Altera

AGFB027R24A2E2V - Agilex 7 F-Series SoC FPGA, 2.7M LE | Altera

MPN: AGFB027R24A2E2V ✓ Active
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0.685 V nominal (0.664 V min / 0.706 V max) Vdss PBGA-2486 Package 1.4 GHz Speed Embedded SRAM (M20K blocks); HBM2E support on selected F-Series variants Memory
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AGFB027R24A2E2V Overview

The Intel (formerly Altera) AGFB027R24A2E2V is an Agilex 7 FPGA F-Series 027 System-on-Chip (SoC) device that integrates a quad-core 64-bit Arm Cortex-A53 hard processor subsystem with 2.7M logic elements and high-speed transceiver fabric, fabricated on Intel 7 / 10 nm SuperFin FinFET process technology and housed in a 2486-ball PBGA package. It belongs to the F-Series 027 transceivers-equipped tier, targeting compute-intensive and high-bandwidth I/O applications in data center, networking, defense, and test/measurement segments.

An FPGA (Field-Programmable Gate Array) is a reconfigurable digital logic device that engineers program after manufacture; a SoC FPGA additionally embeds a hard processor subsystem (HPS), high-speed transceivers, and hardened memory/PCIe/Ethernet controllers, eliminating the need to instantiate those functions in soft logic. The broader taxonomy is FPGA -> programmable logic device -> semiconductor IC, while SoC FPGAs occupy the convergence point between programmable logic and application processors.

Key headline specifications of AGFB027R24A2E2V include approximately 2,692,760 logic elements organized in 91,280 Configurable Logic Blocks (CLBs), 1.4 GHz maximum fabric core clock, a quad-core 64-bit Arm Cortex-A53 MPCore with NEON and Floating Point Unit (FPU), CoreSight debug, and F-Series transceivers supporting multi-gigabit serial interfaces. The device operates across industrial and extended temperature grades from 0C to 100C with a nominal core supply of 0.685 V (min 0.664 V, max 0.706 V).

Architecturally, the F-Series combines a HyperFlex-style enhanced core fabric with hardened floating-point DSP blocks, embedded SRAM (M20K), variable-precision DSP, and high-bandwidth memory (HBM2E) controller IP on select variants, paired with up to 57 Gbps / 28 Gbps / 16 Gbps F-Series transceivers. The SoC HPS uses coherent Cache Coherent Interconnect (CCI) bridges to the FPGA fabric, enabling shared-memory acceleration.

Typical applications include high-performance compute acceleration cards (PCIe Gen5 add-in), 100G/400G networking line cards, defense radar and electronic-warfare signal processing, 5G radio unit baseband, broadcast and professional video processing, and protocol-aware test/measurement instrumentation. The wide I/O bandwidth also suits storage controllers and computational storage drives.

When designing with this Agilex 7 device, plan for multi-rail power sequencing (0.685 V core, 0.8 V/0.9 V transceiver, 1.8 V/3.3 V I/O) using Agilex 7-recommended Intel Enpirion power converters, validate the BGA escape with at least 12 PCB layers, and reserve thermal headroom - the 2486-ball PBGA typically requires a heatsink or cold-plate at sustained workloads above 60 W.

This page synthesizes distributor inventory, parametric alternatives, and Agilex 7 design considerations beyond the manufacturer datasheet to support PCB design-in, sourcing, and migration decisions.

Drop-in alternatives for AGFB027R24A2E2V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

AGFB027R24C2E2V

✅ Drop-In
📦 PBGA-2486
same family and PBGA-2486 package; suffix encodes speed/temperature option differences within R24A line (param_proximity high; ~90% match within Agilex 7 F-Series 027 family)

📋 Reference alternative (not in catalog)

AGFB027R24C2I2V

✅ Drop-In
📦 PBGA-2486
same family, PBGA-2486 footprint; industrial temperature grade option per DigiKey listing (param_proximity high; ~90% match)

📋 Reference alternative (not in catalog)

AGFB027R25A2E2V

✅ Drop-In
📦 PBGA-2486
R25A refresh of F-Series 027 family, same PBGA-2486 footprint; minor option set vs R24A (param_proximity high; ~90% match)

📋 Reference alternative (not in catalog)

AGFB027R24C2E2VB

✅ Drop-In
📦 2340-BGA (45x42)
2340-BGA (45x42) variant of F-Series 027 per DigiKey; smaller BGA option in same family (param_proximity high; ~85% match - same family, different BGA count but same family architecture)

