DSPIC33CH512MP506-I/MR - Dual-Core 100MHz DSC, 512KB Flash | Microchip
N.º da peça: DSPIC33CH512MP506-I/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.5 | $8,50 |
| 10 | $7.65 | $76,50 |
| 100 | $6.8 | $680,00 |
| 500 | $6.1 | $3.050,00 |
| 1.000 | $5.45 | $5.450,00 |
DSPIC33CH512MP506-I/MR Visão geral
What is a Digital Signal Controller (DSC)? A DSC is a hybrid microcontroller that integrates a DSP engine with a microcontroller core, optimized for real-time control loops where deterministic latency and high-throughput math are required simultaneously. Within the broader hierarchy, a DSC sits between a microcontroller (MCU) and a full DSP, targeting power conversion, motor control, and signal-conditioning applications. The dsPIC33CH family specifically introduces a dual-core architecture where the slave core can offload time-critical tasks (e.g., control-loop computation, housekeeping) from the master core, freeing it to handle communication stacks, user interfaces, and supervisory functions.
Key features include 100 MIPS master / 90 MIPS slave performance, 512 KB Flash with live-update dual-partition support, integrated CAN-FD controllers, high-resolution PWM with 250 ps resolution, a 12-bit 3.5 Msps ADC with up to 24 channels, and a Functional Safety (FuSa) feature set targeting IEC 61508 SIL 2 capable systems. The slave core can independently run user code and exchange data with the master through shared memory and hardware semaphores.
The device uses a 5V tolerant I/O design with separate analog and digital supply domains, supports trace and JTAG debugging on both cores simultaneously, and integrates dual partition Flash for over-the-air firmware updates without service interruption.
Typical applications include digital power conversion (AC/DC, DC/DC, PFC, LLC, wireless charging), high-performance motor control (field-oriented control for PMSM, BLDC), and functional safety systems. The QFN-64 footprint is footprint-compatible with the related dsPIC33CH256MP506 and dsPIC33CH128MP506 variants, allowing scalable platform designs.
When designing with this DSC, allocate boot, code, and data memory regions carefully between the two cores and follow the dsPIC33CH Dual-Core Programming Guide for shared resource arbitration to avoid race conditions on peripheral access.
This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical dual-core design notes not aggregated on any single manufacturer or distributor page.
Alternativas drop-in para DSPIC33CH512MP506-I/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33CH512MP506-I/MR (mesmo formato e footprint) — diferindo em Package, Core Architecture, Operating Temperature, ADC, Functional Safety.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33CH512MP506-E/PT
✅ Drop-In✓ Em estoque
$7.65 / unidade
Ver ficha técnica →DSPIC33CH512MP206-I/MR
✅ Drop-In✓ Em estoque
$3.96 / unidade
Ver ficha técnica →DSPIC33CH512MP506-I/PT
✅ Drop-In✓ Em estoque
$7.8 / unidade
Ver ficha técnica →DSPIC33CH512MP506-I/MR Classificações máximas e características elétricas
| Core Architecture | Dual-core 16-bit dsPIC33 DSC (master + slave) |
| Master Core Speed | 100 MIPS (50 MHz) |
| Slave Core Speed | 90 MIPS (45 MHz) |
| Program Memory (Flash) | 512 KB dual-partition |
| RAM | 72 KB (including slave-core RAM) |
| Encapsulamento | 64-pin QFN (9x9 mm) |
| Temperatura de operação | -40C to +85C (industrial) |
| Tensão de alimentação | 3.0 V to 3.6 V (core), 3.0 V to 5.5 V (I/O tolerant) |
| ADC | 12-bit, up to 3.5 Msps |
| High-Resolution PWM | Yes, 250 ps resolution |
| CAN-FD | Yes |
| Functional Safety | FuSa feature set, IEC 61508 capable |
| Tipo de montagem | Surface Mount |
| Nível MSL | 3 (168 hours) |
| Status RoHS | Compliant |
Configuração de pinos do DSPIC33CH512MP506-I/MR
| Pino 1 | RP46/PWM4H/RA8 — Remappable I/O / PWM / Port A |
| Pino 2 | RP47/PWM4L/RA9 — Remappable I/O / PWM / Port A |
| Pino 3 | RP48/PWM5H/RA10 — Remappable I/O / PWM / Port A |
