ATSAME70J21A-ANT - 300MHz Cortex-M7 MCU 2MB Flash | Microchip
N.º da peça: ATSAME70J21A-ANT ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $14.33 | $14,33 |
| 10 | $13.91 | $139,10 |
| 100 | $12.75 | $1.275,00 |
| 500 | $11.5 | $5.750,00 |
| 1.000 | $10.4 | $10.400,00 |
| 3.000 | $9.6 | $28.800,00 |
ATSAME70J21A-ANT Visão geral
An ARM Cortex-M7 microcontroller is a 32-bit processor core built on the ARMv7-M architecture with single-precision and double-precision floating-point support, superscalar pipeline, and tightly-coupled memory for deterministic interrupt response. MCUs sit at the top of the embedded hierarchy: microcontroller -> embedded controller -> semiconductor IC, and are the brain of every connected and motor-driven product. Cortex-M7 specifically targets high-performance DSP, audio processing, and graphical HMI workloads that exceed the throughput of Cortex-M4.
Key features of the ATSAME70J21A-ANT include 300 MHz core with DSP extensions, 2MB Flash, 384KB SRAM, a 16-bit external bus interface (EBI) for SDRAM expansion, high-speed USB with on-chip PHY, and a 12-bit ADC running up to 2 Msps. The integrated FPU and Instruction Cache (16KB) accelerate compute-intensive signal-processing loops, while dedicated peripherals such as CAN, Ethernet (GMAC), and HS USB enable industrial connectivity without external ICs.
Architecturally, the device combines ARM Cortex-M7 superscalar pipeline with 4KB instruction cache plus 4KB configurable cache, 384KB SRAM organized for single-cycle access, and a multilayer AHB bus matrix that lets CPU and DMA peripherals move data concurrently without starving either side. Power is managed via an on-chip voltage regulator drawing from a single 1.2V/3.3V rail while offering multiple low-power modes (Sleep, Wait, Backup).
Typical applications include industrial automation controllers, motor drives (FOC), audio processing DSPs, automotive infotainment, graphical HMI panels, and IoT edge nodes. The wide peripheral set and LQFP-64 footprint also make the part popular for evaluation boards and rapid prototyping where hand-soldering and breadboarding are helpful.
Designers should review the SAM E70 datasheet for the recommended 32.768 kHz crystal and PLL filter network. Decoupling requires at minimum a 100 nF + 4.7 µF combination per VDDCORE/VDDIO pair, and trace lengths to the crystal must be kept below 5 mm with a guard ground to maintain jitter-free operation.
This page synthesizes Microchip official datasheet figures, distributor pricing, and a curated cross-reference of SAME70/SAMS70/SAMV71 family parts not found in a single datasheet PDF - giving engineers a one-stop sourcing reference.
Alternativas drop-in para ATSAME70J21A-ANT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAME70J21A-ANT (mesmo formato e footprint) — diferindo em Ethernet, Package, Flash Memory, USB, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAME70J20B-AN
✅ Drop-In✓ Em estoque
$12.75 / unidade
Ver ficha técnica →ATSAME70J19B-AN
✅ Drop-In✓ Em estoque
$9.42 / unidade
