DSPIC33CK256MP502-I/SS - 100MHz 16-bit DSC, CAN-FD | Microchip
N.º da peça: DSPIC33CK256MP502-I/SS ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.52 | $4,52 |
| 10 | $4.11 | $41,10 |
| 100 | $3.66 | $366,00 |
| 500 | $3.31 | $1.655,00 |
| 1.000 | $2.98 | $2.980,00 |
DSPIC33CK256MP502-I/SS Visão geral
A digital signal controller combines the computational horsepower of a DSP with the deterministic, peripheral-rich behavior of a microcontroller. Within the power management hierarchy of embedded systems, the DSC sits above general-purpose MCUs for control-loop tasks, providing single-cycle MAC and DSP instructions that execute PID, notch filter, and transform algorithms in real time for switch-mode power conversion and motor commutation.
Key features of the DSPIC33CK256MP502 include a modified Harvard architecture core running at up to 100 MIPS, dual-panel flash supporting live update firmware switching, 12-bit ADCs, high-resolution PWM outputs, and on-chip operational amplifiers that reduce external component count in current-sense paths. The CAN FD interface supports higher data payloads and bit rates than classical CAN, making the part suitable for modern in-vehicle and industrial networks.
The DSP engine includes a barrel shifter and multiple internal bus architectures for efficient data handling, with 4 DMA channels and 4 external interrupts per Microchip USA product documentation, enabling zero-overhead data movement between peripherals and RAM in time-critical loops.
Typical applications include digital power supplies, LLC and totem-pole PFC converters, BLDC and PMSM motor control systems, LED lighting drivers, and CAN FD-connected industrial sensing nodes. The combination of high-resolution PWM and fast 12-bit ADC sampling suits closed-loop converters switching at hundreds of kilohertz.
Design consideration: the core operates strictly from a 3.0 V to 3.6 V rail, so plan an LDO or buck-derived 3.3 V supply, and verify flash partition selection early since live update requires careful linker configuration.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para DSPIC33CK256MP502-I/SS — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33CK256MP502-I/SS (mesmo formato e footprint) — diferindo em CAN Interface, Data SRAM, Operating Temperature, Package, Core.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33CK256MP202-I/SS
✅ Drop-In✓ Em estoque
$3.15 / unidade
Ver ficha técnica →DSPIC33CK128MP502-I/SS
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33CK64MP502-I/SS
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33CK128MP202-I/SS
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33CK256MP502-E/SS
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.96 / unidade
Ver ficha técnica →DSPIC33CK256MP502-I/SS Classificações máximas e características elétricas
| Core Architecture | 16-bit dsPIC DSC, modified Harvard |
| Maximum CPU Speed | 100 MHz (100 MIPS) |
| Program Flash Memory | 256 KB with ECC, dual partition (live update) |
| Data SRAM | 24 KB with MBIST |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Temperatura de operação | -40C to +85C (I grade) |
| CAN Interface | CAN FD (Flexible Data) |
| ADC Resolution | 12-bit |
| PWM | High-Resolution PWM |
| On-chip Op-Amps | Yes |
| DMA Channels | 4 |
| External Interrupts | 4 |
| DSP Engine | Single-cycle MAC, barrel shifter |
| Encapsulamento | 28-SSOP |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Boundary Scan Support | Yes |
Guia de Configuração de Pinos do DSPIC33CK256MP502-I/SS 28-ssop
Configuração de pinos para DSPIC33CK256MP502-I/SS (pacote 28-ssop). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33CK256MP502-I/SS.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33CK256MP502-I/SS é adequado para 6 aplicaçãos: Digital Power Supplies, Brushless Motor Control (BLDC/PMSM), CAN FD Industrial Networking Nodes, LED Lighting Drivers, Advanced Sensing and Control Systems, Wireless Charging and Consumer Power Conversion.
