ATSAMA5D24C-CU - Cortex-A5 MPU 500MHz 256-TFBGA | Microchip
N.º da peça: ATSAMA5D24C-CU ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $12.95 | $129,50 |
| 100 | $11.4 | $1.140,00 |
| 500 | $10.1 | $5.050,00 |
| 1.000 | $9.05 | $9.050,00 |
ATSAMA5D24C-CU Visão geral
An embedded microprocessor (MPU) is a CPU subsystem integrated with memory controllers and peripheral IP on a single die, distinct from a microcontroller (MCU) which typically combines CPU, RAM, non-volatile storage, and peripherals for standalone operation. MPUs rely on external DDR memory and external flash, enabling higher performance and larger memory footprints than typical MCUs. Within the broader hierarchy, MPU sits under microprocessor -> SoC -> integrated circuit -> semiconductor.
Key features of the ATSAMA5D24C-CU include 32 KB L1 instruction cache, 32 KB L1 data cache, a floating point unit, arm TrustZone technology, secure boot, encrypted storage, and an embedded audio subsystem with I2S and Class D amplifier interfaces. The device supports Linux and other RTOS distributions via the mainline kernel, with BSPs maintained by Microchip. Power management includes multiple low-power modes with backup-mode current as low as 5 uA per the datasheet overview, enabling extensive battery life for portable or always-on designs.
Architecturally, the device pairs the Cortex-A5 core with a 128 KB L2 cache and a multi-layer bus matrix that provides simultaneous access to DDR memory, peripherals, and DMA engines. The hardware video accelerator supports H.264/VP8 decoding up to 720p, allowing the MPU to drive small-to-mid-size displays without external video decoder ICs. The integrated peripherals, including dual Ethernet GMAC, dual USB (one HS USB host/device with PHY, one HS USB host), and an LCD controller up to XGA, reduce total BOM and PCB area.
Typical applications include industrial HMI panels, smart energy gateways, IoT edge nodes, medical point-of-care terminals, and portable consumer devices with audio playback. The 8x8 mm BGA package suits space-constrained designs, and the wide memory interface (DDR2/DDR3L/LPDDR2/LPDDR3) allows designers to balance cost, performance, and power across product variants.
When designing with this part, ensure the PCB supports BGA assembly (microvia or laser-drilled stacked vias, controlled-impedance routing for DDR and Ethernet), and verify the PMIC selection against the SAMA5D2 power sequencing requirements documented in the datasheet. A 4-layer stackup with continuous reference planes is recommended for the DDR interface to maintain signal integrity.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para ATSAMA5D24C-CU — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAMA5D24C-CU (mesmo formato e footprint) — diferindo em Ethernet, Package, USB, Core Architecture, Backup Mode Current.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAMA5D24B-CU
✅ Drop-In✓ Em estoque
$10.42 / unidade
Ver ficha técnica →ATSAMA5D24A-CU
✅ Drop-In✓ Em estoque
$9.85 / unidade
Ver ficha técnica →ATSAMA5D23B-CU
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$11.9 / unidade
Ver ficha técnica →ATSAMA5D23A-CU
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$7.2 / unidade
Ver ficha técnica →ATSAMA5D22C-CU
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$7.14 / unidade
Ver ficha técnica →ATSAMA5D22B-CUR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$9.1 / unidade
Ver ficha técnica →ATSAMA5D21C-CUR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$11.65 / unidade
Ver ficha técnica →ATSAMA5D21B-CU
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$9.8 / unidade
Ver ficha técnica →ATSAMA5D24C-CU Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-A5 |
| Number of Cores | 1 |
| Largura do barramento de dados | 32-bit |
| Maximum CPU Clock | 500 MHz |
| Internal SRAM | 128 KB |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| Memory Interface | DDR2, DDR3L, LPDDR2, LPDDR3 |
| External Memory Bus | 16-bit (DDR2/DDR3L/LPDDR2/LPDDR3) |
| Boot Memory | QSPI, e.MMC, NAND, SD |
| Graphics / Video | Hardware H.264/VP8 720p decoder, LCD controller up to XGA |
| Encapsulamento | 256-ball TFBGA, 8x8 mm |
| Supply Voltage (Core) | 1.2 V typical |
| Temperatura de operação | -40C to +85C (industrial) |
| Backup Mode Current | 5 uA typical |
| Ethernet | 2x GMAC (10/100/1000 Mbps) |
| USB | 1x HS USB Host/Device with PHY, 1x HS USB Host |
| CAN | 2x CAN-FD controllers |
| Audio | I2S, Class D amplifier, embedded audio subsystem |
| Security | TrustZone, secure boot, hardware crypto accelerators |
| Status RoHS | Compliant |
| Tipo de montagem | Surface Mount (BGA) |
Guia de Configuração de Pinos do ATSAMA5D24C-CU 256-ball tfbga, 8x8 mm
Configuração de pinos para ATSAMA5D24C-CU (pacote 256-ball tfbga, 8x8 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para ATSAMA5D24C-CU.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
ATSAMA5D24C-CU é adequado para 6 aplicaçãos: Industrial HMI Control Panels, Smart Energy Gateways, IoT Edge Nodes and Gateways, Medical Point-of-Care Terminals, Portable Consumer Audio Devices, Building Automation Controllers.
