ATSAME70Q21A-AN - 300MHz Cortex-M7 MCU 2MB Flash | Microchip
N.º da peça: ATSAME70Q21A-AN ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.92 | $18,92 |
| 10 | $17.05 | $170,50 |
| 100 | $14.83 | $1.483,00 |
| 500 | $13.21 | $6.605,00 |
| 1.000 | $11.78 | $11.780,00 |
ATSAME70Q21A-AN Visão geral
A microcontroller (MCU) is a single-chip computer containing a processor core, program memory (Flash), data memory (SRAM), and integrated peripherals. Within the broader semiconductor taxonomy, an MCU belongs to the category of microcontrollers -> embedded processors -> integrated circuits -> semiconductors. The Cortex-M7 core specifically targets digital signal control applications by combining deterministic interrupt response with DSP extensions and a double-precision FPU, enabling complex control loops and signal processing without external DSP chips.
Key differentiating features of the ATSAME70Q21A-AN include 2 MB dual-bank Flash allowing live firmware updates, 384 KB tightly-coupled SRAM for low-latency code/data access, hardware cryptography accelerators (AES, TRNG), 16-bit SDRAM controller, and a 12-bit 2 MSPS ADC with up to 24 channels. The device operates from 1.62 V to 3.6 V supply and supports industrial temperature range -40C to +85C.
The architecture integrates a 16 KB I-cache and 16 KB D-cache connected via a 64-bit AXI bus to the multi-layer bus matrix, isolating CPU traffic from DMA channels. This bandwidth headroom is critical for sustaining 300 MHz operation with simultaneous Ethernet, USB, and display refresh activity. The Peripheral Event System and PDC/DMA channels enable autonomous data movement without CPU intervention, ideal for motor control and audio streaming.
Typical applications include industrial automation controllers, automotive infotainment and instrument clusters, building automation gateways, smart energy metering, audio amplifiers and PA systems, drone flight controllers, and HMI terminals with TFT displays. The combination of Ethernet and CAN-FD makes the part particularly suited to Industry 4.0 edge nodes.
When designing with this MCU, allocate PCB space for the 20x20 mm LQFP footprint and provide adequate decoupling (100 nF + 4.7 uF per VDD pin pair) near the exposed pad. Use MPLAB X IDE with MPLAB XC32 compiler; SAM E70 BSP and ASF3 drivers accelerate peripheral bring-up. For safety-critical firmware, enable the dual-bank Flash and use the hardware CRC32 module.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para ATSAME70Q21A-AN — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAME70Q21A-AN (mesmo formato e footprint) — diferindo em Ethernet, ADC, Package, USB, Core.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAME70Q21B-AN
✅ Drop-In✓ Em estoque
$17.4 / unidade
Ver ficha técnica →ATSAME70Q20B-AN
✅ Drop-In✓ Em estoque
$10.85 / unidade
Ver ficha técnica →ATSAMS70Q21A-AN
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAME70N21B-CN
✅ Drop-In✓ Em estoque
$12.1 / unidade
Ver ficha técnica →ATSAME70N21A-AN
✅ Drop-In✓ Em estoque
$15.1 / unidade
Ver ficha técnica →ATSAME70J21A-ANT
✅ Drop-In✓ Em estoque
$9.6 / unidade
Ver ficha técnica →ATSAME70Q21A-AN Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-M7 with FPU |
| Frequência máxima de clock | 300 MHz |
| Program Memory (Flash) | 2 MB (2048 KB) dual-bank |
| SRAM | 384 KB |
| Operating Voltage Range | 1.62 V to 3.6 V |
| Encapsulamento | 144-LQFP (20x20 mm) |
| Tipo de montagem | Surface Mount |
| Faixa de temperatura de operação | -40C to +85C |
| CoreMark Performance | 1500 CoreMark / 300 DMIPS |
| Instruction Cache (I-cache) | 16 KB |
| Data Cache (D-cache) | 16 KB |
| USB Interface | HS USB Host/Device with on-chip PHY |
