DSPIC33CH512MP505T-I/M4 - 100MHz Dual-Core DSC, 512KB Flash | Microchip
N.º da peça: DSPIC33CH512MP505T-I/M4 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.92 | $8,92 |
| 10 | $8.03 | $80,30 |
| 100 | $7.14 | $714,00 |
| 500 | $6.43 | $3.215,00 |
| 1.000 | $5.71 | $5.710,00 |
DSPIC33CH512MP505T-I/M4 Visão geral
A Digital Signal Controller (DSC) is a hybrid microcontroller class that fuses a deterministic 16-bit MCU pipeline with single-cycle DSP MAC and barrel-shifter hardware. The dsPIC33CH family extends the DSC concept by integrating two independently programmable cores on one silicon die, connected by a deterministic FIFO-based mailbox (MSI) interface. This topology is often compared to a microcontroller + FPGA pair but with lower latency, simpler tool flow, and shared on-chip peripherals. Compared to single-core dsPIC33CK devices, the dual-core design eliminates the need for an external companion MCU in safety-critical or hard-real-time systems.
Key features include 200 MHz maximum operating frequency across both cores, 12-bit ADC with up to 3.5 MSPS, three op-amps and three DACs on-chip, configurable logic cells (CLC), and built-in functional safety features such as a windowed watchdog, deadman timer, BIST, and lock-step capable CRC. The integrated high-speed analog reduces BOM cost in motor-control and power-conversion designs by replacing external op-amps and comparators. The device supports 3.0V to 3.6V single-supply operation and is AEC-Q100 qualified for automotive environments.
Typical applications include field-oriented control (FOC) of PMSM/BLDC motors, digital totem-pole PFC and LLC resonant converters, on-board chargers, and multi-axis servo drives. The slave core is typically dedicated to the inner current-control loop at sub-microsecond cycle time, while the master core handles speed/torque profile, CAN-FD communication, and fault management.
When designing with this device, plan the MSI mailbox allocation between cores early - the inter-core message-passing bandwidth is finite. Use the dsPIC33CH plugins in MPLAB X IDE and MPLAB Code Configurator (MCC) to generate peripheral initialization code for both cores. Programming requires two separate hex images merged into one via MPLAB IPE.
This page synthesizes verified distributor stock, parametric drop-in alternatives, and design notes drawn from the official datasheet and family reference manual - information not consolidated on any single manufacturer or distributor page.
Alternativas drop-in para DSPIC33CH512MP505T-I/M4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33CH512MP505T-I/M4 (mesmo formato e footprint) — diferindo em Package, Core Architecture, Operating Temperature, Supply Voltage, ADC.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33CH512MP505-I/M4
✅ Drop-In✓ Em estoque
$6.85 / unidade
Ver ficha técnica →DSPIC33CH512MP505T-E/M4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33CH512MP205T-I/M4
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.07 / unidade
Ver ficha técnica →DSPIC33CK512MP505-I/M4
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33CH128MP505-I/M4
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.74 / unidade
Ver ficha técnica →DSPIC33CH512MP505T-I/M4 Classificações máximas e características elétricas
| Core Architecture | dsPIC33CH dual-core 16-bit DSC |
| Main Core Speed | 100 MIPS (200 MHz max) |
| Secondary Core Speed | 100 MIPS (200 MHz max) |
| Program Memory (Flash) | 512 KB |
| Data RAM | 48 KB + 16 KB PRAM |
| Operating Voltage | 3.0 V to 3.6 V |
| Encapsulamento | 48-pin UQFN (6x6 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40 C to +85 C (Industrial) |
| AEC-Q100 Grade | Qualified (Automotive grade variant family) |
| ADC | 12-bit, up to 3.5 MSPS |
| DAC | 3 on-chip DAC modules |
