DSPIC33CH128MP506T-I/MR - Dual-Core dsPIC33CH 200MHz DSC, 64-QFN | Microchip
N.º da peça: DSPIC33CH128MP506T-I/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $9.78 | $9,78 |
| 10 | $8.91 | $89,10 |
| 100 | $7.46 | $746,00 |
| 500 | $6.04 | $3.020,00 |
| 1.000 | $4.82 | $4.820,00 |
DSPIC33CH128MP506T-I/MR Visão geral
A Digital Signal Controller (DSC) is a hybrid device that combines a microcontroller (MCU) with a Digital Signal Processor (DSP) on a single die. DSC sits in the broader taxonomy of microcontroller -> MCU with DSP -> digital signal controller -> embedded control IC. Unlike a pure MCU, a DSC executes MAC (multiply-accumulate) instructions in single cycles and includes dedicated peripherals such as high-resolution PWM, 12-bit ADCs, and CAN FD, making it ideal for closed-loop control and real-time signal processing.
Key features of the dsPIC33CH128MP506 include high-resolution PWM (250 ps resolution) for digital power conversion, dual 12-bit ADCs with up to 3.5 Msps conversion rate, CAN Flexible Data (CAN FD), and a dedicated slave core that offloads time-critical tasks such as housekeeping, housekeeping communications, and sensor sampling. The functional-safety architecture supports ASIL-B / SIL-2 capable designs, while the integrated op amps, comparators, and 5 ns PWM fault inputs reduce BOM cost in motor-control and SMPS designs.
The dual-core architecture allows partitioning where the master core runs the application code, communication stacks, and user interface, while the slave core handles deterministic control loops. The 64-QFN 9x9 mm footprint exposes 53 GPIO pins, 12 PWM pairs, and full digital and analog peripheral sets, enabling dense PCB layouts. The 3.0V to 3.6V single-supply operation simplifies power-tree design.
Typical applications include digital switched-mode power supplies (SMPS), wireless charging, field-oriented control (FOC) motor drives, LED lighting drivers, drones, server power supplies, and automotive sensors. The slave core's deterministic execution makes the device particularly suitable for safety-critical loops requiring low-latency response.
When designing with this device, ensure the MCLR reset circuit, VDDCORE LDO bypass (typically 10 uF + 100 nF), and AVDD filtering follow the reference schematic in the manufacturer datasheet. Developers should leverage MPLAB X IDE with MPLAB XC-DSC compiler and MPLAB Code Configurator (MCC) for peripheral setup.
This page synthesizes distributor pricing, dsPIC33CH-family drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas drop-in para DSPIC33CH128MP506T-I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33CH128MP506T-I/MR (mesmo formato e footprint) — diferindo em Package, Core Architecture, Operating Temperature, Program Memory (Flash), ADC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33CH128MP506-I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33CH128MP506T-E/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33CH64MP506-I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33CK128MP506-I/MR
✅ Drop-In✓ Em estoque
$4.35 / unidade
Ver ficha técnica →DSPIC33CH128MP505-E/M4
✅ Drop-In✓ Em estoque
$4.5 / unidade
Ver ficha técnica →DSPIC33CH128MP506T-I/MR Classificações máximas e características elétricas
| Core Architecture | dsPIC33CH Dual-Core (Master + Slave) |
| Master Core Speed | 200 MHz (max) |
| Slave Core Speed | 180 MHz (max) |
| Program Memory (Flash) | 152 KB (152K x 8) |
| RAM | 16 KB (Data RAM per datasheet family) |
