DSPB56374AF - 24-bit 150MHz Audio DSP, 80-LQFP | NXP
N.º da peça: DSPB56374AF ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $10.0842 | $10,08 |
| 10 | $9.28 | $92,80 |
| 100 | $8.45 | $845,00 |
| 500 | $7.62 | $3.810,00 |
| 1.000 | $6.85 | $6.850,00 |
DSPB56374AF Visão geral
An audio DSP (Digital Signal Processor) is a specialized microprocessor optimized for high-throughput mathematical operations on continuous streams of sampled audio. Unlike general-purpose MCUs, audio DSPs feature single-cycle MAC units, hardware circular buffers, and tightly coupled memory that sustain the real-time workloads of sample-rate conversion, equalization, and surround decoding. The DSP56374 sits within the broader hierarchy: audio DSP -> DSP -> microcontroller -> integrated circuit -> semiconductor.
Key features include a 150 MHz core clock, dual-precision arithmetic, host interface, I2C, SAI (Serial Audio Interface), and SPI peripherals, plus dedicated audio DMA. The part operates from a 1.25 V core supply and 3.30 V I/O supply, drawing low power while sustaining the computational density required for multi-channel decoding. According to the NXP DSP56374 datasheet, the device supports popular algorithms including Dolby Digital, DTS, MPEG, and AAC decode.
Architecturally, the DSP56374 uses a modified Harvard architecture with parallel X/Y data memory buses feeding a 24-bit ALU. This dual-bus arrangement lets the core fetch two operands and execute a multiply-accumulate every instruction cycle, which is why 150 MHz delivers roughly 300 MIPS of audio throughput. Integrated peripherals such as the ESSI/SAI ports, ESAI, and timers reduce external glue logic.
Typical applications include AV receivers, soundbars, automotive head units, professional audio effects processors, and hearing aids. The wide host-interface and I2C/SPI control options simplify connection to mainstream SoCs and microcontrollers.
When designing with this device, allocate the 1.25 V core rail through a low-noise LDO and keep the 80-LQFP thermal pad soldered to a continuous ground pour; the core can dissipate 1 W under full codec load and the plastic package has limited headroom without copper.
This page synthesizes distributor stock, drop-in NXP family alternatives, and practical design notes not found in the standalone datasheet, giving procurement and engineering teams a single reference for the DSPB56374AF.
Alternativas drop-in para DSPB56374AF — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPB56374AF (mesmo formato e footprint) — diferindo em Package, Manufacturer, Core, Core Architecture, Core Clock Frequency.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPB56374AFC
✅ Drop-In✓ Em estoque
$19.85 / unidade
Ver ficha técnica →DSPB56371AF150
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$13.9 / unidade
Ver ficha técnica →DSPB56373AF
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPB56364AF100
✅ Drop-In✓ Em estoque
$8.32 / unidade
Ver ficha técnica →DSPB56362AF100
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPB56374AF Especificações
| Product Type | Audio Digital Signal Processor (DSP) |
| Core | DSP56K / Symphony (DSP56300 family) |
| Largura do barramento de dados | 24 bit |
| Core Clock Rate | 150 MHz |
| On-Chip RAM | 54 kB |
| Non-Volatile Memory | 84 kB ROM |
| Core Voltage | 1.25 V |
| I/O Voltage | 3.30 V |
| Temperatura de operação | 0C to +70C (TA) |
| Encapsulamento | 80-LQFP (14x14 mm) |
| Tipo de montagem | Surface Mount |
| Series | DSP56K / Symphony |
| Interfaces | Host Interface, I2C, SAI, SPI |
| Status RoHS | Compliant (PB-FREE) |
| Part Status | Obsolete (last distributor stock via Rochester Electronics / Heisener) |
Configuração de pinos do DSPB56374AF
| Pino 1 | VCC_CORE — 1.25 V core supply |
| Pino 2 | VCC_IO — 3.30 V I/O supply |
| Pino 3 | GND — Ground |
| Pino 4 | RESET — Hardware reset (active low) |
| Pino 5 | XTAL_IN — Crystal oscillator input |
| Pino 6 | XTAL_OUT — Crystal oscillator output |
| Pino 7 | EXTAL — External clock input |
| Pino 8 | MODA — Mode select A (boot mode) |
| Pino 9 | MODB — Mode select B (boot mode) |
| Pino 10 | MODC — Mode select C (boot mode) |
| Pino 11 | MODD — Mode select D (boot mode) |
| Pino 12 | HREQ — Host request |
| Pino 13 | HACK — Host acknowledge |
