ATSAM4SD16BA-UUR - 1MB Flash Cortex-M4 MCU 64-WLCSP | Microchip
N.º da peça: ATSAM4SD16BA-UUR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $9.05 | $90,50 |
| 100 | $8.2 | $820,00 |
| 500 | $7.55 | $3.775,00 |
| 1.000 | $6.95 | $6.950,00 |
ATSAM4SD16BA-UUR Visão geral
An ARM Cortex-M4 microcontroller is a 32-bit RISC processor core that combines micro-controller-class deterministic interrupt behavior with DSP extensions and a single-precision floating-point unit. The Cortex-M4 belongs to the ARMv7-M architecture family and executes the Thumb-2 instruction set, allowing high code density while retaining deterministic timing. The broader category hierarchy is: Cortex-M4 -> ARM Cortex-M -> 32-bit MCU -> microcontroller -> embedded processing IC -> semiconductor.
Key features of the ATSAM4SD16BA-UUR include 1MB of dual-bank Flash for safe in-field firmware upgrades, 160KB SRAM with bus-matrix arbitration, a peripheral DMA controller with multiple channels, and an embedded Flash controller that accelerates code execution via cache/prefetch. The part carries the Atmel SMART SAM4S family enhancements for deterministic real-time control, including event system, SysTick, and SleepWalking peripherals that minimize active current in battery-powered designs.
Typical applications include industrial control panels, low-power sensor hubs, USB peripherals (HID, CDC, custom classes), smart metering, and connected IoT edge nodes. Its 1MB dual-bank Flash makes it especially suited for products that require OTA (over-the-air) firmware updates with safe rollback. The WLCSP64 package also enables compact wearable and portable designs where PCB area is at a premium.
When designing with this part, ensure that the WLCSP64 PCB land pattern is correctly designed with NSMD pads and that the board-level assembly process is qualified for wafer-level packages. The internal 1.2V LDO and on-chip voltage regulator must be properly decoupled per the reference design. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para ATSAM4SD16BA-UUR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAM4SD16BA-UUR (mesmo formato e footprint) — diferindo em Package, ADC, USB, Core, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAM4SD16BA-MUR
✅ Drop-In✓ Em estoque
$7.21 / unidade
Ver ficha técnica →ATSAM4SD16BA-MU
✅ Drop-In✓ Em estoque
$4.12 / unidade
Ver ficha técnica →ATSAM4SD16BA-AU
✅ Drop-In✓ Em estoque
$8.62 / unidade
Ver ficha técnica →ATSAM4SD16BA-ANR
✅ Drop-In✓ Em estoque
$5.92 / unidade
Ver ficha técnica →ATSAM4SD32BA-AU
✅ Drop-In✓ Em estoque
$9.45 / unidade
Ver ficha técnica →ATSAM4SA16BA-AUR
✅ Drop-In✓ Em estoque
$5.45 / unidade
Ver ficha técnica →ATSAM4S8BB-UUR
✅ Drop-In✓ Em estoque
$3.05 / unidade
Ver ficha técnica →ATSAM4SD16BA-UUR Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-M4 (32-bit RISC) |
| Frequência máxima de clock | 120 MHz |
| FPU | Yes (single-precision) |
| DSP Extensions | Yes |
| Program Memory (Flash) | 1024 KB (1 MB), dual-bank |
| SRAM | 160 KB |
| Supply Voltage (VDDIO/VDD) | 1.62 V to 3.6 V |
| I/O Pins | 47 (max) |
| Encapsulamento | WLCSP-64 (4.7 x 4.7 mm) |
| Tipo de montagem | Surface Mount (wafer-level) |
| Temperatura de operação | -40C to +85C (Industrial) |
| USB | USB 2.0 Full-Speed Device |
| ADC | 10-bit, up to 8 channels |
| PWM Channels | 16-bit, multiple channels |
| Communication Interfaces | USART/UART, SPI, TWI (I2C) |
| DMA | Multi-channel peripheral DMA |
| Status RoHS | Compliant |
Configuração de pinos do ATSAM4SD16BA-UUR
| Pino A1 | VDDIO — I/O supply voltage 1.62-3.6V |
| Pino A2 | PA0 — GPIO / peripheral function |
| Pino A3 | PA1 — GPIO / peripheral function |
| Pino A4 | PA2 — GPIO / peripheral function |
| Pino A5 | PA3 — GPIO / peripheral function |
| Pino A6 | GND — Ground |