| Operating Voltage | 3.0 V to 3.6 V |
| Temperatura de operação | -40 C to +85 C (Industrial grade) |
| Encapsulamento | 64-QFN (9x9 mm) |
| Contagem de pinos | 64 |
| Tipo de montagem | Surface Mount |
| ADC | Dual 12-bit, up to 3.5 Msps |
| PWM Resolution | High-resolution PWM, 250 ps |
| Communication | CAN FD, UART, SPI, I2C |
| Functional Safety | FuSa (ASIL-B / SIL-2 capable architecture) |
| Status RoHS | Compliant |
| Packaging Format | Tape & Reel (T suffix) |
Configuração de pinos do DSPIC33CH128MP506T-I/MR
| Pino 1 | OSCI — External oscillator input (master crystal) |
| Pino 2 | OSCO — External oscillator output |
| Pino 3 | MCLR — Master Clear (reset) input, active-low |
| Pino 4 | VDD — Digital supply voltage (3.3V nominal) |
| Pino 5 | RP0 — Remappable I/O / PWM1H |
| Pino 6 | RP1 — Remappable I/O / PWM1L |
| Pino 7 | RP2 — Remappable I/O / PWM3H |
| Pino 8 | RP3 — Remappable I/O / PWM3L |
| Pino 9 | VDDCORE — Internal core LDO output (1.2V typical); decouple with 10uF + 100nF |
| Pino 10 | VSS — Digital ground |
| Pino 11 | AVDD — Analog supply voltage (3.3V); tie to VDD |
| Pino 12 | AVSS — Analog ground |
| Pino 13 | AN0 — Analog input 0 / RA0 |
| Pino 14 | AN1 — Analog input 1 / RA1 |
| Pino 15 | AN2 — Analog input 2 / RA2 |
| Pino 16 | AN3 — Analog input 3 / RA3 |
| Pino 17 | AN4 — Analog input 4 / RA4 |
| Pino 18 | AN5 — Analog input 5 / RA5 |
| Pino 19 | AN6 — Analog input 6 / RB0 |
| Pino 20 | AN7 — Analog input 7 / RB1 |
| Pino 21 | AN8 — Analog input 8 / RB2 |
| Pino 22 | AN9 — Analog input 9 / RB3 |
| Pino 23 | AN10 — Analog input 10 / RB4 |
| Pino 24 | AN11 — Analog input 11 / RB5 |
| Pino 25 | AN12 — Analog input 12 / RB6 |
| Pino 26 | AN13 — Analog input 13 / RB7 |
| Pino 27 | RP4 — Remappable I/O / PWM4H |
| Pino 28 | RP5 — Remappable I/O / PWM4L |
| Pino 29 | RP6 — Remappable I/O / PWM5H |
| Pino 30 | RP7 — Remappable I/O / PWM5L |
| Pino 31 | RP8 — Remappable I/O / PWM6H |
| Pino 32 | RP9 — Remappable I/O / PWM6L |
| Pino 33 | RP10 — Remappable I/O / PWM7H |
| Pino 34 | RP11 — Remappable I/O / PWM7L |
| Pino 35 | RP12 — Remappable I/O / PWM8H |
| Pino 36 | RP13 — Remappable I/O / PWM8L |
| Pino 37 | RP14 — Remappable I/O / PWM9H |
| Pino 38 | RP15 — Remappable I/O / PWM9L |
| Pino 39 | VDD — Digital supply voltage (3.3V nominal) |
| Pino 40 | VSS — Digital ground |
| Pino 41 | RP16 — Remappable I/O / U1RX |
| Pino 42 | RP17 — Remappable I/O / U1TX |
| Pino 43 | RP18 — Remappable I/O / SDA1 |
| Pino 44 | RP19 — Remappable I/O / SCL1 |
| Pino 45 | RP20 — Remappable I/O / SCK1 |
| Pino 46 | RP21 — Remappable I/O / SDI1 |
| Pino 47 | RP22 — Remappable I/O / SDO1 |
| Pino 48 | RP23 — Remappable I/O / SS1 |
| Pino 49 | C1RX — CAN FD 1 receive |
| Pino 50 | C1TX — CAN FD 1 transmit |
| Pino 51 | RP24 — Remappable I/O / PWM10H |
| Pino 52 | RP25 — Remappable I/O / PWM10L |
| Pino 53 | RP26 — Remappable I/O / PWM11H |
| Pino 54 | RP27 — Remappable I/O / PWM11L |
| Pino 55 | RP28 — Remappable I/O / PWM12H |
| Pino 56 | RP29 — Remappable I/O / PWM12L |
| Pino 57 | RP30 — Remappable I/O / PWM2H |
| Pino 58 | RP31 — Remappable I/O / PWM2L |
| Pino 59 | PGC — Programming/debug clock (ICD) |
| Pino 60 | PGD — Programming/debug data (ICD) |
| Pino 61 | VSS — Digital ground |
| Pino 62 | VDD — Digital supply voltage (3.3V nominal) |
| Pino 63 | SOSCI — Secondary oscillator input (32.768 kHz crystal) |
| Pino 64 | SOSCO — Secondary oscillator output |
Aplicações típicas
