ATSAM3N1AB-MU - 48MHz Cortex-M3 MCU 64KB Flash | Microchip
부품 번호: ATSAM3N1AB-MU ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.24 | $4.24 |
| 10 | $3.86 | $38.60 |
| 100 | $3.51 | $351.00 |
| 500 | $3.22 | $1,610.00 |
| 1,000 | $2.98 | $2,980.00 |
ATSAM3N1AB-MU 개요
A microcontroller unit (MCU) is a single-chip computer that integrates a processor core, memory, and programmable peripherals on one die, sitting within the broader hierarchy of semiconductor devices: integrated circuit -> embedded processor -> ARM Cortex-M microcontroller. The SAM3N series, originally developed by Atmel and now manufactured by Microchip Technology, targets cost-sensitive, high-volume embedded applications where pin compatibility across family members enables easy migration and supply-chain flexibility.
Key features of the ATSAM3N1AB-MU include the high-performance ARM Cortex-M3 RISC processor with Thumb-2 instruction set, 48 MHz maximum operating frequency, and 64 KB of single-cycle flash program memory. According to Microchip product documentation, the SAM3N series is pin-to-pin compatible with the SAM7S and SAM3S series, facilitating migration within the family when memory or peripheral requirements change.
The device integrates standard communication peripherals typical of the SAM3N family, including USART, SPI, and TWI (I2C) interfaces, along with an ADC and general-purpose I/O, allowing a single chip to handle sensing, control, and communication in an embedded node. The aggressive price point and high integration level push its scope of use into cost-sensitive, high-volume applications, as stated in the SAM3N series datasheet.
Typical applications include industrial control and automation nodes, consumer appliance interfaces, motor control panels, and battery-powered metering or sensing systems where a 32-bit core is required at 8/16-bit price levels.
A key design consideration is power-supply decoupling: the 48-QFN exposed pad must be soldered to a solid ground plane for both thermal relief and signal integrity, and the industrial temperature-grade device should be operated within its rated conditions per the datasheet.
This page synthesizes distributor pricing, stock availability, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: ATSAM3N1AB-MU — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM3N1AB-MU (동일 폼 팩터 및 풋프린트) — 차이점: Package, SRAM, Core Size, Core Processor, Series.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAM3N1AA-MU
✅ 드롭인✓ 재고 있음
$3.18 / 개
데이터시트 보기 →ATSAM3N0AA-MU
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAM3S1AA-MU
✅ 드롭인✓ 재고 있음
$3.34 / 개
데이터시트 보기 →ATSAM3S1AB-MU
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAM3N1AB-MU
✅ 드롭인✓ 재고 있음
$2.98 / 개
데이터시트 보기 →ATSAM3N1AB-MU 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| 최대 클록 주파수 | 48 MHz |
| Flash Memory | 64 KB (64K x 8) |
| SRAM | 8 KB |
| 패키지 | 48-QFN (7x7 mm) Exposed Pad |
| 실장 유형 | Surface Mount |
| Communication Interfaces | USART, SPI, TWI (I2C) [per SAM3N series peripherals] |
| RoHS 상태 | Compliant (Green package per Mouser listing) |
| Series | SAM3N |
| Pin Compatibility | Pin-to-pin compatible with SAM7S and SAM3S series |
ATSAM3N1AB-MU 48-qfn (7x7 mm) exposed pad 핀 구성 가이드
ATSAM3N1AB-MU(48-qfn (7x7 mm) exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAM3N1AB-MU.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAM3N1AB-MU 적합 용도: 6 애플리케이션s: Industrial Control and Automation Nodes, Consumer Appliance Interfaces, Battery-Powered Metering and Sensing, Motor Control Panels, Embedded Communication Bridges, Smart Home and IoT Sensor Endpoints.
Industrial Control and Automation Nodes
The ATSAM3N1AB-MU fits industrial control nodes where a 32-bit ARM Cortex-M3 core is needed but cost per unit is tightly constrained. Its 48 MHz Cortex-M3 executes control loops and communication stacks comfortably, while 64 KB of flash holds firmware, parameter tables, and a modest RTOS. USART, SPI, and TWI (I2C) interfaces link PLC I/O modules, sensors, and HMI peripherals. The 48-QFN (7x7 mm) exposed-pad package keeps board area small in DIN-rail and panel-mount electronics, and pin compatibility across SAM3N/SAM3S lets one PCB carry multiple memory tiers, reducing SKUs. Industrial-grade manufacturing and the Green/RoHS package support high-volume factory deployments.
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Consumer Appliance Interfaces
Cost-sensitive consumer appliances - coffee machines, air conditioners, washing-machine panels - benefit from the ATSAM3N1AB-MU's combination of 32-bit processing power and aggressive pricing. The 64 KB flash accommodates UI logic, EEPROM emulation for user settings, and communication protocols to display or inverter boards, while 8 KB SRAM handles state machines and small buffers. The 48 MHz Cortex-M3 with Thumb-2 instruction density outperforms 8-bit MCUs at similar board cost, and the SAM3N series documentation explicitly positions the family for high-volume, cost-sensitive use. The 48-QFN package suits compact appliance control PCBs with two-layer layouts and machine-assembly processes.
