ATSAM3S1CA-CU - 64MHz Cortex-M3 64KB Flash MCU | Microchip
N.º da peça: ATSAM3S1CA-CU ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.87 | $3,87 |
| 10 | $3.6 | $36,00 |
| 100 | $3.4 | $340,00 |
| 500 | $3.2 | $1.600,00 |
| 1.000 | $3.05 | $3.050,00 |
ATSAM3S1CA-CU Visão geral
A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, program memory, data memory, and peripherals into one chip, sitting at the heart of embedded systems within the broader hierarchy of semiconductor devices (MCU -> embedded processor -> integrated circuit). The SAM3S family belongs to Atmel/Microchip's AT91 ARM-based flash MCU line, targeting cost-sensitive, low-power applications that still require 32-bit performance.
Key features include the ARM Cortex-M3 core at 64 MHz for efficient thumb-2 instruction execution, 64KB of on-chip flash for program storage, 16KB of SRAM, 47 general-purpose I/O lines, and a rich analog set: 15 ADC channels with selectable 10/12-bit resolution and two 12-bit DAC channels. System peripherals include Brown-out Detect/Reset (BOD), DMA controller, I2S audio interface, Power-on Reset (POR), PWM channels, and a watchdog timer (WDT).
The device operates from a 1.62V to 3.6V supply with a 1.08V to 1.32V core domain, and the MRL A / industrial temperature grade version (-40C to +85C) suits demanding environments. Per Mouser, the part is classified as ARM Microcontrollers - MCU, MRL A, 64K Flash, 16K SRAM, Industrial temperature.
Typical applications include industrial control and factory automation nodes, consumer and industrial HMI panels, data-logging and sensor interfaces, and audio-capable embedded systems leveraging the I2S and 12-bit DAC peripherals.
When designing with this MCU, note that the dense 0.8 mm-ball TFBGA footprint requires careful PCB fan-out and controlled-impedance breakout; power the VDDCORE domain at 1.2V per the supply specification of 1.08 to 1.32 volts.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, with pricing as of 2026-09-19.
Alternativas drop-in para ATSAM3S1CA-CU — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAM3S1CA-CU (mesmo formato e footprint) — diferindo em SRAM, Flash Memory, Operating Temperature, Core Processor, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAM3S1CB-CU
✅ Drop-In✓ Em estoque
$2.82 / unidade
Ver ficha técnica →ATSAM3N1CB-CU
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAM3N4BA-MU
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.48 / unidade
Ver ficha técnica →ATSAM3S2BA-CU
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
ATSAM3S4BA-CU
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
ATSAM3S1CA-CU Classificações máximas e características elétricas
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Maximum Clock Speed | 64 MHz |
| Flash Memory | 64KB (64K x 8) |
| SRAM | 16K x 8 |
| Core Supply Voltage | 1.08 V to 1.32 V |
| I/O Supply Voltage | 1.62 V to 3.6 V |
| Number of I/O | 47 |
| ADC Channels | 15 channels, 10/12-bit |
| DAC Channels | 2 channels, 12-bit |
| Peripherals | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT |
| Encapsulamento | 100-TFBGA (9x9 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | Industrial, -40C to +85C |
| Status do ciclo de vida | ACTIVE |
| Tipo de memória | Flash |
| PWM Channels | Yes |
Guia de Configuração de Pinos do ATSAM3S1CA-CU 100-tfbga (9x9 mm)
Configuração de pinos para ATSAM3S1CA-CU (pacote 100-tfbga (9x9 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para ATSAM3S1CA-CU.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
ATSAM3S1CA-CU é adequado para 6 aplicaçãos: Industrial Control and Automation, Human-Machine Interface (HMI) Panels, Audio Interface and Data Logging, Sensor Acquisition and IoT Edge Nodes, Motor Control and Actuator Drive, Test and Measurement Instrumentation.
