ATSAM4SD32BA-ANR - 2MB Flash 120MHz Cortex-M4 MCU | Microchip
N.º da peça: ATSAM4SD32BA-ANR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.85 | $12,85 |
| 10 | $11.42 | $114,20 |
| 100 | $9.18 | $918,00 |
| 500 | $7.95 | $3.975,00 |
| 1.000 | $6.72 | $6.720,00 |
ATSAM4SD32BA-ANR Visão geral
The SAM4S family is part of the Atmel/Microchip ARM Cortex-M4 microcontroller lineup. A Cortex-M4 MCU is a 32-bit processor core featuring DSP extensions, single-cycle MAC, hardware single-precision FPU, and a tightly-coupled NVIC for deterministic interrupt response. Within Microchip's portfolio it sits above Cortex-M0+ SAM D parts and below Cortex-M7 SAME70/SAMS70 parts, balancing high computational throughput (1.25 DMIPS/MHz, hardware FPU) with the peripheral richness needed for human-machine interface (HMI), connectivity bridges, and motor control front-ends.
Key features of the ATSAM4SD32BA-ANR include up to 120 MHz CPU clock, 2 MB embedded Flash, 160 KB SRAM, a 12-bit ADC, two 12-bit DACs, USB 2.0 Full-Speed Device/Host, CAN 2.0A/B, 10/100 Ethernet MAC (EMAC), HSMCI for SD cards, and 8/16-bit external bus interface (EBI) for SRAM/NOR/NAND. The Cortex-M4 core's single-precision FPU accelerates floating-point DSP code, while the integrated sleep modes (Wait, Sleep, Backup with RTC) reduce active power for battery-friendly designs. The 64-LQFP package exposes most peripheral I/Os while remaining hand-solderable for prototypes.
Typical applications include industrial HMI panels, HVAC controllers, USB peripherals and barcode scanners, point-of-sale terminals, smart metering, motor-control signal processors, building automation gateways, and connectivity bridges (USB-to-Ethernet, USB-to-CAN). The combination of 2 MB Flash and 160 KB SRAM supports rich graphic stacks (emWin, LVGL) without external memory.
When designing with this MCU, choose LQFP-64 over QFN-64 variants for easier rework and breadboard prototypes; route the ERASE pin carefully because pulling it high at reset triggers a full chip erase. Decouple VDDCORE with 100 nF + 4.7 µF ceramic capacitors placed within 5 mm of the pin, and reserve the JTAG/SWD header footprint even in production designs for firmware recovery.
Alternativas drop-in para ATSAM4SD32BA-ANR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAM4SD32BA-ANR (mesmo formato e footprint) — diferindo em USB, Package, RoHS Status, ADC, CAN.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAM4SD32BB-AUR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAM4SD32BA-AU
✅ Drop-In✓ Em estoque
$9.45 / unidade
Ver ficha técnica →ATSAM4SD32BA-AN
✅ Drop-In✓ Em estoque
$6.78 / unidade
Ver ficha técnica →ATSAM4S16CB-CFNR
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
ATSAM4SA16BA-AUR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.45 / unidade
Ver ficha técnica →ATSAM4S8BA-AU
✅ Drop-In✓ Em estoque
$3.72 / unidade
Ver ficha técnica →ATSAM4S8BA-MU
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.79 / unidade
Ver ficha técnica →ATSAM4SD32BA-ANR Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-M4 with FPU and DSP extensions |
| CPU Bit Width | 32-bit |
| Maximum CPU Clock | 120 MHz |
| DMIPS Performance | 1.25 DMIPS/MHz |
| Program Flash | 2 MB (2048 KB) |
| SRAM | 160 KB |
| Core Supply Voltage (VDDCORE) | 1.2 V (typ) |
| I/O Supply Voltage (VDDIO) | 1.62 V to 3.6 V |
| Faixa de temperatura de operação | -40 °C to +85 °C (industrial) |
| Encapsulamento | 64-pin LQFP |
| ADC | 12-bit, up to 16 channels |
| DAC | 2x 12-bit |
| USB | USB 2.0 Full-Speed Device/Host with on-chip transceiver |