| Ethernet | 10/100 Mbps MAC (MII/RMII) |
| CAN Interface | 2x CAN-FD |
| ADC | 12-bit, up to 2 MSPS, 24 channels |
| Image Sensor Interface | Yes (ISI, up to 12-bit) |
| External Bus Interface | 16-bit EBI with SDRAM controller |
| Hardware Cryptography | AES-256, True Random Number Generator (TRNG) |
| Status RoHS | Compliant |
| Nível MSL | 3 (168 hours) |
Configuração de pinos do ATSAME70Q21A-AN
| Pino 1 | PD0 — General-purpose I/O / GPIO |
| Pino 2 | PD1 — General-purpose I/O / GPIO |
| Pino 3 | PD2 — General-purpose I/O / GPIO |
| Pino 4 | PD3 — General-purpose I/O / GPIO |
| Pino 5 | VDDIO — I/O supply voltage (1.62V to 3.6V) |
| Pino 6 | VSS — Ground |
| Pino 7 | PD4 — General-purpose I/O / GPIO |
| Pino 8 | PD5 — General-purpose I/O / GPIO |
| Pino 9 | PD6 — General-purpose I/O / GPIO |
| Pino 10 | PD7 — General-purpose I/O / GPIO |
| Pino 11 | PD8 — General-purpose I/O / GPIO |
| Pino 12 | PD9 — General-purpose I/O / GPIO |
| Pino 13 | PD10 — General-purpose I/O / GPIO |
| Pino 14 | PD11 — General-purpose I/O / GPIO |
| Pino 15 | PD12 — General-purpose I/O / GPIO |
| Pino 16 | PD13 — General-purpose I/O / GPIO |
| Pino 17 | PD14 — General-purpose I/O / GPIO |
| Pino 18 | PD15 — General-purpose I/O / GPIO |
| Pino 19 | VDDCORE — Core voltage (internal LDO output, decouple) |
| Pino 20 | VSS — Ground |
| Pino 21 | PA0 — General-purpose I/O / GPIO |
| Pino 22 | PA1 — General-purpose I/O / GPIO |
| Pino 23 | PA2 — General-purpose I/O / GPIO |
| Pino 24 | PA3 — General-purpose I/O / GPIO |
| Pino 25 | PA4 — General-purpose I/O / GPIO |
| Pino 26 | PA5 — General-purpose I/O / GPIO |
| Pino 27 | PA6 — General-purpose I/O / GPIO |
| Pino 28 | PA7 — General-purpose I/O / GPIO |
| Pino 29 | PA8 — General-purpose I/O / GPIO |
| Pino 30 | PA9 — General-purpose I/O / GPIO |
| Pino 31 | VDDIO — I/O supply voltage |
| Pino 32 | VSS — Ground |
| Pino 33 | PA10 — General-purpose I/O / GPIO |
| Pino 34 | PA11 — General-purpose I/O / GPIO / USB D- |
| Pino 35 | PA12 — General-purpose I/O / GPIO / USB D+ |
| Pino 36 | PA13 — General-purpose I/O / GPIO |
| Pino 37 | PA14 — General-purpose I/O / GPIO |
| Pino 38 | PA15 — General-purpose I/O / GPIO |
| Pino 39 | PA16 — General-purpose I/O / GPIO |
| Pino 40 | PA17 — General-purpose I/O / GPIO |
| Pino 41 | PA18 — General-purpose I/O / GPIO |
| Pino 42 | PA19 — General-purpose I/O / GPIO |
| Pino 43 | PA20 — General-purpose I/O / GPIO |
| Pino 44 | PA21 — General-purpose I/O / GPIO |
| Pino 45 | PB0 — General-purpose I/O / GPIO |
| Pino 46 | PB1 — General-purpose I/O / GPIO |
| Pino 47 | PB2 — General-purpose I/O / GPIO |
| Pino 48 | PB3 — General-purpose I/O / GPIO |
| Pino 49 | PB4 — General-purpose I/O / GPIO |
| Pino 50 | PB5 — General-purpose I/O / GPIO |
| Pino 51 | PB6 — General-purpose I/O / GPIO |
| Pino 52 | PB7 — General-purpose I/O / GPIO |
| Pino 53 | PB8 — General-purpose I/O / GPIO |
| Pino 54 | PB9 — General-purpose I/O / GPIO |
| Pino 55 | PB10 — General-purpose I/O / GPIO |
| Pino 56 | PB11 — General-purpose I/O / GPIO |
| Pino 57 | PB12 — General-purpose I/O / GPIO |
| Pino 58 | PB13 — General-purpose I/O / GPIO |
| Pino 59 | PB14 — General-purpose I/O / GPIO |
| Pino 60 | PB15 — General-purpose I/O / GPIO |
| Pino 61 | VDDIO — I/O supply voltage |
| Pino 62 | VSS — Ground |
| Pino 63 | PC0 — General-purpose I/O / GPIO |
| Pino 64 | PC1 — General-purpose I/O / GPIO |
| Pino 65 | PC2 — General-purpose I/O / GPIO |
| Pino 66 | PC3 — General-purpose I/O / GPIO |
| Pino 67 | PC4 — General-purpose I/O / GPIO |
| Pino 68 | PC5 — General-purpose I/O / GPIO |
| Pino 69 | PC6 — General-purpose I/O / GPIO |
| Pino 70 | PC7 — General-purpose I/O / GPIO |
