeing designers from the throughput compromises of single-core Blackfin-class microcontrollers.
When designing with the ADSP-BF607BBCZ-5, ensure PCB BGA fanout supports the 0.8 mm pitch ball array and that the DDR/LPDDR memory interface is routed with controlled-impedance, length-matched traces. Use the BSDL and VDSP++ tool chain for software development, and consult the manufacturer datasheet for full peripheral multiplexing and boot-mode configuration guidance.
This page synthesizes distributor pricing, drop-in alternatives within the ADSP-BF60x family, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para ADSP-BF607BBCZ-5 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ADSP-BF607BBCZ-5 (mesmo formato e footprint) — diferindo em Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ADSP-BF608BBCZ-5
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ADSP-BF607BBCZ-4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ADSP-BF607BBCZ-3
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ADSP-BF606BBCZ-5
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ADBF607WCBCZ502
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ADSP-BF607BBCZ-5 Especificações
| Core Architecture | Blackfin (MSA) dual-core |
| Number of Cores | 2 |
| Core Clock (max) | 500 MHz (per core, -5 speed grade) |
| Combined Performance | 1000 MMACs (16-bit) / 500 MMACs (32-bit) |
| Data Format | Fixed-Point 16-bit / 32-bit |
| L2 SRAM | 256 KB shared |
| Internal Core Supply | 1.25 V |
| Temperatura de operação | -40°C to +85°C (TA) |
| Encapsulamento | 349-ball CSP-BGA, 19x19 mm |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
| Peripherals | USB 2.0 HS OTG, 2x CAN 2.0B, 10/100 Ethernet MAC, DDR/LPDDR controller, PPI, SPI, TWI, Timers, Sports |
| Speed Grade Identifier | -5 (500 MHz) |
Guia de Configuração de Pinos do ADSP-BF607BBCZ-5 349-ball csp-bga, 19x19 mm
Configuração de pinos para ADSP-BF607BBCZ-5 (pacote 349-ball csp-bga, 19x19 mm). A numeração dos pinos, funções e diagramas de conexão estão definidos no datasheet do fabricante. Consulte-o para o footprint exato e diretrizes de soldagem.
Nenhum dado detalhado de pinagem disponível para ADSP-BF607BBCZ-5.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
ADSP-BF607BBCZ-5 é adequado para 6 aplicaçãos: Industrial Motor Control and Drive, Multi-Channel Audio Processing and Beam-Forming, Portable Medical Instrumentation, Automotive Audio and Driver-Assistance Preprocessing, Image Processing Pipelines, Networked Smart-Grid Metering.
Industrial Motor Control and Drive
The ADSP-BF607BBCZ-5 fits industrial motor-control applications because its dual 500 MHz Blackfin cores deliver 1000 MMACs of combined throughput, sufficient to execute field-oriented control (FOC) loops while leaving the second core free for condition monitoring or communication protocol handling. The on-chip dual CAN 2.0B interfaces connect directly to industrial bus nodes (CANopen, DeviceNet), while the 10/100 Ethernet MAC supports real-time industrial Ethernet (EtherCAT, PROFINET) via external PHYs. With -40C to +85C operation, the BF607 handles the thermal envelope of enclosed drives and inverter boards. Place the BF607 with the PWM timer outputs routed to the gate-driver stage, the ADC sampling synchronized via the PPI port, and the DDR/LPDDR memory holding control tables and current-loop coefficients. Compared with single-core microcontrollers, the dual-core architecture removes the throughput compromise between control and signal-processing tasks that otherwise forces designers to choose between latency and bandwidth.
Recomendado
Multi-Channel Audio Processing and Beam-Forming
The ADSP-BF607BBCZ-5 is well matched to multi-channel audio processing because each Blackfin core runs dual 16-bit MAC units at 500 MHz, supporting up to 1000 MMACs of combined DSP throughput for FIR filtering, FFT-based beam-forming, and active noise cancellation across arrays of microphones. The serial ports and dedicated audio interface accept multiple I2S/TDM microphone streams while the parallel peripheral interface (PPI) can stream audio buffers to a companion DAC or codec. The 256 KB of shared L2 SRAM plus per-core L1 memory allows dual-buffered audio pipelines without external memory pressure. Place the BF607 between the multi-mic pre-amplifier array and the output audio chain, with DMA-driven buffers flowing through the dual cores. Compared with general-purpose microcontrollers, the dual-MAC SIMD instruction set accelerates audio algorithms 5-10x, lowering latency below the 10 ms threshold required for conversational beam-forming.
Recomendado
Portable Medical Instrumentation
The ADSP-BF607BBCZ-5 suits portable medical instrumentation because the dual-core Blackfin architecture lets one core run the real-time signal-processing pipeline (ECG/EEG/pulse-oximetry filtering and feature extraction) while the second core handles the user interface, display refresh, and connectivity stacks. The on-chip USB 2.0 HS OTG supports tethered data transfer to host PCs, and the 10/100 Ethernet MAC enables networked bedside monitors. The 1.25 V internal core supply keeps active power consumption manageable for battery-powered designs, and the -40C to +85C industrial temperature range covers clinical and field-deployed use cases. Place the BF607 between the analog front-end (AFE) ICs and the display/host interface, with the analog signals digitized and filtered through the dual cores. Compared with single-core DSPs, the dual-core split removes scheduling conflicts that otherwise force compromises between sample rate and UI responsiveness.
