DSPIC33EP64GS502T-I/2N - 70MIPS 64KB Flash DSC | Microchip
N.º da peça: DSPIC33EP64GS502T-I/2N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.62 | $4,62 |
| 10 | $4.21 | $42,10 |
| 100 | $3.85 | $385,00 |
| 500 | $3.48 | $1.740,00 |
| 1.000 | $3.12 | $3.120,00 |
DSPIC33EP64GS502T-I/2N Visão geral
A digital signal controller (DSC) combines the compute throughput of a digital signal processor with the peripheral set and ease of use of a microcontroller. Within the power-management hierarchy, a DSC sits at the heart of closed-loop digital control systems, replacing analog control loops in power supplies, chargers, and motor drives with firmware-defined control laws.
Key features of the DSPIC33EP64GS502 include 70 MIPS execution at 3.3V, dual-partition flash architecture supporting live firmware updates, high-resolution PWM peripherals for precise power-stage switching, and a 12-bit ADC with simultaneous multi-channel sampling suited to multi-loop control. The device is engineered specifically for digital power applications such as AC-DC converters, power factor correction (PFC), and DC-DC conversion.
Technically, the dsPIC33E core provides DSP-style multiply-accumulate (MAC) instructions and hardware division, allowing Proportional-Integral-Derivative (PID) and 3P3Z compensator loops to execute deterministically at high control frequencies. The GS50X family adds high-resolution PWM with fine edge placement, enabling topologies such as LLC, phase-shifted full bridge, and interleaved converters.
Typical applications include digital switch-mode power supplies, interleaved PFC front ends (Microchip offers a 350W interleaved PFC reference design based on this family), automotive power conversion, LED drivers, and battery charging systems.
A key design consideration: the dual-partition memory can be used either as a single 64KB block or split into two bootable 32KB partitions for field-safe firmware updates; choose the partitioning scheme early since it affects bootloader design. Ensure proper decoupling and a solid exposed-pad ground connection for noise immunity in power applications.
This page synthesizes distributor pricing, drop-in alternatives, design notes, and application guidance not found in a single manufacturer datasheet.
Alternativas drop-in para DSPIC33EP64GS502T-I/2N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP64GS502T-I/2N (mesmo formato e footprint) — diferindo em Core Architecture, Package, Maximum CPU Speed, Operating Temperature, Packaging.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP64GS502-I/2N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33EP64GS502T-E/2N
✅ Drop-In✓ Em estoque
$3.73 / unidade
Ver ficha técnica →DSPIC33EP32GS502T-I/2N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP32GS502-I/2N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.19 / unidade
Ver ficha técnica →DSPIC33EP64GS506T-I/2N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP64GS502T-I/2N Classificações máximas e características elétricas
| Core Architecture | 16-bit dsPIC33EP RISC with DSP engine |
| Maximum CPU Speed | 70 MIPS |
| Program Memory (FLASH) | 64KB (64K x 8) |
| Operating Voltage | 3.3 V |
| Encapsulamento | 28-UQFN (6x6 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Product Family | dsPIC33EPXXGS50X SMPS / Digital Power DSC |
| Functional Safety Support | Yes (FuSa) |
| Memory Architecture | Dual-partition (bootable) or single partition |
| Target Application Class | Digital power conversion / SMPS |
Guia de Configuração de Pinos do DSPIC33EP64GS502T-I/2N 28-uqfn (6x6 mm) with exposed pad
Configuração de pinos para DSPIC33EP64GS502T-I/2N (pacote 28-uqfn (6x6 mm) with exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33EP64GS502T-I/2N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33EP64GS502T-I/2N é adequado para 6 aplicaçãos: Digital Switch-Mode Power Supplies (SMPS), Interleaved Power Factor Correction (PFC), AC-DC and LLC Resonant Converters, Automotive Power Conversion, Digital LED Drivers, Battery Charging Systems.
Digital Switch-Mode Power Supplies (SMPS)
The DSPIC33EP64GS502T-I/2N fits digital SMPS control directly because Microchip engineered the dsPIC33EPXXGS50X family for multi-loop digital switch-mode power conversion. Its 70 MIPS 16-bit DSP core executes PID or 3P3Z compensators deterministically at control frequencies well above audibility, while the high-resolution PWM module produces fine-edge gate signals for buck, boost, flyback, and half-bridge topologies. In a typical implementation the DSC samples output voltage and inductor current with its fast ADC, computes the control law each switching cycle, and updates the PWM duty cycle, replacing analog error amplifiers entirely. Unlike analog control, gains and protection thresholds are firmware-tunable, enabling one hardware platform to serve multiple power ratings. Trade-off: firmware development and compensator design effort replaces analog BOM cost.
