DCM3717S60E13G5TN1 - 750W 40-60V to 12.2V Non-Iso PoL | Vicor
N.º da peça: DCM3717S60E13G5TN1 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $187.5 | $187,50 |
| 10 | $175.2 | $1.752,00 |
| 100 | $162.8 | $16.280,00 |
| 500 | $151.4 | $75.700,00 |
| 1.000 | $142.1 | $142.100,00 |
DCM3717S60E13G5TN1 Visão geral
A non-isolated point-of-load (PoL) DC-DC converter module is a high-density power component that steps a higher intermediate bus voltage down to a low, well-regulated rail that sits immediately adjacent to a load IC such as a CPU, GPU, ASIC, or FPGA. The DCM family sits in the power-management hierarchy: DC-DC converter -> non-isolated PoL module -> voltage regulator -> power management IC -> semiconductor. By eliminating the isolation barrier and integrating magnetics, switching FETs, and control within a single SM-ChiP package, these modules deliver far higher power density than discrete buck designs while simplifying EMI, thermal, and layout work for the system engineer.
Key features include 750 W continuous / 900 W transient peak output power, 61.5 A continuous load current, 96.5% to 97.0% peak efficiency, and parallelable operation for higher power. The SM-ChiP surface-mount package enables top-side cooling and reflow soldering while exposing a low thermal resistance path for cold-plate or heatsink attachment in dense compute, networking, and industrial platforms.
Architecturally, the ZVS buck-boost front stage produces a regulated bus that feeds the SAC secondary stage; the SAC operates as a soft-switched resonant topology that delivers clean, low-noise output without the large output LC filters required by conventional buck converters. The result is fast transient response and tight regulation suitable for powering low-voltage, high-current silicon with minimal bulk capacitance.
Typical applications include 48 V direct-to-point-of-load conversion for AI accelerator cards, GPU and CPU core rails in hyperscale servers, telecom and networking switch fabrics, industrial 48 V bus systems, and battery or renewable-energy intermediate bus architectures. Compared with discrete multi-phase buck regulators, the DCM3717S60E13G5TN1 removes PCB area, switching losses, and magnetics design effort from the engineer's plate.
When designing with this part, ensure adequate cold-plate or top-side thermal management - the SM-ChiP package is intended for surface-mount solder attachment plus an external thermal spreader. Confirm that input bulk capacitance meets the datasheet's low-impedance requirement at the 40 V to 60 V rail, and observe polarity marking before reflow.
This page consolidates Vicor datasheet parameters, real-time distributor pricing, drop-in DCM-family alternatives, and practical design notes not assembled in any single source, giving engineers a one-stop reference for the DCM3717S60E13G5TN1.
Alternativas drop-in para DCM3717S60E13G5TN1 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DCM3717S60E13G5TN1 (mesmo formato e footprint) — diferindo em Mounting Type, Package, Peak Efficiency, Continuous Output Current, Continuous Output Power.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DCM3717S60D13K0TN1
✅ Drop-In✓ Em estoque
$205 / unidade
Ver ficha técnica →DCM3717S60E13G5TN1-STD
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DCM3735S60E13G5TN1
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DCM3717S60E13F5TN1
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DCM3717E60E13G5TN1
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DCM3717S60E13G5TN1 Classificações máximas e características elétricas
| Topologia | ZVS buck-boost + Sine Amplitude Converter (SAC) |
| Isolation | Non-isolated |
| Faixa de tensão de entrada | 40 V to 60 V |
| Faixa de tensão de saída | 10.0 V to 12.5 V (12.2 V nominal trim) |
| Continuous Output Power | 750 W |
| Peak Output Power | 900 W (transient) |
| Continuous Output Current | 61.5 A |
| Peak Efficiency | 96.5% to 97.0% |
| Encapsulamento | SM-ChiP (surface-mount ChiP) |
| Tipo de montagem | Surface Mount with top-side thermal interface |
| Tipo de saída | Regulated, adjustable trim |
| Número de saídas | 1 |
| Parallelable | Yes (for higher output power) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do DCM3717S60E13G5TN1 sm-chip (surface-mount chip)
Configuração de pinos para DCM3717S60E13G5TN1 (pacote sm-chip (surface-mount chip)). Este dispositivo de potência possui terminais de gate, drain e source. Para pacotes não polarizados, consulte o datasheet do fabricante para a orientação exata do pino 1 e detalhes do footprint. Aplicações comuns incluem projeto de fontes de alimentação, acionamento de motores e comutação de cargas.
