DSPIC33EP128GM306-E/MR - 16-Bit DSC 60 MIPS 128KB | Microchip
N.º da peça: DSPIC33EP128GM306-E/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.85 | $6,85 |
| 10 | $6.3 | $63,00 |
| 100 | $5.75 | $575,00 |
| 500 | $5.3 | $2.650,00 |
| 1.000 | $4.95 | $4.950,00 |
DSPIC33EP128GM306-E/MR Visão geral
A digital signal controller combines the compute pipeline of a microcontroller with the mathematical acceleration of a DSP. In the power-management hierarchy of embedded systems, a DSC sits above general-purpose MCUs for control-loop-intensive tasks: it executes deterministic interrupt-driven control loops for digital power conversion, motor commutation, and sensor fusion while retaining the peripherals, interrupts, and I/O flexibility of a microcontroller.
Key features include the dsPIC33E CPU core with DSP engine (17-bit x 17-bit multiplier, 40-bit accumulator, dual operand fetch), multiple PWM modules, input capture and output compare channels, and quadrature encoder interface support, making the device well suited to precision motor control per the manufacturer product page. The GM subfamily adds controller area network peripherals for industrial connectivity.
Technically, the dsPIC33EP architecture supports fixed-point DSP instructions executing in single cycles at the 60 MIPS operating point reported by distributors, with a PLL-based clock system that allows operation from an internal or external oscillator. FLASH program memory of 128KB provides room for field-usable code such as field-oriented control (FOC) firmware, and the extended -E temperature grade qualifies the part for harsh industrial and automotive-adjacent environments.
Typical applications include brushless DC and PMSM motor drives, digital switched-mode power supplies and PFC stages, industrial automation nodes on CAN networks, and sensing/signal-processing systems requiring deterministic real-time response.
When designing with this device, connect every VDD and VSS pin pair and use any PGECx/PGEDx pair consistently for ICSP programming, as noted in Microchip programming documentation; a 10uF plus 0.1uF decoupling combination per supply pin group is standard practice.
This page synthesizes distributor pricing, same-footprint drop-in alternatives across the dsPIC33EP GM306 family, and practical design notes not found in the manufacturer datasheet, providing one-stop engineering reference value.
Alternativas drop-in para DSPIC33EP128GM306-E/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP128GM306-E/MR (mesmo formato e footprint) — diferindo em Package, Communication Interfaces, Core, Input Capture / Output Compare, Maximum CPU Speed.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP256GM306-E/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$5.35 / unidade
Ver ficha técnica →DSPIC33EP64GM306-E/MR
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP128GM306-I/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.1 / unidade
Ver ficha técnica →DSPIC33EP128GP306-E/MR
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP256GP306-E/MR
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP256GM706-E/MR
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP128GM306-E/MR Classificações máximas e características elétricas
| Core | dsPIC33E 16-bit DSC core |
| Performance | 60 MIPS |
| Program Memory | 128KB (43K x 24) FLASH |
| RAM | 16KB |
| Encapsulamento | 64-VQFN (9x9 mm), MR |
| Temperatura de operação | -40C to +125C (E grade) |
| Tensão de alimentação | 3.0 V to 3.6 V |
| Largura do barramento de dados | 16 bit |
| Instruction Width | 24 bit |
| DSP Engine | 17x17-bit multiplier, 40-bit accumulator |
| PWM Modules | Motor Control PWM (per datasheet family features) |
| Communication Interfaces | UART, SPI, I2C, CAN (GM subfamily) |
| Timers/Capture | Input Capture / Output Compare, QEI support |
| Tipo de montagem | Surface Mount |
| Programming Interface | ICSP via PGECx/PGEDx pairs |
