DSPIC33EP16GS502T-I/2N - 70MIPS 16KB Digital Power DSC | Microchip
N.º da peça: DSPIC33EP16GS502T-I/2N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.2 | $4,20 |
| 10 | $3.78 | $37,80 |
| 100 | $3.35 | $335,00 |
| 500 | $3.02 | $1.510,00 |
| 1.000 | $2.71 | $2.710,00 |
DSPIC33EP16GS502T-I/2N Visão geral
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and deterministic control of a microcontroller. Within the power-management hierarchy, a DSC sits between a general-purpose MCU and a dedicated power-supply ASIC, closing high-bandwidth control loops for switch-mode converters that a standard MCU cannot handle. The dsPIC33EP16GS502 belongs to the dsPIC33EPXXGS50X family, a product line Microchip specifically engineered for switch-mode power supplies and power-conversion systems.
Key differentiating features include an interconnected high-speed PWM module, an ADC, programmable gain amplifiers (PGA), and on-chip comparators, all tightly coupled so that analog-to-PWM loop latency is minimized. The device operates at 3.3V and is designated as Functional Safety (FuSa) capable by Microchip, supporting safety-oriented power designs. The industrial temperature rating (-I suffix, -40C to +85C) covers most industrial and telecom power environments.
Technically, the high-speed PWM architecture supports the complementary, push-pull, and phase-shifted topologies common in digital power, while the PGA and comparators enable fast cycle-by-cycle current limiting without external components. Microchip reference designs, such as the Interleaved Power Factor Correction design producing a single high-voltage DC output up to 350W from a universal AC input, demonstrate the family's fitness for demanding conversion tasks.
Typical applications include AC-DC and DC-DC power supplies, PFC stages, LLC and half-bridge converters, solar micro-inverters, LED drivers, and battery chargers - anywhere a 70 MIPS control core with integrated analog is required.
When designing with this device, budget loop bandwidth against PWM resolution and verify ADC sampling timing against the switching frequency to guarantee stable current-mode control.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with pricing verified as of 2026-09-24.
Alternativas drop-in para DSPIC33EP16GS502T-I/2N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP16GS502T-I/2N (mesmo formato e footprint) — diferindo em Package, Application Optimization, Core Architecture, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP16GS502-I/2N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33EP16GS502T-E/2N
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →DSPIC33EP64GS502T-I/2N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.12 / unidade
Ver ficha técnica →DSPIC33EP32GS502T-I/2N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP16GS502T-I/MF
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP16GS502T-I/2N Classificações máximas e características elétricas
| Core Architecture | 16-bit dsPIC DSC |
| Maximum CPU Speed | 70 MIPS |
| FLASH Memory | 16 KB (16K x 8) |
| Tensão de alimentação | 3.3 V |
| Encapsulamento | 28-UQFN (6x6 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Family | dsPIC33EP (dsPIC33EPXXGS50X) |
| Application Optimization | Digital power (SMPS) |
| High-Speed PWM | Yes, interconnected |
| ADC | Yes, on-chip |
| Amplificador de ganho programável (PGA) | Yes, on-chip |
| Comparators | Yes, on-chip |
| Functional Safety | FuSa designated |
| Temperatura de operação | -40C to +85C (I grade) |
| In-Circuit Programming | ICSP via MPLAB SNAP |
Guia de Configuração de Pinos do DSPIC33EP16GS502T-I/2N 28-uqfn (6x6 mm) with exposed pad
Configuração de pinos para DSPIC33EP16GS502T-I/2N (pacote 28-uqfn (6x6 mm) with exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33EP16GS502T-I/2N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33EP16GS502T-I/2N é adequado para 6 aplicaçãos: AC-DC Digital Power Supplies, Power Factor Correction (PFC), DC-DC Converters and Point-of-Load Regulation, Solar Micro-Inverters, LED Drivers and Lighting Ballasts, Battery Chargers and BMS Front-End Control.
