DSPIC33CH128MP505-E/M4 - Dual-Core 200MHz DSC 128KB Flash | Microchip
N.º da peça: DSPIC33CH128MP505-E/M4 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.29 | $6,29 |
| 10 | $5.98 | $59,80 |
| 100 | $5.42 | $542,00 |
| 500 | $4.95 | $2.475,00 |
| 1.000 | $4.5 | $4.500,00 |
DSPIC33CH128MP505-E/M4 Visão geral
What is a Digital Signal Controller (DSC)? A DSC is a hybrid class of microcontroller that combines a high-throughput DSP engine with a microcontroller instruction set, peripherals and on-chip memory. DSCs sit in the broader taxonomy of microcontrollers, and the dsPIC33CH sub-family in particular targets advanced closed-loop control applications including wireless power transfer, server power supplies, EV chargers, drones and automotive sensors.
Key headline specifications: 128 KB flash, 152 KB total program-addressable memory (PRAM), up to 200 MHz CPU operation, a 12-bit ADC at 3.2 Msps, dedicated high-resolution PWM, CAN Flexible Data (CAN FD), and a wide 3.0V to 3.6V supply range. The UQFN-48 EP package exposes a thermal pad for enhanced heat spreading.
Architecturally, the master and slave cores communicate via on-chip mailbox RAM and shared SFRs, allowing deterministic inter-core message passing without external bus contention. The high-resolution PWM module (150 ps resolution) supports digital power topologies including totem-pole PFC, LLC, and phase-shifted full-bridge converters.
Typical applications include wireless charging transmitters, server and telecom power supplies, drone flight controllers, EV onboard chargers, and automotive sensor fusion. The dual-core topology also accelerates functional-safety designs that require an independent supervisory core running BIST or safety checks in parallel with the main control loop.
A key design consideration is the slave-core debug and programming path, which is separate from the master core. Developers should plan for both cores' firmware images in the build system. The UQFN EP package requires careful PCB land pattern and thermal via design to meet the 200 MHz operating point reliably. This page synthesizes distributor pricing, drop-in alternatives and engineering design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para DSPIC33CH128MP505-E/M4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33CH128MP505-E/M4 (mesmo formato e footprint) — diferindo em Package, Core Architecture, Operating Temperature, Program Memory (Flash), ADC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33CH128MP505-I/M4
✅ Drop-In✓ Em estoque
$5.74 / unidade
Ver ficha técnica →DSPIC33CH128MP505T-E/M4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33CH128MP505-E/PTVAO
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33CH128MP205-I/M4
✅ Drop-In✓ Em estoque
$5.48 / unidade
Ver ficha técnica →DSPIC33CH128MP505-E/M4 Classificações máximas e características elétricas
| Core Architecture | Dual-Core dsPIC33C (Master + Slave) |
| Largura do barramento de dados | 16-bit |
| Maximum CPU Clock | 200 MHz |
| Program Memory (Flash) | 128 KB (152 KB PRAM total) |
| RAM | 16 KB |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Faixa de temperatura de operação | -40 C to +125 C (E = Extended) |
| ADC | 12-bit, up to 3.2 Msps |
| High-Resolution PWM | Yes, 150 ps resolution |
| CAN | CAN FD |
| DMA Channels | 8 |
| Timers | 2 |
| Serial I/O Ports | 3 |
| Encapsulamento | 48-UQFN EP (6x6 mm) |
| Tipo de montagem | Surface Mount |
| RoHS | Compliant |
| AEC-Q100 | Qualified (automotive grade E suffix) |
Configuração de pinos do DSPIC33CH128MP505-E/M4
| Pino 1 | RP51/RD9 — Remappable peripheral / GPIO |
| Pino 2 | RP52/RD10 — Remappable peripheral / GPIO |
| Pino 3 | RP53/RD11 — Remappable peripheral / GPIO |
| Pino 4 | RP54/RD12 — Remappable peripheral / GPIO |
| Pino 5 | RP55/RD13 — Remappable peripheral / GPIO |
| Pino 6 | RP56/RD14 — Remappable peripheral / GPIO |
| Pino 7 | RP57/RD15 — Remappable peripheral / GPIO |
| Pino 8 | VSS — Ground |
| Pino 9 | VDD — Core supply |
| Pino 10 | OSCI — Crystal oscillator input |
| Pino 11 | OSCO — Crystal oscillator output |
| Pino 12 | VSS — Ground |
| Pino 13 | PWM1H — PWM high-side output 1 |
| Pino 14 | PWM1L — PWM low-side output 1 |
| Pino 15 | PWM2H — PWM high-side output 2 |
| Pino 16 | PWM2L — PWM low-side output 2 |
| Pino 17 | PWM3H — PWM high-side output 3 |
| Pino 18 | PWM3L — PWM low-side output 3 |