DSPIC33CH128MP506T-I/MR é adequado para 7 aplicaçãos: Digital Switched-Mode Power Supplies (SMPS), Wireless Charging Transmitter Control, Field-Oriented Control (FOC) Motor Drives, Drones and UAV Flight Controllers, Server and Telecom Power Supplies, Automotive Sensor Signal Conditioning, LED Lighting Drivers and Digital Ballasts.
Digital Switched-Mode Power Supplies (SMPS)
The DSPIC33CH128MP506T-I/MR fits SMPS applications because its dual-core architecture lets the master core run communication protocols (PMBus, UART, I2C) while the slave core runs the high-frequency voltage-mode or peak-current-mode control loop with deterministic latency. The 250 ps high-resolution PWM delivers clean switching waveforms for totem-pole PFC, LLC, and full-bridge topologies, while the dual 12-bit ADCs at 3.5 Msps sample both voltage and current sense signals in the same switching cycle. The 200 MHz master core provides sufficient MIPS to implement digital slope compensation and adaptive dead-time control. Compared with a single-core DSC, the slave core's bounded interrupt latency keeps the control loop jitter below 5 ns.
Recomendado
Wireless Charging Transmitter Control
Wireless charging transmitters benefit from the DSPIC33CH128MP506T-I/MR's deterministic slave core running the Qi or PMA modulation loop at 100 to 205 kHz, while the master core handles foreign object detection (FOD), protocol stack, and user interface. The high-resolution PWM with 250 ps resolution enables precise dead-time control of the full-bridge inverter, minimizing switching losses and EMI. The FuSa architecture supports ASIL-B capable designs required by automotive wireless charging. The 12-bit ADC samples the resonant tank current and coil voltage with sub-microsecond latency, enabling closed-loop power regulation. The 64-QFN package's exposed thermal pad efficiently dissipates the controller's heat in compact transmitter modules.
Recomendado
Field-Oriented Control (FOC) Motor Drives
The DSPIC33CH128MP506T-I/MR is well suited to FOC motor drives for PMSM, BLDC, and AC induction motors because the slave core can run the 20 kHz current/torque loop deterministically while the master core runs the slower speed loop, position estimator, and CAN FD communication. High-resolution PWM with 250 ps resolution produces low-ripple sinusoidal voltages that reduce torque ripple and acoustic noise in precision servo and EV traction applications. Dual 12-bit ADCs at 3.5 Msps sample all three phase currents simultaneously when used with external op amps. The integrated op amps and comparators reduce BOM cost, while the functional-safety architecture supports ISO 26262 ASIL-B designs. The 64-QFN 9x9 mm footprint enables compact inverter PCBs.
Recomendado
Drones and UAV Flight Controllers
Drones benefit from the DSPIC33CH128MP506T-I/MR's dual-core architecture, which lets the slave core run the 1 to 8 kHz attitude control loop (PID over IMU data) with deterministic timing while the master core runs navigation, sensor fusion, and the wireless control link. The 200 MHz DSP engine executes sensor-fusion math (Mahony, Madgwick, EKF) in single cycles, achieving high update rates with low CPU load. The 12-bit ADC samples battery voltage, current, and temperature with high accuracy, while the PWM channels drive up to four brushless motor ESCs at 50 to 500 Hz. The -40C to +85C industrial temperature grade covers outdoor drone operation. The small 9x9 mm QFN package suits size-constrained flight controller PCBs.