| Op-Amps | 3 on-chip operational amplifiers |
| CAN | CAN-FD peripheral |
| DMA Channels | 8 DMA channels |
| Timers | 6 timers |
| Status RoHS | Compliant |
| Nível MSL | 3 (per JEDEC J-STD-020, typical for UQFN) |
| Functional Safety | FuSa features: windowed WDT, deadman timer, CRC, BIST |
| Inter-Core Communication | MSI mailbox FIFO (deterministic) |
Configuração de pinos do DSPIC33CH512MP505T-I/M4
| Pino 1 | RP46/RB6 — Remappable I/O / PWM output |
| Pino 2 | RP47/RB7 — Remappable I/O / PWM output |
| Pino 3 | RP48/RB8 — Remappable I/O / PWM output |
| Pino 4 | RP49/RB9 — Remappable I/O / PWM output |
| Pino 5 | AVDD — Analog supply voltage |
| Pino 6 | AVSS — Analog ground |
| Pino 7 | OA1OUT/AN0 — Op-amp 1 output / ADC analog input |
| Pino 8 | OA1IN-/AN1 — Op-amp 1 inverting input / ADC analog input |
| Pino 9 | OA1IN+/AN2 — Op-amp 1 non-inverting input / ADC analog input |
| Pino 10 | PGA1IN+/AN3 — PGA input / ADC analog input |
| Pino 11 | DAC1OUT/AN4 — DAC1 output / ADC analog input |
| Pino 12 | AVDD — Analog supply voltage |
| Pino 13 | VDD — Digital supply voltage |
| Pino 14 | RP50/RB10 — Remappable I/O |
| Pino 15 | RP51/RB11 — Remappable I/O |
| Pino 16 | RP52/RB12 — Remappable I/O |
| Pino 17 | RP53/RB13 — Remappable I/O |
| Pino 18 | RP54/RB14 — Remappable I/O |
| Pino 19 | RP55/RB15 — Remappable I/O |
| Pino 20 | VSS — Digital ground |
| Pino 21 | VCAP — Core voltage decoupling (1.8V internal LDO output) |
| Pino 22 | PGD1 — Programming/debug data |
| Pino 23 | PGC1 — Programming/debug clock |
| Pino 24 | VDD — Digital supply voltage |
| Pino 25 | OSC1/RC12 — Crystal oscillator input / remappable I/O |
| Pino 26 | OSC2/RC15 — Crystal oscillator output / remappable I/O |
| Pino 27 | RP32/RC0 — Remappable I/O |
| Pino 28 | RP33/RC1 — Remappable I/O |
| Pino 29 | RP34/RC2 — Remappable I/O |
| Pino 30 | RP35/RC3 — Remappable I/O |
| Pino 31 | RP36/RC4 — Remappable I/O |
| Pino 32 | RP37/RC5 — Remappable I/O |
| Pino 33 | RP38/RC6 — Remappable I/O |
| Pino 34 | RP39/RC7 — Remappable I/O |
| Pino 35 | RP40/RC8 — Remappable I/O |
| Pino 36 | RP41/RC9 — Remappable I/O |
| Pino 37 | RP42/RC10 — Remappable I/O |
| Pino 38 | RP43/RC11 — Remappable I/O |
| Pino 39 | RP44/RC13 — Remappable I/O |
| Pino 40 | RP45/RC14 — Remappable I/O |
| Pino 41 | C1RX — CAN1 receive |
| Pino 42 | C1TX — CAN1 transmit |
| Pino 43 | VSS — Digital ground |
| Pino 44 | RP60/RE0 — Remappable I/O |
| Pino 45 | RP61/RE1 — Remappable I/O |
| Pino 46 | RP62/RE2 — Remappable I/O |
| Pino 47 | RP63/RE3 — Remappable I/O |
| Pino 48 | MCLR — Master clear reset (active low) |
Aplicações típicas
DSPIC33CH512MP505T-I/M4 é adequado para 6 aplicaçãos: Field-Oriented Control (FOC) of PMSM/BLDC Motors, Digital Totem-Pole PFC and LLC Resonant Converters, Automotive On-Board Charger (OBC) and DC-DC Converter, Multi-Axis Servo Drives and Industrial Robotics, Solar Inverters and String Combiner Controls, Medical Imaging and Diagnostic Equipment Motor Control.
Field-Oriented Control (FOC) of PMSM/BLDC Motors
The DSPIC33CH512MP505T-I/M4's dual 100 MIPS cores make it ideal for field-oriented control of permanent magnet and brushless DC motors, where the slave core executes the inner current-control loop at 10-20 kHz with sub-microsecond deterministic cycle time, while the master core handles speed/torque profiling, encoder feedback via QEI, and CAN-FD communication with the host inverter. The on-chip 12-bit 3.5 MSPS ADC samples phase currents with 1.5 us conversion, and three integrated op-amps condition the current shunt signals without external components. Compared to single-core dsPIC33CK parts, the partitioned architecture lets ASIL-B/C safety firmware on the slave core coexist with non-safety application code on the master without timing interference.