| CAN | 1x CAN 2.0A/B |
| Ethernet | 10/100 Ethernet MAC (EMAC) with MII/RMII interface |
| MCI/SDIO | HSMCI for SD/SDIO cards |
| External Bus Interface (EBI) | 8/16-bit SRAM, NOR Flash, NAND Flash support |
| Timers | Multiple TC channels, PWM, RTT, RTC |
| Package Mounting Type | Surface Mount |
| Nível MSL | 3 (per JEDEC J-STD-020) |
| RoHS Compliance | Compliant |
Configuração de pinos do ATSAM4SD32BA-ANR
| Pino 1 | PB0 — General-purpose I/O / PWM |
| Pino 2 | PB1 — General-purpose I/O / PWM |
| Pino 3 | PB2 — General-purpose I/O |
| Pino 4 | PB3 — General-purpose I/O |
| Pino 5 | VDDIO — I/O supply voltage (1.62 V to 3.6 V) |
| Pino 6 | VSSIO — I/O ground |
| Pino 7 | PB4 — General-purpose I/O |
| Pino 8 | PB5 — General-purpose I/O |
| Pino 9 | PB6 — General-purpose I/O |
| Pino 10 | PB7 — General-purpose I/O |
| Pino 11 | PB8 — General-purpose I/O |
| Pino 12 | PB9 — General-purpose I/O |
| Pino 13 | PB10 — General-purpose I/O |
| Pino 14 | PB11 — General-purpose I/O |
| Pino 15 | PB12 — General-purpose I/O |
| Pino 16 | PB13 — General-purpose I/O |
| Pino 17 | PB14 — General-purpose I/O |
| Pino 18 | PB15 — General-purpose I/O |
| Pino 19 | VDDCORE — Core supply voltage (1.2 V typical) |
| Pino 20 | VSS — Core ground |
| Pino 21 | PA0 — General-purpose I/O / AD0 |
| Pino 22 | PA1 — General-purpose I/O / AD1 |
| Pino 23 | PA2 — General-purpose I/O / AD2 |
| Pino 24 | PA3 — General-purpose I/O / AD3 |
| Pino 25 | PA4 — General-purpose I/O / AD4 |
| Pino 26 | PA5 — General-purpose I/O / AD5 |
| Pino 27 | PA6 — General-purpose I/O / AD6 |
| Pino 28 | PA7 — General-purpose I/O / AD7 |
| Pino 29 | PA8 — General-purpose I/O / AD8 |
| Pino 30 | PA9 — General-purpose I/O / AD9 |
| Pino 31 | PA10 — General-purpose I/O / AD10 |
| Pino 32 | VDDCORE — Core supply voltage (1.2 V typical) |
| Pino 33 | VSS — Core ground |
| Pino 34 | PA11 — General-purpose I/O / AD11 |
| Pino 35 | PA12 — General-purpose I/O / AD12 |
| Pino 36 | PA13 — General-purpose I/O / AD13 |
| Pino 37 | PA14 — General-purpose I/O / AD14 |
| Pino 38 | PA15 — General-purpose I/O / AD15 |
| Pino 39 | PA16 — General-purpose I/O |
| Pino 40 | PA17 — General-purpose I/O |
| Pino 41 | PA18 — General-purpose I/O |
| Pino 42 | PA19 — General-purpose I/O |
| Pino 43 | PA20 — General-purpose I/O |
| Pino 44 | PA21 — General-purpose I/O |
| Pino 45 | PA22 — General-purpose I/O |
| Pino 46 | PA23 — General-purpose I/O |
| Pino 47 | PA24 — General-purpose I/O |
| Pino 48 | PA25 — General-purpose I/O |
| Pino 49 | PA26 — General-purpose I/O |
| Pino 50 | PA27 — General-purpose I/O |
| Pino 51 | PA28 — General-purpose I/O |
| Pino 52 | PA29 — General-purpose I/O |
| Pino 53 | PA30 — General-purpose I/O |
| Pino 54 | PA31 — General-purpose I/O |
| Pino 55 | TDI — JTAG Test Data In |
| Pino 56 | TDO — JTAG Test Data Out |
| Pino 57 | TMS — JTAG Test Mode Select / SWDIO |
| Pino 58 | TCK — JTAG Test Clock / SWCLK |
| Pino 59 | NRST — Reset input (active low) |
| Pino 60 | ERASE — Chip erase pin (high at reset triggers full erase) |
| Pino 61 | HDP — Hardware debug port enable |
| Pino 62 | VDDIO — I/O supply voltage (1.62 V to 3.6 V) |
| Pino 63 | VSSIO — I/O ground |
| Pino 64 | DP — USB Full-Speed Data Plus (with on-chip transceiver) |
Aplicações típicas
ATSAM4SD32BA-ANR é adequado para 8 aplicaçãos: Industrial Human-Machine Interface (HMI) Panels, USB Peripherals and Barcode Scanners, USB-to-Ethernet and USB-to-CAN Bridges, Smart Energy Metering, Building Automation Gateways, Motor Control Front-End Processors, Point-of-Sale (POS) Terminals, HVAC and Climate Controllers.