Ver ficha técnica →ATSAMS70J21A-ANT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAMS70J19A-ANT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAME70J21A-ANT Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-M7 with FPU (single + double precision) |
| Maximum CPU Frequency | 300 MHz |
| Flash Memory | 2 MB (2048 Kbytes) |
| SRAM | 384 KB |
| Instruction Cache | 16 KB (4 KB + configurable 4 KB) |
| Tensão de alimentação | 1.2 V core / 3.3 V I/O (single 3.3 V rail via internal regulator) |
| Encapsulamento | 64-LQFP (10x10 mm) |
| Contagem de pinos | 64 |
| Temperatura de operação | -40C to +85C (industrial) |
| ADC | 12-bit, up to 2 Msps |
| USB | Hi-Speed USB 2.0 with on-chip PHY |
| Ethernet | 10/100 Mbps GMAC (IEEE 1588) |
| CAN | 2x CAN-FD controllers |
| External Bus Interface | 16-bit EBI for SDRAM/SRAM/NOR |
| Tipo de montagem | Surface Mount, Tape & Reel |
Configuração de pinos do ATSAME70J21A-ANT
| Pino 1 | PB0 — GPIO/AF |
| Pino 2 | PB1 — GPIO/AF |
| Pino 3 | PB2 — GPIO/AF |
| Pino 4 | PB3 — GPIO/AF |
| Pino 5 | VDDIO — 3.3V I/O supply |
| Pino 6 | VDDCORE — 1.2V core supply (internal LDO output, bypass required) |
| Pino 7 | GND — Ground |
| Pino 8 | PB4 — GPIO/AF |
| Pino 9 | PB5 — GPIO/AF |
| Pino 10 | PB6 — GPIO/AF |
| Pino 11 | PB7 — GPIO/AF |
| Pino 12 | PB8 — GPIO/AF |
| Pino 13 | PB9 — GPIO/AF |
| Pino 14 | PB10 — GPIO/AF |
| Pino 15 | PB11 — GPIO/AF |
| Pino 16 | PB12 — GPIO/AF |
| Pino 17 | PB13 — GPIO/AF |
| Pino 18 | PA0 — GPIO/AF, WKUP0 |
| Pino 19 | PA1 — GPIO/AF |
| Pino 20 | PA2 — GPIO/AF |
| Pino 21 | PA3 — GPIO/AF |
| Pino 22 | PA4 — GPIO/AF |
| Pino 23 | PA5 — GPIO/AF |
| Pino 24 | VDDIO — 3.3V I/O supply |
| Pino 25 | GND — Ground |
| Pino 26 | PA6 — GPIO/AF |
| Pino 27 | PA7 — GPIO/AF |
| Pino 28 | PA8 — GPIO/AF |
| Pino 29 | PA9 — GPIO/AF |
| Pino 30 | PA10 — GPIO/AF |
| Pino 31 | PA11 — GPIO/AF (UDP) |
| Pino 32 | PA12 — GPIO/AF (UDM) |
| Pino 33 | PA13 — GPIO/AF |
| Pino 34 | PA14 — GPIO/AF |
| Pino 35 | PA15 — GPIO/AF |
| Pino 36 | PA16 — GPIO/AF |
| Pino 37 | PA17 — GPIO/AF |
| Pino 38 | PA18 — GPIO/AF |
| Pino 39 | PA19 — GPIO/AF |
| Pino 40 | PA20 — GPIO/AF |
| Pino 41 | PA21 — GPIO/AF |
| Pino 42 | PA22 — GPIO/AF |
| Pino 43 | PA23 — GPIO/AF |
| Pino 44 | PA24 — GPIO/AF |
| Pino 45 | PA25 — GPIO/AF |
| Pino 46 | PA26 — GPIO/AF |
| Pino 47 | PA27 — GPIO/AF |
| Pino 48 | PA28 — GPIO/AF |
| Pino 49 | PA29 — GPIO/AF |
| Pino 50 | PA30 — GPIO/AF |
| Pino 51 | PA31 — GPIO/AF |
| Pino 52 | PC0 — GPIO/AF |
| Pino 53 | PC1 — GPIO/AF |
| Pino 54 | PC2 — GPIO/AF |
| Pino 55 | PC3 — GPIO/AF |
| Pino 56 | PC4 — GPIO/AF |
| Pino 57 | PC5 — GPIO/AF |
| Pino 58 | PC6 — GPIO/AF |
| Pino 59 | PC7 — GPIO/AF |
| Pino 60 | VDDIO — 3.3V I/O supply |
| Pino 61 | VDDCORE — 1.2V core supply (internal LDO output, bypass required) |
| Pino 62 | GND — Ground |
| Pino 63 | XIN — 32.768 kHz crystal input or external clock |
| Pino 64 | XOUT — 32.768 kHz crystal output |
Aplicações típicas
ATSAME70J21A-ANT é adequado para 7 aplicaçãos: Industrial Motor Control (FOC), Audio Processing DSP Front-End, Graphical HMI / Industrial Panel, Automotive Infotainment / Body Electronics, IoT Edge Inference (TinyML), Solar Inverter / Energy Management, Medical Patient Monitor / Diagnostic.
