ATSAMA5D24B-CUR - 500MHz Cortex-A5 MPU, 256-TFBGA | Microchip
N.º da peça: ATSAMA5D24B-CUR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.4963 | $7,50 |
| 10 | $6.75 | $67,50 |
| 100 | $6.2 | $620,00 |
| 500 | $5.85 | $2.925,00 |
| 1.000 | $5.5 | $5.500,00 |
ATSAMA5D24B-CUR Visão geral
What is an Arm Cortex-A5 MPU? An MPU (Microprocessor Unit) is a class of application processor that relies on external memory for program and data storage, in contrast to a microcontroller (MCU) which integrates Flash and SRAM on-chip. The Cortex-A5 core is Arm's smallest, lowest-power 32-bit application core, widely used in industrial HMI, IoT gateways, and cost-sensitive graphical products. The ATSAMA5D24B sits at the integration layer between an MCU (internal memory, deterministic I/O) and a high-end application processor (rich OS, multimedia), trading deterministic real-time latency for higher compute and richer peripheral integration.
Key features of the ATSAMA5D24B-CUR include: a hardened hardware crypto accelerator suite (AES, TDES, SHA, True Random Number Generator), a 12-bit ADC with up to 12 channels, an EMAC with 10/100 Mbit Ethernet plus two CAN-FD controllers, and a state-of-the-art secure boot chain with monotonic secure counters and tamper detection. The integrated LCD controller (up to WXGA) and 2D graphics accelerator (widget, composition, blending) simplify GUI design without an external GPU.
Technically, the device pairs the Cortex-A5 core with a NEON SIMD/FPU engine, dedicated SRAM for audio and crypto, and a low-power architecture drawing as little as 5 uA in backup mode, enabling battery-backed applications. Industrial temperature grade (-40C to +85C) and BGA-green package qualification position it for harsh-environment deployments.
Typical applications include industrial HMI touchscreens, IoT gateways and edge nodes, building-automation controllers, smart-home concentrators, low-end graphical consoles, and secure-connected embedded systems. The combination of CAN-FD, EMAC, USB, and LCD makes it well-suited for automotive infotainment prototypes (non-safety), vending and ticketing kiosks, and medical user-interface panels.
When designing with the ATSAMA5D24B-CUR, plan the PCB for fine-pitch BGA escape routing and provide a robust PMIC power tree - downstream designers typically pair it with the MIC2800 or MIC5365 regulators. Validate DDR3L signal integrity with reference-design IBIS models and allocate sufficient decoupling.
This page synthesizes distributor pricing, drop-in alternatives drawn from the SAMA5D2 family, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para ATSAMA5D24B-CUR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAMA5D24B-CUR (mesmo formato e footprint) — diferindo em Ethernet, Package, USB, Backup Mode Current, Core Architecture.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAMA5D24C-CU
✅ Drop-In✓ Em estoque
$9.05 / unidade
Ver ficha técnica →ATSAMA5D24B-CU
✅ Drop-In✓ Em estoque
$10.42 / unidade
Ver ficha técnica →ATSAMA5D24A-CU
✅ Drop-In✓ Em estoque
$9.85 / unidade
Ver ficha técnica →ATSAMA5D23B-CU
✅ Drop-In✓ Em estoque
$11.9 / unidade
Ver ficha técnica →ATSAMA5D23B-CNR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$10.25 / unidade
Ver ficha técnica →ATSAMA5D24B-CUR Classificações máximas e características elétricas
| Architecture | ARM Cortex-A5 |
| Core Count | 1 |
| Largura do barramento de dados | 32-bit |
| Maximum CPU Clock | 500 MHz |
| Encapsulamento | 256-TFBGA (8x8 mm) |
| Tipo de montagem | Surface Mount |
| L1 Instruction Cache | 128 KByte |
| L1 Data Cache | 128 KByte |
| L2 Cache | 128 KByte |
| External Memory Support | DDR2/DDR3L, LPDDR2/LPDDR3, QSPI, e.MMC Flash |
| Temperatura de operação | -40C to +85C (industrial) |
| Backup Mode Current | 5 uA |
| Hardware Crypto | AES, TDES, SHA, TRNG |
| ADC | 12-bit, up to 12 channels |
| Ethernet | 10/100 Mbit EMAC |
| CAN Controllers | 2 x CAN-FD |
| Graphics | 2D accelerator, LCD controller up to WXGA |
| Peripheral Touch Controller | Yes (PTC) |
| NEON SIMD / FPU | Yes |
| Audio Subsystem | Embedded |
| Status RoHS | Compliant (BGA Green) |
Guia de Configuração de Pinos do ATSAMA5D24B-CUR 256-tfbga (8x8 mm)
Configuração de pinos para ATSAMA5D24B-CUR (pacote 256-tfbga (8x8 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para ATSAMA5D24B-CUR.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
ATSAMA5D24B-CUR é adequado para 7 aplicaçãos: Industrial HMI Touchscreen Controllers, IoT Edge Gateways and Concentrators, Building Automation Controllers, Smart Home Hubs and Concentrators, Low-End Graphical Consoles and Kiosks, Medical User-Interface Panels, Connected Embedded Linux Appliances.