Digital Power Supplies
The DSPIC33CK256MP502 fits digital power supply control because its 100 MHz (100 MIPS) core executes PID and multi-loop compensation algorithms with single-cycle MAC instructions, while high-resolution PWM provides fine duty-cycle granularity for converters switching at 100 kHz to 1 MHz. The 12-bit ADC and on-chip op-amps let designers build the current-sense front end without external amplifiers, shortening the control-loop latency path. In an LLC or totem-pole PFC design, the DSC runs from a 3.3 V rail with the CAN FD module optionally used for telemetry and PMBus-style supervision. Unlike fixed-function controllers, firmware-defined control enables soft-start profiles, adaptive dead-time, and fault logging. Trade-off: developing firmware control requires validation effort versus a hardware PWM controller, but yields flexibility across product variants.
Recomendado
Brushless Motor Control (BLDC/PMSM)
For BLDC and PMSM drives, the DSPIC33CK256MP502 provides the classic motor-control quartet: high-resolution complementary PWM with dead-time insertion, fast 12-bit ADC sampling synchronized to the PWM period, on-chip op-amps for low-side shunt current sensing, and a 100 MIPS DSP core for field-oriented control (FOC) transforms at PWM-rate execution. A 20 kHz PWM loop gives roughly 1-2 kHz current-loop bandwidth headroom, adequate for servo-class performance. The 256 KB dual-partition flash stores both FOC firmware and protocol stacks, and live update permits field firmware changes without stopping the motor. CAN FD supports industrial networked drives. Design consideration: shunt amplifier gain setting and ADC trigger alignment to PWM center must be tuned to minimize torque ripple and avoid sampling during switching transients.
Recomendado
CAN FD Industrial Networking Nodes
The integrated CAN FD module distinguishes the MP502 within the 28-pin dsPIC33CK family, making it a compact single-chip solution for industrial nodes that must exchange large payloads (up to 64 data bytes) at higher bit rates than classical CAN. Sensor aggregation, factory automation I/O, and building control nodes benefit from the combination of CAN FD, a 100 MIPS core for local processing, and 24 KB SRAM for message buffering. The 4 DMA channels offload CAN FIFO servicing from the CPU, improving worst-case interrupt latency for concurrent control tasks. Network designs should pair the DSC with a CAN FD transceiver and account for the strict 3.0-3.6 V supply range when interfacing to 5 V field wiring through level-shifted inputs or appropriate transceiver selection.
Recomendado
LED Lighting Drivers
Microchip has long positioned dsPIC DSCs for efficient power supplies in lighting, and the DSPIC33CK256MP502 continues this role with high-resolution PWM suited to LED current regulation and dimming control. The 100 MHz core implements average-current-mode control for boost or buck LED drivers, while spare PWM channels generate independent dimming or fan control outputs. On-chip op-amps condition shunt-based current feedback, reducing BOM cost in compact driver boards, and the 28-SSOP footprint suits dense lighting power stages. CAN FD enables networked architectural lighting over DALI-alternative or custom bus topologies. Thermal design matters: in enclosed luminaires, keep junction temperature within the -40C to +85C ambient rating by derating clock speed or adding copper pour under the exposed thermal path.
Recomendado
Advanced Sensing and Control Systems
For advanced sensing nodes, the DSPIC33CK256MP502 combines local signal processing with networked reporting: the DSP engine applies digital filters (IIR/FIR, notch) to raw ADC streams using single-cycle MAC instructions, on-chip op-amps amplify small sensor signals, and CAN FD or UART links publish processed results. Typical uses include vibration monitoring, precision pressure and flow transmitters, and power-quality analyzers where 12-bit ADC sampling at PWM-triggered intervals provides deterministic acquisition timing. The 24 KB SRAM with MBIST suits reliability-focused industrial deployments, and ECC flash protects code integrity in electrically noisy environments. Because the whole sensing chain sits in one 28-pin SSOP package, designers save board area versus discrete amplifier-plus-MCU solutions while retaining firmware upgrade flexibility over product lifetime.
