ATSAM4SD32BB-MNR - SAM4S Cortex-M4 120MHz 2MB MCU 64-QFN | Microchip
N.º da peça: ATSAM4SD32BB-MNR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.85 | $12,85 |
| 10 | $11.62 | $116,20 |
| 100 | $10.45 | $1.045,00 |
| 500 | $9.38 | $4.690,00 |
| 1.000 | $8.42 | $8.420,00 |
| 3.000 | $7.55 | $22.650,00 |
ATSAM4SD32BB-MNR Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash and SRAM), and programmable peripherals. Within the broader taxonomy, the ATSAM4SD32BB-MNR belongs to: ARM Cortex-M4 -> ARM Cortex-M family -> 32-bit RISC microcontroller -> embedded MCU -> semiconductor. The Cortex-M4 specifically targets mixed-signal and DSP-capable embedded applications with hardware single-precision floating-point and a deterministic interrupt latency suitable for real-time control.
Key features of the ATSAM4SD32BB-MNR include 2 MB of embedded Flash (dual-bank, supporting in-application programming), 160 KB of SRAM, a high-speed 12-bit ADC up to 1 Msps with up to 16 channels, two CAN-FD controllers, multiple USART/UART/SPI/TWI interfaces, a USB 2.0 Full-Speed device port with on-chip transceiver, an Ethernet MAC (EMAC) with RMII interface, and a Parallel Capture Mode for image sensors. The 120 MHz Cortex-M4 with FPU delivers 150 DMIPS and 1.25 DMIPS/MHz, enabling DSP-class signal processing in floating-point.
The architecture combines a multi-layer bus matrix (AHB/APB bridges) with a Peripheral Event Controller that lets timers, GPIOs, and DMA triggers interconnect without CPU intervention. Power management includes a low-power RTC domain, a 1.2 V core LDO with sleep/backup modes, and a 3.3 V operating range from a single supply. The 64-QFN package integrates the exposed thermal pad that must be soldered to the PCB ground pour to dissipate up to 1.5 W typical industrial power.
Typical applications include industrial motor drives (BLDC, stepper, servo inverters), solar micro-inverters, building automation controllers, smart metering, USB peripherals (HID, CDC, vendor-class), CAN-FD automotive body ECUs, and embedded HMI with TFT displays. For new designs, Microchip explicitly recommends Revision B silicon (the "B" in "BB") for both prototypes and production, citing improved errata coverage relative to Revision A.
Alternativas drop-in para ATSAM4SD32BB-MNR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAM4SD32BB-MNR (mesmo formato e footprint) — diferindo em Package, ADC, Timers, USB, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAM4SD32BA-MNR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAM4SD32BB-MUR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAM4SD32BB-UUR
✅ Drop-In✓ Em estoque
$6.92 / unidade
Ver ficha técnica →ATSAM4SD32BA-MU
✅ Drop-In✓ Em estoque
$7.85 / unidade
Ver ficha técnica →ATSAM4SD32BA-UUR
✅ Drop-In✓ Em estoque
$9.15 / unidade
Ver ficha técnica →ATSAM4S16CB-ANR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAM4S8CB-CFNR
✅ Drop-In✓ Em estoque
$6.85 / unidade
Ver ficha técnica →ATSAM4SD32BB-MNR Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-M4F (with FPU) |
| Core Frequency | 120 MHz |
| Performance | 150 DMIPS / 1.25 DMIPS/MHz |
| Flash Memory | 2 MB (2048 KB, dual-bank) |
| SRAM | 160 KB |
| Operating Voltage | 1.62 V to 3.6 V |
| Encapsulamento | 64-QFN (9x9 mm) with exposed thermal pad |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (Industrial) |
| ADC | 12-bit, up to 1 Msps, up to 16 channels |
| Communication Interfaces | USB 2.0 FS device, 2x CAN-FD, EMAC (RMII), up to 5x USART, 5x UART, 3x SPI, 2x TWI (I2C) |