Industrial HMI Touchscreen Controllers
The ATSAMA5D24B-CUR is well matched to industrial HMI panels thanks to its integrated 2D graphics accelerator, LCD controller capable of WXGA (1280x768) resolution, and on-chip Peripheral Touch Controller (PTC) that interfaces directly with projected-capacitive touch sensors. Operating at 500 MHz with NEON SIMD, the Cortex-A5 core can run a Qt5-based graphical stack smoothly while keeping power under 1 W - critical for sealed fanless enclosures common on factory floors. The industrial temperature grade (-40C to +85C) and 256-TFBGA 8x8 mm footprint enable compact designs behind 5- to 10-inch touch panels. Dual CAN-FD interfaces also let the same MPU drive both the HMI and a fieldbus slave on the same PCB, reducing BoM cost in PLC-style machines.
Recomendado
IoT Edge Gateways and Concentrators
For IoT edge gateways aggregating Zigbee, LoRa, or Bluetooth Low Energy traffic, the ATSAMA5D24B-CUR delivers Linux-class networking, on-chip 10/100 EMAC, dual CAN-FD for industrial protocols, and USB 2.0 high-speed for cellular modems. The 5 uA backup current enables battery-backed operation during grid loss, allowing gateways to log last-mile data. With 128 KByte L2 cache and DDR3L support up to 1 GByte, the device runs MQTT brokers and lightweight container runtimes. The hardened hardware crypto (AES, TDES, SHA) and TRNG secure over-the-air firmware updates without external secure elements. Reference designs in Microchip's Linux4SAM distribution shorten prototype cycles for AWS IoT Greengrass or Azure IoT Edge deployments.
Recomendado
Building Automation Controllers
The ATSAMA5D24B-CUR serves as a building-automation central controller where HVAC, lighting, and access-control subsystems converge. Its Cortex-A5 500 MHz compute and NEON SIMD accelerate BACnet, KNX, and Modbus protocol stacks simultaneously. Industrial -40C to +85C temperature range and the small 8x8 mm BGA footprint suit cramped DIN-rail enclosures. The integrated LCD controller and 2D accelerator drive a local status display without an external GPU. Hardware crypto secures credential storage and firmware integrity, while the embedded audio subsystem enables voice-prompt intercoms. Dual CAN-FD and EMAC route building-bus traffic to cloud backhaul via Ethernet, all powered from a single PMIC tree - a typical BoM advantage over multi-MCU designs.
Recomendado
Smart Home Hubs and Concentrators
Smart-home hubs benefit from the ATSAMA5D24B-CUR's balance of Cortex-A5 compute, rich peripherals, and ultra-low 5 uA backup current. The device can host a Matter/Thread border router stack while simultaneously driving a local color touchscreen, all within a single chip. Its 10/100 EMAC, USB 2.0, and QSPI boot from external e.MMC simplify the bill of materials. The integrated audio subsystem supports voice-assistant front-ends. Hardware AES/TDES secures Zigbee/Thread network keys, and the secure-boot chain with monotonic counters prevents firmware rollback attacks - an essential feature for always-connected consumer products. The 256-TFBGA package allows slimmer hub enclosures than competing QFP-packaged MPUs.
Recomendado
Low-End Graphical Consoles and Kiosks
Vending machines, ticketing kiosks, and information displays use the ATSAMA5D24B-CUR as a single-chip solution combining Cortex-A5 compute, 2D graphics, LCD controller, and touch sensing. The NEON SIMD engine accelerates JPEG decoding for promotional videos, while the LCD controller supports panels up to WXGA without an external bridge. The peripheral touch controller interfaces directly with projected-capacitive sensors, eliminating a discrete touch IC. With DDR3L support up to 1 GByte, the device runs modern HTML5/JavaScript kiosk shells via Electron-style containers. Backup-mode 5 uA draw extends battery-backed uptime for portable kiosks during power interruptions.
Recomendado
Medical User-Interface Panels
For medical-device front panels requiring graphical user interfaces without full safety-class certification, the ATSAMA5D24B-CUR delivers 500 MHz Cortex-A5 performance, integrated LCD/touch, and secure boot. Its industrial -40C to +85C temperature range tolerates the warm, enclosed environments of medical carts. The hardware crypto accelerator secures patient-data-at-rest encryption. The 2D graphics accelerator drives smooth menu transitions, while the embedded audio subsystem supports voice prompts for accessibility. Designers should pair the MPU with an isolation barrier and additional IEC 60601-1 qualified peripherals for full medical compliance. Mainline Linux BSP support accelerates FDA submission cycles by reducing custom firmware maintenance.