Industrial HMI Control Panels
The ATSAMA5D24C-CU is a strong fit for industrial HMI panels because the integrated LCD controller supports resolutions up to XGA and the on-chip H.264/VP8 decoder handles 720p video without an external companion IC. At 500 MHz the Cortex-A5 core runs a full Linux distribution with Qt or Web-based UIs smoothly, and the dual 10/100/1000 Ethernet GMACs connect the panel to factory networks with link aggregation or dual LAN redundancy. The 256-ball TFBGA 8x8 mm package plus industrial -40C to +85C temperature grade suit panel enclosures with constrained space and thermally demanding environments. DDR3L support keeps BOM cost low for high-volume panel SKUs while maintaining responsive UI rendering at 60 fps.
Recomendado
Smart Energy Gateways
For smart energy gateways aggregating meter data over multiple protocols, the ATSAMA5D24C-CU delivers 500 MHz Cortex-A5 performance to run MQTT brokers, TLS-secured cloud uplinks, and local protocol stacks concurrently. Two CAN-FD controllers interface to sub-meters or inverters, while dual Ethernet provides WAN and metering LAN segmentation. The hardware crypto accelerators accelerate TLS handshakes critical to secure grid communications, and TrustZone plus secure boot protect firmware integrity in deployed units. The 128 KB on-chip SRAM caches small protocol messages without round-trips to external DDR, reducing latency in high-rate metering scenarios.
Recomendado
IoT Edge Nodes and Gateways
The ATSAMA5D24C-CU suits IoT edge nodes running lightweight containerized workloads. The 500 MHz Cortex-A5 plus 128 KB SRAM executes edge analytics, MQTT-SN bridging, and OTA update logic on Linux without overprovisioning. LPDDR2/LPDDR3 support reduces idle power for battery or PoE-powered designs, and the 5 uA backup mode keeps RTC and wake logic alive between active intervals. Dual USB and dual Ethernet give designers flexibility for wired backhaul plus local peripheral connectivity (cameras, sensors) over USB, while the 256-ball TFBGA 8x8 mm package keeps PCB footprint small for wall-mount or DIN-rail enclosures.
Recomendado
Medical Point-of-Care Terminals
In medical point-of-care terminals the ATSAMA5D24C-CU provides deterministic display response and secure boot needed for regulated environments. The integrated LCD controller drives up to XGA touchscreen panels for clinician UI, and the embedded audio subsystem supports speaker/microphone paths for telehealth features. Hardware crypto accelerators and secure boot enable HIPAA-compliant data-at-rest protection, while the industrial -40C to +85C temperature range supports clinical and field-use environments. The DDR3L interface keeps the platform within tight medical device BOM targets.
Recomendado
Portable Consumer Audio Devices
For portable consumer audio devices, the ATSAMA5D24C-CU integrates the Class D amplifier interface and I2S paths directly, removing external audio codec cost. The 500 MHz Cortex-A5 decodes compressed audio and runs user-interface stacks simultaneously, while LPDDR2/LPDDR3 support reduces battery drain versus DDR3L. The 5 uA backup mode extends standby time for always-listening wake-word designs, and the 256-ball TFBGA 8x8 mm package fits slim handheld enclosures. TrustZone and secure boot protect streamed content and pairing credentials.