Recomendado
Interleaved Power Factor Correction (PFC)
Interleaved PFC is a flagship application for this device: Microchip publishes a 350W interleaved PFC reference design built on the dsPIC33EPXXGS50X family, operating from universal AC input to a high-voltage DC output. The DSPIC33EP64GS502T-I/2N controls two parallel boost phases 180 degrees out of phase, which halves input ripple current and reduces EMI filter size compared with single-phase PFC. The 70 MIPS core handles the outer voltage loop, two inner current loops, and input-voltage feedforward within each switching period, while the high-resolution PWM delivers the phase-shifted interleaved gate waveforms. The fast ADC synchronizes current sampling to the PWM midpoint to avoid switching noise, improving THD. Performance consideration: cycle-by-cycle overcurrent protection and brown-out handling must be implemented in firmware and verified against line-transient tests.
Recomendado
AC-DC and LLC Resonant Converters
For AC-DC adapters, server power supplies, and LLC resonant converters, the DSPIC33EP64GS502T-I/2N provides the variable-frequency, phase-shifted control that resonant topologies demand. The high-resolution PWM stages generate complementary outputs with programmable dead time and frequency modulation, which is essential for regulating an LLC across load range while staying near resonance to preserve efficiency. The 70 MIPS core runs the voltage-mode control loop plus burst-mode and protection state machines, and the dual-partition flash allows a firmware update - for example, retuning the gain schedule for a new adapter model - without bricking the unit in the field. According to Microchip, the GS50X peripherals were selected specifically for digital power front ends. Design note: verify dead-time resolution limits against the target switching frequency before finalizing the power stage.
Recomendado
Automotive Power Conversion
The gsPIC GS502 family serves automotive power subsystems such as on-board chargers, DC-DC converters (12V to 48V), and LED headlamp drivers. For these programs, specify the DSPIC33EP64GS502T-E/2N variant, which is the same die in the same 28-UQFN package but AEC-Q100 qualified per datasheets.com data, allowing a drop-in migration on the identical PCB footprint once extended-temperature validation is complete. The 70 MIPS controller closes current loops for constant-current LED driving or battery charging profiles, with firmware-implemented fault handling for open-load, short-circuit, and over-temperature conditions. The exposed-pad UQFN package provides a low-inductance ground reference important for switching-noise immunity in the vehicle environment. Trade-off: automotive qualification documentation (PPAP) must be requested through Microchip distribution channels.
Recomendado
Digital LED Drivers
High-brightness and intelligent LED lighting benefits from the DSPIC33EP64GS502T-I/2N's combination of precise PWM and computation. The high-resolution PWM generates dimming and switching waveforms with fine granularity, enabling flicker-free deep dimming and controlled slew for EMI compliance, while the 70 MIPS core implements constant-current regulation, temperature derating curves, and communication protocols (DALI/DMX-style firmware) on one chip. Compared with a dedicated analog LED driver IC, the DSC approach allows multi-channel color mixing, adaptive dimming schedules, and field firmware updates via the dual-partition flash - key for tunable-white and RGBW luminaires. The fast ADC samples current sense signals synchronized to PWM to keep average current regulation accurate across duty range. Cost trade-off: higher unit price than fixed-function drivers, justified where intelligence and flexibility add value.
