ATSAMD51J19A-MU-EFP - SAM D51 120MHz Cortex-M4F MCU 512KB | Microchip
N.º da peça: ATSAMD51J19A-MU-EFP ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.4 | $9,40 |
| 10 | $8.55 | $85,50 |
| 100 | $7.65 | $765,00 |
| 500 | $6.85 | $3.425,00 |
| 1.000 | $6.1 | $6.100,00 |
ATSAMD51J19A-MU-EFP Visão geral
What is an ARM Cortex-M4F microcontroller? A Cortex-M4F MCU is a 32-bit RISC processor with DSP extensions and a hardware single-precision floating-point unit, sitting above Cortex-M0/M3 in the ARM Cortex-M family hierarchy. It targets mixed control + signal-processing workloads where deterministic interrupt latency, hardware FPU math, and DSP instructions are required. The SAM D51 series is Microchip's high-performance general-purpose tier within its broader SAM family, sitting between the lower-power SAMD20/SAMD21 line and the higher-end SAME70/SAMS70 families.
Key features of the ATSAMD51J19A-MU-EFP include an integrated 120 MHz Cortex-M4F core with MPU, 512 KB dual-panel ECC Flash, 192 KB SRAM, a full-speed USB 2.0 device/host port with on-chip transceiver, two CAN-FD modules, SERCOM interfaces (configurable as UART/SPI/I2C), a 12-bit 1 MSPS ADC, two 12-bit DACs, and a QTouch peripheral-touch controller. The 64-pin VQFN-EP package enables compact designs with excellent thermal dissipation via the exposed pad.
Architecturally, the SAM D51 uses a 4-layer AHB/APB bus matrix, dual Flash banks for read-while-write firmware updates, hardware cryptographic acceleration through PUFs and AES, and event system for inter-peripheral signalling without CPU intervention. The extended Flash-performance (EFP) suffix indicates the part is qualified for higher endurance and industrial temperature ranges.
Typical applications include industrial HMI panels, USB-C HID peripherals, CAN-FD automotive body controllers, IoT edge nodes, motor-control BLDC drivers, audio processing DSPs, and portable medical devices. Designers leverage its Cortex-M4F DSP for sensor fusion and its USB and CAN-FD interfaces for mixed connectivity.
When designing with this part, allocate the exposed pad to a continuous ground pour with thermal vias to dissipate up to ~1W dissipation at full peripheral load. Configure the brown-out detector (BOD) to 2.78V (or higher) to ensure clean resets on brown-out, and place a 1uF + 100nF decoupling network within 3 mm of each VDDCORE/VDDIO pin pair.
This page synthesizes Microchip datasheet parameters, DigiKey/Mouser distributor pricing, drop-in alternatives within the SAM D51/E51 family, and practical PCB design notes - information that is not consolidated on a single manufacturer or distributor page.
Alternativas drop-in para ATSAMD51J19A-MU-EFP — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAMD51J19A-MU-EFP (mesmo formato e footprint) — diferindo em ADC, Package, SRAM, USB, DAC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAMD51J19A-MU
✅ Drop-In✓ Em estoque
$6.1 / unidade
Ver ficha técnica →ATSAME51J19A-MU-EFP
✅ Drop-In✓ Em estoque
$4.85 / unidade
Ver ficha técnica →ATSAMD51J19A-AUT-EFP
✅ Drop-In✓ Em estoque
$4.45 / unidade
Ver ficha técnica →ATSAMD51J19A-AFT
✅ Drop-In✓ Em estoque
$4.8 / unidade
Ver ficha técnica →ATSAMD51J18A-MU
✅ Drop-In✓ Em estoque
$3.42 / unidade
Ver ficha técnica →ATSAMD51J19A-MU-EFP Classificações máximas e características elétricas
| Core | ARM Cortex-M4F with FPU and MPU |
| Maximum Clock Speed | 120 MHz |
