PIC24FJ1024GA606-I/MR - 16-Bit MCU, 1MB Flash, 32KB RAM | Microchip
N.º da peça: PIC24FJ1024GA606-I/MR ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.5 | $7,50 |
| 10 | $6.85 | $68,50 |
| 100 | $6.1 | $610,00 |
| 500 | $5.4 | $2.700,00 |
| 1.000 | $4.85 | $4.850,00 |
PIC24FJ1024GA606-I/MR Visão geral
A 16-bit microcontroller (MCU) is a programmable processor with a 16-bit data path, sitting in the hierarchy between 8-bit MCUs (PIC16, AVR) and 32-bit MCUs (Cortex-M, PIC32). Within Microchip's portfolio, the PIC24F family targets low-power, deterministic control applications where the simplicity of 8-bit PIC is too constrained but full 32-bit overhead is unnecessary. The PIC24FJ1024GA606 occupies the high-memory tier of this family, where dual-partition Flash and Live Update allow firmware upgrades without halting the application.
Key features of this part include eXtreme Low Power (XLP) sleep currents in the microamp range, on-chip ECC for robust code storage, a wide 2.0V to 3.6V operating range, and an integrated LCD driver option for HMI panels. Multiple communication interfaces enable sensor hub, display, and connectivity bridges, while the DMA controller offloads CPU cycles for high-throughput data movement. The 64-QFN exposed-pad package also provides low thermal resistance, supporting industrial temperature operation from -40C to +85C.
Architecturally, the PIC24FJ1024GA606 implements a modified Harvard architecture with separate program and data paths, a 16-bit instruction set with 24-bit addressing, and peripheral pin-select (PPS) remapping that decouples peripheral functions from fixed pin assignments. Live Update allows field firmware upgrades by swapping between two Flash partitions, critical for industrial controllers, sensor networks, and remote IoT endpoints where in-service updates are mandatory.
Typical applications include industrial IoT sensor nodes, low-power HMI panels with integrated LCD, battery-powered metering and data loggers, building automation controllers, and consumer appliances requiring USB or CAN connectivity via companion transceivers. Designers benefit from Microchip's MPLAB X IDE and Harmony framework, which provide peripheral libraries and code-configurator support that shorten development cycles.
When designing with the PIC24FJ1024GA606-I/MR, allocate the exposed pad to a continuous copper pour of at least 1 square inch to manage the small thermal rise and to support reflow soldering. Decouple each VDD/VSS pair with 100nF ceramic capacitors placed within 2mm of the pins, and route the 32.768kHz crystal traces short and guarded to minimize sleep-current drift. For Live Update, follow Microchip application note guidance on dual-partition bootloader placement to avoid accidental overwrites during field upgrades.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para PIC24FJ1024GA606-I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com PIC24FJ1024GA606-I/MR (mesmo formato e footprint) — diferindo em Package, ADC, Operating Temperature, Program Memory (Flash), Core.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
PIC24FJ1024GA606-E/MR
✅ Drop-In✓ Em estoque
$7.36 / unidade
Ver ficha técnica →PIC24FJ1024GA606-I/MR Classificações máximas e características elétricas
| Core Architecture | PIC24F (16-bit RISC, modified Harvard) |
| CPU Core | PIC24 |
| Instruction Set | 16-bit instructions, 24-bit addressing |
| Maximum Clock Speed | 32 MHz |
| Program Memory (Flash) | 1 MB (341.5K x 24), dual partition with ECC |