| Pino 4 | RP49/PWM5L/RA11 — Remappable I/O / PWM / Port A |
| Pino 5 | VDD — Digital supply voltage (3.3V) |
| Pino 6 | VSS — Digital ground |
| Pino 7 | OSCI/CLKI/RA2 — Crystal oscillator input / Port A |
| Pino 8 | OSCO/CLKO/RA3 — Crystal oscillator output / Port A |
| Pino 9 | PGED3/RP50/RA0 — Programming data / Remappable I/O / Port A |
| Pino 10 | PGEC3/RP51/RA1 — Programming clock / Remappable I/O / Port A |
| Pino 11 | PGED1/AN18/RP52/RB0 — Programming / Analog / Remappable I/O / Port B |
| Pino 12 | PGEC1/AN19/RP53/RB1 — Programming / Analog / Remappable I/O / Port B |
| Pino 13 | AN20/RP54/RB2 — Analog input / Remappable I/O / Port B |
| Pino 14 | AN21/RP55/RB3 — Analog input / Remappable I/O / Port B |
| Pino 15 | AN22/RP56/RB4 — Analog input / Remappable I/O / Port B |
| Pino 16 | AN23/RP57/RB5 — Analog input / Remappable I/O / Port B |
| Pino 17 | VDD — Digital supply voltage (3.3V) |
| Pino 18 | VSS — Digital ground |
| Pino 19 | AN24/RP58/RB6 — Analog input / Remappable I/O / Port B |
| Pino 20 | AN25/RP59/RB7 — Analog input / Remappable I/O / Port B |
| Pino 21 | AN26/RP60/RB8 — Analog input / Remappable I/O / Port B |
| Pino 22 | AN27/RP61/RB9 — Analog input / Remappable I/O / Port B |
| Pino 23 | AN28/RP62/RB10 — Analog input / Remappable I/O / Port B |
| Pino 24 | AN29/RP63/RB11 — Analog input / Remappable I/O / Port B |
| Pino 25 | AN30/RP64/RB12 — Analog input / Remappable I/O / Port B |
| Pino 26 | AN31/RP65/RB13 — Analog input / Remappable I/O / Port B |
| Pino 27 | AN32/RP66/RB14 — Analog input / Remappable I/O / Port B |
| Pino 28 | AN33/RP67/RB15 — Analog input / Remappable I/O / Port B |
| Pino 29 | AVDD — Analog supply voltage |
| Pino 30 | AVSS — Analog ground |
| Pino 31 | RP68/PWM6H/RC0 — Remappable I/O / PWM / Port C |
| Pino 32 | RP69/PWM6L/RC1 — Remappable I/O / PWM / Port C |
| Pino 33 | RP70/PWM7H/RC2 — Remappable I/O / PWM / Port C |
| Pino 34 | RP71/PWM7L/RC3 — Remappable I/O / PWM / Port C |
| Pino 35 | RP72/PWM8H/RC4 — Remappable I/O / PWM / Port C |
| Pino 36 | RP73/PWM8L/RC5 — Remappable I/O / PWM / Port C |
| Pino 37 | RP74/PWM9H/RC6 — Remappable I/O / PWM / Port C |
| Pino 38 | RP75/PWM9L/RC7 — Remappable I/O / PWM / Port C |
| Pino 39 | RP76/SCL1/RC8 — Remappable I/O / I2C clock / Port C |
| Pino 40 | RP77/SDA1/RC9 — Remappable I/O / I2C data / Port C |
| Pino 41 | RP78/RC10 — Remappable I/O / Port C |
| Pino 42 | RP79/RC11 — Remappable I/O / Port C |
| Pino 43 | RP80/RC12 — Remappable I/O / Port C |
| Pino 44 | RP81/RC13 — Remappable I/O / Port C |
| Pino 45 | RP82/RC14 — Remappable I/O / Port C |
| Pino 46 | RP83/RC15 — Remappable I/O / Port C |
| Pino 47 | VDD — Digital supply voltage (3.3V) |
| Pino 48 | VSS — Digital ground |
| Pino 49 | RP84/PWM10H/RD0 — Remappable I/O / PWM / Port D |
| Pino 50 | RP85/PWM10L/RD1 — Remappable I/O / PWM / Port D |
| Pino 51 | RP86/PWM11H/RD2 — Remappable I/O / PWM / Port D |
| Pino 52 | RP87/PWM11L/RD3 — Remappable I/O / PWM / Port D |
| Pino 53 | RP88/C1RX/RD4 — Remappable I/O / CAN-FD receive / Port D |
| Pino 54 | RP89/C1TX/RD5 — Remappable I/O / CAN-FD transmit / Port D |
| Pino 55 | RP90/RD6 — Remappable I/O / Port D |
| Pino 56 | RP91/RD7 — Remappable I/O / Port D |
| Pino 57 | RP92/RD8 — Remappable I/O / Port D |
| Pino 58 | RP93/RD9 — Remappable I/O / Port D |
| Pino 59 | RP94/RD10 — Remappable I/O / Port D |
| Pino 60 | RP95/RD11 — Remappable I/O / Port D |
| Pino 61 | RP96/RD12 — Remappable I/O / Port D |
| Pino 62 | RP97/RD13 — Remappable I/O / Port D |
| Pino 63 | RP98/RD14 — Remappable I/O / Port D |
| Pino 64 | RP99/RD15 — Remappable I/O / Port D |
Aplicações típicas
DSPIC33CH512MP506-I/MR é adequado para 6 aplicaçãos: Digital Power Conversion (PFC + LLC), Field-Oriented Control (FOC) Motor Drives, Wireless Charging Transmitter Control, Solar Inverter Control, Functional Safety (IEC 61508) Industrial Control, Automotive Auxiliary Motor Control.