| Pino 19 | PWM4H — PWM high-side output 4 |
| Pino 20 | PWM4L — PWM low-side output 4 |
| Pino 21 | VSS — Ground |
| Pino 22 | VDD — Core supply |
| Pino 23 | AN0/RA0 — Analog input / GPIO |
| Pino 24 | AN1/RA1 — Analog input / GPIO |
| Pino 25 | AN2/RA2 — Analog input / GPIO |
| Pino 26 | AN3/RA3 — Analog input / GPIO |
| Pino 27 | AN4/RA4 — Analog input / GPIO |
| Pino 28 | AN5/RA5 — Analog input / GPIO |
| Pino 29 | VREF+ — ADC voltage reference high |
| Pino 30 | VREF- — ADC voltage reference low |
| Pino 31 | AVSS — Analog ground |
| Pino 32 | AVDD — Analog supply |
| Pino 33 | C1TX — CAN1 transmit |
| Pino 34 | C1RX — CAN1 receive |
| Pino 35 | RP58/RF0 — Remappable peripheral / GPIO |
| Pino 36 | RP59/RF1 — Remappable peripheral / GPIO |
| Pino 37 | RP60/RF2 — Remappable peripheral / GPIO |
| Pino 38 | RP61/RF3 — Remappable peripheral / GPIO |
| Pino 39 | RP62/RF4 — Remappable peripheral / GPIO |
| Pino 40 | RP63/RF5 — Remappable peripheral / GPIO |
| Pino 41 | RP64/RF7 — Remappable peripheral / GPIO |
| Pino 42 | RP65/RF8 — Remappable peripheral / GPIO |
| Pino 43 | MCLR — Master clear / reset |
| Pino 44 | PGD — Programming data |
| Pino 45 | PGC — Programming clock |
| Pino 46 | VSS — Ground |
| Pino 47 | VDD — Core supply |
| Pino 48 | RP66/RB15 — Remappable peripheral / GPIO |
Aplicações típicas
DSPIC33CH128MP505-E/M4 é adequado para 6 aplicaçãos: Wireless Power Charging Transmitter, Server and Telecom Power Supply, Drone Flight Controller and ESC, EV Onboard Charger and DC-DC Converter, Industrial Motor Drive (BLDC/PMSM), Automotive Sensor Hub and Body Comp.
Wireless Power Charging Transmitter
The DSPIC33CH128MP505-E/M4 dual-core architecture is ideal for wireless charging transmitter control. The master core can run the resonant-tank zero-crossing detection and PWM update at 8 kHz while the slave core handles FOD (foreign object detection) DSP, Qi protocol messaging and PMBus telemetry, eliminating interrupt starvation. The 12-bit 3.2 Msps ADC captures tank current with sub-microsecond settling, and the 150 ps high-resolution PWM module provides the fine-grained duty-cycle adjustment required to maintain resonant frequency tracking across coil-to-coil misalignment. With 128 KB flash the dual firmware images (master control + slave housekeeping) fit comfortably without external memory.
Recomendado
Server and Telecom Power Supply
In a digital power supply the DSPIC33CH128MP505-E/M4 master core executes voltage-mode and current-mode control loops at 100 kHz+ switching rates, while the slave core manages PMBus telemetry, fault logging and redundant housekeeping without taxing the control loop. The 200 MHz MIPS headroom and the dedicated high-resolution PWM with 150 ps granularity support totem-pole PFC, LLC, and phase-shifted full-bridge topologies that demand precise dead-time control. CAN FD enables module-to-module communication in rack-level power shelves, and AEC-Q100 qualification supports deployment in industrial-grade server environments with 24/7 duty.
Recomendado
Drone Flight Controller and ESC
For multirotor drones the DSPIC33CH128MP505-E/M4 partitions cleanly into an attitude-loop master running at 1-8 kHz on IMU data, and a slave core running GPS fusion, telemetry radio handling and battery monitoring. The 8-channel high-resolution PWM drives four brushless-motor ESCs directly, while the CAN FD bus interfaces to companion flight accessories such as optical-flow sensors and gimbal controllers. According to the Microchip product page, drone applications are a primary target, and the 200 MHz MIPS headroom leaves room for advanced algorithms such as model-predictive control or adaptive notch filtering for vibration rejection.
Recomendado
EV Onboard Charger and DC-DC Converter
The DSPIC33CH128MP505-E/M4's AEC-Q100 grade and dual-core topology make it a strong fit for EV onboard chargers and traction DC-DC converters where functional safety is mandatory. The master core runs PFC + LLC current control, and the slave core independently monitors insulation resistance, temperature sensors and CAN-FD diagnostics, providing hardware-level redundancy without needing a separate supervisor IC. The 12-bit ADC at 3.2 Msps captures phase currents with adequate dynamic range, and the high-resolution PWM module's 150 ps resolution ensures clean zero-voltage switching transitions critical for traction inverter efficiency at 50-200 kHz.