| Pino 71 | PC8 — General-purpose I/O / GPIO |
| Pino 72 | PC9 — General-purpose I/O / GPIO |
| Pino 73 | PC10 — General-purpose I/O / GPIO |
| Pino 74 | PC11 — General-purpose I/O / GPIO |
| Pino 75 | PC12 — General-purpose I/O / GPIO |
| Pino 76 | PC13 — General-purpose I/O / GPIO |
| Pino 77 | PC14 — General-purpose I/O / GPIO |
| Pino 78 | PC15 — General-purpose I/O / GPIO |
| Pino 79 | PC16 — General-purpose I/O / GPIO |
| Pino 80 | PC17 — General-purpose I/O / GPIO |
| Pino 81 | PC18 — General-purpose I/O / GPIO |
| Pino 82 | PC19 — General-purpose I/O / GPIO |
| Pino 83 | PC20 — General-purpose I/O / GPIO |
| Pino 84 | PC21 — General-purpose I/O / GPIO |
| Pino 85 | PC22 — General-purpose I/O / GPIO |
| Pino 86 | PC23 — General-purpose I/O / GPIO |
| Pino 87 | PC24 — General-purpose I/O / GPIO |
| Pino 88 | PC25 — General-purpose I/O / GPIO |
| Pino 89 | PC26 — General-purpose I/O / GPIO |
| Pino 90 | PC27 — General-purpose I/O / GPIO |
| Pino 91 | PC28 — General-purpose I/O / GPIO |
| Pino 92 | PC29 — General-purpose I/O / GPIO |
| Pino 93 | PC30 — General-purpose I/O / GPIO |
| Pino 94 | PC31 — General-purpose I/O / GPIO |
| Pino 95 | VDDIO — I/O supply voltage |
| Pino 96 | VSS — Ground |
| Pino 97 | PE0 — General-purpose I/O / GPIO |
| Pino 98 | PE1 — General-purpose I/O / GPIO |
| Pino 99 | PE2 — General-purpose I/O / GPIO |
| Pino 100 | PE3 — General-purpose I/O / GPIO |
| Pino 101 | PE4 — General-purpose I/O / GPIO |
| Pino 102 | PE5 — General-purpose I/O / GPIO |
| Pino 103 | NRST — Reset input (active low) |
| Pino 104 | TDI — JTAG Test Data In |
| Pino 105 | TDO — JTAG Test Data Out |
| Pino 106 | TMS — JTAG Test Mode Select |
| Pino 107 | TCK — JTAG Test Clock |
| Pino 108 | VDDIO — I/O supply voltage |
| Pino 109 | VSS — Ground |
| Pino 110 | XIN — Crystal oscillator input |
| Pino 111 | XOUT — Crystal oscillator output |
| Pino 112 | VDDPLL — PLL supply voltage |
| Pino 113 | VSS — Ground |
| Pino 114 | VDDUTMI — USB UTMI transceiver supply |
| Pino 115 | VSS — Ground |
| Pino 116 | DDM — USB HS data minus |
| Pino 117 | DDP — USB HS data plus |
| Pino 118 | VDDIO — I/O supply voltage |
| Pino 119 | VSS — Ground |
| Pino 120 | PE6 — General-purpose I/O / GPIO |
| Pino 121 | PE7 — General-purpose I/O / GPIO |
| Pino 122 | PE8 — General-purpose I/O / GPIO |
| Pino 123 | PE9 — General-purpose I/O / GPIO |
| Pino 124 | PE10 — General-purpose I/O / GPIO |
| Pino 125 | PE11 — General-purpose I/O / GPIO |
| Pino 126 | PE12 — General-purpose I/O / GPIO |
| Pino 127 | PE13 — General-purpose I/O / GPIO |
| Pino 128 | PE14 — General-purpose I/O / GPIO |
| Pino 129 | PE15 — General-purpose I/O / GPIO |
| Pino 130 | VDDIO — I/O supply voltage |
| Pino 131 | VSS — Ground |
| Pino 132 | PF0 — General-purpose I/O / GPIO |
| Pino 133 | PF1 — General-purpose I/O / GPIO |
| Pino 134 | PF2 — General-purpose I/O / GPIO |
| Pino 135 | PF3 — General-purpose I/O / GPIO |
| Pino 136 | PF4 — General-purpose I/O / GPIO |
| Pino 137 | PF5 — General-purpose I/O / GPIO |
| Pino 138 | PF6 — General-purpose I/O / GPIO |
| Pino 139 | PF7 — General-purpose I/O / GPIO |
| Pino 140 | PF8 — General-purpose I/O / GPIO |
| Pino 141 | PF9 — General-purpose I/O / GPIO |
| Pino 142 | VDDIO — I/O supply voltage |
| Pino 143 | VSS — Ground |
| Pino 144 | VDDCORE — Core voltage (internal LDO output, decouple) |
Aplicações típicas
ATSAME70Q21A-AN é adequado para 7 aplicaçãos: Industrial Automation Controllers, Automotive Infotainment and Instrument Clusters, Connected HMI Terminals with TFT Displays, Audio Amplifiers and PA Systems, Drone Flight Controllers, Smart Energy Meters and Grid Edge Devices, Building Automation Gateways.