| Data Memory (SRAM) | 32 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| Faixa de temperatura de operação | -40 C to +85 C (Industrial, -I suffix) |
| Number of I/O Pins | Up to 53 (64-pin QFN) |
| ADC | 12-bit ADC (multiple channels) |
| Timers | 9 (16/32-bit) |
| UART | 6 |
| SPI | 3 |
| I2C | 3 |
| PWM Channels | 6 |
| DMA Channels | Yes (peripheral DMA supported) |
| Live Update | Yes (dual-partition Flash) |
| LCD Driver | Integrated (segment LCD controller) |
| Encapsulamento | 64-QFN (9x9 mm) with exposed thermal pad |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 (168 hours) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| ECC Support | Yes (Flash ECC) |
Configuração de pinos do PIC24FJ1024GA606-I/MR
| Pino 1 | RP15/PWM3H — Remappable I/O / PWM output |
| Pino 2 | RP14/PWM3L — Remappable I/O / PWM output |
| Pino 3 | RP13 — Remappable I/O |
| Pino 4 | RP12 — Remappable I/O |
| Pino 5 | RP11 — Remappable I/O |
| Pino 6 | RP10 — Remappable I/O |
| Pino 7 | RP9 — Remappable I/O |
| Pino 8 | RP8 — Remappable I/O |
| Pino 9 | VDD — Digital supply voltage |
| Pino 10 | VSS — Digital ground |
| Pino 11 | RP7 — Remappable I/O |
| Pino 12 | RP6 — Remappable I/O |
| Pino 13 | RP5 — Remappable I/O |
| Pino 14 | RP4 — Remappable I/O |
| Pino 15 | RP3 — Remappable I/O |
| Pino 16 | RP2 — Remappable I/O |
| Pino 17 | RP1 — Remappable I/O |
| Pino 18 | RP0 — Remappable I/O |
| Pino 19 | VDD — Digital supply voltage |
| Pino 20 | VSS — Digital ground |
| Pino 21 | OSCI/RC12 — Main oscillator input or remappable I/O |
| Pino 22 | OSCO/RC15 — Main oscillator output or remappable I/O |
| Pino 23 | SOSCI/RPC13 — Secondary oscillator or remappable I/O |
| Pino 24 | SOSCO/RPC14 — Secondary oscillator or remappable I/O |
| Pino 25 | MCLR — Master clear reset (active low) |
| Pino 26 | PGEC2 — Programming/debug clock |
| Pino 27 | PGED2 — Programming/debug data |
| Pino 28 | VDD — Digital supply voltage |
| Pino 29 | VSS — Digital ground |
| Pino 30 | AN0 — Analog input 0 |
| Pino 31 | AN1 — Analog input 1 |
| Pino 32 | AN2 — Analog input 2 |
| Pino 33 | AN3 — Analog input 3 |
| Pino 34 | AN4 — Analog input 4 |
| Pino 35 | AN5 — Analog input 5 |
| Pino 36 | AN6 — Analog input 6 |
| Pino 37 | AN7 — Analog input 7 |
| Pino 38 | AVDD — Analog supply voltage |
| Pino 39 | AVSS — Analog ground |
| Pino 40 | RP16/PWM4H — Remappable I/O / PWM output |
| Pino 41 | RP17/PWM4L — Remappable I/O / PWM output |
| Pino 42 | RP18/PWM5H — Remappable I/O / PWM output |
| Pino 43 | RP19/PWM5L — Remappable I/O / PWM output |
| Pino 44 | RP20/PWM6H — Remappable I/O / PWM output |
| Pino 45 | RP21/PWM6L — Remappable I/O / PWM output |
| Pino 46 | RP22 — Remappable I/O |
| Pino 47 | RP23 — Remappable I/O |
| Pino 48 | RP24 — Remappable I/O |
| Pino 49 | RP25 — Remappable I/O |
| Pino 50 | VDD — Digital supply voltage |
| Pino 51 | VSS — Digital ground |
| Pino 52 | RP26 — Remappable I/O |
| Pino 53 | RP27 — Remappable I/O |
| Pino 54 | RP28 — Remappable I/O |
| Pino 55 | RP29 — Remappable I/O |
| Pino 56 | RP30 — Remappable I/O |
| Pino 57 | RP31 — Remappable I/O |
| Pino 58 | RP32 — Remappable I/O |
| Pino 59 | RP33 — Remappable I/O |
| Pino 60 | RP34 — Remappable I/O |
| Pino 61 | RP35 — Remappable I/O |
| Pino 62 | RP36 — Remappable I/O |
| Pino 63 | RP37 — Remappable I/O |
| Pino 64 | RP38 — Remappable I/O |
Aplicações típicas
PIC24FJ1024GA606-I/MR é adequado para 6 aplicaçãos: Industrial IoT Sensor Nodes, Battery-Powered Metering and Data Loggers, HMI Panels with Integrated LCD, Building Automation Controllers, Consumer Appliance Control Boards, Portable Medical Monitoring Devices.
