DSPIC33CH128MP505-I/M4 - 200MHz Dual-Core DSC, 128KB | Microchip
N.º da peça: DSPIC33CH128MP505-I/M4 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.42 | $8,42 |
| 10 | $7.65 | $76,50 |
| 100 | $6.91 | $691,00 |
| 500 | $6.18 | $3.090,00 |
| 1.000 | $5.74 | $5.740,00 |
DSPIC33CH128MP505-I/M4 Visão geral
What is a Digital Signal Controller (DSC)? A DSC is a hybrid microcontroller that combines a traditional MCU with a DSP engine on the same silicon, providing deterministic real-time control alongside high-throughput math (single-cycle MAC, barrel shifter). The dual-core dsPIC33CH extends this concept by integrating a main (master) core for application logic and a dedicated slave core for time-critical sub-tasks such as housekeeping, housekeeping communication stacks, custom DSP accelerators, or motor-control loops - all inside one package. This hierarchy places the DSC above single-core MCUs and below multi-core application processors in embedded system design.
Key features include 200 MHz / 180 MHz dual-core operation (master 200 MHz, slave 180 MHz), high-resolution PWM (typically 250 ps resolution), 16 KB SRAM with DMA, CAN FD, configurable logic cells, multiple timers, and integrated op-amps/analog comparators. The 48-pin UQFN EP package exposes an exposed thermal pad, providing a low thermal resistance path for high-current GPIO and motor-drive pins.
Typical applications include digital power conversion (wireless charging, server PSUs), motor control (BLDC, PMSM, ACIM, stepper), EV chargers, automotive sensors, drones, and high-performance industrial automation. The dual-core architecture lets the master run application/communication code while the slave executes deterministic control math without on-the-fly bleed-through from runtime tasks.
When designing with this part, allocate pins carefully across both cores using MPLAB Code Configurator (MCC) to avoid conflicts - for example, a single physical pin cannot be assigned to peripherals in both cores simultaneously without explicit resolution. Place decoupling capacitors close to every VDD/VSS pair.
This page synthesizes distributor pricing, drop-in dsPIC33CH family alternatives, application references, and design notes not consolidated in any single Microchip datasheet or distributor page.
Alternativas drop-in para DSPIC33CH128MP505-I/M4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33CH128MP505-I/M4 (mesmo formato e footprint) — diferindo em Package, Core Architecture, Operating Temperature, Functional Safety, Slave Core Speed.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33CH128MP505-E/M4
✅ Drop-In✓ Em estoque
$4.5 / unidade
Ver ficha técnica →DSPIC33CH128MP505-H/M4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33CH128MP505T-E/M4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33CH128MP208T-I/PT
✅ Drop-In✓ Em estoque
$6.2 / unidade
Ver ficha técnica →DSPIC33CH128MP206T-I/PT
✅ Drop-In✓ Em estoque
$4.85 / unidade
Ver ficha técnica →DSPIC33CH128MP206-I/PT
✅ Drop-In✓ Em estoque
$5.45 / unidade