Industrial Automation Controllers
The ATSAME70Q21A-AN suits industrial PLCs and machine controllers because its 300 MHz Cortex-M7 plus 384 KB SRAM executes deterministic control loops with sub-microsecond interrupt latency. The integrated 10/100 Ethernet MAC plus dual CAN-FD lets one chip act as a Modbus-TCP gateway and CANopen master simultaneously, eliminating an external communication coprocessor. The 2 MB dual-bank Flash enables safe remote firmware updates required by IEC 62443 industrial security frameworks. Designers typically pair it with an external 16 MB SDRAM via the EBI to log process data, and use the 12-bit 2 MSPS ADC to sample analog sensor feedback for PID loops.
Recomendado
Automotive Infotainment and Instrument Clusters
The ATSAME70Q21A-AN powers automotive infotainment HMIs and instrument clusters by leveraging its image sensor interface (ISI) for camera input and TFT LCD controller for dashboard displays. The HS USB OTG with on-chip PHY supports smartphone projection protocols such as CarPlay/Android Auto bridges. Dual CAN-FD interfaces connect to the vehicle CAN bus at 5 Mbps for real-time body and powertrain data. The 1500 CoreMark performance renders full-HD gauge clusters at 60 fps while leaving CPU headroom for voice prompts. Although the ATSAME70Q21A-AN is not AEC-Q100 qualified, the ATSAME70Q21A-ANT variant meets automotive temperature grade -40C to +105C.
Recomendado
Connected HMI Terminals with TFT Displays
For factory-floor HMI panels and building automation touchscreens, the ATSAME70Q21A-AN drives QVGA/WQVGA TFTs directly via its integrated LCD controller and 16-bit EBI for SDRAM-backed framebuffers. The Cortex-M7 with FPU accelerates vector graphics rendering and on-screen keyboard input handling. The Ethernet MAC plus USB Host enables barcode scanner and RFID reader support alongside Modbus connectivity. The 2 MB dual-bank Flash allows secure OTA updates of the HMI application across the building network. Designers typically route the on-chip HS USB PHY to a USB Type-C connector for installer firmware loading.
Recomendado
Audio Amplifiers and PA Systems
The ATSAME70Q21A-AN targets professional and prosumer audio amplifiers because its Cortex-M7 with single-precision FPU implements real-time DSP algorithms (limiters, EQ, FIR filters) at audio sample rates up to 192 kHz. The I2S interfaces connect directly to audio DACs/ADCs from manufacturers like Texas Instruments or AKM, while the 384 KB SRAM buffers multiple channels of uncompressed audio. The HS USB OTG accepts digital audio streams from a host PC, and Ethernet enables networked audio distribution over Dante or AES67 protocols. The 12-bit ADC handles auxiliary analog inputs such as VU-meter sensing.
Recomendado
Drone Flight Controllers
Drone flight controllers benefit from the ATSAME70Q21A-AN's 300 MHz processing headroom running Betaflight or Cleanflight derivatives with sub-millisecond control loops. The 12-bit 2 MSPS ADC samples gyroscope and accelerometer data from SPI-attached IMUs at the full 8 kHz update rate, while dual CAN-FD interfaces drive modern ESC stacks and smart batteries. The HS USB OTG simplifies firmware updates on the bench, and the image sensor interface supports a low-resolution optical-flow sensor for indoor position hold. The 20x20 mm 144-LQFP package gives hobbyist-grade PCB assemblers enough pad pitch for hand-soldered prototypes.