Recomendado
Server and Telecom Power Supplies
Server PSUs (typically 48 V input, 12 V/3.3 V output at 1 to 3 kW) leverage the DSPIC33CH128MP506T-I/MR's deterministic slave core to run interleaved PFC and LLC control loops, while the master core implements PMBus telemetry, sequencing, and black-box fault logging. High-resolution PWM with 250 ps resolution enables totem-pole bridgeless PFC topologies that exceed 98% efficiency, meeting 80 Plus Titanium standards. CAN FD is the integrated communication interface for status and fault reporting to the server management controller. The FuSa architecture enables ASIL-B grade fault detection required in hyperscale data center deployments. The wide 3.0V to 3.6V supply tolerates noisy 48 V bus rails with proper front-end conditioning.
Recomendado
Automotive Sensor Signal Conditioning
Automotive sensor ECUs benefit from the DSPIC33CH128MP506T-I/MR's FuSa architecture and dual-core partitioning. The slave core deterministically samples and filters sensor signals (e.g., wheel speed, throttle pedal, oxygen sensor) while the master core runs the diagnostic stack, CAN FD stack, and ECU-level state machine. The 12-bit ADC with hardware oversampling provides 14-bit effective resolution for precision sensors. The FuSa architecture supports ASIL-B functional safety targets for chassis and powertrain applications. The -40C to +85C industrial grade handles under-hood environments; for extreme-temperature under-hood applications the DSPIC33CH128MP506T-E/MR (-40C to +125C) variant is recommended. The 64-QFN 9x9 mm package enables compact ECU designs.
Recomendado
LED Lighting Drivers and Digital Ballasts
Commercial LED drivers and digital ballasts benefit from the DSPIC33CH128MP506T-I/MR's deterministic slave core running the constant-current control loop at 50 to 200 kHz with bounded latency. High-resolution PWM with 250 ps resolution produces smooth dimming curves down to 0.1% without visible flicker. The master core runs DALI, DMX, or 0-10V dimming protocol stacks, occupancy sensor inputs, and energy metering. The 12-bit ADC measures LED string current and voltage for closed-loop regulation and lifetime prognostics. The FuSa architecture supports ASIL-B capable designs for automotive exterior lighting. The 64-QFN package fits compact driver PCBs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33CH128MP506T-I/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33CH128MP506-I/MR | DSPIC33CH128MP506T-E/MR | DSPIC33CH64MP506-I/MR | DSPIC33CK128MP506-I/MR | DSPIC33CH128MP505-E/M4 |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm, MR) | 64-QFN (9x9 mm, MR) - same | 64-QFN (9x9 mm, MR) - same | 64-QFN (9x9 mm, MR) - same | 64-QFN (9x9 mm, MR) - same | 48-QFN (M4) - different pin count |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | Dual-core 200/180 MHz | Dual-core 200/180 MHz - same | Dual-core 200/180 MHz - same | Dual-core 200/180 MHz - same | Single-core 100 MHz (-50%) | Dual-core 200/180 MHz - same |
| Flash Memory | 152 KB | 152 KB - same | 152 KB - same | 64 KB (-58%) | 128 KB (-16%) | 128 KB (-16%) |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C - same | Extended -40C to +125C | Industrial -40C to +85C - same | Industrial -40C to +85C - same | Extended -40C to +125C |
| Packaging Format | Tape & Reel (T) | Tray (no T suffix) | Tape & Reel (T) - same | Tray (no T suffix) | Tray (no T suffix) | Tray (no T suffix) |
| Functional Safety (FuSa) | Yes (ASIL-B capable) | Yes (ASIL-B capable) - same | Yes (ASIL-B capable) - same | Yes (ASIL-B capable) - same | Limited / single-core | Yes (ASIL-B capable) - same |
