ATSAM3N1AB-MU - 48MHz Cortex-M3 MCU 64KB Flash | Microchip
N.º da peça: ATSAM3N1AB-MU ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.24 | $4,24 |
| 10 | $3.86 | $38,60 |
| 100 | $3.51 | $351,00 |
| 500 | $3.22 | $1.610,00 |
| 1.000 | $2.98 | $2.980,00 |
ATSAM3N1AB-MU Visão geral
A microcontroller unit (MCU) is a single-chip computer that integrates a processor core, memory, and programmable peripherals on one die, sitting within the broader hierarchy of semiconductor devices: integrated circuit -> embedded processor -> ARM Cortex-M microcontroller. The SAM3N series, originally developed by Atmel and now manufactured by Microchip Technology, targets cost-sensitive, high-volume embedded applications where pin compatibility across family members enables easy migration and supply-chain flexibility.
Key features of the ATSAM3N1AB-MU include the high-performance ARM Cortex-M3 RISC processor with Thumb-2 instruction set, 48 MHz maximum operating frequency, and 64 KB of single-cycle flash program memory. According to Microchip product documentation, the SAM3N series is pin-to-pin compatible with the SAM7S and SAM3S series, facilitating migration within the family when memory or peripheral requirements change.
The device integrates standard communication peripherals typical of the SAM3N family, including USART, SPI, and TWI (I2C) interfaces, along with an ADC and general-purpose I/O, allowing a single chip to handle sensing, control, and communication in an embedded node. The aggressive price point and high integration level push its scope of use into cost-sensitive, high-volume applications, as stated in the SAM3N series datasheet.
Typical applications include industrial control and automation nodes, consumer appliance interfaces, motor control panels, and battery-powered metering or sensing systems where a 32-bit core is required at 8/16-bit price levels.
A key design consideration is power-supply decoupling: the 48-QFN exposed pad must be soldered to a solid ground plane for both thermal relief and signal integrity, and the industrial temperature-grade device should be operated within its rated conditions per the datasheet.
This page synthesizes distributor pricing, stock availability, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para ATSAM3N1AB-MU — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAM3N1AB-MU (mesmo formato e footprint) — diferindo em Package, SRAM, Core Size, Core Processor, Series.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAM3N1AA-MU
✅ Drop-In✓ Em estoque
$3.18 / unidade
Ver ficha técnica →ATSAM3N0AA-MU
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAM3S1AA-MU
✅ Drop-In✓ Em estoque
$3.34 / unidade
Ver ficha técnica →ATSAM3S1AB-MU
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAM3N1AB-MU
✅ Drop-In✓ Em estoque
$2.98 / unidade
Ver ficha técnica →ATSAM3N1AB-MU Classificações máximas e características elétricas
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Frequência máxima de clock | 48 MHz |
| Flash Memory | 64 KB (64K x 8) |
| SRAM | 8 KB |
| Encapsulamento | 48-QFN (7x7 mm) Exposed Pad |
| Tipo de montagem | Surface Mount |
| Communication Interfaces | USART, SPI, TWI (I2C) [per SAM3N series peripherals] |
| Status RoHS | Compliant (Green package per Mouser listing) |
| Series | SAM3N |
| Pin Compatibility | Pin-to-pin compatible with SAM7S and SAM3S series |
Guia de Configuração de Pinos do ATSAM3N1AB-MU 48-qfn (7x7 mm) exposed pad
Configuração de pinos para ATSAM3N1AB-MU (pacote 48-qfn (7x7 mm) exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para ATSAM3N1AB-MU.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
ATSAM3N1AB-MU é adequado para 6 aplicaçãos: Industrial Control and Automation Nodes, Consumer Appliance Interfaces, Battery-Powered Metering and Sensing, Motor Control Panels, Embedded Communication Bridges, Smart Home and IoT Sensor Endpoints.
Industrial Control and Automation Nodes
The ATSAM3N1AB-MU fits industrial control nodes where a 32-bit ARM Cortex-M3 core is needed but cost per unit is tightly constrained. Its 48 MHz Cortex-M3 executes control loops and communication stacks comfortably, while 64 KB of flash holds firmware, parameter tables, and a modest RTOS. USART, SPI, and TWI (I2C) interfaces link PLC I/O modules, sensors, and HMI peripherals. The 48-QFN (7x7 mm) exposed-pad package keeps board area small in DIN-rail and panel-mount electronics, and pin compatibility across SAM3N/SAM3S lets one PCB carry multiple memory tiers, reducing SKUs. Industrial-grade manufacturing and the Green/RoHS package support high-volume factory deployments.
Recomendado
Consumer Appliance Interfaces
Cost-sensitive consumer appliances - coffee machines, air conditioners, washing-machine panels - benefit from the ATSAM3N1AB-MU's combination of 32-bit processing power and aggressive pricing. The 64 KB flash accommodates UI logic, EEPROM emulation for user settings, and communication protocols to display or inverter boards, while 8 KB SRAM handles state machines and small buffers. The 48 MHz Cortex-M3 with Thumb-2 instruction density outperforms 8-bit MCUs at similar board cost, and the SAM3N series documentation explicitly positions the family for high-volume, cost-sensitive use. The 48-QFN package suits compact appliance control PCBs with two-layer layouts and machine-assembly processes.