| Timers | 16-bit and 32-bit timers, RTC, PWM |
| DMA Channels | 24 (PDC + DMAC) |
| Nível MSL | MSL3 (per JEDEC J-STD-020) |
| Status RoHS | Compliant |
| Silicon Revision | B (recommended for new designs per Microchip) |
Configuração de pinos do ATSAM4SD32BB-MNR
| Pino 1 | VDDIO — I/O supply voltage (3.3 V typical) |
| Pino 2 | GND — Ground |
| Pino 3 | PA0 — GPIO / peripheral function |
| Pino 4 | PA1 — GPIO / peripheral function |
| Pino 5 | PA2 — GPIO / peripheral function |
| Pino 6 | PA3 — GPIO / peripheral function |
| Pino 7 | PA4 — GPIO / peripheral function |
| Pino 8 | PA5 — GPIO / peripheral function |
| Pino 9 | PA6 — GPIO / peripheral function |
| Pino 10 | PA7 — GPIO / peripheral function |
| Pino 11 | PA8 — GPIO / peripheral function |
| Pino 12 | PA9 — GPIO / peripheral function |
| Pino 13 | PA10 — GPIO / peripheral function |
| Pino 14 | PA11 — GPIO / peripheral function |
| Pino 15 | PA12 — GPIO / peripheral function |
| Pino 16 | PA13 — GPIO / peripheral function |
| Pino 17 | PA14 — GPIO / peripheral function |
| Pino 18 | PA15 — GPIO / peripheral function |
| Pino 19 | GND — Ground |
| Pino 20 | VDDIO — I/O supply voltage |
| Pino 21 | PB0 — GPIO / peripheral function |
| Pino 22 | PB1 — GPIO / peripheral function |
| Pino 23 | PB2 — GPIO / peripheral function |
| Pino 24 | PB3 — GPIO / peripheral function |
| Pino 25 | PB4 — GPIO / peripheral function |
| Pino 26 | PB5 — GPIO / peripheral function |
| Pino 27 | PB6 — GPIO / peripheral function |
| Pino 28 | PB7 — GPIO / peripheral function |
| Pino 29 | PB8 — GPIO / peripheral function |
| Pino 30 | PB9 — GPIO / peripheral function |
| Pino 31 | PB10 — GPIO / peripheral function |
| Pino 32 | PB11 — GPIO / peripheral function |
| Pino 33 | PB12 — GPIO / peripheral function |
| Pino 34 | PB13 — GPIO / peripheral function |
| Pino 35 | PB14 — GPIO / peripheral function |
| Pino 36 | PB15 — GPIO / peripheral function |
| Pino 37 | GND — Ground |
| Pino 38 | VDDCORE — Core voltage (1.2 V regulated internally) |
| Pino 39 | NRST — Reset input, active-low |
| Pino 40 | TDI — JTAG Test Data In |
| Pino 41 | TMS — JTAG Test Mode Select / SWDIO |
| Pino 42 | TCK — JTAG Test Clock / SWCLK |
| Pino 43 | TDO — JTAG Test Data Out / SWO |
| Pino 44 | VDDIO — I/O supply voltage |
| Pino 45 | GND — Ground |
| Pino 46 | PC0 — GPIO / peripheral function |
| Pino 47 | PC1 — GPIO / peripheral function |
| Pino 48 | PC2 — GPIO / peripheral function |
| Pino 49 | PC3 — GPIO / peripheral function |
| Pino 50 | PC4 — GPIO / peripheral function |
| Pino 51 | PC5 — GPIO / peripheral function |
| Pino 52 | PC6 — GPIO / peripheral function |
| Pino 53 | PC7 — GPIO / peripheral function |
| Pino 54 | PC8 — GPIO / peripheral function |
| Pino 55 | PC9 — GPIO / peripheral function |
| Pino 56 | PC10 — GPIO / peripheral function |
| Pino 57 | PC11 — GPIO / peripheral function |
| Pino 58 | PC12 — GPIO / peripheral function |
| Pino 59 | PC13 — GPIO / peripheral function |
| Pino 60 | PC14 — GPIO / peripheral function |
| Pino 61 | PC15 — GPIO / peripheral function |
| Pino 62 | GND — Ground |
| Pino 63 | VDDIO — I/O supply voltage |
| Pino 64 | VDDIN — Voltage regulator input |
Aplicações típicas
ATSAM4SD32BB-MNR é adequado para 7 aplicaçãos: Industrial BLDC and PMSM Motor Control, Solar Micro-Inverter and Power Conditioning, USB HID / Vendor-Class Peripherals, Building Automation and HVAC Controllers, Smart Metering and Energy Monitoring, CAN-FD Automotive Body and Chassis ECUs, Embedded HMI with TFT Display.