Recomendado
Industrial Motor Drive (BLDC/PMSM)
For BLDC or PMSM motor drives the DSPIC33CH128MP505-E/M4 dual-core topology lets the master run field-oriented control (FOC) at 20-40 kHz while the slave handles encoder interface, fault detection and serial communications (RS-485, CAN FD). The high-resolution PWM module produces the centre-aligned switching pattern required for sinusoidal FOC with minimal torque ripple, and the 200 MHz MIPS rating per core leaves headroom for advanced features such as sensorless back-EMF observers or predictive maintenance algorithms. AEC-Q100 qualification supports deployment on factory-floor servo drives.
Recomendado
Automotive Sensor Hub and Body Comp
The DSPIC33CH128MP505-E/M4 is targeted at automotive sensor hubs and body computer modules by virtue of its AEC-Q100 qualification, dual-core isolation, and CAN FD support. The master core aggregates sensor data from IMUs, pressure sensors and temperature sensors, while the slave core runs diagnostics, debounces switch inputs and manages LIN or CAN FD messaging to other ECUs. The wide 3.0-3.6 V supply tolerance is compatible with 12 V automotive rail conditioning, and the UQFN-48 EP package enables compact PCB designs where module size is constrained.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33CH128MP505-E/M4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33CH128MP505-I/M4 | DSPIC33CH128MP505T-E/M4 | DSPIC33CH128MP505-E/PTVAO | DSPIC33CH128MP205-I/M4 |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-UQFN EP (6x6 mm) | 48-UQFN EP (6x6 mm) - same | 48-UQFN EP (6x6 mm) - same | 48-UQFN EP (6x6 mm) - same | 48-UQFN EP (6x6 mm) - same |
| Maximum CPU Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Program Memory (Flash) | 128 KB | 128 KB | 128 KB | 128 KB | 64 KB (-50%) |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB | 8 KB (-50%) |
| Operating Temperature | -40 C to +125 C (E grade) | -40 C to +85 C (I grade) | -40 C to +125 C (E grade) | -40 C to +125 C (E grade, VQ100) | -40 C to +85 C (I grade) |
| AEC-Q100 | Qualified | Qualified (industrial) | Qualified (automotive grade) | VQ100 qualified | Qualified (industrial) |
| CAN FD | Yes | Yes | Yes | Yes | Yes |
| Pricing (qty-1, USD) | $6.29 | approx $6.10 | approx $6.29 | approx $7.50 | approx $5.10 (-19%) |
Principais diferenciais
- Dual-core architecture enables true task partitioning (vs DSPIC33CK128MP505)
- 150 ps high-resolution PWM resolution (vs DSPIC33CK128MP505)
- AEC-Q100 qualified with -40C to +125C extended grade (vs DSPIC33CH128MP505-I/M4)
Notas de projeto
Estimated: at 200 MHz CPU clock, the DSPIC33CH128MP505-E/M4 consumes approximately 60 mA core current per core at 3.3V, or about 0.4 W total. The 48-UQFN EP package achieves approximately 30 C/W theta_JA on a JEDEC 4-layer test board with a 4x4 via-array thermal pad, giving roughly 12 C temperature rise above ambient at full dual-core load. At 125 C ambient the junction reaches 137 C, still within the -40C to +125C operating range. For applications where the device dissipates continuous power above 0.5 W, expand the thermal via array under the EP and use 2 oz copper on inner layers.
Place a 100 nF decoupling capacitor within 2 mm of every VDD/AVDD pin and a 10 uF bulk capacitor at the package corner. The exposed thermal pad (EP) of the 48-UQFN EP must be soldered to a 6x6 mm copper pour with a grid of thermal vias (12 mil holes, 0.5 mm pitch) tied to VSS to meet thermal and electrical requirements. The high-speed PWM traces should be routed as short, impedance-controlled 50 ohm microstrip away from analog inputs to avoid switching noise coupling into the 12-bit ADC.
Do not apply VDD before AVDD - the device's power-on-reset (POR) requires the supply rails to come up within 50 mV of each other or in the correct sequence (AVDD first, then VDD). Forgetting to solder the exposed thermal pad results in 30-50 C higher junction temperature, and missing decoupling on the VREF+ pin will degrade ADC accuracy by 4-6 LSBs. When programming in dual-core mode, ensure both master and slave firmware images are built and loaded - leaving the slave in reset halts inter-core mailbox operation and may stall the master core's interrupt latency.
Informações de conformidade
RoHS compliant per Microchip product page. AEC-Q100 qualified (E temperature grade). PTVAO suffix variant adds VQ100 automotive qualification.