| Technology | CMOS Flash |
Configuração de pinos do DSPIC33EP128GM306-E/MR
| Pino 1 | MCLR — Master clear reset (active low) / programming voltage input |
| Pino 2 | RA0 — General purpose I/O PORTA |
| Pino 3 | RA1 — General purpose I/O PORTA |
| Pino 4 | RA2 — General purpose I/O PORTA |
| Pino 5 | RA3 — General purpose I/O PORTA |
| Pino 6 | RA4 — General purpose I/O PORTA / oscillator function |
| Pino 7 | VDD — Power supply (3.0V to 3.6V) |
| Pino 8 | VSS — Ground reference |
| Pino 9 | RA7 — General purpose I/O PORTA |
| Pino 10 | RB0 — General purpose I/O / analog input |
| Pino 11 | RB1 — General purpose I/O / analog input |
| Pino 12 | RB2 — General purpose I/O / analog input |
| Pino 13 | RB3 — General purpose I/O / analog input |
| Pino 14 | VSS — Ground reference |
| Pino 15 | VDD — Power supply |
| Pino 16 | RB4 — General purpose I/O / analog input |
| Pino 17 | RB5 — General purpose I/O / analog input |
| Pino 18 | VSS — Ground reference (VSSCAP connection region) |
| Pino 19 | RB6 — General purpose I/O / PGEC programming clock |
| Pino 20 | RB7 — General purpose I/O / PGED programming data |
| Pino 21 | RB8 — General purpose I/O / analog input |
| Pino 22 | RB9 — General purpose I/O / analog input |
| Pino 23 | VDD — Power supply |
| Pino 24 | VSS — Ground reference |
| Pino 25 | RB10 — General purpose I/O / analog input |
| Pino 26 | RB11 — General purpose I/O / analog input |
| Pino 27 | RB12 — General purpose I/O / analog input |
| Pino 28 | RB13 — General purpose I/O / analog input |
| Pino 29 | VDD — Power supply |
| Pino 30 | VSS — Ground reference |
| Pino 31 | RB14 — General purpose I/O / analog input |
| Pino 32 | RB15 — General purpose I/O / analog input |
| Pino 33 | RC0 — General purpose I/O / remappable peripheral pin |
| Pino 34 | RC1 — General purpose I/O / secondary oscillator |
| Pino 35 | RC2 — General purpose I/O / remappable peripheral pin |
| Pino 36 | VSS — Ground reference |
| Pino 37 | VDD — Power supply |
| Pino 38 | RC3 — General purpose I/O / remappable peripheral pin |
| Pino 39 | RC4 — General purpose I/O / remappable peripheral pin |
| Pino 40 | RC5 — General purpose I/O / remappable peripheral pin |
| Pino 41 | RC6 — General purpose I/O / remappable peripheral pin |
| Pino 42 | RC7 — General purpose I/O / remappable peripheral pin |
| Pino 43 | VSS — Ground reference |
| Pino 44 | VDD — Power supply |
| Pino 45 | RC8 — General purpose I/O / remappable peripheral pin |
| Pino 46 | RC9 — General purpose I/O / remappable peripheral pin |
| Pino 47 | RD0 — General purpose I/O / remappable peripheral pin |
| Pino 48 | RD1 — General purpose I/O / remappable peripheral pin |
| Pino 49 | RD2 — General purpose I/O / remappable peripheral pin |
| Pino 50 | RD3 — General purpose I/O / remappable peripheral pin |
| Pino 51 | VDD — Power supply |
| Pino 52 | VSS — Ground reference |
| Pino 53 | RD4 — General purpose I/O / remappable peripheral pin |
| Pino 54 | RD5 — General purpose I/O / remappable peripheral pin |
| Pino 55 | RD6 — General purpose I/O / remappable peripheral pin |
| Pino 56 | RD7 — General purpose I/O / remappable peripheral pin |
| Pino 57 | VSS — Ground reference |
| Pino 58 | VDD — Power supply |
| Pino 59 | RE0 — General purpose I/O / remappable peripheral pin |
| Pino 60 | RE1 — General purpose I/O / remappable peripheral pin |
| Pino 61 | RE2 — General purpose I/O / remappable peripheral pin |
| Pino 62 | RE3 — General purpose I/O / remappable peripheral pin |
| Pino 63 | OSCI — Primary oscillator input |
| Pino 64 | OSCO — Primary oscillator output / RA3-class I/O |
Aplicações típicas
DSPIC33EP128GM306-E/MR é adequado para 6 aplicaçãos: Brushless DC and PMSM Motor Drives, Digital Power Conversion and PFC, Industrial Automation and CAN Networking Nodes, Robotics and Motion Control, Battery-Powered Portable Instruments, Sensor Signal Conditioning and Embedded Sensing.