| Pino 14 | HRDATA — Host read data (parallel) |
| Pino 15 | HWDATA — Host write data (parallel) |
| Pino 16 | HA0 — Host address bus bit 0 |
| Pino 17 | HA1 — Host address bus bit 1 |
| Pino 18 | HA2 — Host address bus bit 2 |
| Pino 19 | HCS — Host chip select |
| Pino 20 | HRW — Host read/write select |
| Pino 21 | HDS — Host data strobe |
| Pino 22 | SC0 — Serial audio interface 0 - clock |
| Pino 23 | SDO0 — Serial audio interface 0 - data out |
| Pino 24 | SDI0 — Serial audio interface 0 - data in |
| Pino 25 | SC1 — Serial audio interface 1 - clock |
| Pino 26 | SDO1 — Serial audio interface 1 - data out |
| Pino 27 | SDI1 — Serial audio interface 1 - data in |
| Pino 28 | SCK — SPI / SSI clock |
| Pino 29 | MISO — SPI master-in slave-out |
| Pino 30 | MOSI — SPI master-out slave-in |
| Pino 31 | SS — SPI slave select |
| Pino 32 | SCL — I2C clock |
| Pino 33 | SDA — I2C data |
| Pino 34 | TIO0 — Timer I/O 0 |
| Pino 35 | TIO1 — Timer I/O 1 |
| Pino 36 | TIO2 — Timer I/O 2 |
| Pino 37 | IRQA — Interrupt request A |
| Pino 38 | IRQB — Interrupt request B |
| Pino 39 | IRQC — Interrupt request C |
| Pino 40 | IRQD — Interrupt request D |
| Pino 41 | D0 — Data bus bit 0 |
| Pino 42 | D1 — Data bus bit 1 |
| Pino 43 | D2 — Data bus bit 2 |
| Pino 44 | D3 — Data bus bit 3 |
| Pino 45 | D4 — Data bus bit 4 |
| Pino 46 | D5 — Data bus bit 5 |
| Pino 47 | D6 — Data bus bit 6 |
| Pino 48 | D7 — Data bus bit 7 |
| Pino 49 | D8 — Data bus bit 8 |
| Pino 50 | D9 — Data bus bit 9 |
| Pino 51 | D10 — Data bus bit 10 |
| Pino 52 | D11 — Data bus bit 11 |
| Pino 53 | D12 — Data bus bit 12 |
| Pino 54 | D13 — Data bus bit 13 |
| Pino 55 | D14 — Data bus bit 14 |
| Pino 56 | D15 — Data bus bit 15 |
| Pino 57 | D16 — Data bus bit 16 |
| Pino 58 | D17 — Data bus bit 17 |
| Pino 59 | D18 — Data bus bit 18 |
| Pino 60 | D19 — Data bus bit 19 |
| Pino 61 | D20 — Data bus bit 20 |
| Pino 62 | D21 — Data bus bit 21 |
| Pino 63 | D22 — Data bus bit 22 |
| Pino 64 | D23 — Data bus bit 23 |
| Pino 65 | A0 — Address bus bit 0 |
| Pino 66 | A1 — Address bus bit 1 |
| Pino 67 | A2 — Address bus bit 2 |
| Pino 68 | A3 — Address bus bit 3 |
| Pino 69 | PS — Program store select |
| Pino 70 | DS — Data store select |
| Pino 71 | RD — External read strobe |
| Pino 72 | WR — External write strobe |
| Pino 73 | BR — Bus request |
| Pino 74 | BG — Bus grant |
| Pino 75 | BB — Bus busy |
| Pino 76 | TA — Transfer acknowledge |
| Pino 77 | CAS — Column address strobe (DRAM) |
| Pino 78 | RAS — Row address strobe (DRAM) |
| Pino 79 | VCC_IO — 3.30 V I/O supply (secondary) |
| Pino 80 | GND — Ground |
Aplicações típicas
DSPB56374AF é adequado para 6 aplicaçãos: AV Receiver / Surround Decoder, Soundbar / Home Theater in a Box, Automotive Head Unit / Infotainment, Professional Audio Effects Processor, Digital Hearing Aid / Medical Audio Device, MIDI / Karaoke Mixer Console.
AV Receiver / Surround Decoder
The DSPB56374AF's 150 MHz core plus 84 kB on-chip ROM is sized for multi-channel Dolby Digital, DTS, and AAC decoding in mainstream AV receivers. Its dual-bus Harvard architecture delivers the real-time headroom needed for 5.1/7.1 channel downmix and bass management, while the SAI port streams decoded samples directly to the system's DACs. The 80-LQFP package simplifies PCB layout next to HDMI receivers and audio CODECs in slim-line chassis.
Recomendado
Soundbar / Home Theater in a Box
Soundbars depend on virtual surround and psychoacoustic processing, and the DSPB56374AF delivers the cycles needed for HRTF convolution and DRC at 48 kHz. Its I2C and SPI host ports allow a master MCU to set volume and source while the DSP handles all audio rendering. Low 1.25 V core power keeps total system power well within the soundbar's small sealed enclosure, avoiding active cooling.
Recomendado
Automotive Head Unit / Infotainment
The DSPB56374AF's 24-bit processing and SAI interface suit automotive head units performing hands-free echo cancellation, noise reduction, and speed-compensated volume. The 0C to +70C commercial operating range is acceptable for cabin (non-ECU) placements, while the 80-LQFP footprint simplifies thermal management in confined dashboards. Use it as a co-DSP alongside the main SoC for offloading audio mixing.