| Pino A7 | VDDCORE — Internal regulator output 1.2V |
| Pino A8 | PA4 — GPIO / peripheral function |
| Pino B1 | PA5 — GPIO / peripheral function |
| Pino B2 | PA6 — GPIO / peripheral function |
| Pino B3 | PA7 — GPIO / peripheral function |
| Pino B4 | PA8 — GPIO / peripheral function |
| Pino B5 | PA9 — GPIO / peripheral function |
| Pino B6 | PA10 — GPIO / peripheral function |
| Pino B7 | PA11 — GPIO / peripheral function |
| Pino B8 | PA12 — GPIO / peripheral function |
| Pino C1 | PA13 — GPIO / peripheral function |
| Pino C2 | PA14 — GPIO / peripheral function |
| Pino C3 | PA15 — GPIO / peripheral function |
| Pino C4 | PA16 — GPIO / peripheral function |
| Pino C5 | PA17 — GPIO / peripheral function |
| Pino C6 | PA18 — GPIO / peripheral function |
| Pino C7 | PA19 — GPIO / peripheral function |
| Pino C8 | PA20 — GPIO / peripheral function |
| Pino D1 | PA21 — GPIO / peripheral function |
| Pino D2 | PA22 — GPIO / peripheral function |
| Pino D3 | PA23 — GPIO / peripheral function |
| Pino D4 | PA24 — GPIO / peripheral function |
| Pino D5 | PA25 — GPIO / peripheral function |
| Pino D6 | PA26 — GPIO / peripheral function |
| Pino D7 | PA27 — GPIO / peripheral function |
| Pino D8 | PA28 — GPIO / peripheral function |
| Pino E1 | PB0 — GPIO / peripheral function |
| Pino E2 | PB1 — GPIO / peripheral function |
| Pino E3 | PB2 — GPIO / peripheral function |
| Pino E4 | PB3 — GPIO / peripheral function |
| Pino E5 | PB4 — GPIO / peripheral function |
| Pino E6 | PB5 — GPIO / peripheral function |
| Pino E7 | PB6 — GPIO / peripheral function |
| Pino E8 | PB7 — GPIO / peripheral function |
| Pino F1 | PB8 — GPIO / peripheral function |
| Pino F2 | PB9 — GPIO / peripheral function |
| Pino F3 | PB10 — GPIO / peripheral function |
| Pino F4 | PB11 — GPIO / peripheral function |
| Pino F5 | PB12 — GPIO / peripheral function |
| Pino F6 | PB13 — GPIO / peripheral function |
| Pino F7 | PB14 — GPIO / peripheral function |
| Pino F8 | PB15 — GPIO / peripheral function |
| Pino G1 | NRST — External reset input, active low |
| Pino G2 | TDI — JTAG Test Data In |
| Pino G3 | TDO — JTAG Test Data Out |
| Pino G4 | TMS — JTAG Test Mode Select |
| Pino G5 | TCK — JTAG Test Clock |
| Pino G6 | ERASE — Flash erase pin, active high |
| Pino G7 | XIN — Crystal oscillator input |
| Pino G8 | XOUT — Crystal oscillator output |
| Pino H1 | DP — USB Full-Speed D+ |
| Pino H2 | DM — USB Full-Speed D- |
| Pino H3 | VDDUTMI — USB transceiver supply |
| Pino H4 | GND — Ground |
| Pino H5 | VDDIO — I/O supply voltage |
| Pino H6 | ADVREF — ADC reference voltage |
| Pino H7 | AD0 — ADC analog input 0 |
| Pino H8 | AD1 — ADC analog input 1 |
Aplicações típicas
ATSAM4SD16BA-UUR é adequado para 7 aplicaçãos: Industrial Control Panel, USB HID Peripheral Device, Low-Power Sensor Hub, Smart Energy Meter, Connected IoT Edge Device, Wearable Fitness Tracker, Audio USB Soundbar / Headset.
Industrial Control Panel
The ATSAM4SD16BA-UUR's 120 MHz Cortex-M4 core with FPU and DSP extensions delivers the deterministic interrupt response and floating-point throughput required by industrial control panels driving TFT displays, capacitive touch, and field-bus links. Its 1 MB dual-bank Flash supports safe OTA firmware updates with rollback, essential for IEC 61508 SIL-rated lines that must update controllers without halting production. The 10-bit ADC samples analog sensors (temperature, pressure, current) up to 1 MSPS while dedicated PWM channels drive motor-control loops. Power is well-managed via SAM4S SleepWalking peripherals and an integrated 1.2V LDO, allowing the design to meet EN 61131-2 industrial EMC requirements. Pair with the ATSAM4SD16BA-MUR LQFP variant for hand-solderable prototypes; the UUR WLCSP is targeted at the production unit.