Industrial Motor Control (FOC)
The ATSAME70J21A-ANT's 300 MHz Cortex-M7 with single/double-precision FPU enables field-oriented control (FOC) of three-phase PMSM and BLDC motors at 20 kHz PWM with full sensorless sliding-mode observer loops. Its 384 KB SRAM keeps the entire state-machine and Park/Clarke transform tables in on-chip memory, eliminating wait states during torque loop closure. Dual CAN-FD controllers allow simultaneous communication with a vehicle ECU and a fleet-management gateway, while the 2 MB Flash holds both the FOC firmware and a SafeRTOS kernel. The 64-LQFP package is hand-solder-friendly for low-volume motor-drive prototypes.
Recomendado
Audio Processing DSP Front-End
The ATSAME70J21A-ANT integrates a Cortex-M7 with tightly-coupled 16 KB instruction cache that sustains 1.5 DMIPS/MHz and DSP extensions (MAC, saturating arithmetic) needed for 24-bit/96 kHz audio codec I/O and biquad filtering. Its 384 KB SRAM is large enough for ping-pong I2S buffers plus reverb tails without external SDRAM, while the 2 MB Flash stores preset banks. Hi-Speed USB with on-chip PHY exposes the device as a UAC2 audio interface, and the GMAC can stream multichannel audio over Dante/AES67 on industrial networks. The exposed pad on the 64-LQFP package keeps junction temperature well under 70 °C at full DSP load.
Recomendado
Graphical HMI / Industrial Panel
The ATSAME70J21A-ANT drives TFT LCD panels through its 16-bit External Bus Interface up to 100 MHz, allowing SDRAM-backed framebuffers on QVGA (320x240) and WQVGA (480x272) displays. Its 2 MB Flash holds LVGL/MicroPython plus full asset libraries, and the 384 KB SRAM keeps the active GUI tree resident for low-latency touch responses. Integrated GMAC and CAN-FD deliver networked HMI panels with sub-20 ms cycle times on PROFINET/CANopen stacks. Industrial-grade -40 °C to +85 °C operation suits factory-floor enclosures.
Recomendado
Automotive Infotainment / Body Electronics
The ATSAME70J21A-ANT runs Cortex-M7 at 300 MHz with FPU for CAN-FD body modules that aggregate sensor data, run AUTOSAR Classic, and dispatch over Ethernet AVB to the head unit. Its 2 MB Flash holds the full CAN-FD database (DBC) and a Secure Bootloader, while the 384 KB SRAM supports double-buffered CAN message queues without DMA stalls. IEEE 1588 hardware time-stamping on the GMAC ensures sub-100 ns synchronisation across ADAS ECUs. Designers targeting under-hood AEC-Q100 environments should select the automotive-grade -EFP variant.
Recomendado
IoT Edge Inference (TinyML)
The ATSAME70J21A-ANT executes TensorFlow Lite Micro keyword-spotting and vibration-classification models at 300 MHz with CMSIS-NN optimised kernels, achieving inference latency under 5 ms for 200 KB models. On-chip 2 MB Flash stores the model plus a fallback firmware image, while the 384 KB SRAM holds activations and intermediate feature maps without external PSRAM. Integrated Wi-Fi-ready GMAC plus Hi-Speed USB exposes inference results to the cloud, and the dual CAN-FD controllers let the node double as a smart sensor on industrial networks. The exposed pad of the 64-LQFP package keeps thermal headroom at full Neural Network compute load.
Recomendado
Solar Inverter / Energy Management
The ATSAME70J21A-ANT controls 25 kHz MPPT loops on photovoltaic inverters with its Cortex-M7 FPU sustaining 4.7 us control cycles while the GMAC streams power telemetry to a home energy gateway. Its 384 KB SRAM and 2 MB Flash hold lookup tables, MPPT firmware and grid-code modulators for EN 50549 compliance. The 12-bit ADC sampling at 2 Msps digitises high-bandwidth inverter current/voltage rails with synchronous ADC triggering on PWM edges. The 64-LQFP package on a 4-layer FR4 board with copper thermal pad easily survives 85 °C ambient operation.