Industrial Human-Machine Interface (HMI) Panels
The ATSAM4SD32BA-ANR is well suited to industrial HMI panels because its 2 MB Flash can hold emWin or LVGL graphic stacks plus fonts and bitmaps without external memory, and the Cortex-M4 FPU accelerates raster operations. The 12-bit ADC and PWM outputs drive backlight dimming and analog sensor reads, while the EBI bus can connect to an external TFT controller for larger displays. Compared to lower-flash SAM4S variants, the 2 MB Flash allows more language assets and screen templates to coexist. Keep VDDCORE decoupling within 5 mm of the pin to avoid LCD noise on the analog ADC readings.
Recomendado
USB Peripherals and Barcode Scanners
The integrated USB 2.0 Full-Speed Device/Host controller with on-chip transceiver enables USB HID, CDC, and mass-storage peripherals without external PHY. For barcode scanners, the DMA-fed USB endpoint delivers 12 Mbps sustained throughput while the Cortex-M4 processes image decode and trigger logic. The 160 KB SRAM accommodates frame buffers for 1D/2D decoding libraries. Add a USBLC6-2SC6 ESD array on DP/DM for production robustness and follow USB-IF pull-up resistor recommendations for full-speed enumeration.
Recomendado
USB-to-Ethernet and USB-to-CAN Bridges
The ATSAM4SD32BA-ANR integrates both USB Full-Speed and 10/100 Ethernet MAC (EMAC), making it a single-chip USB-to-Ethernet gateway. Add an external PHY such as the LAN8720A via RMII for 100 Mbps operation. For industrial protocols, the CAN 2.0A/B controller supports automotive and factory-automation bridging. The 2 MB Flash holds TCP/IP stacks (lwIP) and CANopen or J1939 firmware; the 160 KB SRAM is sufficient for lwIP PBUF buffers. Use MII/RMII according to board layout constraints.
Recomendado
Smart Energy Metering
Single-phase and three-phase smart electricity meters use the ATSAM4SD32BA-ANR for metrology DSP and for the communication backhaul (MCI for SD-card logging plus optional PLC or RF module). The Cortex-M4 DSP extensions execute FFT-based harmonic analysis on the 12-bit ADC samples, while the hardware FPU accelerates per-sample calibration math. Backup mode with RTC keeps the calendar running during mains loss with sub-2 µA draw, preserving time-of-use tariff schedules. The CAN interface supports DLMS/COSEM over CAN for industrial metering.
Recomendado
Building Automation Gateways
Building automation gateways aggregate KNX, Modbus, BACnet, and Wi-Fi/Ethernet traffic. The ATSAM4SD32BA-ANR's combination of USB Host, Ethernet MAC, multiple USART/SPI/TWI, and 2 MB Flash for protocol stacks (FreeRTOS + lwIP + KNXnet/IP) makes it a strong choice. The Cortex-M4 with FPU runs encryption (TLS) for cloud uplink while leaving headroom for local control logic. The EBI can interface to an external Wi-Fi module's host interface if needed.
Recomendado
Motor Control Front-End Processors
In FOC and PFC motor drives, the ATSAM4SD32BA-ANR serves as the supervisory MCU running commutation state machines, while the Cortex-M4 DSP extensions handle fast current-loop math. PWM outputs drive a 3-phase inverter through gate drivers, and the 12-bit ADC samples phase currents synchronously to the PWM center. The CAN interface supports CiA 402 motion-control networking. For higher-frequency loops, pair with a SAM4S16 or SAME70 dual-core design; for low-power fans, the ATSAM4S8CA-AU sibling is sufficient.
Recomendado
Point-of-Sale (POS) Terminals
POS terminals need USB Host for barcode scanners and printers, Ethernet for payment processing, secure key storage, and a colorful HMI. The ATSAM4SD32BA-ANR covers USB Host, Ethernet MAC, HSMCI for SD-card transaction logs, and 2 MB Flash for application code plus TLS libraries. The hardware AES in the SAM4S accelerates secure transaction handshakes. Use the 12-bit ADC for battery monitoring on portable terminals and the RTC for tamper-resistant timestamping.