Industrial Control and Automation
The ATSAM3S1CA-CU fits industrial control nodes because it combines an industrial temperature grade (per Mouser and Partstack classification) with robust system peripherals: brown-out detect/reset, power-on reset, watchdog timer, and DMA. The 64 MHz ARM Cortex-M3 core delivers the deterministic performance needed for control loops, while 47 GPIO lines interface directly with relays, optocouplers, and discrete sensors. In a typical PLC expansion module, the MCU scans 15 ADC channels at 12-bit resolution for analog sensor acquisition, uses PWM outputs for actuator drive, and offloads data movement to the DMA controller to keep the core free for protocol handling. The 1.62V to 3.6V I/O supply tolerates noisy 3.3V industrial rails, and the watchdog ensures recovery from field disturbances.
Recomendado
Human-Machine Interface (HMI) Panels
HMI panels benefit directly from the SAM3S series' peripheral integration. The ATSAM3S1CA-CU drives resistive or capacitive touch inputs through its 15-channel 12-bit ADC, renders simple graphics to LCD segments or small TFT modules via parallel buses on its GPIO ports, and generates backlight dimming with hardware PWM channels that run without CPU load. The 64 MHz Cortex-M3 core executes touch-debounce and state-machine code from 64KB flash, adequate for menu-driven interfaces. The DMA controller moves ADC touch samples to SRAM, keeping touch latency below one millisecond even under heavy display refresh. Because the I/O domain accepts 1.62V to 3.6V, it interfaces cleanly with 3.3V display logic. The 9x9 mm TFBGA conserves board area in bezel-constrained panel designs.
Recomendado
Audio Interface and Data Logging
The two 12-bit DACs and the I2S interface make the ATSAM3S1CA-CU unusually well equipped for embedded audio among MCUs of its class. In an audio dongle or voice-prompt logger, the I2S peripheral streams digital audio to an external codec while a DAC provides alert tones or analog line output; the 64 MHz core applies gain and mixing in software. The same architecture suits data loggers: the 15-channel ADC samples multi-sensor arrays, DMA transfers results to SRAM buffers, and records persist to external flash over SPI/USART. The brown-out detector guarantees that flash writes complete cleanly before supply collapse. The industrial temperature grade permits loggers deployed outdoors or inside machinery enclosures where consumer-grade MCUs would drift out of specification.
Recomendado
Sensor Acquisition and IoT Edge Nodes
Battery-powered and line-powered sensor nodes use the ATSAM3S1CA-CU's 15-channel ADC to digitize temperature, pressure, humidity, and current-sense signals at 12-bit resolution without external converter ICs. The 64 MHz Cortex-M3 executes filtering (IIR/FIR) locally, and the DMA streams conversion results while the core sleeps or processes the previous window. The 1.08V to 1.32V core domain keeps internal power low, supporting duty-cycled operation. The watchdog timer and brown-out reset guarantee autonomous recovery in unattended deployments such as metering, agricultural monitoring, and building automation. With 47 GPIO lines, a single device aggregates multiple sensor buses (I2C, SPI, USART) simultaneously, replacing two-chip solutions and reducing bill-of-materials cost in edge-node designs.
Recomendado
Motor Control and Actuator Drive
The ATSAM3S1CA-CU generates multi-channel hardware PWM suitable for driving DC motor H-bridges, stepper drivers, and actuator positioners. Hardware PWM outputs run autonomously from the CPU, so control-loop timing is unaffected by communication or logging tasks. The 12-bit ADC samples current-sense shunt amplifiers and encoder/analog position feedback across 15 channels, enabling closed-loop torque and position control at kilohertz rates with the 64 MHz core. The DMA controller maintains circular ADC buffers without core intervention. Brown-out detect/reset plus watchdog timer satisfy the fault-recovery expectations of actuator systems, and the industrial temperature rating covers motor-adjacent mounting where ambient temperatures rise. The 3.3V I/O domain connects directly to standard gate-driver logic inputs.
