DSPIC33EP128GS702-I/MM - 16-bit DSC 70 MIPS 128KB Flash QFN-28 | Microchip
N.º da peça: DSPIC33EP128GS702-I/MM ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5.38 | $5,38 |
| 10 | $5.12 | $51,20 |
| 100 | $4.78 | $478,00 |
| 500 | $4.52 | $2.260,00 |
| 1.000 | $4.25 | $4.250,00 |
DSPIC33EP128GS702-I/MM Visão geral
A digital signal controller combines the computational strengths of a microcontroller with the math acceleration of a digital signal processor. Within the power-management hierarchy, the dsPIC33EP GS family sits at the application layer of digital switch-mode power conversion, replacing analog control loops with firmware-executed PID and multi-loop control. The dsPIC33EP core, DSP engine, and high-resolution PWM peripherals form the chain that makes software-defined SMPS possible.
Key differentiating features include the 70 MIPS dsPIC DSC core with integrated DSP instruction set, dual-partition Flash supporting live firmware updates without halting power conversion, and an advanced analog subsystem and high-resolution PWM designed for multi-loop control. The industrial temperature grade (-40C to +85C) and AEC-Q100 listing reported by distributors extend its reach into automotive and harsh industrial environments.
Architecturally, the device integrates the dsPIC33EP GS engine optimized for digital power: the DSP engine executes MAC-class operations alongside the control firmware, while dedicated PWM modules provide the resolution and dead-time control needed for peak-current-mode and voltage-mode converters. On-chip peripherals reduce external component count in AC/DC and DC/DC designs.
Typical applications include multi-loop SMPS control, AC/DC power supplies, digital power-conversion front ends, power factor correction stages, and embedded motor-drive control where deterministic 16-bit control at 70 MIPS is required. The compact 6x6 mm QFN suits space-constrained converter boards.
A key design consideration is supply integrity: the 3.0-3.6 V core supply demands tight decoupling and careful analog/digital ground partitioning to preserve ADC accuracy in noisy converter environments.
This page synthesizes distributor pricing, verified drop-in alternatives, and practical design guidance not found together in the manufacturer datasheet.
Alternativas drop-in para DSPIC33EP128GS702-I/MM — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP128GS702-I/MM (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Core, Functional Safety Support, Product Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP64GS702-I/MM
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP32GS702-I/MM
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP128GS706-I/MM
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP128GS702T-I/MM
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.95 / unidade
Ver ficha técnica →DSPIC33EP128GS702-I/MM Classificações máximas e características elétricas
| Core | dsPIC33EP 16-bit DSC |
| CPU Speed | 70 MIPS |
| Flash Memory | 128 KB (43K x 24), dual-partition with live update |
| RAM | 8 KB |
| Operating Voltage | 3.3 V |
| Encapsulamento | 28-QFN-S (6x6 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (I grade) |
| Qualification | AEC-Q100 (per Newark listing) |
| Product Family | dsPIC33EP GS (SMPS & Digital Power Conversion) |
| Application Focus | Multi-loop SMPS, digital power conversion |
| Functional Safety Support | Yes (FuSa classification per Microchip USA) |
| Largura do barramento de dados | 16 bit |
| Program Memory Type | Flash |
Guia de Configuração de Pinos do DSPIC33EP128GS702-I/MM 28-qfn-s (6x6 mm)
Configuração de pinos para DSPIC33EP128GS702-I/MM (pacote 28-qfn-s (6x6 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33EP128GS702-I/MM.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33EP128GS702-I/MM é adequado para 6 aplicaçãos: Digital SMPS Control, AC/DC Power Supplies, Power Factor Correction, Digital Lighting and LED Drivers, Motor Drive Control, Embedded Industrial Control.
Digital SMPS Control
The DSPIC33EP128GS702-I/MM is purpose-built for multi-loop digital switch-mode power supply control. According to Microchip, the dsPIC33EPXXGS70X/80X family supports common multi-loop SMPS topologies including AC/DC converters. The 70 MIPS core executes PID compensation and supervisory logic while the DSP engine handles filtering, and the dedicated PWM modules provide the resolution and dead-time granularity required for peak-current-mode control. Placing the DSC in the control loop replaces analog error amplifiers with firmware, enabling adaptive compensation across line and load conditions - a trade-off of slightly higher control-loop latency versus analog in exchange for full programmability.
Recomendado
AC/DC Power Supplies
In offline AC/DC supplies, the DSPIC33EP128GS702-I/MM implements PFC plus main converter control in a single 3.3 V controller. The 128 KB dual-partition Flash with live update capability allows firmware servicing of a fielded supply without interrupting power delivery - critical for server and telecom front ends. The 70 MIPS execution rate provides sufficient bandwidth for both the PFC loop and DC/DC stage within one scheduling cycle. Compact 6x6 mm QFN packaging fits the controller section of dense power boards, and the -40C to +85C industrial grade withstands elevated ambient temperatures inside sealed power enclosures.