| Flash Memory | 512 KB (dual-panel, ECC) |
| SRAM | 192 KB |
| Operating Voltage | 1.71 V to 3.63 V |
| Encapsulamento | 64-VQFN (9x9 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| USB | USB 2.0 Full-Speed Device/Host with on-chip transceiver |
| CAN | 2x CAN-FD |
| ADC | 12-bit, up to 1 MSPS, up to 16 channels |
| DAC | 2x 12-bit |
| SERCOM | Up to 6 configurable UART/SPI/I2C |
| Temperatura de operação | -40 C to +85 C (industrial) |
| Nível MSL | MSL3 |
| Status RoHS | Compliant |
Configuração de pinos do ATSAMD51J19A-MU-EFP
| Pino 1 | VDDIO — I/O supply voltage |
| Pino 2 | PA00 — GPIO / XIN |
| Pino 3 | PA01 — GPIO / XOUT |
| Pino 4 | PA02 — GPIO / AIN0 |
| Pino 5 | PA03 — GPIO / AIN1 |
| Pino 6 | GND — Ground |
| Pino 7 | PA04 — GPIO / AIN2 |
| Pino 8 | PA05 — GPIO / AIN3 |
| Pino 9 | PA06 — GPIO / AIN4 |
| Pino 10 | PA07 — GPIO / AIN5 |
| Pino 11 | PA08 — GPIO / AIN6 |
| Pino 12 | PA09 — GPIO / AIN7 |
| Pino 13 | PA10 — GPIO / AIN8 |
| Pino 14 | PA11 — GPIO / AIN9 |
| Pino 15 | VDDCORE — Core supply voltage |
| Pino 16 | GND — Ground |
| Pino 17 | PA12 — GPIO / AIN10 |
| Pino 18 | PA13 — GPIO / AIN11 |
| Pino 19 | PA14 — GPIO / AIN12 |
| Pino 20 | PA15 — GPIO / AIN13 |
| Pino 21 | PA16 — GPIO / AIN14 |
| Pino 22 | PA17 — GPIO / AIN15 |
| Pino 23 | PA18 — GPIO |
| Pino 24 | PA19 — GPIO |
| Pino 25 | PA20 — GPIO |
| Pino 26 | PA21 — GPIO |
| Pino 27 | PA22 — GPIO |
| Pino 28 | PA23 — GPIO |
| Pino 29 | PA24 — GPIO / USB_DM |
| Pino 30 | PA25 — GPIO / USB_DP |
| Pino 31 | GND — Ground |
| Pino 32 | PA26 — GPIO |
| Pino 33 | PA27 — GPIO |
| Pino 34 | PA28 — GPIO |
| Pino 35 | PA29 — GPIO |
| Pino 36 | PA30 — GPIO |
| Pino 37 | PA31 — GPIO |
| Pino 38 | PB00 — GPIO |
| Pino 39 | PB01 — GPIO |
| Pino 40 | PB02 — GPIO |
| Pino 41 | PB03 — GPIO |
| Pino 42 | PB04 — GPIO |
| Pino 43 | PB05 — GPIO |
| Pino 44 | PB06 — GPIO |
| Pino 45 | PB07 — GPIO |
| Pino 46 | PB08 — GPIO |
| Pino 47 | PB09 — GPIO |
| Pino 48 | PB10 — GPIO |
| Pino 49 | PB11 — GPIO |
| Pino 50 | PB12 — GPIO |
| Pino 51 | PB13 — GPIO |
| Pino 52 | PB14 — GPIO |
| Pino 53 | PB15 — GPIO |
| Pino 54 | PB16 — GPIO |
| Pino 55 | PB17 — GPIO |
| Pino 56 | PB18 — GPIO |
| Pino 57 | PB19 — GPIO |
| Pino 58 | PB20 — GPIO |
| Pino 59 | PB21 — GPIO |
| Pino 60 | VDDIO — I/O supply voltage |
| Pino 61 | GND — Ground |
| Pino 62 | VDDIO — I/O supply voltage |
| Pino 63 | NRST — Reset (active low) |
| Pino 64 | VDDIO — I/O supply voltage |
Aplicações típicas
ATSAMD51J19A-MU-EFP é adequado para 7 aplicaçãos: Industrial HMI Touch Panels, USB-C Human Interface Peripherals, CAN-FD Automotive Body Controllers, IoT Edge Sensor Nodes, BLDC Motor Control, Portable Medical Devices, Audio Processing DSP Front End.
Industrial HMI Touch Panels
The ATSAMD51J19A-MU-EFP is well suited for industrial HMI touch panels where the Cortex-M4F FPU accelerates graphics rendering of LVGL or emWin UIs while the QTouch peripheral-touch controller handles capacitive buttons. The 120 MHz clock provides headroom for 60 fps frame updates on 480x272 TFT displays, while 192 KB SRAM holds double-buffered framebuffers and widget trees. The 64-VQFN package's exposed pad dissipates up to ~1 W under sustained GUI refresh, and the industrial -40 to +85 C temperature range covers factory-floor operation. Designers can leverage SERCOM for UART to Wi-Fi/BLE modules and USB for firmware updates from a host PC.