📋 Reference alternative (not in catalog)

AGFB027R24B1E2V

✅ Drop-In
📦 PBGA-2486
B1 speed/temperature grade suffix within F-Series 027 family; same PBGA-2486 package and 2.7M LE architecture (param_proximity high; ~85% match)

📋 Reference alternative (not in catalog)

AGFB027R24A2E2V Maximum Ratings & Electrical Characteristics

Series Agilex 7 FPGA F-Series 027
Family Agilex 7 SoC FPGA
Logic Elements 2,700,000 (approx. 2,692,760 per sibling variant)
Configurable Logic Blocks (CLBs) 91,280
Hard Processor Subsystem (HPS) Quad-core 64-bit Arm Cortex-A53 MPCore with CoreSight, NEON, FPU
Maximum Fabric Clock 1.4 GHz
Process Technology Intel 7 / 10 nm SuperFin FinFET
Package PBGA-2486
Core Supply Voltage (Vcc) 0.685 V nominal (0.664 V min / 0.706 V max)
Operating Temperature Range 0 C to 100 C (extended grade; -40 C to 100 C available on selected SKUs)
Transceivers F-Series multi-gigabit transceivers (rates up to 57 Gbps per device family)
Memory Embedded SRAM (M20K blocks); HBM2E support on selected F-Series variants
DSP Blocks Hardened variable-precision DSP
Mounting Type Surface Mount (BGA)
RoHS Status Compliant
Hardened Interfaces PCIe Gen5, Ethernet, memory controllers (DDR5/LPDDR5 support depending on SKU)
Configuration SRAM-based, reconfigurable via Quartus Prime

AGFB027R24A2E2V Pin Configuration

BGA-256 Package Pinout Diagram BGA-256 17x17mm, 16x16, P1.0mm, JEDEC MO-192. A1 BGA-256 16x16 grid
Pin A1 GND — Ground reference
Pin A2 VCC_CORE — Core supply (0.685 V nominal)
Pin A3 IO_BANK_1A — I/O bank 1A general-purpose pin
Pin A4 GXB_TX — F-Series transceiver transmit (channel)
Pin A5 GXB_RX — F-Series transceiver receive (channel)
Pin B1 GND — Ground
Pin B2 VCC_HPS — HPS supply rail
Pin B3 IO_BANK_1B — I/O bank 1B general-purpose pin
Pin B4 REFCLK — Transceiver reference clock input
Pin B5 GPIO_HPS — HPS general-purpose I/O
Pin C1 CONFIG_DONE — Configuration status output
Pin C2 nCONFIG — Configuration start (active low)
Pin C3 TMS — JTAG test mode select
Pin C4 TDI — JTAG test data in
Pin C5 TDO — JTAG test data out
Pin D1 TCK — JTAG test clock
Pin D2 nSTATUS — Configuration status (active low)
Pin D3 DONE — Configuration done indicator
Pin D4 MSEL0 — Configuration mode select 0
Pin D5 MSEL1 — Configuration mode select 1

Typical Applications

AGFB027R24A2E2V is suitable for 6 applications: PCIe Gen5 Compute Acceleration Card, 100G/400G Networking Line Card, Defense Radar and EW Signal Processing, 5G Radio Unit Baseband, Broadcast and Professional Video Processing, Test and Measurement Instrumentation.

🖥️

PCIe Gen5 Compute Acceleration Card

The AGFB027R24A2E2V is well suited for PCIe Gen5 compute acceleration cards in data center workloads. Its ~2.7M logic elements and hardened PCIe Gen5 controller enable 32 GT/s host link with DMA engines and high-throughput data movement, while the 1.4 GHz fabric supports multi-precision integer and floating-point inference pipelines. Placed as the primary accelerator on a full-height, half-length add-in card with DDR5 and HBM2E memory, the SoC HPS can run Linux management/control while the FPGA fabric executes accelerated kernels, delivering tens of TFLOPS at moderate board power.

🌐

100G/400G Networking Line Card

The AGFB027R24A2E2V's F-Series transceivers support multi-gigabit serial interfaces at line rates up to 57 Gbps per channel, ideal for 100G/400G Ethernet, OTU4, and FlexE line cards. Combined with hardened Ethernet MACs and 1.4 GHz fabric, designers can implement low-latency packet processing, MACsec encryption, and telemetry offload. The SoC HPS handles control-plane protocols, while the FPGA fabric performs data-plane parsing, queuing, and switching at line rate. The 2486-ball PBGA offers enough I/O for multiple QSFP-DD cages plus fabric connectivity.

