DSPB56374AF - 24-bit 150MHz Audio DSP, 80-LQFP | NXP
Référence : DSPB56374AF ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $10.0842 | $10,08 |
| 10 | $9.28 | $92,80 |
| 100 | $8.45 | $845,00 |
| 500 | $7.62 | $3 810,00 |
| 1 000 | $6.85 | $6 850,00 |
DSPB56374AF Présentation
An audio DSP (Digital Signal Processor) is a specialized microprocessor optimized for high-throughput mathematical operations on continuous streams of sampled audio. Unlike general-purpose MCUs, audio DSPs feature single-cycle MAC units, hardware circular buffers, and tightly coupled memory that sustain the real-time workloads of sample-rate conversion, equalization, and surround decoding. The DSP56374 sits within the broader hierarchy: audio DSP -> DSP -> microcontroller -> integrated circuit -> semiconductor.
Key features include a 150 MHz core clock, dual-precision arithmetic, host interface, I2C, SAI (Serial Audio Interface), and SPI peripherals, plus dedicated audio DMA. The part operates from a 1.25 V core supply and 3.30 V I/O supply, drawing low power while sustaining the computational density required for multi-channel decoding. According to the NXP DSP56374 datasheet, the device supports popular algorithms including Dolby Digital, DTS, MPEG, and AAC decode.
Architecturally, the DSP56374 uses a modified Harvard architecture with parallel X/Y data memory buses feeding a 24-bit ALU. This dual-bus arrangement lets the core fetch two operands and execute a multiply-accumulate every instruction cycle, which is why 150 MHz delivers roughly 300 MIPS of audio throughput. Integrated peripherals such as the ESSI/SAI ports, ESAI, and timers reduce external glue logic.
Typical applications include AV receivers, soundbars, automotive head units, professional audio effects processors, and hearing aids. The wide host-interface and I2C/SPI control options simplify connection to mainstream SoCs and microcontrollers.
When designing with this device, allocate the 1.25 V core rail through a low-noise LDO and keep the 80-LQFP thermal pad soldered to a continuous ground pour; the core can dissipate 1 W under full codec load and the plastic package has limited headroom without copper.
This page synthesizes distributor stock, drop-in NXP family alternatives, and practical design notes not found in the standalone datasheet, giving procurement and engineering teams a single reference for the DSPB56374AF.
Alternatives de remplacement direct pour DSPB56374AF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPB56374AF (même facteur de forme et même empreinte) — différant par Package, Manufacturer, Core, Core Architecture, Core Clock Frequency.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPB56374AFC
✅ Remplacement direct✓ En stock
$19.85 / unité
Voir la fiche technique →DSPB56371AF150
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$13.9 / unité
Voir la fiche technique →DSPB56373AF
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPB56364AF100
✅ Remplacement direct✓ En stock
$8.32 / unité
Voir la fiche technique →DSPB56362AF100
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPB56374AF Spécifications
| Product Type | Audio Digital Signal Processor (DSP) |
| Core | DSP56K / Symphony (DSP56300 family) |
| Largeur du bus de données | 24 bit |
| Core Clock Rate | 150 MHz |
| On-Chip RAM | 54 kB |
| Non-Volatile Memory | 84 kB ROM |
| Core Voltage | 1.25 V |
| I/O Voltage | 3.30 V |
| Température de fonctionnement | 0C to +70C (TA) |
| Boîtier | 80-LQFP (14x14 mm) |
| Type de montage | Surface Mount |
| Series | DSP56K / Symphony |
| Interfaces | Host Interface, I2C, SAI, SPI |
| Statut RoHS | Compliant (PB-FREE) |
| Part Status | Obsolete (last distributor stock via Rochester Electronics / Heisener) |
Configuration des broches de DSPB56374AF
| Broche 1 | VCC_CORE — 1.25 V core supply |
| Broche 2 | VCC_IO — 3.30 V I/O supply |
| Broche 3 | GND — Ground |
| Broche 4 | RESET — Hardware reset (active low) |
| Broche 5 | XTAL_IN — Crystal oscillator input |
| Broche 6 | XTAL_OUT — Crystal oscillator output |
| Broche 7 | EXTAL — External clock input |
| Broche 8 | MODA — Mode select A (boot mode) |
| Broche 9 | MODB — Mode select B (boot mode) |
| Broche 10 | MODC — Mode select C (boot mode) |
| Broche 11 | MODD — Mode select D (boot mode) |
| Broche 12 | HREQ — Host request |
| Broche 13 | HACK — Host acknowledge |