Digital Power Conversion (PFC + LLC)
The DSPIC33CH512MP506-I/MR is purpose-built for digital power conversion, particularly totem-pole PFC and LLC resonant converter topologies. The dual-core architecture lets the master core run the high-level PFC loop at line frequency (50/60 Hz) while the slave core executes the high-bandwidth LLC control loop at switching frequencies up to 1 MHz, keeping each control period deterministic. The 250 ps high-resolution PWM provides fine duty-cycle control needed for soft-switching transitions, while the 3.5 Msps 12-bit ADC samples current and voltage with adequate headroom for 100 kHz+ control bandwidth. The 512 KB dual-partition Flash enables in-field firmware updates without service interruption.
Recomendado
Field-Oriented Control (FOC) Motor Drives
Field-oriented control of PMSM and BLDC motors requires simultaneous execution of the Park/Clarke transforms, the current PI loops, and the SVPWM modulator, typically within 10-20 us. On the DSPIC33CH512MP506-I/MR, the slave core is dedicated to the current control loop (running at 20-50 kHz) while the master core handles the slower speed/torque loop, CAN-FD communication, and supervisory diagnostics. The dedicated QEI and 250 ps PWM peripherals eliminate interrupt jitter on commutation edges. Industrial servo drives benefit from the Functional Safety (FuSa) feature set, which supports IEC 61508 SIL 2 architectures with dual-core lockstep.
Recomendado
Wireless Charging Transmitter Control
Wireless charging transmitters (Qi, AirFuel) require precise inverter control, foreign object detection (FOD), and real-time communication protocol stacks. The DSPIC33CH512MP506-I/MR's slave core handles the resonant inverter control loop at 100-200 kHz with deterministic latency, while the master core runs the Qi state machine, FOD algorithm, and CAN-FD link to the vehicle bus. The high-resolution PWM enables clean zero-voltage switching (ZVS) transitions critical for EMI compliance. The 512 KB Flash is ample for both the inverter firmware and the Qi library.
Recomendado
Solar Inverter Control
String solar inverters require MPPT, grid-synchronization PLL, anti-islanding protection, and reactive power control, all under IEC 62116 and UL 1741 compliance constraints. The dual-core DSPIC33CH512MP506-I/MR partitions the work cleanly: the slave core runs the 16-32 kHz inverter control loop while the master handles the 50/60 Hz grid-synchronization PLL, MPPT algorithm, and CAN-FD or RS-485 communication to the data logger. The Functional Safety (FuSa) feature set is essential for grid-tied inverters that must meet IEC 62109 safety standards. Industrial temperature grade supports outdoor enclosure operation.
Recomendado
Functional Safety (IEC 61508) Industrial Control
The DSPIC33CH512MP506-I/MR's dual-core architecture with the Functional Safety (FuSa) feature set enables IEC 61508 SIL 2 and IEC 60730 Class B safety implementations for industrial machinery, elevators, and process control. The slave core can run lockstep with the master for diagnostic coverage, and dedicated hardware self-test routines cover the Flash, RAM, and clock subsystems. Combined with CAN-FD safety protocols (CANopen Safety, J1939), the device is suited to safety-critical distributed control systems. Industrial -40C to +85C operation supports typical control cabinet environments.