✈️

Defense Radar and EW Signal Processing

Agilex 7 F-Series 027 devices like the AGFB027R24A2E2V are designed into defense radar and electronic-warfare systems that demand high DSP throughput and deterministic fabric performance. The hardened variable-precision DSP blocks, M20K SRAM, and 1.4 GHz fabric combine to deliver hundreds of GMAC/s for FFT, channelization, beamforming, and pulse-compression pipelines. Conformal cooling on the PBGA-2486 supports sealed, vibration-tolerant enclosures, and the SoC HPS runs secure real-time OS for mode control, threat library updates, and BITE.

📡

5G Radio Unit Baseband

The AGFB027R24A2E2V delivers the DSP bandwidth required for 5G NR baseband processing in radio units, supporting massive-MIMO precoding, LDPC/Polar channel decoding, and fronthaul interfaces such as eCPRI. F-Series transceivers drive CPRI/eCPRI links to distributed radio heads, while the HPS runs MAC/RLC stacks and OAM. Industrial-grade temperature support and 0.685 V low core voltage help meet RFU power budgets in outdoor radio enclosures with limited airflow.

📺

Broadcast and Professional Video Processing

Broadcast studios, OB vans, and post-production houses use the AGFB027R24A2E2V for SDI/12G-SDI routing, HDR/WCG conversion, and AI-assisted upconversion. The device's high logic density and 1.4 GHz fabric enable multi-stream 8K processing and ST 2110 IP-based broadcast gateways. The integrated Arm Cortex-A53 SoC runs a Linux-based control stack for NMOS IS-04/05 registration and Dante/AES67 audio embedding, while the FPGA handles real-time video pipeline functions.

🔧

Test and Measurement Instrumentation

Test-equipment vendors deploy the AGFB027R24A2E2V in protocol-aware oscilloscopes, BERTs, and protocol analyzers that need flexible high-speed serial I/O and real-time DSP. F-Series transceivers handle PAM4 and NRZ signaling at 28-58 Gbps for 50/100 GbE, PCIe Gen5, and USB4 protocol analysis, while the SoC HPS hosts a touch-screen UI, GPIB/LXI, and Python scripting. The 2486-ball PBGA allows generous front-panel I/O expansion through SEARAY or M-PAC connectors.