Recomendado
HVAC and Climate Controllers
HVAC controllers combine analog sensing (NTC thermistors, 0-10 V actuator feedback), digital I/O for relays, and a graphical LCD or segment display. The ATSAM4SD32BA-ANR's 12-bit ADC with up to 16 channels handles multiple temperature zones, while PWM outputs drive triac-fired heaters and variable-speed fans. The 2 MB Flash holds complex scheduling algorithms and multi-language UI assets. CAN bus integration supports BACnet or Modbus HVAC networking. Backup mode with RTC keeps schedules running across power cycles.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAM4SD32BA-ANR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAM4SD32BB-AUR | ATSAM4SD32BA-AU | ATSAM4SD32BA-AN | ATSAM4S16CB-CFNR | ATSAM4SA16BA-AU | ATSAM4S8BA-AU |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | LQFP-64 | LQFP-64 - same | LQFP-64 - same | LQFP-64 - same | LQFP-64 - same | LQFP-64 - same | LQFP-64 - same |
| Program Flash | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB | 1 MB | 512 KB |
| SRAM | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 128 KB |
| Maximum Clock | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Core | Cortex-M4 with FPU | Cortex-M4 with FPU | Cortex-M4 with FPU | Cortex-M4 with FPU | Cortex-M4 with FPU | Cortex-M4 with FPU | Cortex-M4 with FPU |
| USB | USB 2.0 FS Device/Host | USB 2.0 FS Device/Host | USB 2.0 FS Device/Host | USB 2.0 FS Device/Host | USB 2.0 FS Device/Host | USB 2.0 FS Device/Host | USB 2.0 FS Device/Host |
| Ethernet MAC | 10/100 EMAC with MII/RMII | 10/100 EMAC with MII/RMII | 10/100 EMAC with MII/RMII | 10/100 EMAC with MII/RMII | 10/100 EMAC with MII/RMII | 10/100 EMAC with MII/RMII | 10/100 EMAC with MII/RMII |
| CAN | 1x CAN 2.0A/B | 1x CAN 2.0A/B | 1x CAN 2.0A/B | 1x CAN 2.0A/B | 1x CAN 2.0A/B | 1x CAN 2.0A/B | 1x CAN 2.0A/B |
| Silicon Revision | Revision A | Revision B (recommended) | Revision A | Revision A | Revision B | Revision B | Revision A |
| Unit Price (qty 100) | $9.18 | $9.50 | $9.20 | $9.00 | $7.20 | $7.10 | $6.40 |
Principais diferenciais
- Highest flash density in the SAM4S 64-LQFP family (vs ATSAM4S8BA-AU)
- On-chip Ethernet MAC plus USB Host makes it a single-chip gateway (vs PIC32MX)
- Revision A silicon - mature and well-characterized (vs ATSAM4SD32BB-AUR (Revision B))
Notas de projeto
Decouple VDDCORE (pin 19 and pin 32) with a 100 nF X7R ceramic + a 4.7 µF X5R ceramic placed within 5 mm of the pins, and add a 10 µF bulk capacitor near the supply. VDDIO (pin 5 and pin 62) requires a 100 nF ceramic per pin plus a 1 µF bulk. Estimated: at 120 MHz and 1.2 V core, the active current is roughly 30-40 mA, so the LDO supplying VDDCORE must handle at least 50 mA. Use a 3.3 V LDO such as MCP1700 (250 mA) for VDDIO from a 5 V input.
Do NOT leave the ERASE pin floating - tie it to GND through a 10 kΩ resistor. Driving ERASE high during reset triggers a full chip erase of the 2 MB Flash, which can destroy firmware in the field. The NRST pin must have a 10 kΩ pull-up and a 100 nF capacitor to GND for a clean power-on reset. Avoid using PA0-PA3 for high-current loads because they share ADC reference circuits.
Route the USB DP/DM traces as a 90 Ω differential pair with length matching to within 2 mm, keep them short (< 50 mm), and surround them with a ground pour. Place the USBLC6-2SC6 ESD array within 5 mm of the USB connector. For Ethernet, route the RMII signals (50 MHz) with length matching to within 5 mm and keep them away from switching nodes. Reserve a 2x5 0.05" JTAG/SWD header footprint even in production designs to allow firmware recovery.
Estimated: at full 120 MHz CPU + USB + Ethernet activity, the LQFP-64 thermal resistance theta_JA is approximately 50 °C/W, giving a 5-7 °C rise above ambient at 100 mA active current. Industrial-grade operating range (-40 °C to +85 °C) is easily met without a heatsink. The Backup mode with RTC reduces core current below 2 µA, allowing RTC-only operation on a coin cell during mains loss.
Informações de conformidade
RoHS compliant per Microchip product page. Industrial-grade temperature range -40 °C to +85 °C. Not AEC-Q100 qualified; for automotive applications consider the SAM V71/V70 family which has AEC-Q100 Grade 2 variants.
