CXDB5CCAM-MK - LPDDR4X SDRAM 8Gb | CXMT | Mobile & AI
N.º da peça: CXDB5CCAM-MK ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $92.7273 | $92,73 |
| 10 | $66.9697 | $669,70 |
| 100 | $59.2424 | $5.924,24 |
| 500 | $56.6667 | $28.333,35 |
| 1.000 | $54.0909 | $54.090,90 |
CXDB5CCAM-MK Visão geral
LPDDR4X (Low Power Double Data Rate 4X) is a type of synchronous dynamic random-access memory (SDRAM) optimized for low power consumption and high data rates, commonly used in smartphones, tablets, and embedded systems. It is part of the LPDDR memory family, which evolved from DDR to provide reduced voltage and power for mobile applications. LPDDR4X operates at a lower I/O voltage (0.6V) compared to LPDDR4 (1.1V), enabling significant power savings while maintaining high bandwidth.
Key features of the CXDB5CCAM-MK include support for asynchronous reset, data mask function, and ZQ calibration, which are essential for reliable memory operation. The device is RoHS compliant, ensuring environmental safety. The BGA200 package offers a compact footprint suitable for space-constrained designs, and the -25°C to +85°C operating temperature range supports both commercial and industrial applications.
Technically, the CXDB5CCAM-MK is a 8Gb (gigabit) LPDDR4X device, organized as 512M x 16, providing a 16-bit data bus. It supports data rates up to 4266 Mbps, delivering high bandwidth for demanding applications. The memory uses a 1.1V core voltage and 0.6V I/O voltage, reducing power consumption by up to 40% compared to LPDDR4. The device includes on-die ECC and supports deep power-down mode for extended battery life.
Typical applications include smartphones, tablets, AI edge devices, and automotive infotainment systems. The CXDB5CCAM-MK is also used in Rockchip RK3588S-based systems, where it provides the necessary memory bandwidth for high-resolution displays and AI processing. Its low power consumption makes it ideal for battery-powered devices.
When designing with this memory, ensure proper PCB layout for high-speed signals, including impedance matching and minimal trace lengths. Use the ZQ calibration feature to optimize signal integrity. The device supports a wide range of operating conditions, but careful attention to power supply decoupling is recommended to maintain stable operation.
Alternativas drop-in para CXDB5CCAM-MK — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
CXDB5CCAM-MJ
📋 Alternativa de referência (fora do catálogo)
CXDB5CCAM-ML
📋 Alternativa de referência (fora do catálogo)
K4UBE3D4AA-MGCL
📋 Alternativa de referência (fora do catálogo)
H9HCNNN8KUML
📋 Alternativa de referência (fora do catálogo)
MT53B256M32D1
📋 Alternativa de referência (fora do catálogo)
CXDB5CCAM-MK Classificações máximas e características elétricas
| Tipo de memória | LPDDR4X SDRAM |
| Density | 8Gb |
| Organização da memória | 512M x 16 |
| Largura do barramento de dados | 16 bits |
| Taxa de dados | 4266 Mbps |
| Core Voltage (VDD1) | 1.1 V |
| I/O Voltage (VDD2) | 0.6 V |
| Faixa de temperatura de operação | -25°C to +85°C |
| Encapsulamento | BGA200 |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Asynchronous Reset | Yes |
| Data Mask Function | Yes |
| ZQ Calibration | Yes |
| On-Die ECC | Yes |
Configuração de pinos do CXDB5CCAM-MK
| Pino A1 | VDD1 — Core power supply (1.1V) |
| Pino A2 | VDDQ — I/O power supply (0.6V) |
| Pino B1 | DQ0 — Data input/output 0 |
| Pino B2 | DQ1 — Data input/output 1 |
| Pino C1 | DQS0 — Data strobe 0 |
| Pino C2 | DQS0# — Data strobe 0 complement |
| Pino D1 | CK — Clock input |
| Pino D2 | CK# — Clock input complement |
| Pino E1 | CS# — Chip select |
| Pino E2 | CKE — Clock enable |
| Pino F1 | RESET# — Asynchronous reset |
| Pino F2 | ZQ — ZQ calibration |
Aplicações típicas
CXDB5CCAM-MK é adequado para 6 aplicaçãos: Smartphones, AI Edge Devices, Tablets, Automotive Infotainment, Embedded Systems, Wearables.