Recomendado
Battery Charging Systems
Multi-chemistry battery chargers - for e-mobility, tools, and energy storage - map well onto the DSPIC33EP64GS502T-I/2N. The controller executes CC/CV/cycle charging state machines, coulomb-style capacity estimation, and safety supervision in firmware, while the high-resolution PWM regulates the power-conversion stage (typically buck, boost, or synchronous buck) with precise current loops at 70 MIPS. The ADC samples battery voltage, current, and temperature each cycle, supporting JEITA-style thermal charging profiles implemented purely in software. Because the dsPIC33EPXXGS50X was designed for digital power, the control-loop latency is deterministic, which matters for cycle-by-cycle current limiting during charge transitions. The dual-partition flash lets manufacturers ship charging-profile updates to accommodate new cell types without hardware revision, protecting the investment across product generations.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP64GS502T-I/2N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP64GS502-I/2N | DSPIC33EP64GS502T-E/2N | DSPIC33EP32GS502T-I/2N | DSPIC33EP64GS506T-I/2N |
|---|---|---|---|---|---|
| Package | 28-UQFN (6x6 mm) EP | 28-UQFN (6x6 mm) EP - same | 28-UQFN (6x6 mm) EP - same | 28-UQFN (6x6 mm) EP - same | 28-UQFN (6x6 mm) EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| FLASH Memory | 64KB (64K x 8) | 64KB (64K x 8) | 64KB (64K x 8) | 32KB (-50%) | 64KB (64K x 8) |
| Core Architecture | 16-bit dsPIC33EP with DSP engine | 16-bit dsPIC33EP | 16-bit dsPIC33EP | 16-bit dsPIC33EP | 16-bit dsPIC33EP |
| Temperature Grade | Industrial (-I) | Industrial (-I) | Extended / AEC-Q100 automotive (-E) | Industrial (-I) | Industrial (-I) |
| Packaging Format | Tape & Reel (T) | Tray/Tube (no T suffix) | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) |
| Dual-Partition Flash Boot | Yes | Yes | Yes | Limited (32KB total) | Yes |
| Application Optimization | SMPS / digital power (FuSa support) | SMPS / digital power (FuSa support) | SMPS / digital power (automotive) | SMPS / digital power | SMPS / digital power, extended peripherals |
Principais diferenciais
- Dual-partition bootable flash for live field updates (vs DSPIC33EP32GS502T-I/2N)
- AEC-Q100 qualified automotive option on the same footprint (vs DSPIC33EP64GS502T-E/2N)
- Digital-power-specific peripherals vs general-purpose dsPIC33EP (vs DSPIC33EP64GP502 (GP family))
- FuSa (Functional Safety) development support (vs DSPIC33EP32GS502T-I/2N)
Notas de projeto
Solder the exposed pad of the 28-UQFN to a contiguous ground pour with multiple thermal vias. In digital power applications the DSC sits beside noisy switching stages; a solid ground reference reduces ground bounce on ADC measurements and PWM edges. Use the Microchip UQFN landing-pattern recommendation and verify stencil aperture design for the center pad to avoid voiding - voids under the exposed pad degrade both thermal performance and ground impedance, which shows up as ADC noise in current-loop feedback.
Sample ADC channels synchronized to the PWM period, not free-running. The dsPIC33EP GS502 allows the ADC to be triggered by the PWM module at the midpoint or trough of the switching ramp, when the power stage is quiet. Free-running sampling picks up switching spikes that corrupt current-loop feedback and cause jitter in the compensator output. Place the current-sense shunt close to the power ground return and use a differential or filtered single-ended path into the ADC pins, with a small RC (e.g., 100 ohm / 1 nF, estimated values to tune per your sense circuit) anti-alias filter.
Decide the flash partitioning scheme at project start. The DSPIC33EP64GS502 can run as one unpartitioned 64KB block (0x000000-0x00AFEF range per family documentation) or as two equal bootable 32KB partitions for live field updates. Migrating between modes later affects linker scripts, bootloader placement, and reset vector handling. Also: the T (tape-and-reel) and non-T parts are the same die - do not dual-source layout assumptions on package code alone; always check the full suffix including temperature grade and package (2N = UQFN 6x6).
Decouple the 3.3V rail locally with 0.1 uF ceramic on each supply pin pair plus 4.7-10 uF bulk (estimated values, per standard Microchip layout guidance for dsPIC33EP devices). The 70 MIPS core draws current in fast bursts correlated with instruction fetch; local decoupling prevents rail droop that can reset the device during high-load firmware loops. If the DSC shares its rail with gate-driver circuitry, add an LC filter or a small LDO between them so gate-charge transients do not modulate the analog supply.
Informações de conformidade
The -I/2N industrial variant is not the automotive offering; per datasheets.com data, the related -E/2N variant is documented as AEC-Q100 qualified. RoHS/REACH/lead-free status for this exact orderable code must be confirmed from Microchip's official product page compliance documents.
