BCM8722BIFBG - Dual 10GbE SFP/LRM to XAUI Transceiver | Broadcom
N.º da peça: BCM8722BIFBG ✗ Fim de vidaBCM8722BIFBG Visão geral
A transceiver is an interface IC that converts parallel or framed digital data into high-speed serial signals and reverses that process on the receive side. The BCM8722BIFBG occupies the interface ICs and transceivers portion of the network-equipment hierarchy, connecting SFP/LRM optical or copper modules to an XAUI-capable switching or forwarding ASIC. Its dual-channel architecture supports two 10GbE links in one device, reducing component count when a board needs more than one high-speed port.
The principal application attributes are dual 10GbE operation, SFP/LRM serial connectivity, and XAUI interfacing. These features place the device in optical transport, Ethernet switching, router, and server-network-adapter designs where multiple 10-gigabit links must connect removable SFP modules to a host controller. The SFP/LRM designation identifies the intended module-side interface, while the XAUI side connects to a compatible network processor, switch ASIC, or field-programmable logic design.
In a typical design, the BCM8722BIFBG is placed between one or two SFP/LRM modules and the board's line-card or switching controller. The host controller must support the same XAUI electrical interface and provide the required clocking, reference, power, and control connections. Because this is a high-speed mixed-signal interface device, PCB layout, controlled-impedance routing, power-plane integrity, connector mechanics, and thermal management can determine whether the complete link operates reliably.
A key design consideration is that an SFP module, XAUI host device, optical or copper cable, and transceiver must be treated as one interoperable link path. Validate connector, media, reach, coding, clocking, and application-level compatibility rather than judging the BCM8722BIFBG only by its nominal 10GbE capability. The Broadcom manufacturer's technical documentation should govern electrical characteristics, package dimensions, pin assignments, reflow, and recommended application layouts.
This page combines the confirmed product identity, interface roles, distributor sourcing records, and engineering-focused replacement guidance. It also distinguishes direct drop-in substitutions from broader functional alternatives so procurement and hardware teams can assess PCB impact, protocol compatibility, and qualification risk before releasing a change.
Alternativas drop-in para BCM8722BIFBG — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Nenhuma alternativa drop-in disponível para este produto.
Solicitar alternativasBCM8722BIFBG Classificações máximas e características elétricas
| Product Type | Dual SFP/LRM serial-to-XAUI transceiver |
| Manufacturer | Broadcom |
| Taxa de dados | 10 Gb/s per channel |
| Channel Count | 2 channels |
| Module-Side Interface | SFP/LRM serial interface |
| Host-Side Interface | XAUI |
| Ethernet Classification | 10GBE |
| Função | Dual SFI-to-XAUI PHY |
| Component Class | Driver, receiver, and transceiver IC |
| Moisture Sensitivity Level | MSL 1 (Unlimited) |
| REACH Status | REACH Unaffected |
| Standard Packaging | Tray |
Guia de Configuração de Pinos do BCM8722BIFBG standard
Configuração de pinos para BCM8722BIFBG (pacote standard). Este componente analógico possui pinos de entrada, saída e alimentação. Consulte o datasheet do fabricante para configurações de offset null, compensação e pino de enable. Ideal para circuitos de condicionamento de sinal e amplificadores.
Nenhum dado detalhado de pinagem disponível para BCM8722BIFBG.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
BCM8722BIFBG é adequado para 6 aplicaçãos: 10GbE Ethernet Switch Line Cards, Router and Aggregation Equipment, Enterprise Data-Center Network Cards, Optical Transport and Backplane Links, Industrial Ethernet Gateways, Network Monitoring and Test Equipment.
10GbE Ethernet Switch Line Cards
The BCM8722BIFBG fits a dual-port 10GbE line card by placing two SFP/LRM serial links in front of an XAUI-capable switching ASIC. Its dual-channel architecture reduces the number of separate high-speed PHY devices required when both ports use the same SFP/LRM media family. The board must still provide compliant clocking, power delivery, controlled-impedance routing, and module cage mechanics. System validation should combine the transceiver with the intended SFP/LRM modules and host controller rather than treating it as a stand-alone plug-in.