Smartphones
The CXDB5CCAM-MK provides high-bandwidth, low-power memory for flagship smartphones, enabling smooth multitasking and high-resolution media playback. Its 4266 Mbps data rate and 0.6V I/O voltage reduce power consumption, extending battery life. The BGA200 package fits compact PCB designs, and the -25°C to +85°C range supports various climates.
Recomendado
AI Edge Devices
In AI edge devices, the CXDB5CCAM-MK offers the memory bandwidth needed for neural network inference and real-time data processing. Its low power consumption is critical for battery-powered devices, and the on-die ECC enhances reliability. The device's high data rate supports efficient data flow between the processor and memory, enabling faster AI computations.
Recomendado
Tablets
Tablets benefit from the CXDB5CCAM-MK's combination of high performance and low power, enabling long battery life and responsive multitasking. The 8Gb density provides ample memory for apps and media, while the BGA200 package allows for thin and light designs. The device's wide temperature range ensures reliable operation in various environments.
Recomendado
Automotive Infotainment
The CXDB5CCAM-MK is suitable for automotive infotainment systems, providing high bandwidth for navigation, multimedia, and connectivity features. Its -25°C to +85°C operating range meets automotive temperature requirements, and the low power consumption helps manage thermal loads. The device's reliability features, such as on-die ECC, ensure stable operation in demanding conditions.
Recomendado
Embedded Systems
For embedded systems, the CXDB5CCAM-MK offers a compact, low-power memory solution with high bandwidth. Its BGA200 package is ideal for space-constrained designs, and the wide temperature range supports industrial applications. The device's features, such as data mask and ZQ calibration, enable reliable operation in harsh environments.
Recomendado
Wearables
In wearables, the CXDB5CCAM-MK's low power consumption is essential for extending battery life. Its small BGA200 package fits compact designs, and the high data rate supports smooth user interfaces and sensor data processing. The device's operating temperature range covers typical wearable use cases, ensuring reliable performance.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para CXDB5CCAM-MK — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | CXDB5CCAM-MJ | CXDB5CCAM-ML | K4UBE3D4AA-MGCL |
|---|---|---|---|---|
| Package | BGA200 | BGA200 | BGA200 | BGA200 |
| Brand | CXMT | CXMT | CXMT | Samsung |
| Memory Type | LPDDR4X | LPDDR4X | LPDDR4X | LPDDR4X |
| Operating Temperature | -25°C to +85°C | -25°C to +85°C | -25°C to +85°C | -25°C to +85°C |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Principais diferenciais
- Pin-compatible with CXDB5CCAM-MJ (vs CXDB5CCAM-MJ)
- Low power consumption (vs K4UBE3D4AA-MGCL)
- Wide temperature range (vs H9HCNNN8KUML)
Notas de projeto
For high-speed LPDDR4X signals, maintain 50-ohm single-ended and 100-ohm differential impedance. Keep trace lengths matched within 0.5mm for DQ/DQS groups. Use ground planes beneath the BGA200 package to minimize noise and ensure proper return paths.
Decouple VDD1 and VDDQ with 0.1uF and 1uF capacitors placed as close to the balls as possible. Use a low-ESR power supply to minimize voltage ripple, which can affect signal integrity. Consider a dedicated power plane for VDDQ to reduce noise.
The CXDB5CCAM-MK operates up to +85°C. Ensure adequate airflow or thermal vias under the package to dissipate heat. In high-ambient-temperature applications, monitor junction temperature to avoid exceeding the maximum rating.
Informações de conformidade
RoHS compliant per JLCPCB listing. Other compliance data not provided.