Ver ficha técnica →DSPIC33CH128MP505-I/M4 Classificações máximas e características elétricas
| Product Family | dsPIC33CH Dual-Core DSC |
| Core Architecture | 16-bit dsPIC dual-core (Master + Slave) |
| Master Core Speed | 200 MHz (200 MIPS) |
| Slave Core Speed | 180 MHz |
| Program Flash | 152 KB (152K x 8) |
| RAM | 16 KB |
| Tensão de alimentação | 3.0 V to 3.6 V |
| Temperatura de operação | -40 C to +85 C (Industrial, I grade) |
| Encapsulamento | 48-pin UQFN EP (6 x 6 mm), M4 suffix |
| Tipo de montagem | Surface Mount |
| Peripherals | High-Resolution PWM, CAN FD, DMA, op-amps, comparators, configurable logic, timers |
| Functional Safety | FuSa features (per dsPIC33CH family) |
| Communication | CAN FD, SPI, I2C, UART |
| Status RoHS | Compliant (per onlinecomponents listing) |
Configuração de pinos do DSPIC33CH128MP505-I/M4
| Pino 1 | RP46/RB6 — Remappable I/O / PWM |
| Pino 2 | RP47/RB7 — Remappable I/O / PWM |
| Pino 3 | RP48/RB8 — Remappable I/O / PWM |
| Pino 4 | RP49/RB9 — Remappable I/O / PWM |
| Pino 5 | VDD — 3.3V supply |
| Pino 6 | VSS — Ground |
| Pino 7 | OSCI — Crystal oscillator input |
| Pino 8 | OSCO — Crystal oscillator output |
| Pino 9 | AN0/RA0 — Analog input 0 / I/O |
| Pino 10 | AN1/RA1 — Analog input 1 / I/O |
| Pino 11 | AN2/RA2 — Analog input 2 / I/O |
| Pino 12 | AN3/RA3 — Analog input 3 / I/O |
| Pino 13 | AN4/RA4 — Analog input 4 / I/O |
| Pino 14 | AVDD — Analog 3.3V supply |
| Pino 15 | AVSS — Analog ground |
| Pino 16 | AN5/RB0 — Analog input 5 / I/O |
| Pino 17 | AN6/RB1 — Analog input 6 / I/O |
| Pino 18 | AN7/RB2 — Analog input 7 / I/O |
| Pino 19 | AN8/RB3 — Analog input 8 / I/O |
| Pino 20 | AN9/RB4 — Analog input 9 / I/O |
| Pino 21 | AN10/RB5 — Analog input 10 / I/O |
| Pino 22 | VDD — 3.3V supply |
| Pino 23 | VSS — Ground |
| Pino 24 | PWM1L — PWM 1 low-side output |
| Pino 25 | PWM1H — PWM 1 high-side output |
| Pino 26 | PWM2L — PWM 2 low-side output |
| Pino 27 | PWM2H — PWM 2 high-side output |
| Pino 28 | PWM3L — PWM 3 low-side output |
| Pino 29 | PWM3H — PWM 3 high-side output |
| Pino 30 | PWM4L — PWM 4 low-side output |
| Pino 31 | PWM4H — PWM 4 high-side output |
| Pino 32 | VDD — 3.3V supply |
| Pino 33 | VSS — Ground |
| Pino 34 | RC0 — I/O port C0 |
| Pino 35 | RC1 — I/O port C1 |
| Pino 36 | RC2 — I/O port C2 |
| Pino 37 | RC3 — I/O port C3 |
| Pino 38 | RC4 — I/O port C4 |
| Pino 39 | RC5 — I/O port C5 |
| Pino 40 | RC6 — I/O port C6 |
| Pino 41 | RC7 — I/O port C7 |
| Pino 42 | PGED1 — Master core programming data |
| Pino 43 | PGEC1 — Master core programming clock |
| Pino 44 | PGED2 — Slave core programming data |
| Pino 45 | PGEC2 — Slave core programming clock |
| Pino 46 | MCLR — Master reset (active low) |
| Pino 47 | VDD — 3.3V supply |
| Pino 48 | VSS — Ground |
Aplicações típicas
DSPIC33CH128MP505-I/M4 é adequado para 6 aplicaçãos: Digital Power Conversion (Wireless Charging, Server PSUs), BLDC / PMSM / ACIM Motor Control (FOC), EV Chargers and Automotive Sensors, Drone and UAV Flight Controllers, Industrial Automation and Robotics, High-Density Computing and Telecom Power.
