DCM3717S60E13G5TN1 - 750W 40-60V to 12.2V DCM Module | Vicor
N.º da peça: DCM3717S60E13G5TN1-VICOR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1.325,00 |
| 100 | $120 | $12.000,00 |
| 500 | $108.75 | $54.375,00 |
| 1.000 | $99.5 | $99.500,00 |
DCM3717S60E13G5TN1-VICOR Visão geral
A DCM (DC-DC Converter Module) is a complete, surface-mounted point-of-load conversion subsystem that integrates the magnetics, control loop, and power switches within a single thermally-conductive package, positioned in the power management IC hierarchy above discrete POL regulators and below front-end isolated bricks. These modules are typically used to translate a higher distribution bus (in this case, a 48 V nominal telecom/datacom rail) down to a lower intermediate rail, often a 12 V bus, that downstream VRMs further step down to processor-core voltages.
Key electrical specifications include a 96.5% peak efficiency, 750 W continuous output power, 900 W peak power capability, and a wide 10.0 V to 12.5 V programmable output voltage range. Operating input spans 40 V to 60 V (semi-regulated 48 V rail), and the unit is rated for a chassis-mount baseplate temperature range of -40 °C to +125 °C. The SM-ChiP surface-mount package supports reflow soldering and provides a low-impedance thermal path to the PCB.
Architecturally, the ZVS buck-boost stage produces a safety-grounded switching node, and the SAC output stage guarantees low output impedance and tight load-step regulation across the full dynamic range. Combined, this topology achieves the high efficiency and low noise floor required for 48 V distribution architectures.
Typical applications include 48 V direct-to-PoL conversion in AI servers and high-performance computing, telecom and datacom equipment bridging 48 V to 12 V rails, industrial 48 V battery systems, and high-density computing accelerators that need a regulated 12 V intermediate bus from a 48 V backbone.
Designers should pair the DCM3717 with an upstream 48 V hold-up capacitor and ensure the PCB layout follows Vicor's recommended thermal-via pattern under the SM-ChiP baseplate to dissipate up to 30 W of losses at full load.
This page aggregates verified distributor pricing, same-brand drop-in variants from the Vicor DCM family, and practical design notes drawn from the Vicor datasheet to help engineers pick, place, and procure the right module.
Alternativas drop-in para DCM3717S60E13G5TN1-VICOR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DCM3717S60E13G5TN1-VICOR (mesmo formato e footprint) — diferindo em Continuous Output Current, Continuous Output Power, Input Voltage Range, Mounting Type, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DCM3717S60D13K0TN1
✅ Drop-In✓ Em estoque
$205 / unidade
Ver ficha técnica →DCM3717S60E13A5TN1
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DCM3717E60E13G5TN1
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DCM3735S60E13G5TN1
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DCM3717S60E13G5TN1-VICOR Classificações máximas e características elétricas
| Topologia | Non-isolated, regulated DC-DC converter module (ZVS buck-boost + SAC post-regulator) |
| Faixa de tensão de entrada | 40 V to 60 V (semi-regulated 48 V nominal) |
| Tensão de saída | 12.2 V (programmable 10.0 V to 12.5 V) |
| Continuous Output Current | 61.5 A |
| Continuous Output Power | 750 W |
| Peak Output Power | 900 W |
| Peak Efficiency | 96.5% |
| Encapsulamento | SM-ChiP (surface-mount, thermally-conductive baseplate) |
| Tipo de montagem | Surface Mount (reflow-solderable baseplate recommended for thermal via) |
| Operating Temperature (Baseplate) | -40 °C to +125 °C |
| Isolation | Non-isolated |
| Número de saídas | 1 |
| Switching Technology | Zero-Voltage Switching (ZVS) with Sine Amplitude Converter (SAC) post-regulator |
| Recursos de controle | Enable, trim, fault output (per Vicor SM-ChiP DCM interface) |
| Compliance - RoHS | Compliant per Vicor product page |
Guia de Configuração de Pinos do DCM3717S60E13G5TN1-VICOR sm-chip (surface-mount, thermally-conductive baseplate)
Configuração de pinos para DCM3717S60E13G5TN1-VICOR (pacote sm-chip (surface-mount, thermally-conductive baseplate)). Este dispositivo de potência possui terminais de gate, drain e source. Para pacotes não polarizados, consulte o datasheet do fabricante para a orientação exata do pino 1 e detalhes do footprint. Aplicações comuns incluem projeto de fontes de alimentação, acionamento de motores e comutação de cargas.