Recomendado
USB-C Human Interface Peripherals
The ATSAMD51J19A-MU-EFP's integrated USB 2.0 Full-Speed device/host port with on-chip transceiver eliminates the need for an external PHY, ideal for USB-C keyboards, mice, game controllers, and HID-combo devices. The Cortex-M4F DSP extensions accelerate HID report processing for force-feedback gamepads, while 192 KB SRAM holds large HID descriptor tables and macro recordings. The 512 KB dual-panel Flash supports live firmware updates over USB without device reset, and the SAM D51's 6 SERCOM channels handle RGB LED matrices and UART pass-through. Designers report typical HID polling rates of 1000 Hz with sub-1 ms interrupt latency on this MCU.
Recomendado
CAN-FD Automotive Body Controllers
The ATSAMD51J19A-MU-EFP's dual CAN-FD controllers make it ideal for automotive body-control modules such as door/window controllers, lighting controllers, and seat controllers operating on the vehicle's CAN-FD body network. The Cortex-M4F runs AUTOSAR-friendly real-time scheduling at 120 MHz, while the 12-bit 1 MSPS ADC samples multiple sensor inputs (current, position, temperature) without external analog muxing. For automotive-grade deployment, designers select the ATSAMD51J19A-AUT-EFP variant qualified to -40 to +125 C with full AEC-Q100 Grade 1 documentation, sharing the same 64-VQFN footprint.
Recomendado
IoT Edge Sensor Nodes
The ATSAMD51J19A-MU-EFP is suited for IoT edge sensor nodes combining sensor-fusion DSP workloads with cloud connectivity. The Cortex-M4F FPU executes TinyML inference models (e.g., motion classification, anomaly detection) at sub-10 ms latency while 192 KB SRAM buffers sensor windows and inference intermediate states. The 6 SERCOM channels connect to I2C sensors, SPI IMUs, and UART-to-NBIoT modules. The 1.71 to 3.63 V operating range supports direct Li-ion battery operation, and the Event System routes ADC-complete interrupts to DMA without CPU wakeup - extending sleep-mode battery life for years on a single cell.
Recomendado
BLDC Motor Control
The ATSAMD51J19A-MU-EFP drives sensorless and sensored BLDC motors for drones, e-bikes, and small appliances using its Cortex-M4F DSP to execute field-oriented control (FOC) at 20 kHz PWM. The SAM D51's high-resolution timer/counter (TC) channels produce complementary 3-phase PWM with programmable dead-time insertion, while the 12-bit 1 MSPS ADC samples back-EMF via synchronized hardware triggering. The 192 KB SRAM holds FOC state variables and PI controller history, and the 64-VQFN exposed pad dissipates motor-driver side power dissipation. The QTouch peripheral adds capacitive HMI for fan-speed or mode controls.
Recomendado
Portable Medical Devices
The ATSAMD51J19A-MU-EFP fits portable medical devices such as pulse oximeters, blood-pressure monitors, and wearable ECG patches. The Cortex-M4F FPU runs DSP filter chains (FIR, IIR, FFT) for biosignal conditioning at low latency, while the 12-bit 1 MSPS ADC captures PPG and ECG waveforms at sufficient sampling rates. The 1.71 to 3.63 V supply supports single-cell Li-ion or coin-cell operation, and the Event System routes sensor-ready interrupts directly to DMA for power-efficient capture. The 192 KB SRAM buffers waveform segments for Bluetooth streaming to a host phone.