Recomendado
Power Factor Correction
The DSPIC33EP128GS702-I/MM suits continuous-conduction-mode boost PFC stages where high-resolution PWM and fast ADC sampling shape input current sinusoidally. The DSP engine accelerates the multiply-accumulate operations of current-shaping algorithms, while the 16-bit core manages housekeeping, telemetry, and protection. Firmware-based PFC enables adaptive switching between operating modes to maintain efficiency at light load. The integrated high-precision analog subsystem samples input voltage and inductor current each switching cycle; designers should budget loop latency against switching frequency - at typical 65-100 kHz PFC frequencies, the 70 MIPS controller executes compensation well within one switching period.
Recomendado
Digital Lighting and LED Drivers
Firmware-controlled LED drivers benefit from the DSPIC33EP128GS702-I/MM's combination of high-resolution PWM for precise dimming and a DSP engine for smooth current regulation. Dimming resolution and flicker performance depend directly on PWM granularity, which the GS family's power-conversion-oriented PWM modules address. The 128 KB Flash accommodates communication protocols (DALI, DMX-class schemes) alongside the control loop - memory headroom that smaller 32-64 KB variants may not offer. The industrial temperature grade and AEC-Q100 qualification reported by distributors support LED drivers in outdoor signage and automotive lighting where ambient swings stress the controller.
Recomendado
Motor Drive Control
The DSPIC33EP128GS702-I/MM executes field-oriented control (FOC) of BLDC and PMSM motors: the DSP engine performs the Clarke/Park transforms and PI current loops at 70 MIPS, while complementary PWM outputs with dead-time control drive the inverter stage. The 8 KB RAM holds current-loop state plus position-observer variables. Using a DSC instead of a generic MCU keeps the current loop deterministic - a benefit quantified by executing a full FOC iteration within tens of microseconds at 70 MIPS. The 28-QFN package suits compact integrated motor-drive boards where controller real estate is limited.
Recomendado
Embedded Industrial Control
Beyond power conversion, the DSPIC33EP128GS702-I/MM serves general 16-bit embedded control requiring DSP-class math: sensor conditioning, digital filtering, and closed-loop process control. The AEC-Q100 qualification listed by Newark and the -40C to +85C range cover industrial floor and light-automotive environments. Dual-partition Flash enables field firmware updates with rollback safety, valuable for remotely deployed controllers. Compared with a PIC16-class MCU, the 70 MIPS DSC core runs compensation and filtering algorithms an order of magnitude faster, allowing higher sample rates or more complex algorithms within the same interrupt budget, at modestly higher cost per unit.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP128GS702-I/MM — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP64GS702-I/MM | DSPIC33EP32GS702-I/MM | DSPIC33EP128GS706-I/MM |
|---|---|---|---|---|
| Package | 28-QFN-S (6x6) | 28-QFN-S (6x6) - same | 28-QFN-S (6x6) - same | 28-QFN-S (6x6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 128 KB (43K x 24) | 64 KB | 32 KB | 128 KB |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Core | dsPIC33EP 16-bit DSC | dsPIC33EP 16-bit DSC | dsPIC33EP 16-bit DSC | dsPIC33EP 16-bit DSC |
| Temperature Grade | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
Principais diferenciais
- Largest program memory in 28-pin GS702 subfamily (vs DSPIC33EP64GS702-I/MM)
- Lowest-cost entry point of the same family (vs DSPIC33EP32GS702-I/MM)
- Digital-power-optimized peripheral allocation (vs DSPIC33EP128GS706-I/MM)
Notas de projeto
The 28-QFN-S (6x6) exposed thermal pad must be soldered to a solid ground plane with a via array for heat dissipation and low-inductance return path. Place 0.1 uF ceramic decoupling capacitors on each VDD pin within 3 mm of the pad, plus one bulk 4.7-10 uF capacitor per supply rail. Follow Microchip's family datasheet PCB layout guidelines for QFN-U packages; inadequate thermal-pad soldering is the most common cause of intermittent resets in QFN dsPIC designs.
The device operates from a 3.3 V supply; regulators feeding it should maintain the core operating window under all load transients of the power-conversion system. Estimated: a DSC at 70 MIPS drawing tens of mA core current plus peripheral load typically requires an LDO or buck rated at 150-250 mA with margin. Use a low-noise regulator for analog supply domains if ADC accuracy is critical to the control loop; shared supply ripple directly degrades converter-loop measurement quality.
Mouser lists this part as non-stocked with a 6-week lead time, so production schedules must account for replenishment delay; qualify the pin-compatible DSPIC33EP64GS702-I/MM as a backup. Additionally, review the 'dsPIC33EPXXXGS70X/80X Family Silicon Errata and Data Sheet Clarification' document referenced by Microchip before finalizing firmware - early family silicon revisions carry functional clarifications that affect peripheral behavior. Do not reuse pinout diagrams from sibling GS devices without verifying the GS702-specific pin function table.
Informações de conformidade
Newark's product listing identifies the DSPIC33EP128GS702-I/MM as AEC-Q100 qualified (16-bit DSC, 128 KB). RoHS, REACH, lead-free, halogen-free, and conflict-minerals statuses were not stated in the provided verified data.