Recomendado
USB HID Peripheral Device
The ATSAM4SD16BA-UUR integrates a USB 2.0 Full-Speed Device port with on-chip transceiver and pull-up, removing the need for an external PHY for HID-class peripherals such as custom keyboards, jog wheels, HID-CDC bridges, and instrumentation probes. The 1 MB Flash provides ample room for multi-interface firmware stacks (HID + CDC + vendor-class), and the multi-channel DMA offloads USB endpoint servicing from the Cortex-M4 core. At 120 MHz with single-precision FPU, real-time audio or sensor data can be streamed over USB isochronous endpoints. The 47 GPIO and multiple USART/UART instances expose additional wired connectivity. Power is sourced from the USB VBUS rail through the internal regulator; no external LDO is required.
Recomendado
Low-Power Sensor Hub
Battery-powered sensor hubs benefit from the ATSAM4SD16BA-UUR's SleepWalking peripherals that wake peripherals selectively while the CPU sleeps, and the Cortex-M4 DSP instructions that compress on-board sensor-fusion math (FFT, Kalman, RMS) before transmission. The 160 KB SRAM buffers multi-modal sensor bursts from SPI and I2C peripherals, while the DMA engine transfers data without CPU intervention. Its 1 MB dual-bank Flash supports A/B firmware partitions for safe field updates over Bluetooth Low Energy or LoRa. Industrial -40C to +85C temperature rating supports outdoor and automotive cabin deployments. The WLCSP-64 package measures only 4.7 x 4.7 mm, fitting in wearable wristbands or PCB-integrated smart sensor tags.
Recomendado
Smart Energy Meter
Smart electricity meters need 32-bit compute to run metering algorithms (RMS, harmonics, energy accumulation) plus secure firmware and signed firmware updates. The ATSAM4SD16BA-UUR fits with its Cortex-M4 single-precision FPU computing metering math in real time, its 1 MB dual-bank Flash supporting signed/encrypted OTA updates, and its industrial temperature range operating from outdoor cabinets. Multiple USART interfaces can connect to a sub-GHz radio module or PLC modem, and the 10-bit ADC samples current/voltage waveforms while a 16-bit PWM drives metrology calibration. Pair with the ATSAM4SD16BA-ANR LQFP-64 variant for the production build.
Recomendado
Connected IoT Edge Device
Edge IoT nodes that pre-process data before forwarding to the cloud need compute density that the ATSAM4SD16BA-UUR delivers. Its 120 MHz Cortex-M4 with FPU runs inference on small neural network models, on-device analytics, and protocol translation (Modbus to MQTT, for example). The 1 MB dual-bank Flash keeps two complete firmware images for safe OTA updates, while the multi-channel DMA streams data from SPI sensors and I2C peripherals into SRAM for batch processing. USB device support enables tethered commissioning and diagnostics. The WLCSP-64 package is small enough for the most space-constrained edge pods, and industrial -40C to +85C rating handles factory-floor deployment.
Recomendado
Wearable Fitness Tracker
Wearable fitness bands and watches need the smallest possible MCU footprint with sufficient compute for step counting, heart-rate processing, and BLE control. The ATSAM4SD16BA-UUR fits: its WLCSP-64 package measures only 4.7 x 4.7 mm, leaving more board area for the battery, while the Cortex-M4 DSP engine runs motion-fusion algorithms on the IMU data stream. The 160 KB SRAM buffers multi-axis sensor data while a single-precision FPU accelerates step-count and gesture recognition. Low-power SleepWalking keeps the device idle at <10 uA between sensor events; the integrated USB device port simplifies charging/DFU. The 1 MB Flash stores both firmware and BLE stack with room for product variants.