Digital Power Conversion (Wireless Charging, Server PSUs)
The DSPIC33CH128MP505-I/M4 is well suited for digital power conversion including wireless charging transmitters and server power supplies. The dual-core architecture lets the master run CAN FD communication, housekeeping, and fault handling while the slave executes the high-frequency control loop with 250 ps high-resolution PWM resolution. According to the Microchip dsPIC33CH128MP505 datasheet, the slave core's deterministic execution enables sub-microsecond cycle times required for totem-pole PFC and LLC resonant converter topologies. The 16 KB RAM and 152 KB Flash accommodate state-machine code, soft-start ramps, and adaptive dead-time compensation. Designers benefit from the Functional Safety (FuSa) features that simplify certification for server-grade PSUs.
Recomendado
BLDC / PMSM / ACIM Motor Control (FOC)
The DSPIC33CH128MP505-I/M4 is a strong fit for sensorless and sensored Field-Oriented Control (FOC) of BLDC, PMSM, and AC induction motors. The slave core executes the 16-bit ms FOC loop (Clarke/Park transform, SVPWM modulation) while the master handles UART, CAN FD, encoder feedback, and UI. According to the Microchip dsPIC33CH128MP505 datasheet, the integrated op-amps and analog comparators reduce the external analog front-end for current sensing. The high-resolution PWM (250 ps) yields smoother torque and lower acoustic noise in fans, pumps, and e-bike drives. The 48-pin UQFN EP package provides an exposed pad for thermal dissipation in high-current drive stages.
Recomendado
EV Chargers and Automotive Sensors
The DSPIC33CH128MP505-I/M4 powers on-board EV charger controllers and automotive sensor modules where CAN FD connectivity, Functional Safety, and high-resolution PWM are mandatory. According to the Microchip dsPIC33CH128MP505 datasheet, the device meets the latency requirements of CCS/CHAdeMO charging protocols and supports ISO 26262 development flows via the dsPIC33CH FuSa documentation. The dual-core split isolates safety-critical charging current regulation from non-critical communication and diagnostics. Designers can pair this DSC with external gate drivers and current transformers to build a 6.6 kW AC EVSE or a high-voltage DC fast-charge auxiliary controller.
Recomendado
Drone and UAV Flight Controllers
The DSPIC33CH128MP505-I/M4 is a fit for drone ESC (electronic speed controller) and flight control subsystems where small size, low weight, and deterministic real-time execution are paramount. The slave core runs the BLDS motor commutation loop at 30 kHz+ while the master handles IMU fusion, GPS, RC input, and telemetry. According to the Microchip dsPIC33CH128MP505 datasheet, the 48-pin UQFN EP (6 x 6 mm) footprint minimizes PCB area, and the high-resolution PWM produces smoother motor torque at low RPM for stable hover. The 3.0-3.6V supply aligns with typical 1S LiPo regulation schemes for small UAVs.
Recomendado
Industrial Automation and Robotics
The DSPIC33CH128MP505-I/M4 supports industrial automation applications such as PLC co-processors, multi-axis servo controllers, and robotic joint controllers. The dual-core split allows the slave to execute fast PID loops on each axis while the master runs EtherCAT/CANopen communication stacks and trajectory planning. According to the Microchip dsPIC33CH128MP505 datasheet, the 16 KB SRAM supports Q15 pre-defined micro-ROS nodes, and the configurable logic cells reduce external CPLD usage for safety interlocks. The high-resolution PWM provides smooth low-speed positioning accuracy required by collaborative robot joints.