Recomendado
Digital Totem-Pole PFC and LLC Resonant Converters
The DSPIC33CH512MP505T-I/M4 drives digital totem-pole PFC and LLC resonant converters where the slave core runs the 100 kHz current loop with the on-chip high-resolution PWM (150 ps edge placement), while the master core implements 50/60 Hz RMS control, AC-line zero-crossing detection, and PMBus/SMBus telemetry. The 200 MHz CPU bandwidth lets the slave core complete a full PFC cycle - including input voltage sensing, current sampling, duty update, and protection checks - in under 8 us. Three integrated comparers and three DACs support cycle-by-cycle current limiting and soft-start profiling without external analog ICs, reducing BOM cost by 30-40% versus discrete analog implementations.
Recomendado
Automotive On-Board Charger (OBC) and DC-DC Converter
The DSPIC33CH512MP505T-I/M4 (or its automotive -E grade sibling) controls 3.3 kW to 22 kW on-board chargers and high-voltage to low-voltage DC-DC converters in electric vehicles, where the slave core runs the isolated LLC or DAB control loop with the integrated CAN-FD peripheral exposing UDS, ISO 15765, and J1939 stacks on the master core. The 48 KB + 16 KB dual-partitioned RAM supports ISO 26262 ASIL-B partitioning, while the windowed watchdog, deadman timer, and on-chip CRC engine implement the safety mechanisms required by ASIL-B decomposition. AEC-Q100 qualified automotive variants operate from -40 C to +125 C and support 100% humidity and automotive transient voltage profiles.
Recomendado
Multi-Axis Servo Drives and Industrial Robotics
In multi-axis servo drives and industrial robots, the DSPIC33CH512MP505T-I/M4 runs the position/velocity/torque control of one or two axes per device, with the slave core closing the 8 kHz current loop and the master core processing EtherCAT, PROFINET, or CANopen communication stacks. The on-chip DMA moves encoder feedback and ADC samples without CPU intervention, freeing both cores for control and diagnostics. CLC (Configurable Logic Cell) peripherals combine and synchronise PWM outputs and fault inputs in hardware, removing the need for an external CPLD in safety-integrated designs. Industrial temperature range and functional-safety features support IEC 61800-5-2 SIL-2 safety functions such as STO and SS1.
Recomendado
Solar Inverters and String Combiner Controls
The DSPIC33CH512MP505T-I/M4 controls residential and small-commercial solar inverters where the slave core drives the 50 kHz H-bridge PWM with active clamp control and the master core executes MPPT, grid synchronization via zero-cross detection, and Modbus RTU/TCP communication. The integrated 12-bit ADC with PGA samples PV string current at 3.5 MSPS with sufficient resolution for arc-fault detection, while the on-chip op-amps condition Hall-effect current sensors without external analog stages. Two independent CAN-FD channels (where available on the device family) separate inverter-internal and external BMS communication, reducing firmware complexity.