AC-DC Digital Power Supplies
The DSPIC33EP16GS502T-I/2N is purpose-built for switch-mode power supply control: its interconnected high-speed PWM, fast ADC, and on-chip comparators close voltage- and current-mode loops with minimal latency, enabling high control bandwidth at switching frequencies well above what a general-purpose MCU can serve. In an AC-DC converter, the DSC runs the outer voltage loop and inner current loop digitally, supporting topologies such as flyback, forward, and LLC with adaptive dead-time and cycle-by-cycle current limiting handled in hardware via the comparators. The 70 MIPS core leaves headroom for soft-start, compensation, and housekeeping tasks on the same silicon. The 3.3V supply and 28-UQFN 6x6 footprint keep the controller compact near the power stage, while the industrial -40C to +85C rating covers typical enclosed PSU environments.
Recomendado
Power Factor Correction (PFC)
Power factor correction demands a fast current-shaping loop synchronized to the rectified line, and the DSPIC33EP16GS502T-I/2N fits this role directly. Microchip's own Interleaved PFC reference design, built on the SMPS dsPIC DSC family, operates from a universal AC input and produces a single high-voltage DC output up to 350W, demonstrating the architecture's capability end-to-end. The interconnected PWM/ADC path samples inductor current each switching cycle, while the on-chip PGA amplifies shunt signals without external op-amps, reducing BOM cost. The comparators provide hardware overcurrent protection with microsecond-class response, independent of software latency. With 16KB FLASH, an interleaved single-channel PFC compensator and housekeeping code fit comfortably; designers needing dual-interleaved phases with advanced averaging can step to the footprint-compatible 64KB variant without PCB changes.
Recomendado
DC-DC Converters and Point-of-Load Regulation
For telecom and industrial DC-DC bricks and point-of-load converters, the DSPIC33EP16GS502T-I/2N provides digital control with full configurability of compensation, sequencing, and fault handling. The 70 MIPS core executes proportional-integral loops at switching frequencies into the hundreds of kilohertz, while the high-speed PWM supports complementary outputs with programmable dead time for synchronous buck and boost stages. The integrated ADC with PGA reads output voltage and current Sense signals directly, and the comparators implement fast hiccup or latch-off protection. Digital control enables telemetry and adaptive tuning that analog controllers cannot offer. The 28-UQFN exposed-pad package provides low thermal impedance to the PCB, and the 3.3V rail simplifies integration with logic-level systems.
Recomendado
Solar Micro-Inverters
Solar micro-inverters combine MPPT, DC-AC conversion, and grid synchronization in a thermally constrained outdoor enclosure, a workload well matched to the DSPIC33EP16GS502T-I/2N. The 70 MIPS DSP core executes MPPT algorithms and sinusoidal reference generation, while the interconnected high-speed PWM drives the power stage with precise phase control. The ADC and PGA digitize panel voltage/current and grid feedback, and on-chip comparators guard against overcurrent faults without external protection ICs. The -40C to +85C industrial rating accommodates rooftop temperature swings, and the compact 6x6 UQFN fits dense inverter boards. For designs requiring more code for grid-certification firmware and communication, the same-footprint 32KB and 64KB family variants allow a memory upgrade with zero PCB rework.
Recomendado
LED Drivers and Lighting Ballasts
High-power LED drivers require precise current regulation, dimming control, and fault protection, all of which the DSPIC33EP16GS502T-I/2N delivers in a single compact device. The high-speed PWM generates both the main conversion switching and independent dimming channels with fine resolution, supporting PWM and analog dimming schemes. The ADC with PGA reads LED current from low-value shunts, and the comparators trigger fast short-circuit protection critical for LED string reliability. Running the control loop digitally allows temperature-derating curves and flicker-free dimming algorithms to be implemented in firmware and updated in the field via ICSP. The 3.3V, 28-UQFN 6x6 package suits compact luminaire driver boards, and the industrial temperature grade handles enclosed fixture environments.