Recomendado
Automotive Audio and Driver-Assistance Preprocessing
The ADSP-BF607BBCZ-5 fits automotive audio and ADAS preprocessing because the dual Blackfin cores at 500 MHz deliver enough throughput to run acoustic echo cancellation (AEC), noise reduction, and beam-forming on microphone arrays while leaving headroom for CAN bus messaging and infotainment protocol handling. The dual CAN 2.0B interfaces connect directly to automotive body and chassis networks, while the parallel peripheral interface accepts camera or sensor data for preprocessing. Although the -5 grade is rated -40C to +85C, the wide-temperature ADBF607WCBCZ502 variant covers the automotive -40C to +105C range with identical pinout. Place the BF607 between the microphone pre-amplifier array and the head-unit amplifier chain, or as a sensor-preprocessing stage feeding an application processor. The 349-ball CSP-BGA footprint allows compact PCB layouts suited to head-unit and gateway modules.
Recomendado
Image Processing Pipelines
The ADSP-BF607BBCZ-5 is appropriate for embedded image-processing pipelines because the dual-core 500 MHz architecture provides 1000 MMACs of DSP throughput for convolution, FFT, and image-filter operations, while the parallel peripheral interface (PPI) accepts high-bandwidth image sensor data at rates up to tens of MPixels per second. The DDR/LPDDR controller handles frame buffers for video-rate processing, and the 256 KB of shared L2 SRAM keeps tile-sized image blocks close to the cores. Place the BF607 between the CMOS image sensor output and the display or compression stage, with DMA moving pixel data through the dual cores. Compared with single-core microcontrollers, the dual-core split allows one core to drive sensor acquisition while the other core processes the previous frame, eliminating the throughput compromise that otherwise caps frame rates at VGA resolutions.
Recomendado
Networked Smart-Grid Metering
The ADSP-BF607BBCZ-5 matches networked smart-grid metering designs because its dual-core architecture supports simultaneous DSP-driven energy-measurement algorithms (FFT-based harmonic analysis, power-quality calculation) and communication-stack processing (TLS, DLMS/COSEM, or Modbus). The 10/100 Ethernet MAC enables direct connection to metering backhaul, and the dual CAN 2.0B controllers support local building-automation networks. The -40C to +85C industrial temperature range covers outdoor meter enclosures, while the 1.25 V core supply keeps active power low for always-on metering deployments. Place the BF607 between the metering ADE (analog front-end) ICs and the communication interface, with one core dedicated to DSP measurement and the second to networking. The shared 256 KB L2 SRAM lets both cores share measurement tables without external memory traffic, reducing latency in real-time billing calculations.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ADSP-BF607BBCZ-5 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ADSP-BF608BBCZ-5 | ADSP-BF607BBCZ-4 | ADSP-BF607BBCZ-3 | ADSP-BF606BBCZ-5 | ADBF607WCBCZ502 |
|---|---|---|---|---|---|---|
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Package | 349-ball CSP-BGA 19x19 mm | 349-ball CSP-BGA 19x19 mm - same | 349-ball CSP-BGA 19x19 mm - same | 349-ball CSP-BGA 19x19 mm - same | 349-ball CSP-BGA 19x19 mm - same | 349-ball CSP-BGA 19x19 mm - same |
| Core Clock | 500 MHz (dual-core) | 500 MHz (dual-core, more peripherals) | 400 MHz (dual-core, -20%) | 300 MHz (dual-core, -40%) | 500 MHz (single-core, -50%) | 500 MHz (dual-core, same) |
| Number of Cores | 2 | 2 | 2 | 2 | 1 (single-core variant) | 2 |
| L2 SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +105C (wide temp) |
| Data Format | Fixed-Point 16-bit / 32-bit | Fixed-Point 16-bit / 32-bit | Fixed-Point 16-bit / 32-bit | Fixed-Point 16-bit / 32-bit | Fixed-Point 16-bit / 32-bit | Fixed-Point 16-bit / 32-bit |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- Highest-throughput variant in the ADSP-BF607 family (vs ADSP-BF607BBCZ-4)
- Dual-core architecture vs single-core BF606 (vs ADSP-BF606BBCZ-5)
- Industrial temperature range option vs wide-temperature variant (vs ADBF607WCBCZ502)
Notas de projeto
The 349-ball CSP-BGA uses 0.8 mm ball pitch on a 19x19 mm substrate, which requires via-in-pad (VIP) or microvia PCB technology for fanout. Use a 4-layer or 6-layer stack-up with one solid ground plane directly under the BGA and a DDR/LPDDR-controlled-impedance layer for the memory interface. Estimate: with a 0.8 mm BGA pitch, escape routing demands microvias (typically 0.1 mm / 4 mil drill) on the top layer with dog-bone fanout to the inner layers.
Estimated thermal dissipation: at full dual-core 500 MHz load with both cores 100% utilized, the BF607 dissipates approximately 1.5-2.0 W. With typical CSP-BGA theta_JA values of 20-25 C/W for a 19x19 mm package on a 4-layer JEDEC test board, junction temperature rise above ambient is roughly 30-50 C. A thermal pad and ground-plane copper pour below the BGA are required to stay within the 85C industrial limit when ambient temperature is 50 C or higher. Place NTC thermal vias (0.3 mm drill) on a 1.2 mm grid under the package center.
The BF607 boot mode is sampled from GPIO pins at reset; misconfiguring the boot mode pins is a common pitfall that leaves the part in an unexpected boot state (e.g. SPI boot instead of flash boot). Tie unused boot-mode pins to known logic levels through 10 kohm resistors. Ensure the DDR/LPDDR memory initialization sequence follows the manufacturer datasheet exactly - deviating from the recommended DLL locking procedure leads to intermittent memory failures.
Informações de conformidade
RoHS compliant per Analog Devices product page. Not AEC-Q100 qualified for automotive - choose ADBF607WCBCZ502 if wide-temperature automotive-grade is required.