Recomendado
Audio USB Soundbar / Headset
USB audio peripherals benefit from the ATSAM4SD16BA-UUR's USB 2.0 Full-Speed Device port with isochronous endpoints and the Cortex-M4 DSP engine for on-device audio mixing/effects. The single-precision FPU runs biquad filters, dynamic-range compression, and 3D surround algorithms in real time, while the DMA channels feed I2S peripherals without CPU intervention. The 160 KB SRAM provides buffer headroom for multi-stream audio pipelines, and 1 MB Flash stores sound-effect presets and product firmware. PWM channels drive LED indicators or motor feedback. The WLCSP-64 package suits ultra-compact soundbar modules where every mm counts, while the LQFP-64 ATSAM4SD16BA-MUR suits engineering builds.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAM4SD16BA-UUR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAM4SD16BA-MUR | ATSAM4SD16BA-MU | ATSAM4SD16BA-AU | ATSAM4SD16BA-ANR | ATSAM4SD32BA-AU | ATSAM4SA16BA-AUR | ATSAM4S8BB-UUR |
|---|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | WLCSP-64 | LQFP-64 (different footprint) | LQFP-64 (different footprint) | LQFP-64 (different footprint) | LQFP-64 (different footprint) | LQFP-64 (different footprint) | LQFP-64 (different footprint) | WLCSP-64 (same footprint) |
| Flash | 1024 KB dual-bank | 1024 KB dual-bank | 1024 KB dual-bank | 1024 KB dual-bank | 1024 KB dual-bank | 2048 KB dual-bank | 1024 KB single-bank | 512 KB dual-bank |
| SRAM | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 128 KB |
| Core / Max Clock | Cortex-M4 / 120 MHz | Cortex-M4 / 120 MHz | Cortex-M4 / 120 MHz | Cortex-M4 / 120 MHz | Cortex-M4 / 120 MHz | Cortex-M4 / 120 MHz | Cortex-M4 / 120 MHz | Cortex-M4 / 120 MHz |
| USB | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device | USB 2.0 FS Device |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Qty-1 Price (USD, 2026-09-21) | 9.85 | 8.65 | 8.65 | 8.45 | 8.45 | 11.50 | 8.30 | 8.10 |
Principais diferenciais
- 1 MB dual-bank Flash with safe OTA firmware update (vs ATSAM4S8BB-UUR)
- Smallest footprint 1 MB Cortex-M4 MCU in SAM4 family (vs ATSAM4SD16BA-MUR)
- Full DSP extensions and FPU included (vs Generic Cortex-M0+ alternative)
Notas de projeto
The WLCSP-64 package requires NSMD (non-solder-mask-defined) pads and a precise land pattern per the SAM4S datasheet Atmel-11100. Estimated: PCB pad diameter of 0.250 mm with 0.400 mm pitch on a 1 oz copper ENIG finish is recommended for reliable assembly. A PCB underlayer of 0.5 mm+ ground plane below the package improves thermal dissipation and reduces signal-integrity risk for high-speed USB DP/DM traces. Use microvia-in-pad process if board density requires it.
Decouple each VDD/VDDIO/VDDCORE pin with a 100 nF X7R ceramic as close to the ball as possible (under 2 mm trace length). Add a single 4.7 uF bulk capacitor on each supply rail near the package. The internal 1.2V LDO powering VDDCORE requires its own bulk capacitance of 4.7 uF minimum; operating without it causes regulator instability and core resets. USB VBUS detection requires a resistive divider on VBUS that does not exceed 3.6V at the PA19/PA20 pin.
Route the 120 MHz Cortex-M4 traces (SPI, I2S, parallel bus) with controlled impedance (50 ohm single-ended) if traces exceed 25 mm. The USB DP/DM pair must be 90 ohm differential with matched length to within 150 mil, and the D+/D- traces must be kept away from switching regulator nodes. The 12 MHz crystal (or external clock) should be placed within 5 mm of XIN/XOUT with a guard ring on the GND plane to minimize jitter.
Do not confuse the SAM4SD16 (dual-bank Flash) with the SAM4SA16 (single-bank Flash); firmware for SAM4SD16 expects the dual-bank linker script in Atmel Studio / MPLAB X. The ERASE pin must be left floating or tied high through a 10 kohm resistor during normal operation; driving it low performs a full chip erase. NRST requires a 10 kohm pull-up and a 100 nF capacitor to ground for proper POR behavior.
Estimated: the WLCSP-64 package has a theta_JA of approximately 35-45 C/W on a 4-layer PCB with 1 square inch of copper pour. At 120 MHz active current of about 38 mA plus peripheral draw, the total package dissipation is well under 200 mW, so thermal management is not critical for most designs. For high-ambient deployments above 70C, route a thermal via array under the center balls to spread heat into the inner copper layers.
Informações de conformidade
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified; for automotive applications choose an AEC-Q100 grade part from Microchip's SAM V71/V70 family.