Recomendado
Wireless Charging and Consumer Power Conversion
High-frequency resonant conversion, such as wireless power transmitters and compact consumer adapters, benefits from the DSPIC33CK256MP502's combination of high-resolution PWM (fine phase and frequency control of resonant half-bridges), fast ADC feedback, and 100 MIPS computation for frequency-tracking algorithms. Live-update dual-partition flash allows tuning of control coefficients in the field as coil coupling characteristics vary across product generations. The 3.0-3.6 V supply simplifies gate-drive interfacing through level shifters to the power stage. Consumer safety designs should implement the DSC's fault and brownout resources in firmware supervision of foreign-object detection loops. Compared with fixed-function wireless power controllers, this DSC approach trades higher engineering effort for protocol flexibility (Qi revision updates) and product-line reuse of a single controller platform.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33CK256MP502-I/SS — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33CK256MP202-I/SS | DSPIC33CK128MP502-I/SS | DSPIC33CK64MP502-I/SS | DSPIC33CK128MP202-I/SS |
|---|---|---|---|---|---|
| Package | 28-SSOP | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 100 MHz (100 MIPS) | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Program Flash | 256 KB (ECC, dual partition) | 256 KB | 128 KB | 64 KB | 128 KB |
| CAN FD | Yes | No | Yes | Yes | No |
| On-chip Op-Amps | Yes | No | Yes | Yes | No |
| Operating Temperature | -40C to +85C (I grade) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principais diferenciais
- CAN FD connectivity in a 28-pin package (vs DSPIC33CK256MP202-I/SS)
- Integrated op-amps reduce BOM cost (vs DSPIC33CK256MP202-I/SS)
- Full 256 KB ECC flash with live update (vs DSPIC33CK128MP502-I/SS)
- Same 100 MHz core across all alternatives (vs DSPIC33CK64MP502-I/SS)
Notas de projeto
The dsPIC33CK256MP502 core requires a tightly regulated 3.0 V to 3.6 V supply. Use a 3.3 V LDO or buck stage with at least one 0.1 uF ceramic decoupling capacitor per VDD pin placed within 2 mm of each pin, plus a 4.7-10 uF bulk capacitor per Microchip's family reference layout guidance. If the board also carries a 5 V CAN transceiver, verify the transceiver's input tolerates 3.3 V logic levels; most modern CAN FD transceivers are 3.3 V/5 V tolerant.
For digital power or motor-control designs, route the ADC input traces away from the PWM switching nodes and keep the shunt-sense Kelvin connections directly across the current-sense resistor to the op-amp inputs. Synchronize ADC sampling to the PWM period center via the peripheral trigger so sampling occurs away from switching transients. Keep the crystal or internal-FRC clock source short-looped; the 100 MHz core tolerates the FRC with PLL for most control loops, avoiding crystal EMI issues.
Two frequent pitfalls: (1) Live Update requires dual-partition linker configuration from the start of the project - retrofitting a single-partition project into dual-partition can invalidate fixed addresses and bootloader assumptions. (2) Substituting an MP202 for the MP502 loses CAN FD and op-amps; confirm the required peripheral list before cross-family substitution, and re-check the 28-SSOP pin map in the datasheet since peripheral-to-pin multiplexing differs between MP5xx and MP2xx variants.
The 28-SSOP package has limited thermal dissipation capability, but a 100 MHz dsPIC33CK typically consumes well under the package limit in active mode. Estimated: at roughly 60-90 mA typical active current on 3.3 V (0.2-0.3 W), junction rise stays modest for SSOP theta-JA values on a standard 2-layer board. Verify with your firmware's actual clock gating and peripheral activity; enable idle/doze modes in sensing applications to reduce average dissipation.
Informações de conformidade
RoHS compliance and lead-free status per Microchip product family practice; REACH, halogen-free, and conflict-minerals declarations not stated in the provided web data.