Recomendado
Test and Measurement Instrumentation
Bench accessories, portable meters, and data-acquisition front ends leverage the ATSAM3S1CA-CU's mixed-signal integration: the 15-channel 10/12-bit ADC digitizes measurement inputs, while the two 12-bit DACs generate calibration references and stimulus signals. The I2S and USART peripherals communicate with host systems, and DMA sustains continuous waveform capture into the 16KB SRAM. The 64 MHz Cortex-M3 applies averaging, calibration constants, and unit conversion in firmware stored in 64KB flash. Distributors classify the part as industrial grade, supporting instrument operation across -40C to +85C ambient. The 9x9 mm TFBGA package permits dense analog front-end layout with short ADC traces, and the 1.62V to 3.6V I/O supply simplifies integration with 3.3V signal-conditioning chains.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAM3S1CA-CU — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAM3S1CB-CU | ATSAM3N1CB-CU | ATSAM3N4BA-MU | ATSAM3S2BA-CU |
|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-ball BGA - same footprint family | 100-ball BGA - same footprint family | 100-TFBGA (BA) - same footprint family | 100-TFBGA (BA) - same footprint family |
| Brand | Microchip Technology (Atmel) | Atmel / Microchip Technology | Atmel / Microchip Technology | Atmel / Microchip Technology | Atmel / Microchip Technology |
| Core / Clock | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz |
| Flash Memory | 64KB | 64KB (verify per FindIC listing) | 128KB (CB tier, per comparison data) | 256KB | 128KB |
| 12-bit DAC | 2 channels | 2 channels (SAM3S series) | None (SAM3N series) | None (SAM3N series) | 2 channels (SAM3S series) |
| I2S Interface | Yes | Yes | No (per Utmel SAM3N comparison) | No | Yes |
Principais diferenciais
- Integrated 12-bit audio-grade analog (vs ATSAM3N1CB-CU)
- Cost-optimized memory point (vs ATSAM3S4BA-CU)
- 15-channel 10/12-bit ADC on-chip (vs ATSAM3S1CB-CU)
Notas de projeto
The ATSAM3S1CA-CU requires two supply domains: 1.08V to 1.32V for VDDCORE and 1.62V to 3.6V for VDDIO/VDDA. Decouple each VDDCORE ball with 100 nF close to the package, plus bulk 10 uF per domain. Sequence or verify that VDDCORE reaches regulation before or with VDDIO to avoid latch-up during power-up; the datasheet power-management section details the internal regulator option. Estimated: at 64 MHz, core current is on the order of tens of mA - confirm exact figures from the datasheet electrical characteristics table rather than relying on estimates.
A 100-ball TFBGA at 9x9 mm demands via-in-pad or microvia fan-out on at least a 4-layer board: dedicate one layer to a ground plane and one to the 1.2V core rail. Keep the 15 ADC channel traces short and away from switching nodes; route a clean analog ground island under the ADC input balls. The exposed ball grid leaves no visual alignment feature, so ensure silkscreen ball-A1 markers and reflow stencil aperture design follow the land-pattern data in the manufacturer datasheet.
Do not assume the SAM3N series (ATSAM3N1CB-CU, ATSAM3N4BA-MU) is a functional drop-in: per Utmel/FindIC comparisons, SAM3N parts omit the 12-bit DACs and I2S interface present on this SAM3S device. If firmware uses those peripherals, the swap fails at bring-up even though the footprint matches. Also confirm flash size requirements before moving to ATSAM3S1CB-CU - distributor comparisons indicate a different memory tier. Verify the ball map against the current Microchip datasheet revision before releasing the PCB.
Informações de conformidade
Mouser listing references 'MRL A' and green packaging indicators typical of Microchip parts, but explicit RoHS/REACH/lead-free declarations were not present in the verified web data; confirm on the official Microchip product page.
