ATSAM3S1CA-CU - 64MHz Cortex-M3 64KB Flash MCU | Microchip
부품 번호: ATSAM3S1CA-CU ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3.87 | $3.87 |
| 10 | $3.6 | $36.00 |
| 100 | $3.4 | $340.00 |
| 500 | $3.2 | $1,600.00 |
| 1,000 | $3.05 | $3,050.00 |
ATSAM3S1CA-CU 개요
A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, program memory, data memory, and peripherals into one chip, sitting at the heart of embedded systems within the broader hierarchy of semiconductor devices (MCU -> embedded processor -> integrated circuit). The SAM3S family belongs to Atmel/Microchip's AT91 ARM-based flash MCU line, targeting cost-sensitive, low-power applications that still require 32-bit performance.
Key features include the ARM Cortex-M3 core at 64 MHz for efficient thumb-2 instruction execution, 64KB of on-chip flash for program storage, 16KB of SRAM, 47 general-purpose I/O lines, and a rich analog set: 15 ADC channels with selectable 10/12-bit resolution and two 12-bit DAC channels. System peripherals include Brown-out Detect/Reset (BOD), DMA controller, I2S audio interface, Power-on Reset (POR), PWM channels, and a watchdog timer (WDT).
The device operates from a 1.62V to 3.6V supply with a 1.08V to 1.32V core domain, and the MRL A / industrial temperature grade version (-40C to +85C) suits demanding environments. Per Mouser, the part is classified as ARM Microcontrollers - MCU, MRL A, 64K Flash, 16K SRAM, Industrial temperature.
Typical applications include industrial control and factory automation nodes, consumer and industrial HMI panels, data-logging and sensor interfaces, and audio-capable embedded systems leveraging the I2S and 12-bit DAC peripherals.
When designing with this MCU, note that the dense 0.8 mm-ball TFBGA footprint requires careful PCB fan-out and controlled-impedance breakout; power the VDDCORE domain at 1.2V per the supply specification of 1.08 to 1.32 volts.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, with pricing as of 2026-09-19.
드롭인 대체품: ATSAM3S1CA-CU — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM3S1CA-CU (동일 폼 팩터 및 풋프린트) — 차이점: SRAM, Flash Memory, Operating Temperature, Core Processor, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAM3S1CB-CU
✅ 드롭인✓ 재고 있음
$2.82 / 개
데이터시트 보기 →ATSAM3N1CB-CU
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAM3N4BA-MU
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.48 / 개
데이터시트 보기 →ATSAM3S2BA-CU
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
ATSAM3S4BA-CU
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
ATSAM3S1CA-CU 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Maximum Clock Speed | 64 MHz |
| Flash Memory | 64KB (64K x 8) |
| SRAM | 16K x 8 |
| Core Supply Voltage | 1.08 V to 1.32 V |
| I/O Supply Voltage | 1.62 V to 3.6 V |
| Number of I/O | 47 |
| ADC Channels | 15 channels, 10/12-bit |
| DAC Channels | 2 channels, 12-bit |
| Peripherals | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT |
| 패키지 | 100-TFBGA (9x9 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | Industrial, -40C to +85C |
| 수명 주기 상태 | ACTIVE |
| 메모리 유형 | Flash |
| PWM Channels | Yes |
ATSAM3S1CA-CU 100-tfbga (9x9 mm) 핀 구성 가이드
ATSAM3S1CA-CU(100-tfbga (9x9 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAM3S1CA-CU.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAM3S1CA-CU 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Human-Machine Interface (HMI) Panels, Audio Interface and Data Logging, Sensor Acquisition and IoT Edge Nodes, Motor Control and Actuator Drive, Test and Measurement Instrumentation.
Industrial Control and Automation
The ATSAM3S1CA-CU fits industrial control nodes because it combines an industrial temperature grade (per Mouser and Partstack classification) with robust system peripherals: brown-out detect/reset, power-on reset, watchdog timer, and DMA. The 64 MHz ARM Cortex-M3 core delivers the deterministic performance needed for control loops, while 47 GPIO lines interface directly with relays, optocouplers, and discrete sensors. In a typical PLC expansion module, the MCU scans 15 ADC channels at 12-bit resolution for analog sensor acquisition, uses PWM outputs for actuator drive, and offloads data movement to the DMA controller to keep the core free for protocol handling. The 1.62V to 3.6V I/O supply tolerates noisy 3.3V industrial rails, and the watchdog ensures recovery from field disturbances.
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Human-Machine Interface (HMI) Panels
HMI panels benefit directly from the SAM3S series' peripheral integration. The ATSAM3S1CA-CU drives resistive or capacitive touch inputs through its 15-channel 12-bit ADC, renders simple graphics to LCD segments or small TFT modules via parallel buses on its GPIO ports, and generates backlight dimming with hardware PWM channels that run without CPU load. The 64 MHz Cortex-M3 core executes touch-debounce and state-machine code from 64KB flash, adequate for menu-driven interfaces. The DMA controller moves ADC touch samples to SRAM, keeping touch latency below one millisecond even under heavy display refresh. Because the I/O domain accepts 1.62V to 3.6V, it interfaces cleanly with 3.3V display logic. The 9x9 mm TFBGA conserves board area in bezel-constrained panel designs.
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Audio Interface and Data Logging
The two 12-bit DACs and the I2S interface make the ATSAM3S1CA-CU unusually well equipped for embedded audio among MCUs of its class. In an audio dongle or voice-prompt logger, the I2S peripheral streams digital audio to an external codec while a DAC provides alert tones or analog line output; the 64 MHz core applies gain and mixing in software. The same architecture suits data loggers: the 15-channel ADC samples multi-sensor arrays, DMA transfers results to SRAM buffers, and records persist to external flash over SPI/USART. The brown-out detector guarantees that flash writes complete cleanly before supply collapse. The industrial temperature grade permits loggers deployed outdoors or inside machinery enclosures where consumer-grade MCUs would drift out of specification.