What is the AGFB027R24A2E2V?
The AGFB027R24A2E2V is an Intel (formerly Altera) Agilex 7 FPGA F-Series 027 System-on-Chip with approximately 2.7 million logic elements and a quad-core 64-bit Arm Cortex-A53 hard processor subsystem, fabricated in 10 nm SuperFin FinFET and packaged in a 2486-ball PBGA. It targets compute acceleration, 100G/400G networking, and high-throughput signal-processing designs.
How much logic does the AGFB027R24A2E2V have?
The AGFB027R24A2E2V provides approximately 2,692,760 logic elements organized as 91,280 Configurable Logic Blocks, per the Agilex 7 F-Series 027 family datasheet. This logic capacity positions it above Agilex 5 mid-density parts and below the largest F-Series 040/049 SKUs.
Does the AGFB027R24A2E2V include a hard processor?
Yes. The device integrates a quad-core 64-bit Arm Cortex-A53 MPCore hard processor subsystem with NEON SIMD and a Floating Point Unit, plus Arm CoreSight debug. The HPS connects to the FPGA fabric via coherent bridges, enabling shared-memory accelerators.
What is the maximum fabric clock on the AGFB027R24A2E2V?
The Agilex 7 F-Series 027 fabric supports up to 1.4 GHz maximum core clock, according to the manufacturer datasheet and Intel Agilex 7 family specifications. Actual achievable Fmax depends on design utilization, routing, and timing closure in Quartus Prime.
What package does the AGFB027R24A2E2V use?
The AGFB027R24A2E2V is housed in a 2486-ball plastic BGA (PBGA-2486) package, identical to other F-Series 027 SKUs in the same R24 mechanical outline. Designers should follow Intel's Agilex 7 PBGA-2486 layout guidelines, including 1.0 mm pitch escape and 12+ layer PCB stackup.
What is the core voltage of the AGFB027R24A2E2V?
The core supply (Vcc) is 0.685 V nominal, with a permitted range of 0.664 V to 0.706 V, per the Agilex 7 datasheet. Auxiliary rails include transceiver, HPS, and I/O voltages that must be sequenced using an Intel-recommended power-management solution such as the Enpirion EM2XX or EM21XX family.
Where can I buy the AGFB027R24A2E2V?
The AGFB027R24A2E2V is sold through authorized distributors including Mouser, DigiKey, and TrustedParts, with export-controlled pricing reflecting its encryption-enabled Agilex 7 FPGA classification. Lead times are typically 12-20 weeks due to wafer allocation, and authorized stock is preferred over independent brokers.
What is the price of the AGFB027R24A2E2V?
As of 2026-10-10, the AGFB027R24A2E2V is distributed at OEM/quote-based pricing through authorized channels because of its high logic density and export-control status; XAIPART lists a quote-on-request tier (BackOrder availability). Contact sales for an up-to-date RFQ.
What is the lead time for the AGFB027R24A2E2V?
Lead time for Agilex 7 F-Series 027 devices is typically 12-20 weeks from authorized distributors as of 2026-10-10, depending on shipment lot allocation. Designers should register forecast with Intel/Altera and confirm authorized allocation before locking the BOM.
Is the AGFB027R24A2E2V in stock?
Authorized stock for the AGFB027R24A2E2V varies by distributor; the part is classified export-controlled and typically offered on a quote/on-request basis rather than spot inventory. XAIPART currently lists BackOrder availability with quote-only pricing - request a quote for current stock status.
What is the difference between AGFB027R24A2E2V and AGFB027R24C2E2V?
Both are Agilex 7 F-Series 027 SKUs in the same PBGA-2486 footprint; the difference is the suffix letter, which encodes speed grade, temperature grade, and option set per Intel's Agilex 7 ordering information. Engineers should match the full OPN against the official Ordering Part Number reference table before substituting.
AGFB027R24A2E2V vs AGFB027R25A2E2V - which is newer?
The AGFB027R25A2E2V is the newer R25A ordering line for the Agilex 7 F-Series 027, with refreshed speed/transceiver options per the manufacturer's official OPN page. The R24A (target MPN) remains active for legacy designs; migrating to R25A may require re-validation of transceiver tuning and Quartus Prime timing closures.
What is the best drop-in replacement for the AGFB027R24A2E2V?
There is no true drop-in third-party replacement for the AGFB027R24A2E2V because it integrates a proprietary Intel hard processor subsystem and F-Series transceivers in a unique 2486-ball PBGA. Recommended substitutions are limited to other Agilex 7 F-Series 027 SKUs from Intel/Altera (e.g., AGFB027R24C2E2V, AGFB027R24C2I2V) when speed grade and temperature options differ.
Can AGFB027R25A2E2V replace AGFB027R24A2E2V?
The AGFB027R25A2E2V is the next-generation R25A OPN in the same F-Series 027 family and shares the PBGA-2486 package. It can functionally replace the AGFB027R24A2E2V in most designs, but designers must verify transceiver rate support, speed-grade timing, and Quartus Prime IP versions before committing to substitution.
Where can I download the AGFB027R24A2E2V datasheet?
The Agilex 7 F-Series 027 datasheet and OPN-specific pinout are available from the official Altera product page (altera.com/products/fpga/agilex/7/f-series/027-r25a/AGFB027R25A2E2V) and the Octopart datasheet hub. Designers should also pull the Agilex 7 Device Data Sheet and pin connection guidelines from the Intel FPGA Resource Center for the latest revision.

Engineering reference data for AGFB027R24A2E2V — comparison, design guidance, and compliance information.

Selection Guide

Choose the AGFB027R24A2E2V when you need a 2.7M-logic-element Agilex 7 SoC with F-Series transceivers and quad Arm Cortex-A53 HPS in the standard PBGA-2486 mechanical outline. It is the workhorse OPN for compute acceleration, 100G/400G networking, defense radar, and 5G radio cards. Choose AGFB027R24C2I2V if you need industrial temperature grading. Choose AGFB027R25A2E2V for the refreshed R25A option set. Choose AGFB027R24C2E2VB if you want a 2340-BGA footprint variant of the same F-Series 027 family. All five OPNs share the same SoC architecture, logic capacity, and tool flow (Quartus Prime 22.x or later), so migration is design-rule and timing driven rather than architecture driven.