Nenhum dado detalhado de pinagem disponível para DCM3717S60E13G5TN1.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DCM3717S60E13G5TN1 é adequado para 6 aplicaçãos: 48V Direct-to-PoL for AI Accelerator Cards, Hyperscale Server CPU/GPU Core Rails, Telecom and Networking Switch Fabrics, Industrial 48V Bus Systems, Battery and Renewable Intermediate Bus, High-Performance Computing and Test Equipment.
48V Direct-to-PoL for AI Accelerator Cards
The DCM3717S60E13G5TN1 is purpose-built for 48 V direct-to-point-of-load conversion on AI accelerator and GPU cards. Its 40 V to 60 V input accepts the standard 48 V telecom/intermediate bus directly, eliminating the bulky 48 V-to-12 V isolation stage. The 750 W continuous and 900 W transient peak power, paired with 61.5 A of continuous current at a 12.2 V nominal output, comfortably feeds high-current GPU/ASIC core rails. The ZVS-plus-SAC topology delivers 96.5% to 97.0% peak efficiency, which directly reduces cold-plate burden in liquid-cooled racks. Compared with discrete multi-phase buck regulators, the SM-ChiP integration removes PCB area, magnetics design effort, and EMI filter complexity from the engineer's plate.
Recomendado
Hyperscale Server CPU/GPU Core Rails
Hyperscale servers with 48 V rack distribution use the DCM3717S60E13G5TN1 to step down to 12 V intermediate or directly to 12.2 V point-of-load rails. Its 750 W continuous rating supports a full CPU socket or a pair of high-end GPUs from a single module, and units parallel for higher output. The SM-ChiP package enables top-side cold-plate attachment, the dominant cooling architecture in modern hyperscale racks. The ZVS switching plus Sine Amplitude Converter secondary stage keeps output noise low enough to feed downstream buck converters or directly power the silicon, while 97% peak efficiency reduces data-center PUE. Engineers value the deterministic, repeatable layout versus tuning a discrete multi-phase regulator.
Recomendado
Telecom and Networking Switch Fabrics
In telecom and networking switches, the DCM3717S60E13G5TN1 takes the standard -48 V nominal bus (rectified to +48 V to +60 V) and produces a tightly regulated 12.2 V rail for switch ASICs, PHYs, and timing cards. Its 750 W continuous rating supports aggregate switch fabric power per card slot. Non-isolated PoL architecture eliminates bulky isolation transformers, freeing board space for high-density SerDes routing. The wide 40 V to 60 V input tolerates battery backup transients, while 96.5%+ efficiency keeps thermal headroom for sealed, fan-less chassis. Compared with brick converters, the SM-ChiP form factor enables denser card-edge designs.
Recomendado
Industrial 48V Bus Systems
Industrial PLCs, motion controllers, and 48 V factory-automation backplanes use the DCM3717S60E13G5TN1 to deliver 12.2 V to motor-driver and sensor-hub subsystems. The 750 W continuous rating covers multi-axis motion systems, while the 900 W transient headroom handles motor inrush peaks. The SM-ChiP surface-mount package supports automated reflow assembly in volume production, and the wide 40 V to 60 V input tolerates rectified industrial bus variation. The module's high efficiency reduces cabinet cooling load and enables sealed enclosures. Drop-in SM-ChiP variants simplify qualification across product families sharing the same PCB card.
Recomendado
Battery and Renewable Intermediate Bus
Battery energy storage and renewable-energy systems use an intermediate 48 V bus that the DCM3717S60E13G5TN1 steps to 12.2 V for downstream battery-management, inverter control, and monitoring electronics. Its 40 V to 60 V input range accommodates battery voltage variation during charge/discharge cycles without losing regulation. 96.5%+ efficiency is critical in energy-harvesting and battery-powered deployments where every watt of conversion loss reduces usable capacity. The compact SM-ChiP form factor enables integration into space-constrained battery enclosures and outdoor inverter cabinets.