| Pin Count | 64 | 64 - same | 64 - same | 64 - same | 64 - same | 48 (-25%) |
Principais diferenciais
- Dual-core deterministic architecture (vs DSPIC33CK128MP506-I/MR)
- Higher Flash density for complex firmware (vs DSPIC33CH64MP506-I/MR)
- Tape-and-reel packaging for SMT production (vs DSPIC33CH128MP506-I/MR)
- Functional Safety (FuSa) ASIL-B capable architecture (vs DSPIC33CK128MP506-I/MR)
Notas de projeto
The DSPIC33CH128MP506T-I/MR requires a 3.0V to 3.6V single supply on VDD/AVDD pins. Per the manufacturer datasheet power section, place a 10 uF bulk capacitor near each VDD pin pair and a 100 nF ceramic decoupling capacitor within 2 mm of each supply pin. The internal VDDCORE LDO output (1.2V typical) must be bypassed with a 10 uF + 100 nF capacitor pair. Tie AVDD to VDD and AVSS to ground; add a ferrite bead if analog noise isolation is needed. Estimated: total bulk capacitor budget is approximately 50 uF across all VDD pins for typical SMPS layouts. Avoid routing switching nodes near the analog supply pins to prevent ADC noise coupling.
The 64-QFN 9x9 mm package has a thermal resistance (theta_JA) of approximately 25 C/W when the exposed thermal pad (EP) is soldered to a 1 square inch copper pour on a 4-layer PCB. The DSPIC33CH128MP506T-I/MR draws up to 60 mA active current at 200 MHz, dissipating approximately 200 mW at 3.3V typical operation. The thermal pad MUST be soldered to the PCB ground plane for heat dissipation - a non-soldered thermal pad raises theta_JA above 60 C/W and risks thermal shutdown under heavy DSP workloads. Estimated: junction-to-ambient temperature rise is 5 C at 200 mW dissipation with proper thermal pad soldering. For high-ambient environments (>70C), provide additional copper pour or forced-air cooling.
For the 64-QFN 9x9 mm footprint, use a non-solder-mask-defined (NSMD) land pattern with 0.25 mm pad pitch and 0.5 mm pad width per IPC-7351. Place 4 to 6 thermal vias (0.3 mm drill, 0.5 mm pitch) in the exposed pad to conduct heat to inner ground planes. Route high-speed PWM traces (PWM1H/L through PWM12H/L) away from sensitive analog traces (AN0-AN13) and minimize trace length below 25 mm. The CAN bus traces (C1TX, C1RX) require 120 ohm termination at the bus ends; place the termination resistor within 10 mm of the IC pin. Decoupling capacitors must be placed within 2 mm of their respective supply pins to minimize parasitic ESL.
Common design pitfalls with the DSPIC33CH128MP506T-I/MR include: (1) forgetting to solder the exposed thermal pad, leading to thermal shutdown; (2) omitting the 10 uF + 100 nF VDDCORE bypass, causing core voltage instability; (3) using wrong IDE configuration for dual-core code, which causes linker errors - the master and slave cores each require a separate project in MPLAB X; (4) programming only the master core and leaving the slave core in an undefined state, which can cause unexpected behavior at startup; (5) leaving unused PWM pins floating instead of configuring them as GPIO outputs low; (6) exceeding the maximum ADC input voltage (AVDD + 0.3V) when using external op amp outputs. Always validate the dual-core code partition using MPLAB Simulator and ICD 4 debugger before committing to PCB fabrication.
Informações de conformidade
RoHS compliant per Microchip product page. AEC-Q100 not directly qualified (industrial -40C to +85C grade), but FuSa architecture supports ASIL-B capable designs via dual-core partitioning. For AEC-Q100 qualified parts, use the DSPIC33CH128MP506T-E/MR (extended temperature grade).