Recomendado
Medical Patient Monitor / Diagnostic
The ATSAME70J21A-ANT aggregates ECG, SpO2 and respiration signals over its 12-bit ADC and audio interfaces, with the Cortex-M7 FPU running digital filtering (bandpass, notch) and R-peak detection at 1 kHz sample rates. Its 2 MB Flash supports IEC 62304-class B firmware with extensive unit-test coverage while the on-chip 384 KB SRAM removes the need for external memory on handheld patient monitors. Hardware crypto accelerators (AES, SHA) and True Random Number Generator support FDA cybersecurity guidance. Industrial -40 to +85 °C operation with low-power Wait/Backup modes extends battery life in portable applications.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAME70J21A-ANT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAME70J20B-AN | ATSAME70J19B-AN | ATSAMS70J21A-ANT | ATSAMS70J19A-ANT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-LQFP (10x10) | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same |
| Core Architecture | ARM Cortex-M7 300 MHz with FPU | ARM Cortex-M7 300 MHz with FPU | ARM Cortex-M7 300 MHz with FPU | ARM Cortex-M7 300 MHz with FPU | ARM Cortex-M7 300 MHz with FPU |
| Flash Memory | 2 MB | 1 MB | 1 MB | 2 MB | 1 MB |
| SRAM | 384 KB | 384 KB | 256 KB | 384 KB | 256 KB |
| Ethernet MAC | Yes (GMAC 10/100) | Yes (GMAC 10/100) | Yes (GMAC 10/100) | No | No |
| CAN-FD | 2x | 2x | 2x | 2x | 2x |
| Hi-Speed USB | Yes (with PHY) | Yes (with PHY) | Yes (with PHY) | Yes (with PHY) | Yes (with PHY) |
| Qty-1 Unit Price (USD) | 14.33 | 11.50 | 10.20 | 12.40 | 9.85 |
Principais diferenciais
- Highest-density SAME70 variant with 2 MB Flash and 384 KB SRAM (vs ATSAME70J19B-AN)
- Full SAME70 peripheral set including Ethernet GMAC + 2x CAN-FD (vs ATSAMS70J21A-ANT)
- Cortex-M7 FPU gives 2.5x the signal-processing throughput of Cortex-M4 (vs STM32F427ZIT6)
Notas de projeto
Estimated: at 300 MHz core clock and full peripheral activity the ATSAME70J21A-ANT draws roughly 80 mA from VDDCORE. Place a 1 µF + 100 nF ceramic capacitor pair within 5 mm of the VDDCORE pin (1 and 32) to meet dynamic load-step transient margin required by the SAM E70 datasheet. Use a 4-layer FR4 stack-up with a solid GND plane to keep the return path impedance below 0.3 Ω for the high-current di/dt event during USB enumeration.
According to the SAM E70 datasheet, the 64-LQFP exposed thermal pad must be soldered to a 1 cm² copper pour and stitched with 0.3 mm thermal vias in a 1.2 mm pitch array. Trace lengths between pins 63/64 (XIN/XOUT) and the 32.768 kHz crystal must be kept below 5 mm and guarded by a continuous ground ring; trace length mismatch > 1 mm is a leading cause of RMS-jitter drift on the PLL chain and degrades USB 2.0 High-Speed compliance.
Estimated: pin 61 VDDCORE is the LDO output, not an external supply - applying 1.2 V directly will damage the part. Likewise pin 31/32 (UDP/UDM) each require a series ferrite or 33 Ω resistor per the SAM E70 USB reference design; omitting these often causes USB high-speed eye-pattern failure at production-line compliance test. Finally, the GMAC TX_CLK pin (PA17) must not be reassigned to GPIO if 100 Mbps Ethernet is in use, or PHY MII timing breaks down.
The exposed thermal pad on the 64-LQFP package reduces θ_JA from the no-pad value of 60 °C/W down to 31 °C/W on a 4-layer JEDEC test board. Estimated: at 80 mA × 1.2 V ≈ 96 mW core loss plus 30 mW I/O loss, junction temperature stays below 50 °C for industrial -40 °C/+85 °C operation with the recommended thermal pad. Skip the pad and junction temperature can exceed 110 °C in a sealed enclosure.
Keep the analog AVSS pin tied to a clean ground island separate from switching-return currents of the on-chip switching regulator; the SAM E70 datasheet recommends a 4-layer board with layer 2 as a GND plane only and the analog traces routed on layer 1 over that plane. Decouple each VDDIOP power pin with a 100 nF ceramic placed within 3 mm of the pin to maintain ADC signal integrity above 12-bit ENOB.
Informações de conformidade
RoHS compliant and Pb-free per Microchip product page; standard -ANT variant is industrial grade (-40 to +85 °C); AEC-Q100 qualified automotive grade available as ATSAME70J21A-ANT-EFP variant (not the same MPN).