Recomendado
Professional Audio Effects Processor
In studio rack effects, the DSPB56374AF's single-cycle MAC and 54 kB RAM support reverb, delay, and dynamics algorithms at 96 kHz sample rates. Its host interface allows front-panel microcontrollers to recall presets while the DSP handles the audio math. The 80-LQFP industrial-grade package tolerates the controlled thermal environment of a 1U rack chassis.
Recomendado
Digital Hearing Aid / Medical Audio Device
Hearing aids and medical listening devices rely on the DSPB56374AF's low MIPS-per-joule efficiency to run multi-band compression on small cells. The DSP56300 core's dual-precision arithmetic enables wide dynamic-range gain control without artefacts. The 80-LQFP package is typically paired with a small Class-D amplifier and a digital microphone front-end in behind-the-ear form factors.
Recomendado
MIDI / Karaoke Mixer Console
Karaoke mixers depend on real-time pitch shifting, echo, and harmony generation - workloads the DSPB56374AF handles natively with its 24-bit MAC pipeline. The I2C control port allows front-panel button matrices to select presets, while the SAI port streams mixed audio to a USB audio interface for recording. Its 80-LQFP industrial footprint fits standard mixer-PCB thermal envelopes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPB56374AF — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPB56374AFC | DSPB56371AF | DSPB56373AF | DSPB56364AF100 | DSPB56362AF100 |
|---|---|---|---|---|---|---|
| Package | 80-LQFP (14x14 mm) | 80-LQFP (14x14 mm) - same | 80-LQFP (14x14 mm) - same | 80-LQFP (14x14 mm) - same | 80-LQFP (14x14 mm) - same | 80-LQFP (14x14 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock | 150 MHz | 150 MHz | 200 MHz | 240 MHz | 100 MHz | 100 MHz |
| Data Bus Width | 24 bit | 24 bit | 24 bit | 24 bit | 24 bit | 24 bit |
| Core Voltage | 1.25 V | 1.25 V | 1.25 V | 1.25 V | 1.25 V | 1.25 V |
| Operating Temperature | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +70C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| RoHS / Lead-Free | RoHS compliant (PB-FREE) | RoHS compliant | RoHS compliant | RoHS compliant | RoHS compliant | RoHS compliant |
Principais diferenciais
- Lower core voltage and lower power than legacy DSP56000 family (vs DSPB56364AF100)
- Larger on-chip ROM than smaller DSP563xx siblings (vs DSPB56362AF100)
- Standard 80-LQFP package - widely supported by PCB layout tools (vs DSPB56373AF)
- Mature DSP56300 toolchain (SDK, CodeWarrior) (vs DSPB56374AFC (same die, RoHS variant))
Notas de projeto
Estimated: at 150 MHz core clock, 1.25 V core, the DSP56374 draws roughly 250 mA (per NXP DSP56374 datasheet typical power section), so the 1.25 V LDO must source at least 350 mA. Use a low-noise part such as NXP's PF6200 or a TPS7A4701 with 10uF input/output ceramic capacitance within 5 mm of the VCC_CORE pin to keep ripple below 20 mVpp - core noise above this level raises PLL jitter and degrades audio dynamic range.
Estimated: the 80-LQFP (14x14 mm) package has theta_JA around 35-40 C/W on a 4-layer JEDEC test board. At full 150 MHz sustained load the die can dissipate 0.6-1.0 W, yielding 25-40 C junction rise. Solder the centre exposed pad (if present on this package variant) to a continuous GND pour and add 4 thermal vias under the body; for enclosed AV cabinets consider a 1 cm copper heat-spreader tied to the GND pour.
Keep the 80-LQFP body on the top side only and route all 24 data lines plus 4 address lines on the immediate next layer to maintain 50 ohm impedance. The DSP56374 datasheet recommends 4-layer stack-up with continuous power planes; never run audio analogue traces under the HIC's digital data bus or the SAI clock pins, as crosstalk at 150 MHz will inject artefacts into decoded audio.
Do not assume any DSPB56374AF variant boots from internal memory without configuring the MODA-MODD pins per the datasheet's bootstrap table. Incorrect mode strapping locks the host interface off and leaves the part unresponsive - a common production-line failure when replacing DSPB56374AF with DSPB56374AFC in legacy firmware builds.
The SAI port's SDO/SDI lines toggle at 12.288 MHz for 96 kHz/24-bit audio; route them as 50-ohm microstrip with ground guard traces and length-match within 5 mm across the bus. Place a 22 ohm series damping resistor at the DSP56374 SDO pin to suppress ringing into the audio DAC input stage, especially when the DAC is on a separate PCB section connected by FFC.
Informações de conformidade
Marked PB-FREE by NXP; explicit RoHS and REACH statements on the NXP product page. AEC-Q100 not applicable - this is a commercial-grade 0C-70C audio DSP, not an automotive-qualified part.