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Battery-Powered Metering and Sensing
Utility sub-meters, environmental sensors, and portable instruments use the ATSAM3N1AB-MU where computation must be balanced against battery budget. The Cortex-M3 core delivers datapath performance for metering accumulation and CRC-checked communication at modest clock rates, and the SAM3N series low-power operating modes allow sleep between measurement intervals. USART and TWI interfaces connect to RF modules, EEPROMs, and LCD drivers; SPI serves external ADCs. Because the SAM3N is pin-to-pin compatible with SAM3S parts, a metering platform can migrate to higher-memory SAM3S variants as firmware grows without changing the PCB. Verify the exact supply-voltage range in the current datasheet when designing the battery regulator.
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Motor Control Panels
Small motor control applications - fans, pumps, dampers - use the ATSAM3N1AB-MU as the supervisory controller that handles user commands, protection logic, and communication while a driver stage handles power. The 48 MHz Cortex-M3 executes PWM scheduling, fault monitoring, and protocol handling (USART/SPI to the outside world) with headroom. Its 64 KB flash holds control tables, and the exposed-pad 48-QFN provides solid ground return for switching-noise immunity when soldered to a continuous ground plane. For designs needing motor-specific peripherals, the pin-compatible SAM3S family provides an in-socket migration path documented by Microchip for SAM3N-to-SAM3S movement.
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Embedded Communication Bridges
Protocol converters - RS-485-to-UART, USB-adjacent gateways, and SPI-to-I2C translators - map well onto the ATSAM3N1AB-MU's peripheral set. The USART handles serial field buses, TWI (I2C) and SPI address local peripherals, and the 48 MHz core sustains buffering and checksum processing in 8 KB SRAM for typical industrial frame sizes. Pin-to-pin compatibility with SAM7S and SAM3S devices, stated in Microchip documentation, means legacy bridge designs can be updated to the SAM3N without layout changes, extending product life. The Green, RoHS-compliant 48-QFN package supports lead-free reflow assembly required by modern commercial and industrial communication hardware.
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Smart Home and IoT Sensor Endpoints
IoT endpoints such as thermostats, door controllers, and environmental nodes use the ATSAM3N1AB-MU as the local intelligence driving sensors and a wireless module. The 64 KB flash stores application logic plus a lightweight sensor-fusion or Kalman filter, and the Cortex-M3 core leaves CPU margin for radio-stack housekeeping. SPI and USART link to Wi-Fi, sub-GHz, or Zigbee modules, while TWI connects temperature, humidity, and pressure sensors. Sleep-mode operation between sampling events conserves coin-cell or Li-SOCl2 battery energy. The SAM3N/SAM3S pin compatibility lets one smart-home PCB scale memory tiers by product line, amortizing layout and certification costs across SKUs.
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추천 제품 요약
엔지니어링 참조 데이터: ATSAM3N1AB-MU — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM3N1AA-MU | ATSAM3N0AA-MU | ATSAM3S1AA-MU | ATSAM3S1AB-MU |
|---|---|---|---|---|---|
| Package | 48-QFN (7x7 mm) Exposed Pad | 48-QFN (7x7 mm) - same | 48-QFN (7x7 mm) - same | 48-QFN (7x7 mm) - same | 48-QFN (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit |
| Pin Compatibility | SAM3N / SAM3S / SAM7S pin-to-pin compatible | Same SAM3N pinout | Same SAM3N pinout | SAM3S pinout - compatible per Microchip | SAM3S pinout - compatible per Microchip |
| Primary Differentiator | 64 KB flash at aggressive cost point | Adjacent revision/suffix for sourcing flexibility | Lower cost, half the flash | SAM3S peripheral set on same pinout | SAM3S B-suffix grading |
주요 차별점
- Largest flash in the entry SAM3N tier (vs ATSAM3N0AA-MU)
- Family migration path to SAM3S (vs ATSAM3S1AA-MU)
- Authorized aftermarket availability (vs ATSAM3N1AA-MU)
설계 노트
The ATSAM3N1AB-MU comes in a 48-QFN (7x7 mm) package with an exposed pad. The exposed pad is the primary ground connection and thermal path; connect it to a continuous ground plane with a via array (typically 5x5 or more vias) under the pad. Insufficient exposed-pad soldering is the most common cause of intermittent ground faults and poor EMC performance with QFN MCUs. Follow the SAM3N datasheet land-pattern dimensions for stencil aperture design to avoid solder bridging on the 0.5 mm pitch perimeter pins.
Decouple each VDD/VDDIO pin pair with 100 nF ceramic capacitors placed within 2 mm of the pins, plus one bulk capacitor (4.7-10 uF) near the supply entry. The flash controller draws transient current during erase/program operations, so adequate local decoupling prevents brown-out during field firmware updates. Consult the SAM3N datasheet power-supply section for the exact operating voltage range and startup supervision (brown-out detector) configuration before finalizing the regulator choice.
When migrating from ATSAM3N1AB-MU to pin-compatible SAM3S or other SAM3N suffixes (e.g., ATSAM3N1AA-MU), do not assume identical peripheral multiplexing or electrical characteristics. FindIC comparison data notes that even same-function family members can differ in some electrical parameters. Re-verify the pin function table, clock configuration, and flash wait-state settings in the target part's datasheet, and re-run firmware validation before releasing the substitution to production.
규정 준수 정보
Mouser listing describes the package as 'QFN, Grn, IT, MRL B' indicating Green (halogen/antimony-free per Microchip Green definition), industrial temperature. Full REACH and conflict-minerals status should be confirmed from Microchip's official product compliance pages.