Recomendado
Battery-Powered Metering and Sensing
Utility sub-meters, environmental sensors, and portable instruments use the ATSAM3N1AB-MU where computation must be balanced against battery budget. The Cortex-M3 core delivers datapath performance for metering accumulation and CRC-checked communication at modest clock rates, and the SAM3N series low-power operating modes allow sleep between measurement intervals. USART and TWI interfaces connect to RF modules, EEPROMs, and LCD drivers; SPI serves external ADCs. Because the SAM3N is pin-to-pin compatible with SAM3S parts, a metering platform can migrate to higher-memory SAM3S variants as firmware grows without changing the PCB. Verify the exact supply-voltage range in the current datasheet when designing the battery regulator.
Recomendado
Motor Control Panels
Small motor control applications - fans, pumps, dampers - use the ATSAM3N1AB-MU as the supervisory controller that handles user commands, protection logic, and communication while a driver stage handles power. The 48 MHz Cortex-M3 executes PWM scheduling, fault monitoring, and protocol handling (USART/SPI to the outside world) with headroom. Its 64 KB flash holds control tables, and the exposed-pad 48-QFN provides solid ground return for switching-noise immunity when soldered to a continuous ground plane. For designs needing motor-specific peripherals, the pin-compatible SAM3S family provides an in-socket migration path documented by Microchip for SAM3N-to-SAM3S movement.
Recomendado
Embedded Communication Bridges
Protocol converters - RS-485-to-UART, USB-adjacent gateways, and SPI-to-I2C translators - map well onto the ATSAM3N1AB-MU's peripheral set. The USART handles serial field buses, TWI (I2C) and SPI address local peripherals, and the 48 MHz core sustains buffering and checksum processing in 8 KB SRAM for typical industrial frame sizes. Pin-to-pin compatibility with SAM7S and SAM3S devices, stated in Microchip documentation, means legacy bridge designs can be updated to the SAM3N without layout changes, extending product life. The Green, RoHS-compliant 48-QFN package supports lead-free reflow assembly required by modern commercial and industrial communication hardware.
Recomendado
Smart Home and IoT Sensor Endpoints
IoT endpoints such as thermostats, door controllers, and environmental nodes use the ATSAM3N1AB-MU as the local intelligence driving sensors and a wireless module. The 64 KB flash stores application logic plus a lightweight sensor-fusion or Kalman filter, and the Cortex-M3 core leaves CPU margin for radio-stack housekeeping. SPI and USART link to Wi-Fi, sub-GHz, or Zigbee modules, while TWI connects temperature, humidity, and pressure sensors. Sleep-mode operation between sampling events conserves coin-cell or Li-SOCl2 battery energy. The SAM3N/SAM3S pin compatibility lets one smart-home PCB scale memory tiers by product line, amortizing layout and certification costs across SKUs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAM3N1AB-MU — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAM3N1AA-MU | ATSAM3N0AA-MU | ATSAM3S1AA-MU | ATSAM3S1AB-MU |
|---|---|---|---|---|---|
| Package | 48-QFN (7x7 mm) Exposed Pad | 48-QFN (7x7 mm) - same | 48-QFN (7x7 mm) - same | 48-QFN (7x7 mm) - same | 48-QFN (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit |
| Pin Compatibility | SAM3N / SAM3S / SAM7S pin-to-pin compatible | Same SAM3N pinout | Same SAM3N pinout | SAM3S pinout - compatible per Microchip | SAM3S pinout - compatible per Microchip |
| Primary Differentiator | 64 KB flash at aggressive cost point | Adjacent revision/suffix for sourcing flexibility | Lower cost, half the flash | SAM3S peripheral set on same pinout | SAM3S B-suffix grading |
Principais diferenciais
- Largest flash in the entry SAM3N tier (vs ATSAM3N0AA-MU)
- Family migration path to SAM3S (vs ATSAM3S1AA-MU)
- Authorized aftermarket availability (vs ATSAM3N1AA-MU)
Notas de projeto
The ATSAM3N1AB-MU comes in a 48-QFN (7x7 mm) package with an exposed pad. The exposed pad is the primary ground connection and thermal path; connect it to a continuous ground plane with a via array (typically 5x5 or more vias) under the pad. Insufficient exposed-pad soldering is the most common cause of intermittent ground faults and poor EMC performance with QFN MCUs. Follow the SAM3N datasheet land-pattern dimensions for stencil aperture design to avoid solder bridging on the 0.5 mm pitch perimeter pins.
Decouple each VDD/VDDIO pin pair with 100 nF ceramic capacitors placed within 2 mm of the pins, plus one bulk capacitor (4.7-10 uF) near the supply entry. The flash controller draws transient current during erase/program operations, so adequate local decoupling prevents brown-out during field firmware updates. Consult the SAM3N datasheet power-supply section for the exact operating voltage range and startup supervision (brown-out detector) configuration before finalizing the regulator choice.
When migrating from ATSAM3N1AB-MU to pin-compatible SAM3S or other SAM3N suffixes (e.g., ATSAM3N1AA-MU), do not assume identical peripheral multiplexing or electrical characteristics. FindIC comparison data notes that even same-function family members can differ in some electrical parameters. Re-verify the pin function table, clock configuration, and flash wait-state settings in the target part's datasheet, and re-run firmware validation before releasing the substitution to production.
Informações de conformidade
Mouser listing describes the package as 'QFN, Grn, IT, MRL B' indicating Green (halogen/antimony-free per Microchip Green definition), industrial temperature. Full REACH and conflict-minerals status should be confirmed from Microchip's official product compliance pages.