Recomendado
Building Automation Controllers
The ATSAMA5D24C-CU is well matched to building automation controllers coordinating HVAC, lighting, and access subsystems. Dual CAN-FD buses connect to field devices, dual Ethernet segments the management LAN from tenant networks, and the USB interfaces support wireless radios (Wi-Fi/BLE dongles) for retrofit installs. At 500 MHz with 128 KB SRAM the core runs BACnet, Modbus, and cloud bridges concurrently. The industrial temperature grade and 8x8 mm BGA footprint allow compact DIN-rail enclosures with passive cooling. TrustZone and secure boot protect controller firmware from physical-access tampering in unattended equipment rooms.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAMA5D24C-CU — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAMA5D24B-CU | ATSAMA5D24A-CU | ATSAMA5D23B-CU | ATSAMA5D22C-CU | ATSAMA5D21B-CU |
|---|---|---|---|---|---|---|
| Package | 256-TFBGA 8x8 mm | 256-TFBGA 8x8 mm - same | 256-TFBGA 8x8 mm - same | 256-TFBGA 8x8 mm - same | 256-TFBGA 8x8 mm - same | 256-TFBGA 8x8 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Clock | Cortex-A5 / 500 MHz | Cortex-A5 / 500 MHz | Cortex-A5 / 500 MHz | Cortex-A5 / 500 MHz | Cortex-A5 / 500 MHz | Cortex-A5 / 500 MHz |
| Memory Interface | DDR2/DDR3L/LPDDR2/LPDDR3 | DDR2/DDR3L/LPDDR2/LPDDR3 | DDR2/DDR3L/LPDDR2/LPDDR3 | DDR2/DDR3L/LPDDR2/LPDDR3 | DDR2/DDR3L/LPDDR2/LPDDR3 | DDR2/DDR3L/LPDDR2/LPDDR3 |
| Ethernet | 2x GMAC (10/100/1000) | 2x GMAC | 2x GMAC | 2x GMAC | 1x GMAC | 1x GMAC |
| CAN-FD | 2x CAN-FD | 2x CAN-FD | 2x CAN-FD | 2x CAN-FD | 2x CAN-FD | 1x CAN-FD |
| LCD Controller Max | XGA | XGA | XGA | XGA | XGA | VGA |
| Hardware Video Decoder | H.264/VP8 720p | H.264/VP8 720p | H.264/VP8 720p | H.264/VP8 720p | H.264/VP8 720p | Not included |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principais diferenciais
- Pin-compatible alternate sources across full SAMA5D2 family (vs ATSAMA5D24B-CU)
- Highest integrated feature set in SAMA5D2 family (vs ATSAMA5D21B-CU)
- Lower BOM cost versus higher-end D27 variant (vs ATSAMA5D27C-CU)
Notas de projeto
The 256-ball TFBGA 8x8 mm package requires microvia or laser-drilled stacked-via PCB technology for fan-out. A 4-layer stackup with dedicated ground and power planes is recommended for the DDR interface to maintain signal integrity. Use controlled impedance routing for DDR, USB, and Ethernet differential pairs and follow the SAMA5D2 reference design stackup dimensions. Verify the BGA pad pattern against the JEDEC MO-192 registration to avoid solder joint defects during reflow.
The ATSAMA5D24C-CU requires a multi-rail power supply: 1.2 V for the core, 1.35 V for LPDDR2/LPDDR3, 1.5 V for DDR3L, plus 3.3 V for I/O. Power sequencing per the datasheet must be respected to avoid latch-up; the recommended Microchip PMIC for SAMA5D2 designs (e.g. ACT8865 or similar) integrates the required sequencer. Decouple each supply pin with a 100 nF X7R ceramic cap placed within 2 mm of the ball, plus bulk capacitors on the DDR rail per the reference schematic.
Estimated: at 500 MHz CPU load with DDR3L activity, core power dissipation is approximately 1.0-1.2 W. With the TFBGA package thermal resistance theta_JA of roughly 30-35 C/W on a 4-layer JEDEC test board, junction temperature rises approximately 30-42 C above ambient at 1 W. In enclosed industrial HMI enclosures without airflow, derate ambient by 10-15 C or provide a thermal pad path to the enclosure chassis.
Do not route DDR signals across plane splits - return path discontinuity creates reflections and signal-integrity failures. Verify boot mode strap pins are pulled to the correct state during reset; the SAMA5D2 boot mode (QSPI vs SD vs NAND) is sampled at reset release. The Class D amplifier outputs require an LC output filter and proper PCB layout per the datasheet to meet EMC requirements; do not omit the filter or share the analog ground return path with digital switching currents.
Place the DDR termination VTT resistors and VREF divider within 5 mm of the MPU balls. Route the two Ethernet GMAC RMII/RGMII signals with matched trace lengths within the tolerance specified in the SAMA5D2 datasheet, typically +/- 50 mil for RGMII. Keep USB DP/DN traces at 90 ohm differential and away from switching DC-DC nodes. Refer to the SAMA5D2 Xplained evaluation board schematic and layout for a proven implementation baseline.
Informações de conformidade
RoHS compliant per Microchip product page. Industrial -40C to +85C operating range. AEC-Q100 not applicable - this is an industrial/consumer MPU, not an automotive-qualified device. Refer to SAMA5D2 errata document for known silicon anomalies.