Recomendado
High-Performance Computing and Test Equipment
ATE load boards, FPGA prototyping systems, and high-performance compute platforms use the DCM3717S60E13G5TN1 to power FPGAs, high-speed ADCs/DACs, and data-acquisition ASICs. Its 750 W continuous and 900 W transient peak rating covers FPGA+ADC/DAC combinations, while the clean SAC post-regulated output keeps noise low for sensitive measurement circuits. The 40 V to 60 V input lets the same module operate from laboratory 48 V supplies or system rails. The SM-ChiP package enables repeatable, reflow-compatible assembly for production test systems where reliability and channel-to-channel consistency matter.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DCM3717S60E13G5TN1 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DCM3717S60D13K0TN1 | DCM3717S60E13G5TN1-STD | DCM3735S60E13G5TN1 | DCM3717S60E13F5TN1 | DCM3717E60E13G5TN1 |
|---|---|---|---|---|---|---|
| Brand | Vicor | Vicor | Vicor | Vicor | Vicor | Vicor |
| Package | SM-ChiP | SM-ChiP - same | SM-ChiP - same | SM-ChiP - same | SM-ChiP - same | SM-ChiP evaluation board |
| Continuous Output Power | 750 W | 1000 W | 750 W | 750 W | 750 W | 750 W (evaluation board) |
| Output Current (continuous) | 61.5 A | 82 A | 61.5 A | 61.5 A | 61.5 A | 61.5 A |
| Output Voltage | 10.0 V to 12.5 V (12.2 V nom) | 10.0 V to 12.5 V (12.2 V nom) | 10.0 V to 12.5 V (12.2 V nom) | 10.0 V to 12.5 V (12.2 V nom) | 10.0 V to 12.5 V (12.2 V nom) | 10.0 V to 12.5 V (12.2 V nom) |
| Input Voltage Range | 40 V to 60 V | 40 V to 60 V | 40 V to 60 V | 40 V to 60 V | 40 V to 60 V | 40 V to 60 V |
| Topology | ZVS buck-boost + SAC | ZVS buck-boost + SAC | ZVS buck-boost + SAC | ZVS buck-boost + SAC | ZVS buck-boost + SAC | ZVS buck-boost + SAC |
| Peak Efficiency | 96.5% to 97.0% | 96.5% to 97.0% | 96.5% to 97.0% | 96.5% to 97.0% | 96.5% to 97.0% | 96.5% to 97.0% |
Principais diferenciais
- Highest power density in the DCM3717 family at this input range (vs Discrete multi-phase buck regulator)
- True 48 V direct-to-PoL without isolation stage (vs Brick converter + downstream buck)
- ZVS switching plus SAC post-regulation (vs Conventional hard-switched buck)
Notas de projeto
The SM-ChiP package of the DCM3717S60E13G5TN1 is intended for surface-mount solder plus a top-side thermal interface (cold plate or heatsink). At 96.5% to 97.0% peak efficiency the converter dissipates only 2.5% to 3.5% of through-power, but at 750 W continuous that still means roughly 19 W to 26 W of loss to remove. Use the recommended cold-plate torque and thermal interface material from Vicor to keep junction temperatures within the rated operating envelope. Estimated: at 750 W and 96.7% efficiency, internal loss is approximately 25.4 W.
Follow the Vicor SM-ChiP land pattern exactly as documented in the datasheet. Place input bulk capacitance as close as possible to the input terminals to keep the 40 V to 60 V bus low-impedance; insufficient input capacitance is the most common cause of instability in DCM modules. Keep the output capacitor loop tight and use low-ESR ceramic or polymer parts to exploit the SAC stage's fast transient response.
Route the analog trim and enable signals away from switching-node copper to avoid noise coupling. The DCM3717S60E13G5TN1 exposes a top thermal pad - keep signal traces and vias out of this region. Use a 4-layer or higher stackup with a solid inner ground plane beneath the module to provide a low-impedance return path and to spread heat. Consult the Vicor DCM3717 layout application note for full via and copper-pour guidance.
Do not assume the SM-ChiP package is a drop-in across the entire DCM37xx family - different SKUs have different power ratings (DCM3717 vs DCM3735) and different output voltage trims. Verify that the chosen variant matches your load's continuous and peak current. Also, do not parallel DCM units without following Vicor's paralleling guidance: current sharing requires specific sense-pin wiring that differs from the standard standalone hookup.
Informações de conformidade
RoHS and REACH compliance per Vicor product page. AEC-Q100 not applicable for this industrial/data-center module. Confirm halogen-free status directly with Vicor for the latest environmental compliance attestations.