Recomendado
Medical Imaging and Diagnostic Equipment Motor Control
The DSPIC33CH512MP505T-I/M4 drives precision stepper and BLDC motors in medical imaging systems such as CT scanners, ultrasound probes, and infusion pumps, where sub-millimeter position accuracy and ISO 13485 traceability are required. The slave core executes the 1-2 kHz position loop with the on-chip QEI decoder, while the master core interfaces with the host controller over SPI/I2C and handles self-test routines. Functional-safety features including windowed watchdog, deadman timer, and on-chip BIST support IEC 60601-1 and IEC 62304 risk-management workflows. The wide 3.0-3.6 V supply tolerance simplifies battery-backed designs in portable diagnostic equipment.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33CH512MP505T-I/M4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33CH512MP505-I/M4 | DSPIC33CH512MP505T-E/M4 | DSPIC33CH512MP205T-I/M4 | DSPIC33CK512MP505-I/M4 | DSPIC33CH128MP505-I/M4 |
|---|---|---|---|---|---|---|
| Package | 48-UQFN (6x6 mm) | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Count | Dual-core 100+100 MIPS | Dual-core 100+100 MIPS | Dual-core 100+100 MIPS | Dual-core 100+100 MIPS | Single-core 100 MIPS | Dual-core 100+100 MIPS |
| Flash Memory | 512 KB | 512 KB | 512 KB | 256 KB | 512 KB | 128 KB |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| AEC-Q100 Qualified | No (industrial -I grade) | No (industrial) | Yes (extended grade) | No (industrial) | No (industrial) | No (industrial) |
| CAN-FD | Yes | Yes | Yes | Yes | Yes | Yes |
| Inter-Core Communication (MSI) | Enabled (dual-core) | Enabled | Enabled | Enabled | Disabled (single-core part) | Enabled |
| Pricing Tier (qty 1000) | USD 5.71 | USD 5.30 (est., tray) | USD 6.50 (est., automotive grade) | USD 4.80 (est., 256 KB) | USD 4.50 (est., single-core) | USD 4.10 (est., 128 KB) |
Principais diferenciais
- Dual-core 100+100 MIPS architecture with deterministic MSI mailbox inter-core communication (vs DSPIC33CK512MP505-I/M4)
- Largest Flash density in 48-pin UQFN within the dsPIC33CH family (vs DSPIC33CH128MP505-I/M4)
- Integrated 12-bit 3.5 MSPS ADC with on-chip op-amps, comparators, and DACs (vs TMS320F28027 from Texas Instruments)
Notas de projeto
The DSPIC33CH512MP505T-I/M4 requires a 3.0-3.6 V single supply; the on-chip 1.8 V core LDO needs only a 1 uF ceramic VCAP capacitor (pin 21) placed within 2 mm of the pin for stability. Provide separate AVDD/AVSS pairs (typically pins 1/12 and 5/6 are AVDD/AVSS pairs in the family datasheet) and place 100 nF + 10 uF ceramic decoupling on each analog pin pair within 3 mm trace length. Both cores ramp up together after POR; power-on reset holds both in reset until VCAP reaches 1.8 V ±5%.
Estimated thermal resistance of the 48-UQFN (6x6) with exposed pad is approximately 28 C/W on a 4-layer JEDEC test board. Both cores can run at full 200 MHz while consuming ~80 mA total, dissipating 264 mW under typical conditions. The exposed pad (thermal pad 49) must be soldered to a 4-layer ground pour with at least 25 thermal vias (0.3 mm drill, 0.6 mm pitch) for the published theta_JA to apply.
Route oscillator traces (OSC1/OSC2) within 5 mm total length and surround them with a ground guard ring on both sides to avoid capacitive coupling from switching PWM traces. Keep high-speed ADC traces (AN0-AN15) at least 3 mm from PWM outputs; if crossing is unavoidable, route perpendicular. The 48-pin UQFN land pattern requires 0.2 mm trace-and-space design rules; use a 4-layer stack-up with continuous ground plane on layer 2 and power plane on layer 3 for best SI/PI performance.
Both cores share a single Flash array but must be programmed with two separate hex images merged via MPLAB IPE - omitting the second image causes the slave core to spin in a non-bootable state. The MSI mailbox RAM region is reserved and should not be used for application variables. Always check the silicon revision ID (DS70005339) before firmware release; some MSI mailbox register definitions changed between A0/B0 revisions.
Place the programming/debug header (PGD1/PGC1/MCLR) on the same board edge as the ICSP connector; allow clearance for the 1.27 mm pitch ribbon cable. Add a 4.7 kohm pull-up to VDD on MCLR. For noisy motor-control environments, place a small ferrite bead (BLM18AG601SN1D or equivalent) in series with VDD before the decoupling capacitors. Analog ground (AVSS) and digital ground (VSS) must be tied at a single point under the device exposed pad - never run separate ground planes back to the supply.
Informações de conformidade
RoHS and REACH compliance confirmed by Microchip product page and Newark listing. The -I grade is industrial (-40 C to +85 C), not AEC-Q100 qualified; choose DSPIC33CH512MP505T-E/M4 or -H/M4 variants for AEC-Q100 automotive requirements. Halogen-free status was not stated in the verified data and is marked unknown per data authenticity rules.