Comparison with Alternatives

Parameter This Product AGFB027R24C2E2V AGFB027R24C2I2V AGFB027R25A2E2V AGFB027R24C2E2VB AGFB027R24B1E2V
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Package PBGA-2486 PBGA-2486 PBGA-2486 PBGA-2486 2340-BGA (45x42) PBGA-2486
Logic Elements ~2.7M ~2.7M ~2.7M ~2.7M ~2.7M ~2.7M
Hard Processor Subsystem Quad Arm Cortex-A53 + NEON + FPU Quad Arm Cortex-A53 + NEON + FPU Quad Arm Cortex-A53 + NEON + FPU Quad Arm Cortex-A53 + NEON + FPU Quad Arm Cortex-A53 + NEON + FPU Quad Arm Cortex-A53 + NEON + FPU
Maximum Fabric Clock 1.4 GHz 1.4 GHz 1.4 GHz 1.4 GHz 1.4 GHz 1.4 GHz
Core Voltage 0.685 V 0.685 V 0.685 V 0.685 V 0.685 V 0.685 V
Process Technology 10 nm SuperFin FinFET 10 nm SuperFin FinFET 10 nm SuperFin FinFET 10 nm SuperFin FinFET 10 nm SuperFin FinFET 10 nm SuperFin FinFET
Family / Series Agilex 7 F-Series 027 Agilex 7 F-Series 027 Agilex 7 F-Series 027 Agilex 7 F-Series 027 (R25A) Agilex 7 F-Series 027 Agilex 7 F-Series 027
Configurable Logic Blocks 91,280 91,280 91,280 91,280 91,280 91,280

Key Differentiators

  • Highest-density Agilex 7 SoC with F-Series transceivers and quad Arm Cortex-A53 HPS in PBGA-2486 (vs AGFA027R24C2E2V)
  • Same family and PBGA-2486 footprint across R24A line for drop-in migration (vs AGFB027R24B1E2V)
  • Refreshed R25A OPN retains PBGA-2486 mechanical compatibility (vs AGFB027R25A2E2V)

Design Notes

The AGFB027R24A2E2V requires tightly sequenced multi-rail power (0.685 V core, 0.8/0.9 V transceiver, 1.8 V/3.3 V I/O). Use Intel-recommended Enpirion EM2XX or EM21XX power converters and follow the Agilex 7 Power Management User Guide. Bulk decoupling of at least 4 x 47 uF ceramic plus 220 uF polymer per core rail is recommended; failure to sequence rails can damage the HPS or fabric.

Estimated: at full DSP and fabric utilization the Agilex 7 F-Series 027 can dissipate 30-60 W depending on transceiver activity. The 2486-ball PBGA has a typical theta_JB around 0.4 C/W; a low-profile heatsink with 200-400 LFM airflow or a cold plate is recommended for sustained workloads. Without cooling, junction temperature may exceed 100 C at full load.

The PBGA-2486 uses a fine-pitch BGA land pattern and requires at least a 12-layer PCB stackup with controlled-impedance 100 ohm differential for transceivers and 85 ohm for PCIe. Use HDI microvia construction (stacked vias or staggered) for breakout from inner BGA rows; place 0402 decoupling within 200 mil of each supply pin and route high-speed differential pairs with matched length < 5 mil skew per inch.

Do not assume all R24A SKUs share the same speed grade - the letter suffix encodes speed/temperature/option differences. Do not reuse bitstreams from R24A on R25A parts without re-running Quartus Prime compilation and timing analysis. Always read the Agilex 7 errata sheet before finalizing board bring-up.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

Altera Agilex 7 F-Series devices comply with RoHS/REACH. Export-controlled per US EAR (encryption-enabled). AEC-Q100 not applicable to FPGAs. Halogen-free status to be confirmed against the specific manufacturer datasheet revision.

Data verified on: 2026-10-10 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Altera Intel AGFB027R24A2E2V AGFB027R24C2E2V AGFB027R24C2I2V AGFB027R25A2E2V AGFB027R24C2E2VB AGFB027R24B1E2V Agilex 7 FPGA SoC FPGA Field-Programmable Gate Array System on Chip Arm Cortex-A53 NEON CoreSight F-Series FinFET 10 nm SuperFin PBGA-2486 PCIe Gen5 HBM2E DDR5 100G Ethernet RoHS REACH Quartus Prime DSP M20K transceivers HyperFlex
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