Nenhum dado detalhado de pinagem disponível para DCM3717S60E13G5TN1-VICOR.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DCM3717S60E13G5TN1-VICOR é adequado para 6 aplicaçãos: 48V to Point-of-Load Bridging in AI Servers, Telecom and Datacom Equipment Power, Industrial 48 V Battery and Robotics Systems, High-Performance Computing Accelerator Cards, LED Lighting and High-Power LED Drivers, Aerospace and Defense Power Conditioning.
48V to Point-of-Load Bridging in AI Servers
The DCM3717S60E13G5TN1 converts a semi-regulated 48 V distribution bus directly to a regulated 12.2 V intermediate rail rated at 750 W continuous, ideal for AI/GPU server blades where 48 V backbone distribution reduces I²R losses versus legacy 12 V buses. The 96.5% peak efficiency and SM-ChiP thermal-via package allow placement adjacent to hot-swap connectors without heatsinks. Used between 48 V hot-swap and downstream VRMs feeding GPU core rails, the device eliminates an isolation stage and reduces board copper mass by up to 80%.
Recomendado
Telecom and Datacom Equipment Power
The DCM3717S60E13G5TN1 steps a standard -48 V telecom DC plant (40 V to 60 V input range) down to a regulated 12.2 V bus for routers, switches, and baseband processors. Its 750 W continuous rating covers most 1U/2U line-card power budgets, and the 96.5% efficiency cuts thermal load in sealed enclosures. Placed after the front-end hold-up capacitor, it simplifies compliance with ETSI EN 300 132-2 distribution standards while providing a regulated 12 V plane for downstream POL converters.
Industrial 48 V Battery and Robotics Systems
Within 48 V industrial battery platforms and mobile-robot drivetrains, the DCM3717S60E13G5TN1 bridges the 48 V system bus (40-60 V input) to 12 V auxiliary rails for sensors, controllers, and lighting loads up to 750 W. The wide operating range tolerates battery droop during high-current discharge, and the SM-ChiP package withstands the -40 °C to +125 °C baseplate temperature span seen in outdoor installations. Designed-in with reverse-polarity protection upstream, it provides a regulated 12.2 V supply for PLCs and motion controllers.
High-Performance Computing Accelerator Cards
The DCM3717S60E13G5TN1 powers PCIe accelerator cards and GPU sleds that draw up to 750 W from a host 48 V backplane. With 96.5% efficiency and the SM-ChiP surface-mount footprint, designers can place the module adjacent to the edge card to minimize distribution losses at 12 V. Its 12.2 V regulated output drives downstream multi-phase VRMs that step the voltage further down to 0.8 V-1.2 V core rails. The compact footprint increases slot density without sacrificing conversion efficiency.
LED Lighting and High-Power LED Drivers
The DCM3717S60E13G5TN1 supplies regulated 12.2 V at 61.5 A from a 48 V distribution rail for architectural LED arrays, stadium lighting, and horticulture luminaires where 48 V is the installed distribution voltage. Its 750 W capacity covers most commercial LED driver requirements, and the high efficiency reduces heatsink sizing on the luminaire housing. Often paired with a downstream constant-current LED driver stage, the module isolates any 12 V wiring and simplifies safety certification.
Aerospace and Defense Power Conditioning
In Mil/Aero and defense platforms where 48 V Mil-STD power is increasingly common, the DCM3717S60E13G5TN1 produces a regulated 12.2 V bus for radio, radar, and avionics subsystems rated up to 750 W. The wide -40 °C to +125 °C baseplate temperature envelope supports under-hood and unmanned-aerial applications. Its ZVS architecture and ChiP package reduce EMI emission tails, easing compliance with MIL-STD-461 and DO-160 requirements.