Industrial IoT Sensor Nodes
The PIC24FJ1024GA606-I/MR is well suited to industrial IoT sensor nodes where low sleep current, ample program memory, and multiple communication interfaces converge. Its eXtreme Low Power (XLP) modes drop quiescent current into the microamp range, allowing battery-powered nodes to operate for years on a single primary cell. The 1MB dual-partition Flash supports OTA firmware updates via the Live Update feature, eliminating the need for a service visit when deploying security patches. Three SPI, three I2C, and six UART peripherals allow simultaneous sensor aggregation, while the DMA controller offloads sample buffering from the CPU. Place the device on a continuous ground pour and use the exposed thermal pad as the primary heat-spreader.
Recomendado
Battery-Powered Metering and Data Loggers
The PIC24FJ1024GA606-I/MR fits battery-powered metering and data logger designs because the 1MB Flash stores long-term trend buffers while the 32KB SRAM holds active sample windows. The integrated 12-bit ADC, with multiple channels and a DMA feed, samples sensors at low CPU overhead, extending runtime. The integrated Real-Time Clock and Calendar plus low-power 32kHz oscillator keep time-of-day accuracy while drawing only nanoamps. Industrial -40C to +85C temperature range supports outdoor enclosures. Design tip: route the 32kHz crystal traces symmetrically and guard them with a ground pour to keep sleep-current drift minimal.
Recomendado
HMI Panels with Integrated LCD
The PIC24FJ1024GA606-I/MR drives segment-LCD HMI panels directly through the integrated LCD controller, eliminating an external driver IC and reducing BOM cost. The 1MB Flash accommodates multi-language fonts and graphics bitmaps, while 32KB SRAM holds the active display framebuffer. The 64-pin QFN (9x9 mm) footprint is compact enough for handheld devices and small appliances. Designers can map the six PWM outputs to LED backlight or buzzer, three I2C buses to capacitive touch, and one UART to a Bluetooth module for wireless configuration. Use the PPS (peripheral pin select) feature to remap functions without rerouting the PCB.
Recomendado
Building Automation Controllers
The PIC24FJ1024GA606-I/MR targets building automation controllers such as HVAC zones, lighting panels, and blind actuators. Its 6 UART channels bridge multiple RS-485 sub-buses, while 3 SPI ports connect to motor drivers and dimmer stages. The DMA controller offloads DMX-style packet handling, freeing the CPU for scheduling logic. The 2.0V to 3.6V supply range accepts power from 24V-bus-derived rails via a buck regulator. The wide industrial temperature range supports unheated equipment rooms. Use the 9 timers for software PWM generation and the integrated ECC Flash for code-safety compliance.
Recomendado
Consumer Appliance Control Boards
The PIC24FJ1024GA606-I/MR drives consumer appliance control boards such as washing machines, dishwashers, and coffee makers where reliability, cost, and code size matter. Its 1MB Flash accommodates large state-machine firmware with multiple wash profiles, while 32KB SRAM handles UI strings and sensor fusion buffers. The 6 PWM channels drive motor control via external gate drivers, and the 12-bit ADC reads thermistors and pressure sensors simultaneously. The Live Update dual-partition Flash lets manufacturers push warranty updates without service intervention. Note NRND status: for new consumer products, evaluate the recommended-replacement part for long-term supply.