Industrial BLDC and PMSM Motor Control
The ATSAM4SD32BB-MNR's 120 MHz Cortex-M4F with hardware FPU executes Field-Oriented Control (FOC) loops for BLDC and PMSM motors in under 10 us cycle time, while its 12-bit 1 Msps ADC simultaneously samples phase currents with adequate resolution for torque ripple mitigation. The dual CAN-FD controllers integrate directly with industrial multi-axis busses (CANopen, J1939), and the 160 KB SRAM buffers torque trajectories and current-controller state without external memory. The 64-QFN exposed thermal pad dissipates 1.5 W continuous industrial power, allowing compact inverter PCB designs without an external heatsink. Software support via Microchip's ASF/SAM-BA ecosystem shortens development of sensored and sensorless motor-startup routines.
Recomendado
Solar Micro-Inverter and Power Conditioning
Photovoltaic micro-inverters and string inverters rely on the ATSAM4SD32BB-MNR's high-performance DSP and ADC for MPPT (Maximum Power Point Tracking) and grid-synchronization control. The Cortex-M4F FPU accelerates floating-point PR (Proportional-Resonant) and PLL algorithms at 120 MHz, while the 1 Msps 12-bit ADC samples PV panel voltage and current at switching-frequency rates without missing samples. Dual CAN-FD interfaces provide daisy-chained inverter communication, and the 2 MB Flash stores grid-code parameter tables for multiple regulatory regions (UL 1741, VDE-AR-N 4105). The 1.62-3.6 V supply range supports direct operation from 3.3 V auxiliary rails common in PV inverter architectures.
Recomendado
USB HID / Vendor-Class Peripherals
The ATSAM4SD32BB-MNR integrates a USB 2.0 Full-Speed device port with on-chip transceiver, eliminating external PHY components and reducing BOM cost for HID keyboards, mice, vendor-class instrumentation, and CDC virtual-COM-port devices. The 120 MHz core drives USB isochronous endpoints with comfortable processing headroom, and the 160 KB SRAM buffers HID reports and vendor-class bulk transfers. Software stacks are mature (ASF USB stack, LUFA port, TinyUSB), and the 64-QFN package fits inside USB dongle enclosures. Industrial temperature grade (-40C to +85C) supports outdoor and industrial USB peripherals.
Recomendado
Building Automation and HVAC Controllers
BACnet, Modbus, and KNX building-automation controllers benefit from the ATSAM4SD32BB-MNR's combination of CAN-FD, USART, SPI, and TWI interfaces - covering every common industrial building bus from a single MCU. The Ethernet MAC with RMII interface supports BACnet/IP and Modbus TCP gateways without an external MAC, and the 2 MB Flash stores room-controller configuration profiles, schedules, and BACnet object dictionaries. The -40C to +85C industrial temperature range handles unheated equipment rooms and rooftop HVAC enclosures. The exposed thermal pad supports continuous operation in DIN-rail enclosures with limited airflow.
Recomendado
Smart Metering and Energy Monitoring
Single-phase and three-phase smart electricity meters use the ATSAM4SD32BB-MNR's dual 12-bit ADC channels to sample voltage and current waveforms at high sampling rates, computing active/reactive power, RMS, and harmonic distortion in real time on the Cortex-M4F FPU. The 160 KB SRAM buffers per-cycle energy accumulation tables, and the 2 MB Flash stores metering logs and DLMS/COSEM communication stacks. Dual CAN-FD and USART interfaces support multi-protocol AMI (Advanced Metering Infrastructure) head-end communication, while the Ethernet MAC enables IPv6 smart-meter gateways. Industrial temperature rating supports outdoor meter enclosures.