Recomendado
Automotive Auxiliary Motor Control
Automotive auxiliary loads (water pumps, oil pumps, HVAC blowers, e-compressors) increasingly use BLDC motors with FOC, requiring both functional safety (ISO 26262) and high efficiency. While the -I/MR is industrial-grade (-40C to +85C), the same silicon is used on automotive-grade QFN variants in the dsPIC33CH family. The DSPIC33CH512MP506-I/MR provides the same dual-core FOC architecture at industrial pricing for off-road vehicles, agricultural equipment, and two-wheelers where industrial temperature grade is sufficient. The CAN-FD interface integrates with vehicle body-domain controllers.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33CH512MP506-I/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33CH512MP506-E/PT | DSPIC33CH512MP206-I/MR | DSPIC33CH512MP506-I/PT |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin QFN (9x9 mm) | 64-pin TQFP (10x10 mm) - different footprint | 64-pin QFN (9x9 mm) - same footprint | 64-pin TQFP (10x10 mm) - different footprint |
| Flash Memory | 512 KB dual-partition | 512 KB dual-partition | 256 KB (-50%) | 512 KB dual-partition |
| Master Core Speed | 100 MIPS | 100 MIPS | 100 MIPS | 100 MIPS |
| Slave Core Speed | 90 MIPS | 90 MIPS | 90 MIPS | 90 MIPS |
| Operating Temperature | -40C to +85C (industrial) | -40C to +125C (extended) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| CAN-FD | Yes | Yes | Yes | Yes |
| High-Resolution PWM | Yes (250 ps) | Yes (250 ps) | Yes (250 ps) | Yes (250 ps) |
Principais diferenciais
- Dual-core architecture with shared memory (vs Single-core dsPIC33EP512MC506)
- 512 KB dual-partition Flash with live update (vs DSPIC33CH256MP206-I/MR)
- Functional Safety (FuSa) feature set (vs Standard dsPIC33CK64MC105)
- Industrial -40C to +85C temperature grade (vs DSPIC33CH512MP506-E/PT (extended -40C to +125C))
Notas de projeto
The QFN-64 package has an exposed thermal pad (EP) on the underside that must be soldered to a corresponding PCB land pattern to meet thermal specifications. Connect the EP to a clean analog or digital ground plane with at least 8 thermal vias (0.3 mm drill, 1 mm pitch) to provide both electrical connection and a heat dissipation path. Per Microchip AN1078 (QFN PCB layout), missing or insufficient EP soldering can raise junction temperature by 20-30 C in typical motor-control applications.
Place the 3.3V AVDD and VDD pins with separate decoupling networks: a 10 uF bulk capacitor, a 100 nF ceramic close to each VDD pin, and a 100 nF plus 10 nF pair close to each AVDD pin. According to the dsPIC33CH family datasheet, AVDD and VDD should ideally be driven from separate LDO regulators (or at least filtered separately) to prevent digital switching noise from coupling into the ADC measurements. For ADC sampling accuracy better than 1 LSB at 3.5 Msps, hold AVDD ripple below 10 mVpp.
When using the dual-core feature, always initialize the slave core from the master core's startup code before entering the application's main loop, and configure the MSI (Master Slave Interface) mailbox and semaphore peripherals before either core accesses shared memory. Per the dsPIC33CH Dual-Core Programming Guide, accessing shared peripherals (e.g., a single ADC or PWM generator used by both cores) without proper arbitration can cause data corruption or reset. Use the dedicated MSI1IRQ/S1MSIAIRQ interrupt lines rather than polling for inter-core messages.
For PWM signals driving high-current MOSFET or SiC gate drivers, place the dsPIC33CH as close as possible to the gate drivers and use controlled-impedance traces with series damping resistors (22-33 ohm) within 5 mm of the dsPIC pin. According to Microchip AN2390, traces longer than 25 mm should be treated as transmission lines. For switching nodes above 100 V/ns slew rate, keep the high-dV/dt loop area (drain-source-gate-driver-ground) below 1 cm^2 to minimize EMI.
Informações de conformidade
RoHS compliant per Microchip product page. Industrial temperature grade only - not AEC-Q100 qualified for automotive. For automotive applications, choose dsPIC33CH AEC-Q100 variants in the same family.