Recomendado
Battery Chargers and BMS Front-End Control
Smart battery chargers benefit from the DSPIC33EP16GS502T-I/2N's blend of digital control flexibility and integrated analog. The 70 MIPS core executes CC/CV charging profiles, temperature-based derating, and termination logic in firmware, while the high-speed PWM with programmable dead time controls synchronous buck charging stages efficiently. The on-chip ADC and PGA monitor battery voltage, current, and NTC temperature with adequate resolution for coulomb-style supervision, and the comparators provide hardware-level overcurrent and reverse-polarity protection paths that respond faster than software. The Functional Safety (FuSa) family designation supports charger designs targeting safety-assessed systems. The compact 28-UQFN package and industrial temperature range fit both portable and stationary charger hardware.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP16GS502T-I/2N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP16GS502-I/2N | DSPIC33EP16GS502T-E/2N | DSPIC33EP64GS502T-I/2N | DSPIC33EP32GS502T-I/2N |
|---|---|---|---|---|---|
| Package | 28-UQFN (6x6) EP | 28-UQFN (6x6) EP - same | 28-UQFN (6x6) EP - same | 28-UQFN (6x6) EP - same | 28-UQFN (6x6) EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| FLASH Memory | 16 KB | 16 KB | 16 KB | 64 KB | 32 KB |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) |
| Digital Power Peripherals (PWM/ADC/PGA/Comparators) | Yes, interconnected | Yes, interconnected | Yes, interconnected | Yes, interconnected | Yes, interconnected |
| Delivery Format | Tape & Reel | Tube / Tray | Tape & Reel | Tape & Reel | Tape & Reel |
Principais diferenciais
- Digital-power-optimized peripheral set (vs DSPIC33EP128GP502-H/SO)
- Extended temperature option in identical footprint (vs DSPIC33EP16GS502T-E/2N)
- Flash headroom upgrade path (vs DSPIC33EP64GS502T-I/2N)
Notas de projeto
The 28-UQFN (6x6) exposed pad is the primary ground and thermal path. Solder the exposed pad to a grounded copper pour with an array of thermal vias (typically 4x4, 0.3 mm drill filled or plugged) to keep junction temperature low in power-supply enclosures. Per the family datasheet (70005127d.pdf), follow Microchip's recommended land pattern; deviating via counts under the pad measurably raises theta_JA and can push the -I grade part beyond +85C ambient in sealed adapters.
Decouple the 3.3V supply with a 0.1 uF ceramic capacitor at each VDD pin plus a 4.7 uF to 10 uF bulk capacitor, placed within 2 mm of the pins. Digital power controllers switch the PWM outputs at high edge rates, so ground bounce on VSS can corrupt ADC readings - use a solid ground plane connected through the exposed pad and separate the analog sense routing from PWM return currents. Follow Microchip's SMPS reference design layout (Interleaved PFC design) for a proven pattern.
Use the MPLAB SNAP programmer's 8-pin SIL ICSP connection, which consumes two device I/O pins plus MCLR. Reserve these pins on your PCB and add a series resistor on MCLR (per Microchip programming spec) if the application drives it externally. Do not swap the -I and -E grades arbitrarily: if your thermal estimate shows junction temperature above 85C, order the DSPIC33EP16GS502T-E/2N instead, since the same footprint accepts either grade without redesign.
When routing ADC sense lines from shunt resistors to the PGA inputs, use Kelvin connections at the shunt and keep differential traces short and paired. Fast PWM edges couple into high-impedance sense nodes; a small RC filter (e.g., 100 ohm / 1 nF, chosen within your ADC sampling budget) ahead of the pins reduces aliasing at high switching frequencies. Estimated filter values - verify against your loop bandwidth requirement and the ADC acquisition time in the family datasheet.
Informações de conformidade
Part is standard Microchip current production (RoHS/lead-free platform). Obtain formal REACH/halogen-free declarations from Microchip product page or distributor compliance documents.