Brushless DC and PMSM Motor Drives
The DSPIC33EP128GM306-E/MR fits motor control because its 60 MIPS DSP-accelerated core executes field-oriented control loops with deterministic interrupt latency, its motor-control PWM module generates complementary outputs with hardware dead-time insertion, and input capture/QEI channels process encoder or hall-sensor feedback at full speed. In a typical BLDC/PMSM drive the DSC closes the current loop in the tens of microseconds range, reads phase currents through its ADC, and drives a three-phase inverter bridge, while the 128KB FLASH holds FOC firmware plus communication stacks. The -40C to +125C grade survives drive-enclosure heat. Trade-off: at 60 MIPS it offers less headroom than dsPIC33CK 100 MIPS parts, but remains adequate for most industrial drives.
Recomendado
Digital Power Conversion and PFC
Switched-mode power supplies, PFC stages, and DC-DC converters benefit from the DSPIC33EP128GM306-E/MR's deterministic control-loop execution and PWM resolution. The dsPIC33E core runs voltage- and current-mode compensators sample-by-sample, while the PWM module provides the duty-cycle resolution needed for peak-current-mode control; input capture supports synchronized rectification schemes. Placed as the supervisory controller on a mid-power converter, it replaces analog control ICs with firmware, enabling programmable soft-start, adaptive dead time, and digital telemetry over its UART/SPI ports. The 16KB RAM holds control-state and protection data with margin. Design consideration: budget ADC sample-to-PWM-update latency to keep total control-loop delay within one switching period for stability.
Recomendado
Industrial Automation and CAN Networking Nodes
The GM subfamily's integrated CAN peripheral makes this DSC a strong fit for industrial fieldbus nodes, factory sensors, and actuator controllers that ride on a CAN network. The 60 MIPS core handles protocol stacks and local control concurrently, the 128KB FLASH accommodates bootloader plus application code with room for field upgrades, and the extended -40C to +125C rating covers cabinet and outdoor equipment environments. In a typical node the DSC reads sensors through its ADC, runs local closed-loop logic, and exchanges status and commands over CAN with upstream PLCs. Peripheral pin remapping lets you route UART/SPI/CAN functions to optimal physical pins, simplifying PCB layout in dense industrial boards with mixed analog and communication routing.
Recomendado
Robotics and Motion Control
Multi-axis robotics and motion platforms use the DSPIC33EP128GM306-E/MR for per-axis joint controllers where the quadrature encoder interface decodes high-resolution feedback and the PWM module drives servo drives. The 60 MIPS DSP engine performs inverse-kinematics-friendly fixed-point math and filtering at loop rates in the kilohertz range, while 16KB RAM buffers trajectory segments. The remappable pin architecture allows a single firmware image to serve multiple joint axes with different pin assignments, reducing firmware variants. The 128KB FLASH stores motion profiles, fieldbus protocol handling, and safety monitors. Engineering note: distribute VDD/VSS decoupling near the DSC and isolate PWM switching noise from encoder signal grounds to preserve feedback integrity in servo applications.