Resumo dos produtos recomendados
Dados de referência de engenharia para DCM3717S60E13G5TN1-VICOR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DCM3717S60D13K0TN1 | DCM3717S60E13A5TN1 | DCM3717S60E13G5TN1 | DCM3735S60E13G5TN1 |
|---|---|---|---|---|---|
| Brand | Vicor | Vicor | Vicor | Vicor (eval board variant) | Vicor |
| Package | SM-ChiP (DCM3717 series) | SM-ChiP (same DCM3717 footprint) | SM-ChiP (same DCM3717 footprint) | SM-ChiP (evaluation board) | Larger SM-ChiP (DCM3735) |
| Input Voltage Range | 40 V to 60 V | 40 V to 60 V | 40 V to 60 V | 40 V to 60 V | 40 V to 60 V |
| Output Voltage | 12.2 V (10.0 V to 12.5 V trim) | 12.2 V (10.0 V to 12.5 V trim) | 12.2 V (10.0 V to 12.5 V trim) | 12.2 V (10.0 V to 12.5 V trim) | 12.2 V (programmable range wider) |
| Topology | ZVS buck-boost + SAC | ZVS buck-boost + SAC | ZVS buck-boost + SAC | ZVS buck-boost + SAC (eval) | ZVS buck-boost + SAC (DCM3735 ChiP) |
| Isolation | Non-isolated | Non-isolated | Non-isolated | Non-isolated | Non-isolated |
Principais diferenciais
- Highest continuous power density in the DCM3717 SM-ChiP family at 750 W (vs DCM3717S60E13A5TN1)
- Lower peak power than DCM3717 1000 W tier (vs DCM3717S60D13K0TN1)
- Proprietary SM-ChiP surface-mount form factor (vs Discrete buck regulators)
Notas de projeto
Estimated: At 750 W output with 96.5% efficiency, internal losses are roughly 27.9 W; a thermal-via array under the SM-ChiP baseplate is required to keep the baseplate below 125 °C. Per the Vicor datasheet, follow the recommended footprint with at least 100 thermal vias (0.3 mm hole, 0.2 mm copper plating) under the baseplate to a 2 oz inner copper plane. Without this, chassis temperature will rise above the 125 °C limit at continuous load. Add airflow or a clip-on heatsink for sealed enclosures.
The SM-ChiP baseplate is designed for reflow-solderable mounting with a recommended thermal-via farm. Vicor's datasheet specifies a footprint pad pattern with central copper pour for the baseplate and dedicated input/output/trim pads along the package edges. Place 1 µF X7R input bypass capacitors within 5 mm of the input pins, and keep high-current power traces on inner layers with at least 2 oz copper to handle 61.5 A continuous with minimal voltage droop.
Do not bypass the upstream hold-up capacitor in a 48 V system: power interruption protection requires the system-level capacitance specified by Vicor. The enable pin must be driven to a valid logic level - leaving it floating causes undefined startup behavior. Per the datasheet, ensure the trim pin is set within the 10.0 V to 12.5 V programming range before applying input voltage to avoid output-voltage overshoot. Forcing output voltage outside the rated range may damage downstream loads.
Route the input and output returns on separate inner layers with stitching vias to prevent circulating currents from coupling noise into sensitive analog or RF traces. Vicor's reference layout (in the DCM37xx family overview) shows return-plane stitching every 2-3 mm around the SM-ChiP pads. Keep signal-level traces (enable, trim, fault) isolated from the 48 V input plane by at least 1 mm to maintain 1500 V isolation-equivalent creepage if the system requires reinforced insulation.
Informações de conformidade
RoHS compliant per Vicor product page; the part is not AEC-Q100 qualified - Vicor markets MIL/aerospace graded equivalents separately. Reach and conflict minerals compliance stated on Vicor corporate compliance page.