| Broche 14 | HRDATA — Host read data (parallel) |
| Broche 15 | HWDATA — Host write data (parallel) |
| Broche 16 | HA0 — Host address bus bit 0 |
| Broche 17 | HA1 — Host address bus bit 1 |
| Broche 18 | HA2 — Host address bus bit 2 |
| Broche 19 | HCS — Host chip select |
| Broche 20 | HRW — Host read/write select |
| Broche 21 | HDS — Host data strobe |
| Broche 22 | SC0 — Serial audio interface 0 - clock |
| Broche 23 | SDO0 — Serial audio interface 0 - data out |
| Broche 24 | SDI0 — Serial audio interface 0 - data in |
| Broche 25 | SC1 — Serial audio interface 1 - clock |
| Broche 26 | SDO1 — Serial audio interface 1 - data out |
| Broche 27 | SDI1 — Serial audio interface 1 - data in |
| Broche 28 | SCK — SPI / SSI clock |
| Broche 29 | MISO — SPI master-in slave-out |
| Broche 30 | MOSI — SPI master-out slave-in |
| Broche 31 | SS — SPI slave select |
| Broche 32 | SCL — I2C clock |
| Broche 33 | SDA — I2C data |
| Broche 34 | TIO0 — Timer I/O 0 |
| Broche 35 | TIO1 — Timer I/O 1 |
| Broche 36 | TIO2 — Timer I/O 2 |
| Broche 37 | IRQA — Interrupt request A |
| Broche 38 | IRQB — Interrupt request B |
| Broche 39 | IRQC — Interrupt request C |
| Broche 40 | IRQD — Interrupt request D |
| Broche 41 | D0 — Data bus bit 0 |
| Broche 42 | D1 — Data bus bit 1 |
| Broche 43 | D2 — Data bus bit 2 |
| Broche 44 | D3 — Data bus bit 3 |
| Broche 45 | D4 — Data bus bit 4 |
| Broche 46 | D5 — Data bus bit 5 |
| Broche 47 | D6 — Data bus bit 6 |
| Broche 48 | D7 — Data bus bit 7 |
| Broche 49 | D8 — Data bus bit 8 |
| Broche 50 | D9 — Data bus bit 9 |
| Broche 51 | D10 — Data bus bit 10 |
| Broche 52 | D11 — Data bus bit 11 |
| Broche 53 | D12 — Data bus bit 12 |
| Broche 54 | D13 — Data bus bit 13 |
| Broche 55 | D14 — Data bus bit 14 |
| Broche 56 | D15 — Data bus bit 15 |
| Broche 57 | D16 — Data bus bit 16 |
| Broche 58 | D17 — Data bus bit 17 |
| Broche 59 | D18 — Data bus bit 18 |
| Broche 60 | D19 — Data bus bit 19 |
| Broche 61 | D20 — Data bus bit 20 |
| Broche 62 | D21 — Data bus bit 21 |
| Broche 63 | D22 — Data bus bit 22 |
| Broche 64 | D23 — Data bus bit 23 |
| Broche 65 | A0 — Address bus bit 0 |
| Broche 66 | A1 — Address bus bit 1 |
| Broche 67 | A2 — Address bus bit 2 |
| Broche 68 | A3 — Address bus bit 3 |
| Broche 69 | PS — Program store select |
| Broche 70 | DS — Data store select |
| Broche 71 | RD — External read strobe |
| Broche 72 | WR — External write strobe |
| Broche 73 | BR — Bus request |
| Broche 74 | BG — Bus grant |
| Broche 75 | BB — Bus busy |
| Broche 76 | TA — Transfer acknowledge |
| Broche 77 | CAS — Column address strobe (DRAM) |
| Broche 78 | RAS — Row address strobe (DRAM) |
| Broche 79 | VCC_IO — 3.30 V I/O supply (secondary) |
| Broche 80 | GND — Ground |
Applications typiques
DSPB56374AF convient pour 6 applications: AV Receiver / Surround Decoder, Soundbar / Home Theater in a Box, Automotive Head Unit / Infotainment, Professional Audio Effects Processor, Digital Hearing Aid / Medical Audio Device, MIDI / Karaoke Mixer Console.
AV Receiver / Surround Decoder
The DSPB56374AF's 150 MHz core plus 84 kB on-chip ROM is sized for multi-channel Dolby Digital, DTS, and AAC decoding in mainstream AV receivers. Its dual-bus Harvard architecture delivers the real-time headroom needed for 5.1/7.1 channel downmix and bass management, while the SAI port streams decoded samples directly to the system's DACs. The 80-LQFP package simplifies PCB layout next to HDMI receivers and audio CODECs in slim-line chassis.
Recommandé
Soundbar / Home Theater in a Box
Soundbars depend on virtual surround and psychoacoustic processing, and the DSPB56374AF delivers the cycles needed for HRTF convolution and DRC at 48 kHz. Its I2C and SPI host ports allow a master MCU to set volume and source while the DSP handles all audio rendering. Low 1.25 V core power keeps total system power well within the soundbar's small sealed enclosure, avoiding active cooling.
Recommandé
Automotive Head Unit / Infotainment
The DSPB56374AF's 24-bit processing and SAI interface suit automotive head units performing hands-free echo cancellation, noise reduction, and speed-compensated volume. The 0C to +70C commercial operating range is acceptable for cabin (non-ECU) placements, while the 80-LQFP footprint simplifies thermal management in confined dashboards. Use it as a co-DSP alongside the main SoC for offloading audio mixing.