Recomendado
Portable Medical Monitoring Devices
The PIC24FJ1024GA606-I/MR fits portable medical monitoring devices such as pulse oximeters, blood pressure monitors, and bedside infusion controllers. The eXtreme Low Power (XLP) sleep currents allow battery operation for weeks between charges, and the integrated 12-bit ADC reads analog front-end signals with sufficient resolution for vital signs. The 1MB Flash stores firmware with built-in self-test routines and calibration curves, while 32KB SRAM holds real-time waveforms. The DMA controller offloads sample buffering, leaving CPU cycles for display and alarm logic. Note: this part is not AEC-Q100 qualified; for automotive medical transport applications consider AEC-Q100 alternatives.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para PIC24FJ1024GA606-I/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | PIC24FJ1024GA606-E/MR | PIC24FJ1024GA606-I/PT |
|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-TQFP (10x10 mm) |
| Core | PIC24F 16-bit | PIC24F 16-bit | PIC24F 16-bit |
| Clock Speed | 32 MHz | 32 MHz | 32 MHz |
| Flash Memory | 1 MB dual partition | 1 MB dual partition | 1 MB dual partition |
| SRAM | 32 KB | 32 KB | 32 KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) |
| Operating Voltage | 2.0V to 3.6V | 2.0V to 3.6V | 2.0V to 3.6V |
| UART / SPI / I2C | 6 / 3 / 3 | 6 / 3 / 3 | 6 / 3 / 3 |
| Lifecycle Status | NRND | NRND | NRND |
Principais diferenciais
- 1MB dual-partition Flash with ECC in 64-QFN (vs PIC24FJ1024GA606-E/MR)
- Compact 64-QFN (9x9 mm) package (vs PIC24FJ1024GA606-I/PT)
- Integrated segment-LCD controller (vs PIC24FJ1024GB606-I/MR)
Notas de projeto
The PIC24FJ1024GA606-I/MR uses a 64-QFN (9x9 mm) package with an exposed thermal pad. While MCU power dissipation is low (typically under 100 mW at full CPU load), the exposed pad must still be soldered to a continuous ground pour of at least 1 square inch to provide thermal relief and a low-impedance ground return. Estimated junction-to-ambient thermal resistance (theta_JA) is approximately 28 C/W with the recommended PCB layout; with inadequate copper, junction temperature can exceed the +85C industrial limit in high-ambient environments.
Place one 100nF (0.1uF) ceramic decoupling capacitor within 2mm of each VDD pin pair. For a 64-QFN package with multiple VDD/VSS pins, this typically requires 4 to 5 capacitors placed strategically around the device perimeter. Add a single 4.7uF bulk capacitor at the device supply rail. Use a star-ground topology with the MCU exposed pad as the central ground reference. Keep crystal oscillator traces as short as possible (under 5mm) and guard them with grounded copper to minimize EMI susceptibility.
Common pitfalls when designing with the PIC24FJ1024GA606-I/MR include: (1) using the MCLR pin as a general-purpose input without proper pull-up, which can cause spurious resets; (2) failing to enable the JTAG/ICD pins PGEC2/PGED2 as digital I/O after programming, which leaves them in debug mode and unavailable; (3) incorrect peripheral pin-select (PPS) unlock sequence, which silently disables remapped functions; (4) omitting the dual-partition bootloader when relying on Live Update, which can brick the device during field upgrades. Always follow Microchip application notes AN1094 (PPS), AN1157 (Live Update), and DS30010041F (datasheet) for proper configuration.
For the analog inputs (AN0-AN7), route traces as short as possible and surround them with a ground guard ring connected to AVSS. Place the 100nF AVdd bypass capacitor within 3mm of the AVDD pin. Avoid routing digital signals across the analog trace region. If using the 12-bit ADC at full sampling rate, allow the acquisition time to settle by inserting software delays between channel switches. For high-accuracy measurements, calibrate the ADC offset and gain using the internal bandgap reference.
Informações de conformidade
RoHS compliant and lead-free per Microchip product page. Not AEC-Q100 qualified - this part targets industrial and consumer markets. Lifecycle status is NRND (Not Recommended for new designs) as of 2026-09-29.