Recomendado
Audio Processing DSP Front End
The ATSAMD51J19A-MU-EFP serves as an audio DSP front end for USB-C headsets, hearing-loop processors, and active speaker crossovers. The Cortex-M4F DSP instructions execute biquad filters, dynamics compressors, and FIR crossovers at 48 kHz with sub-block CPU headroom for user interfaces. The two 12-bit DACs drive differential audio outputs directly, and the SERCOM-I2S channel connects to external audio codecs for higher fidelity. The 512 KB dual-panel Flash supports live A/B firmware switching for sound-profile experimentation. The 120 MHz clock sustains 256-tap FIR filters at 48 kHz with under 30% CPU load.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAMD51J19A-MU-EFP — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAMD51J19A-MU | ATSAME51J19A-MU-EFP | ATSAMD51J19A-AUT-EFP | ATSAMD51J19A-AFT | ATSAMD51J18A-MU |
|---|---|---|---|---|---|---|
| Package | 64-VQFN (9x9) | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-TQFP (10x10) - same pinout | 64-VQFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Clock | Cortex-M4F / 120 MHz | Cortex-M4F / 120 MHz | Cortex-M4F / 120 MHz | Cortex-M4F / 120 MHz | Cortex-M4F / 120 MHz | Cortex-M4F / 120 MHz |
| Flash Memory | 512 KB | 512 KB | 256 KB (-50%) | 512 KB | 512 KB | 256 KB (-50%) |
| SRAM | 192 KB | 192 KB | 256 KB (+33%) | 192 KB | 192 KB | 192 KB |
| Ethernet MAC | No | No | Yes (10/100) | No | No | No |
| Temperature Grade | Industrial -40 to +85 C (EFP) | Industrial -40 to +85 C | Industrial -40 to +85 C (EFP) | Automotive -40 to +125 C (AEC-Q100) | Automotive -40 to +125 C (AEC-Q100) | Industrial -40 to +85 C |
| USB 2.0 FS | Yes (Device/Host) | Yes | Yes | Yes | Yes | Yes |
| CAN-FD Controllers | 2 | 2 | 2 | 2 | 2 | 2 |
| EFP / Extended Flash | Yes | No | Yes | Yes | No | No |
Principais diferenciais
- Dual-panel ECC Flash with read-while-write (vs ATSAMD51J18A-MU)
- SAM D51 baseline without Ethernet overhead (vs ATSAME51J19A-MU-EFP)
- Extended Flash Performance (EFP) qualification (vs ATSAMD51J19A-MU)
- 64-pin VQFN with thermal pad (vs ATSAMD51G19A-MFT)
Notas de projeto
Estimated: Place a 1 uF + 100 nF X7R ceramic decoupling pair within 3 mm of each VDDCORE/VDDIO pin, with vias to a continuous ground plane directly under the 64-VQFN exposed pad. The exposed pad must be soldered to a 5x5 via-array thermal pad (0.3 mm drill, 0.6 mm pitch) tied to GND for both thermal and electrical reference. Per the SAM D51 datasheet, missing the EP solder connection can raise junction temperature by 30 C under typical loads.
Configure the BOD33 (brown-out detector on the 3.3 V rail) to a threshold of 2.78 V minimum to ensure clean resets on brown-out events - setting below this can cause Flash corruption during voltage droops. Enable the BOD12 on VDDCORE if your design allows separate core voltage regulation. The SAM D51 datasheet notes that BOR (power-on reset) is automatically enabled at startup; verify VDDIO has reached 1.71 V before peripheral initialization begins.
Do not skip the 32.768 kHz crystal load capacitor selection - the SAM D51's XIN/XOUT pins require 12.5 pF crystal-load capacitors matched to the crystal's CL specification, or the RTC will drift several seconds per day. For USB applications, the 22 ohm series resistors on DP/DM and a 10 uF VBUS bulk capacitor must be placed within 5 mm of the USB connector per USB 2.0 specification. Do not enable the brown-out interrupt before configuring the FPU lazy stacking or first floating-point interrupt may hard-fault.
Estimated: At 120 MHz with all peripherals active (USB, CAN-FD, ADC, DAC), typical core current is approximately 22 mA from VDDCORE (1.2 V) and 18 mA from VDDIO (3.3 V), giving ~80 mW total internal dissipation. This rises to ~250 mW during Flash programming operations. The 64-VQFN with proper EP soldering achieves theta_JA of approximately 28 C/W on a 4-layer JEDEC test board - sufficient for the industrial -40 to +85 C operating range without a dedicated heatsink.
Route the USB DP/DM differential pair with 90 ohm differential impedance, length-matched within 150 mil, and keep them away from switching signals (PWM outputs, SERCOM SPI clocks). For CAN-FD, place a 120 ohm termination resistor between CANH and CANL at each end of the bus, with a split termination capacitor network (2x 60 ohm plus 4.7 nF to GND at each end) for improved EMI. Use the SAM D51's built-in CAN-FD transceiver slew-rate control rather than adding external slew limiting.
Informações de conformidade
Industrial grade only; for automotive AEC-Q100 deploy the AUT variant. RoHS and REACH compliant per Microchip product page; halogen-free per MSL3 packaging datasheet.