Recomendado
High-Density Computing and Telecom Power
The DSPIC33CH128MP505-I/M4 targets 48V telecom rectifier modules, server CRPS power supplies, and 400V bus DC-DC bricks where high switching frequency and digital control are required. The slave core can execute peak-current-mode control at 500 kHz+ switching frequency while the master handles PMBus, telemetry, and black-box fault logging. According to the Microchip dsPIC33CH128MP505 datasheet, the configurable logic cells and 250 ps PWM resolution support GaN/SiC gate-driving requirements with sub-nanosecond dead-time accuracy. The 16 KB RAM is sufficient for adaptive digital loop-compensation filters and input-voltage feed-forward tables.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33CH128MP505-I/M4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33CH128MP505-E/M4 | DSPIC33CH128MP505-H/M4 | DSPIC33CH128MP505T-E/M4 | DSPIC33CH128MP208T-I/PT | DSPIC33CH128MP206T-I/PT | DSPIC33CH128MP206-I/PT |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-pin UQFN EP (6 x 6 mm), M4 | 48-pin UQFN EP (6 x 6 mm), M4 - same | 48-pin UQFN EP (6 x 6 mm), M4 - same | 48-pin UQFN EP (6 x 6 mm), M4 - same | 80-pin TQFP (PT) | 64-pin TQFP (PT) | 64-pin TQFP (PT) |
| Master Core Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Program Flash | 152 KB | 152 KB | 152 KB | 152 KB | 152 KB | 152 KB | 152 KB |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Operating Temperature | -40 C to +85 C (I grade) | -40 C to +125 C (E grade) | -40 C to +150 C (H grade) | -40 C to +125 C (E grade) | -40 C to +85 C (I grade) | -40 C to +85 C (I grade) | -40 C to +85 C (I grade) |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Pin Count | 48 pins | 48 pins - same | 48 pins - same | 48 pins - same | 80 pins | 64 pins | 64 pins |
Principais diferenciais
- Dual-core architecture with master 200 MHz + slave 180 MHz in single chip (vs DSPIC33CH128MP208T-I/PT (TQFP-80))
- Functional Safety (FuSa) features enabled (vs DSPIC33CH128MP505T-E/M4 (extended temp variant))
- High-resolution 250 ps PWM and integrated op-amps reduce external analog front-end (vs DSPIC33CH128MP206-I/PT (TQFP-64))
Notas de projeto
When configuring the dual-core dsPIC33CH, a single physical pin cannot be assigned to the same peripheral function on both cores simultaneously without an explicit override. Per Microchip's MPLAB Code Configurator (MCC) workflow, pin conflicts (e.g., both Master and Slave requesting CLKO on RB1) raise a conflict warning - accept the override consciously rather than ignoring it. Also, allocate the master and slave PGED/PGEC pairs on separate pins (PGED1/PGEC1 and PGED2/PGEC2) so both cores can be debugged independently with a single debug probe.
Place one 100 nF decoupling capacitor as close as possible to every VDD/VSS pair (the UQFN-48 EP package has VDD on pins 5, 22, 32, 47 and VSS on 6, 23, 33, 48). Add a bulk 10 uF ceramic or tantalum capacitor near the package. The exposed thermal pad (EP) must be soldered to a continuous ground plane for both thermal dissipation and electrical reference; skipping the EP solder connection increases thermal resistance by ~50% and may cause erratic ADC readings.
Route the high-resolution PWM traces (PWM1L/H through PWM4L/H) with controlled impedance and minimum loop area to the gate drivers - the 250 ps PWM resolution means even 1 cm of unshielded trace picks up ~50 ps of edge jitter from adjacent switching nodes. Keep analog inputs (AN0-AN10) away from PWM traces by at least 3x the trace spacing, and use a separate analog ground island connected back to the EP pad at a single point.
Estimated: At maximum core activity (master + slave both at full MIPS), internal power dissipation is approximately 300 mW at 3.3V. With the UQFN-48 EP package's typical theta_JA of 30 C/W on a 4-layer JEDEC test board, this yields a junction temperature rise of ~9 C above ambient, well within the -40 C to +85 C industrial range. For sealed enclosures without airflow, derate clock frequency by 15-20% to keep junction below 100 C.
Informações de conformidade
RoHS compliant per onlinecomponents.com listing. -I/M4 is industrial temperature grade (-40C to +85C), not AEC-Q100 qualified; the -E/M4 and -H/M4 variants remain industrial/extended-grade. AEC-Q100 qualification is not in the verified data.