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Sensor Acquisition and IoT Edge Nodes
Battery-powered and line-powered sensor nodes use the ATSAM3S1CA-CU's 15-channel ADC to digitize temperature, pressure, humidity, and current-sense signals at 12-bit resolution without external converter ICs. The 64 MHz Cortex-M3 executes filtering (IIR/FIR) locally, and the DMA streams conversion results while the core sleeps or processes the previous window. The 1.08V to 1.32V core domain keeps internal power low, supporting duty-cycled operation. The watchdog timer and brown-out reset guarantee autonomous recovery in unattended deployments such as metering, agricultural monitoring, and building automation. With 47 GPIO lines, a single device aggregates multiple sensor buses (I2C, SPI, USART) simultaneously, replacing two-chip solutions and reducing bill-of-materials cost in edge-node designs.
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Motor Control and Actuator Drive
The ATSAM3S1CA-CU generates multi-channel hardware PWM suitable for driving DC motor H-bridges, stepper drivers, and actuator positioners. Hardware PWM outputs run autonomously from the CPU, so control-loop timing is unaffected by communication or logging tasks. The 12-bit ADC samples current-sense shunt amplifiers and encoder/analog position feedback across 15 channels, enabling closed-loop torque and position control at kilohertz rates with the 64 MHz core. The DMA controller maintains circular ADC buffers without core intervention. Brown-out detect/reset plus watchdog timer satisfy the fault-recovery expectations of actuator systems, and the industrial temperature rating covers motor-adjacent mounting where ambient temperatures rise. The 3.3V I/O domain connects directly to standard gate-driver logic inputs.
추천
Test and Measurement Instrumentation
Bench accessories, portable meters, and data-acquisition front ends leverage the ATSAM3S1CA-CU's mixed-signal integration: the 15-channel 10/12-bit ADC digitizes measurement inputs, while the two 12-bit DACs generate calibration references and stimulus signals. The I2S and USART peripherals communicate with host systems, and DMA sustains continuous waveform capture into the 16KB SRAM. The 64 MHz Cortex-M3 applies averaging, calibration constants, and unit conversion in firmware stored in 64KB flash. Distributors classify the part as industrial grade, supporting instrument operation across -40C to +85C ambient. The 9x9 mm TFBGA package permits dense analog front-end layout with short ADC traces, and the 1.62V to 3.6V I/O supply simplifies integration with 3.3V signal-conditioning chains.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAM3S1CA-CU — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM3S1CB-CU | ATSAM3N1CB-CU | ATSAM3N4BA-MU | ATSAM3S2BA-CU |
|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-ball BGA - same footprint family | 100-ball BGA - same footprint family | 100-TFBGA (BA) - same footprint family | 100-TFBGA (BA) - same footprint family |
| Brand | Microchip Technology (Atmel) | Atmel / Microchip Technology | Atmel / Microchip Technology | Atmel / Microchip Technology | Atmel / Microchip Technology |
| Core / Clock | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz |
| Flash Memory | 64KB | 64KB (verify per FindIC listing) | 128KB (CB tier, per comparison data) | 256KB | 128KB |
| 12-bit DAC | 2 channels | 2 channels (SAM3S series) | None (SAM3N series) | None (SAM3N series) | 2 channels (SAM3S series) |
| I2S Interface | Yes | Yes | No (per Utmel SAM3N comparison) | No | Yes |
주요 차별점
- Integrated 12-bit audio-grade analog (vs ATSAM3N1CB-CU)
- Cost-optimized memory point (vs ATSAM3S4BA-CU)
- 15-channel 10/12-bit ADC on-chip (vs ATSAM3S1CB-CU)
설계 노트
The ATSAM3S1CA-CU requires two supply domains: 1.08V to 1.32V for VDDCORE and 1.62V to 3.6V for VDDIO/VDDA. Decouple each VDDCORE ball with 100 nF close to the package, plus bulk 10 uF per domain. Sequence or verify that VDDCORE reaches regulation before or with VDDIO to avoid latch-up during power-up; the datasheet power-management section details the internal regulator option. Estimated: at 64 MHz, core current is on the order of tens of mA - confirm exact figures from the datasheet electrical characteristics table rather than relying on estimates.
A 100-ball TFBGA at 9x9 mm demands via-in-pad or microvia fan-out on at least a 4-layer board: dedicate one layer to a ground plane and one to the 1.2V core rail. Keep the 15 ADC channel traces short and away from switching nodes; route a clean analog ground island under the ADC input balls. The exposed ball grid leaves no visual alignment feature, so ensure silkscreen ball-A1 markers and reflow stencil aperture design follow the land-pattern data in the manufacturer datasheet.
Do not assume the SAM3N series (ATSAM3N1CB-CU, ATSAM3N4BA-MU) is a functional drop-in: per Utmel/FindIC comparisons, SAM3N parts omit the 12-bit DACs and I2S interface present on this SAM3S device. If firmware uses those peripherals, the swap fails at bring-up even though the footprint matches. Also confirm flash size requirements before moving to ATSAM3S1CB-CU - distributor comparisons indicate a different memory tier. Verify the ball map against the current Microchip datasheet revision before releasing the PCB.
규정 준수 정보
Mouser listing references 'MRL A' and green packaging indicators typical of Microchip parts, but explicit RoHS/REACH/lead-free declarations were not present in the verified web data; confirm on the official Microchip product page.