Recommandé
Professional Audio Effects Processor
In studio rack effects, the DSPB56374AF's single-cycle MAC and 54 kB RAM support reverb, delay, and dynamics algorithms at 96 kHz sample rates. Its host interface allows front-panel microcontrollers to recall presets while the DSP handles the audio math. The 80-LQFP industrial-grade package tolerates the controlled thermal environment of a 1U rack chassis.
Recommandé
Digital Hearing Aid / Medical Audio Device
Hearing aids and medical listening devices rely on the DSPB56374AF's low MIPS-per-joule efficiency to run multi-band compression on small cells. The DSP56300 core's dual-precision arithmetic enables wide dynamic-range gain control without artefacts. The 80-LQFP package is typically paired with a small Class-D amplifier and a digital microphone front-end in behind-the-ear form factors.
Recommandé
MIDI / Karaoke Mixer Console
Karaoke mixers depend on real-time pitch shifting, echo, and harmony generation - workloads the DSPB56374AF handles natively with its 24-bit MAC pipeline. The I2C control port allows front-panel button matrices to select presets, while the SAI port streams mixed audio to a USB audio interface for recording. Its 80-LQFP industrial footprint fits standard mixer-PCB thermal envelopes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPB56374AF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPB56374AFC | DSPB56371AF | DSPB56373AF | DSPB56364AF100 | DSPB56362AF100 |
|---|---|---|---|---|---|---|
| Package | 80-LQFP (14x14 mm) | 80-LQFP (14x14 mm) - same | 80-LQFP (14x14 mm) - same | 80-LQFP (14x14 mm) - same | 80-LQFP (14x14 mm) - same | 80-LQFP (14x14 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock | 150 MHz | 150 MHz | 200 MHz | 240 MHz | 100 MHz | 100 MHz |
| Data Bus Width | 24 bit | 24 bit | 24 bit | 24 bit | 24 bit | 24 bit |
| Core Voltage | 1.25 V | 1.25 V | 1.25 V | 1.25 V | 1.25 V | 1.25 V |
| Operating Temperature | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +70C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| RoHS / Lead-Free | RoHS compliant (PB-FREE) | RoHS compliant | RoHS compliant | RoHS compliant | RoHS compliant | RoHS compliant |
Principaux différenciateurs
- Lower core voltage and lower power than legacy DSP56000 family (vs DSPB56364AF100)
- Larger on-chip ROM than smaller DSP563xx siblings (vs DSPB56362AF100)
- Standard 80-LQFP package - widely supported by PCB layout tools (vs DSPB56373AF)
- Mature DSP56300 toolchain (SDK, CodeWarrior) (vs DSPB56374AFC (same die, RoHS variant))
Notes de conception
Estimated: at 150 MHz core clock, 1.25 V core, the DSP56374 draws roughly 250 mA (per NXP DSP56374 datasheet typical power section), so the 1.25 V LDO must source at least 350 mA. Use a low-noise part such as NXP's PF6200 or a TPS7A4701 with 10uF input/output ceramic capacitance within 5 mm of the VCC_CORE pin to keep ripple below 20 mVpp - core noise above this level raises PLL jitter and degrades audio dynamic range.
Estimated: the 80-LQFP (14x14 mm) package has theta_JA around 35-40 C/W on a 4-layer JEDEC test board. At full 150 MHz sustained load the die can dissipate 0.6-1.0 W, yielding 25-40 C junction rise. Solder the centre exposed pad (if present on this package variant) to a continuous GND pour and add 4 thermal vias under the body; for enclosed AV cabinets consider a 1 cm copper heat-spreader tied to the GND pour.
Keep the 80-LQFP body on the top side only and route all 24 data lines plus 4 address lines on the immediate next layer to maintain 50 ohm impedance. The DSP56374 datasheet recommends 4-layer stack-up with continuous power planes; never run audio analogue traces under the HIC's digital data bus or the SAI clock pins, as crosstalk at 150 MHz will inject artefacts into decoded audio.
Do not assume any DSPB56374AF variant boots from internal memory without configuring the MODA-MODD pins per the datasheet's bootstrap table. Incorrect mode strapping locks the host interface off and leaves the part unresponsive - a common production-line failure when replacing DSPB56374AF with DSPB56374AFC in legacy firmware builds.
The SAI port's SDO/SDI lines toggle at 12.288 MHz for 96 kHz/24-bit audio; route them as 50-ohm microstrip with ground guard traces and length-match within 5 mm across the bus. Place a 22 ohm series damping resistor at the DSP56374 SDO pin to suppress ringing into the audio DAC input stage, especially when the DAC is on a separate PCB section connected by FFC.
Informations de conformité
Marked PB-FREE by NXP; explicit RoHS and REACH statements on the NXP product page. AEC-Q100 not applicable - this is a commercial-grade 0C-70C audio DSP, not an automotive-qualified part.