Recomendado
Router and Aggregation Equipment
In router and aggregation equipment, the BCM8722BIFBG can provide dual 10GbE SFP/LRM connectivity to an XAUI-capable forwarding processor. This arrangement is useful when a chassis provides interchangeable SFP modules and needs a common host-side interface for packet forwarding. Board partitioning becomes important because high-speed differential lanes must not share noisy switching-power return paths. Confirm module compatibility, lane mapping, reference-clock architecture, and the forwarding ASIC's supported XAUI configuration before release to production.
Recomendado
Enterprise Data-Center Network Cards
The BCM8722BIFBG is applicable to dual 10GbE server-access and data-center network cards when an XAUI-capable controller drives the host side. Its SFP/LRM module interface supports replaceable media choices, while the two-channel arrangement can serve redundant uplink or server-facing ports. Deployment quality depends on careful layer control, connector and cage selection, chassis airflow, and electromagnetic compatibility testing. Validate hot-plug behavior, module insertion effects, error handling, and the complete data path under sustained traffic.
Recomendado
Optical Transport and Backplane Links
BCM8722BIFBG can support optical-transport equipment that uses SFP/LRM modules to connect equipment over copper or optical media. The XAUI interface provides the high-speed host-side path associated with 10GbE Ethernet designs, while the module side permits media flexibility. Optical reach and encoding are properties of the selected SFP/LRM module rather than of the BCM8722BIFBG itself. Engineers should therefore validate interoperability, BER behavior, optical power budget, connector cleanliness, and thermal performance as system-level requirements.
Recomendado
Industrial Ethernet Gateways
A dual-SFP/LRM interface makes the BCM8722BIFBG relevant to industrial Ethernet gateways that bridge multiple 10GbE uplinks into a control or processing architecture. Such systems benefit from removable modules when field technicians need flexible media choices without replacing the gateway. Industrial implementations must account for temperature limits, conducted and radiated emissions, surge requirements, enclosure grounding, and long-term availability of every selected component. Confirm operating-temperature and industrial-qualification requirements before using the transceiver outside a commercial laboratory environment.
Recomendado
Network Monitoring and Test Equipment
The BCM8722BIFBG can be used in network monitoring or test equipment that requires two independent 10GbE SFP/LRM connections to a XAUI-capable analysis engine. This application benefits from the module interface because probes can use different cable, fiber, and reach configurations while retaining a common board architecture. Accurate measurements depend on deterministic clocking, low-jitter reference sources, controlled thermal conditions, and careful isolation between test channels. Calibration routines and interoperability testing should use representative modules and traffic patterns.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para BCM8722BIFBG — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Notas de projeto
Use the manufacturer's reference layout as the starting point for all high-speed differential routes. Keep the XAUI and SFI lane paths continuous, symmetrical, and referenced to a continuous ground plane; avoid stubs, unnecessary vias, and splits in the plane beneath the device. Confirm the final stack-up, characteristic impedance, loss budget, and connector geometry during PCB design.
Partition the high-speed transceiver supply network from noisy switching-converter stages and provide local high-frequency bypass at the pins identified by the manufacturer. Sequence the required rails in the order specified by the device documentation, and verify startup, shutdown, voltage tolerance, and current limits across every operating mode. Do not estimate a common decoupling network without the device's recommended values.
Do not treat an SFP/LRM module as interchangeable merely because it uses the same connector. Media reach, coding, electrical behavior, and supported host protocol must match the design intent. Likewise, an XAUI-capable competitor is not a drop-in substitute unless its package, pin assignments, clocks, supply rails, and timing behavior have been explicitly matched.
Estimate board-level heat dissipation from the device's actual supply voltage and operating current using the manufacturer limits. Keep high-speed retimers, optical modules, and switching regulators spatially separated where practical, preserve airflow paths, and monitor temperature near the transceiver during worst-case traffic. Estimated thermal calculations must use the final board construction and enclosure conditions.
Informações de conformidade
The technical record states REACH Unaffected and MSL 1 (Unlimited). No manufacturer statement for RoHS, AEC-Q100, lead-free status, halogen-free status, or conflict-minerals compliance is established by the available product records.