Recomendado
Battery-Powered Portable Instruments
Handheld test instruments, portable meters, and battery-operated data loggers leverage the DSC's combination of DSP math for signal processing and MCU-style peripherals for user interface and connectivity. Operating from a 3.0V to 3.6V rail, the device runs directly from a single lithium cell via an LDO, and its power-management features allow low-average-current operation by sleeping between sampling bursts and waking on interrupts. The 60 MIPS performance processes FFT and digital filtering on captured sensor data locally, reducing the data sent over its UART or SPI links. The 64-VQFN 9x9 mm footprint fits compact handheld PCBs. Consideration: for battery designs prefer the -I industrial grade if +125C ambient is not required, as it is commonly lower cost.
Recomendado
Sensor Signal Conditioning and Embedded Sensing
Precision sensing front ends use the DSPIC33EP128GM306-E/MR to digitize sensor outputs with its ADC and apply DSP corrections, calibration curves, and filtering in real time. The 40-bit accumulator and single-cycle multiplier support IIR/FIR filtering on fast sample streams at 60 MIPS, while 128KB FLASH retains multi-point calibration tables and multi-protocol output drivers (UART, SPI, I2C, CAN). Applications include pressure and flow transmitters, load-cell systems, and vibration monitors, where the -40C to +125C grade keeps calibration stable across the specified ambient range. The remappable peripheral pins let one PCB serve several product variants. Tip: oversample and average on-chip to improve effective resolution rather than adding an external high-resolution ADC unless the application truly needs 20+ bits.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP128GM306-E/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP256GM306-E/MR | DSPIC33EP64GM306-E/MR | DSPIC33EP128GP306-E/MR | DSPIC33EP128GM306-I/MR |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm, MR) | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| FLASH | 128KB | 256KB | 64KB | 128KB | 128KB |
| CAN Peripheral | Yes (GM subfamily) | Yes | Yes | No (GP subfamily) | Yes |
| Operating Temperature | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Drop-in Compatibility | Reference | Pin-to-pin, zero PCB change | Pin-to-pin, zero PCB change | Pin-to-pin, zero PCB change | Pin-to-pin, same die, temp grade only |
Principais diferenciais
- Extended -40C to +125C temperature grade at standard 60 MIPS performance (vs DSPIC33EP128GM306-I/MR)
- Integrated CAN connectivity within the same pinout (vs DSPIC33EP128GP306-E/MR)
- Field-upgrade headroom via pin-compatible 256KB sibling (vs DSPIC33EP256GM306-E/MR)
Notas de projeto
Connect every VDD pin to the 3.0V-3.6V rail and every VSS pin to ground; per Microchip programming documentation all VDD/VSS pins must be connected for reliable operation and ICSP. Decouple each VDD/VSS pair with 0.1uF ceramic placed within 2 mm of the pin, plus a 10uF bulk capacitor per board quadrant. In motor-drive designs with switching PWM, consider a small ferrite bead plus local bulk capacitance on the DSC supply island to suppress inverter switching transients coupling into the digital rail and ADC reference.
The 64-VQFN 9x9 mm package requires a well-designed exposed-land-pattern: use via arrays on the center thermal pad to ground for heat spreading and a solid return path. Keep the analog reference and ADC input traces away from PWM switching nets and CAN/UART stubs. Use peripheral pin remapping (RPx) to route PWM outputs toward the gate-driver side of the board and communication pins toward the connector edge, minimizing crossovers and ground-loop area in dense industrial layouts.
For ICSP programming, use any PGECx/PGEDx pair but never mix pairs: if PGEC2 carries ICSPCLK, ICSPDAT must be on PGED2, per Microchip programming documentation (Northern Software dsPIC33EP128GM306 support notes). MCLR needs a 10k pull-up for reliable debug. Keep the oscillator circuit traces short with guard ground. Finally, remember this is a 3.3V device: 5V peripherals require level shifting. Budget control-loop latency (ADC sampling to PWM update) within one switching period to avoid instability in digital power designs.
Informações de conformidade
RoHS/REACH/lead-free status not explicitly stated in retrieved distributor data; request Microchip Material Declaration documentation to confirm.