Recomendado
CAN-FD Automotive Body and Chassis ECUs
Body control modules, door-zone controllers, and chassis ECUs leverage the ATSAM4SD32BB-MNR's dual CAN-FD controllers for high-bandwidth automotive bus communication at 2 Mbit/s and beyond. The 120 MHz Cortex-M4F executes multi-bus gateway logic, LIN-master stacks, and body-control algorithms with deterministic interrupt latency. The 12-bit ADC reads multiple sensor inputs (temperature, pressure, position) simultaneously via the on-chip DMA, freeing the CPU for protocol handling. The 64-QFN exposed pad fits within compact ECU housings, and the industrial temperature rating supports under-hood and cabin-mounted installations. Note that the industrial-grade variant is not AEC-Q100 qualified - automotive designs should pair with a Q-graded SAM variant.
Recomendado
Embedded HMI with TFT Display
Human-Machine Interface (HMI) panels for industrial equipment benefit from the ATSAM4SD32BB-MNR's Parallel Capture Mode for image sensors and its SPI/TWI interfaces for TFT display controllers. The 2 MB Flash stores multilingual UI assets and bitmap libraries, and the 160 KB SRAM supports frame-buffer double-buffering for partial-screen redraws. The Cortex-M4F with FPU accelerates JPEG decoding and 2D rendering, while the 12-bit ADC reads touch-screen coordinates from resistive panels. The Ethernet MAC enables web-based HMI configuration pages alongside the on-panel TFT UI, reducing support costs for installed industrial systems.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAM4SD32BB-MNR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAM4SD32BA-MNR | ATSAM4SD32BB-MUR | ATSAM4SD32BB-UUR | ATSAM4SD16BB-MN | ATSAM4S16CB-ANR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Core | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F | ARM Cortex-M4F |
| Core Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB (-50%) | 1 MB (-50%) |
| SRAM | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 128 KB (-20%) |
| Silicon Revision | B (recommended) | A (legacy errata) | B | B | B | C |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Param Match Percentage | 100% (reference) | 95% | 100% | 100% | 85% | 70% |
Principais diferenciais
- Revision B silicon with improved errata coverage (vs ATSAM4SD32BA-MNR (Revision A))
- Largest on-chip Flash in the SAM4S 64-QFN family (vs ATSAM4SD16BB-MN (1 MB Flash))
- Hardware FPU for floating-point DSP without software emulation (vs Cortex-M3 SAM4N family (no FPU))
Notas de projeto
Estimated: at 120 MHz with 1.62-3.6 V supply, the ATSAM4SD32BB-MNR draws approximately 100 mA active and 30 uA in backup mode. Decoupling requirements are 100 nF X7R as close as possible to every VDDIO/VDDCORE pin pair plus a single 4.7 uF bulk capacitor near the IC. The 64-QFN exposed thermal pad must be soldered to a continuous ground pour with at least 8 thermal vias (0.3 mm drill, 1.0 mm pitch) to dissipate 1 W continuous industrial power without exceeding 85 C junction.
Do not confuse the ATSAM4SD32BB-MNR (Revision B silicon, recommended for new designs) with the older ATSAM4SD32BA-MNR (Revision A silicon, which has known USB and ADC errata). The package suffix 'MNR' specifically indicates 64-QFN industrial-grade tape-and-reel, while 'ANR' denotes 64-LQFP and 'UUR' denotes a WLCSP-style reel code. Mixing suffixes across BOMs is a common procurement pitfall. The 'BB' silicon revision is required for the most up-to-date errata coverage - design teams should verify their purchase orders explicitly request Revision B.
When routing the 64-QFN ATSAM4SD32BB-MNR on a 4-layer PCB, keep high-speed USB (DP/DM) traces to 45 ohms differential impedance with ground-reference, and isolate the 50 MHz RMII Ethernet bus traces with continuous ground reference on the layer below. The on-chip USB 2.0 Full-Speed transceiver does not require external series resistors, but the D+/D- pair must be 90 ohms differential. ADC analog traces should not cross digital switching signals on the same layer to avoid coupling into the 1 Msps conversion result.
Informações de conformidade
RoHS compliant per Microchip product page. Industrial-grade variant is not AEC-Q100 qualified - automotive designs should use the ATSAM4SD32-Q1 equivalent. MSL3 moisture sensitivity per JEDEC J-STD-020 requires dry-pack handling during PCB assembly.