Recomendado
Connected Embedded Linux Appliances
The ATSAMA5D24B-CUR is ideal for compact Linux-based appliances such as network-attached printers, point-of-sale terminals, and digital-signage controllers. Its Cortex-A5 with NEON runs Debian or Yocto Linux smoothly, the on-chip EMAC and dual CAN-FD simplify field connectivity, and the DDR3L controller supports low-cost commodity memory. The 256-TFBGA 8x8 mm package fits behind display bezels or inside small-form-factor enclosures. With 5 uA backup current, the device can keep RTC time and secure-boot keys alive on a coin cell during long storage. Hardware AES/TDES offloads TLS handshakes, freeing CPU cycles for application logic and improving overall throughput versus software-only crypto.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAMA5D24B-CUR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAMA5D24C-CU | ATSAMA5D24B-CU | ATSAMA5D24A-CU | ATSAMA5D23B-CU |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 256-TFBGA (8x8 mm) | 256-TFBGA (8x8 mm) - same | 256-TFBGA (8x8 mm) - same | 256-TFBGA (8x8 mm) - same | 256-TFBGA (8x8 mm) - same |
| Core Architecture | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 | ARM Cortex-A5 |
| Maximum CPU Clock | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| L2 Cache | 128 KByte | 128 KByte | 128 KByte | 128 KByte | 128 KByte |
| External Memory | DDR2/DDR3L, LPDDR2/LPDDR3 | DDR2/DDR3L, LPDDR2/LPDDR3 | DDR2/DDR3L, LPDDR2/LPDDR3 | DDR2/DDR3L, LPDDR2/LPDDR3 | DDR2/DDR3L, LPDDR2/LPDDR3 |
| Hardware Crypto | AES, TDES, SHA, TRNG | AES, TDES, SHA, TRNG | AES, TDES, SHA, TRNG | AES, TDES, SHA, TRNG | AES, TDES, SHA, TRNG |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| RoHS / Green Status | Yes (BGA Green, UR suffix) | Yes (CU suffix) | Yes (CU suffix) | Yes (CU suffix) | Yes (CU suffix) |
Principais diferenciais
- Direct drop-in successor within same family (vs ATSAMA5D24C-CU)
- Industrial-grade tape-and-reel variant (vs ATSAMA5D24B-CU)
- Hardware crypto accelerator integrated (vs ATSAMA5D23B-CU)
Notas de projeto
The ATSAMA5D24B-CUR uses a 256-ball TFBGA at 0.4 mm pitch on an 8x8 mm body. Route all signals on inner layers using micro-via or laser-drilled stacked-via technology; place 0.1 uF decoupling capacitors within 1 mm of every VDD pin. Reference the SAMA5D2-XULT evaluation board schematic (DS60001653) for escape routing patterns. A 4-layer stackup with continuous GND plane adjacent to the BGA is mandatory for DDR3L signal integrity - JEDEC JESD79-3L compliance requires matched trace lengths within +/-25 mil and 100 ohm differential impedance for clock lanes.
Build a robust PMIC power tree using the Microchip MIC2800 or equivalent. The SAMA5D24B requires a 1.2 V core (VDDCORE), 1.8 V DDR I/O (VDDANA/VDDHSIC), 3.3 V peripheral I/O (VDDUTMIIO), and a backup supply (VDDBU) for RTC retention at 5 uA. Place bulk capacitors (22 uF tantalum) within 5 mm of each regulator output and add 0.1 uF/10 nF ceramic bypass pairs at every supply pin. Power-rail sequencing per datasheet section 'Power Considerations' must be respected - failure to sequence VDDANA before VDDCORE can cause latch-up.
Common pitfalls when designing with the ATSAMA5D24B-CUR include: (1) omitting the backup-battery circuit, which prevents RTC retention and secure-boot key persistence across power cycles; (2) using an incompatible DDR3L ZQ calibration resistor value, causing intermittent boot failures - use the exact 240 ohm 1% resistor recommended in the SAMA5D2 datasheet; (3) ignoring the JTAG/SWD pin remap, which can lock out boundary-scan debug if mistakenly configured as GPIO in OTP fuses. Estimated: at 500 MHz under Linux4SAM with all peripherals enabled, expect ~700 mW active power dissipation in a typical HMI workload.
While the ATSAMA5D24B-CUR does not require an explicit heatsink in most HMI enclosures, thermal management still matters. At 500 MHz with both CPU and graphics engine active, the device dissipates approximately 0.7 W. With a JEDEC JESD51 4-layer test-board theta_JA around 35 C/W, junction temperature rise above ambient is about 25 C. In sealed enclosures with no airflow, derate ambient to +70 C to keep junction under +95 C. Estimated: a thermal copper pour of 1 square inch on the top layer connected to GND via thermal vias provides 15-20% thermal improvement at zero BOM cost.
Informações de conformidade
BGA Green package (RoHS compliant per Microchip product marking). Not AEC-Q100 qualified - for automotive safety use SAMA5D2x AEC variants. Halogen-free per JEDEC JS709B. Reach SVHC declaration available on Microchip product-compliance portal.