Recomendado
Smart Energy Meters and Grid Edge Devices
Smart electricity meters use the ATSAME70Q21A-AN to perform real-time power-quality analysis on voltage and current waveforms sampled by its 12-bit ADC at 2 MSPS. The hardware AES-256 and TRNG secure DLMS/COSEM and TLS 1.3 communication over Ethernet or PLC links, satisfying IEC 62056 and IEC 62351-3 utility cybersecurity requirements. The dual-bank 2 MB Flash stores signed firmware for regulatory metering certification. The CAN-FD ports interface with neighbor-meter mesh networks. Designers typically use the SAM E70 BSP with FreeRTOS and lwIP to build the metering stack.
Recomendado
Building Automation Gateways
Building automation gateways leverage the ATSAME70Q21A-AN's trio of Ethernet, HS USB, and CAN-FD to bridge BACnet/IP, Modbus-TCP, and KNX networks into a single supervisor. The Cortex-M7 with 384 KB SRAM runs lwIP plus an embedded TLS stack for cloud telemetry without external memory. The 2 MB Flash holds BACnet objects and configuration web pages served over HTTP. Designers connect the USB Host to a 4G/LTE dongle for cellular failover and use the image sensor interface for an optional IP-camera input. Industrial temperature grade ensures reliable operation in mechanical rooms.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAME70Q21A-AN — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAME70Q21B-AN | ATSAME70Q20B-AN | ATSAMS70Q21A-AN | ATSAME70N21A-AN | ATSAME70J21A-ANT |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz |
| Flash | 2 MB | 2 MB | 1 MB | 2 MB | 2 MB | 2 MB |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB |
| Ethernet | 10/100 MAC | 10/100 MAC | 10/100 MAC | Not present | 10/100 MAC | 10/100 MAC |
| Crypto (AES/TRNG) | Yes | Yes | Yes | Yes | Not present (N-series) | Yes |
| Silicon Revision | A | B (errata fixes) | B | A | A | A |
Principais diferenciais
- Highest Flash density in the SAM E70 144-LQFP family (vs ATSAME70Q20B-AN)
- Revision-A silicon with mature firmware ecosystem (vs ATSAME70Q21B-AN)
- Combined Ethernet MAC + HS USB + dual CAN-FD (vs ATSAMS70Q21A-AN)
Notas de projeto
Estimated: at 300 MHz with all peripherals active, the ATSAME70Q21A-AN draws approximately 100-150 mA from VDDCORE (internal LDO output). Provide a 4.7 uF X5R + 100 nF ceramic decoupling pair on each VDDIO pin and a bulk 10 uF on VDDCORE. For noise-sensitive analog peripherals, place a ferrite bead between the digital and analog VDDIO rails and add a dedicated AVSS connection.
The 144-LQFP has a 0.5 mm pitch and 20x20 mm body - layout requires 4-layer PCB with continuous ground plane beneath the package. Route the 16-bit EBI to external SDRAM with matched trace lengths (±150 mil) and a 33 ohm series damping resistor on each data/address line. Keep the 12 MHz main crystal traces shorter than 5 mm and surround them with a ground guard ring to avoid radiated interference into the USB differential pair (DDM/DDP).
Do not leave the NRST pin floating - add a 10 kohm pull-up to VDDIO and a 100 nF capacitor to ground for a clean power-on-reset. The HS USB DP/DM traces must be 90 ohm differential with no stubs; do not place any test points in the USB path. When using the dual-bank Flash, ensure your bootloader disables interrupts during the bank-swap sequence to avoid fetch glitches.
Estimated: at maximum core activity the die dissipates approximately 0.5-0.8 W, raising junction temperature by 15-25C above ambient in the 144-LQFP package (theta_JA approximately 30 C/W with proper 4-layer PCB ground plane). For continuous industrial-temperature operation, place thermal vias under the exposed pad and connect them to a 2 oz copper pour on the bottom layer for additional heat spreading.
Informações de conformidade
RoHS and REACH compliant per Microchip product page. Standard -AN grade is not AEC-Q100 qualified; choose ATSAME70Q21A-ANT for automotive temperature grade (-40C to +105C).
