DSPIC33EP16GS504T-I/ML - 70MIPS 16KB DSC for Digital Power | Microchip
N.º da peça: DSPIC33EP16GS504T-I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.55 | $3,55 |
| 10 | $3.32 | $33,20 |
| 100 | $3.05 | $305,00 |
| 500 | $2.8 | $1.400,00 |
| 1.000 | $2.55 | $2.550,00 |
DSPIC33EP16GS504T-I/ML Visão geral
A digital signal controller combines the compute throughput of a DSP core with the peripheral integration and deterministic interrupt behavior of a microcontroller. Within the power-management hierarchy, a DSC sits at the heart of a closed-loop switch-mode power supply system, replacing analog PWM controllers with firmware-defined control loops. The dsPIC33EP16GS504 belongs to Microchip's SMPS & Digital Power Conversion family (dsPIC33EPXXGS50X), purpose-built for multi-loop digital switch-mode power supplies.
Key features include the 70 MIPS 16-bit pipeline core, on-chip FLASH of 16KB (16K x 8) suitable for PID and state-machine control firmware, 2K x 8 RAM for loop variables and data buffering, and Functional Safety (FuSa) documentation support per Microchip's product page. The device is targeted at power applications, with the family offering specialized high-speed PWM peripherals and ADC resources for digital power conversion.
Architecturally, the dsPIC33EP core uses a modified Harvard pipeline with DSP multiply-accumulate instructions, enabling cycle-deterministic execution of control-loop mathematics. The family datasheet (3723KB PDF available via distributors) documents the high-resolution PWM module, dual-speed ADC, and clock/PLL system that permit kHz-to-hundreds-of-kHz switching frequencies.
Typical applications include interleaved power factor correction (Microchip publishes an Interleaved PFC reference design producing up to 350W from universal AC input), AC-DC and DC-DC digital power supplies, solar micro-inverters, battery chargers, and LED drivers.
Design consideration: the 3V to 3.6V supply window requires a well-regulated 3.3V rail; budget decoupling on all VDD/VDDCORE pins and follow the datasheet layout guidance for the exposed pad thermal and ground connection.
This page synthesizes distributor pricing, drop-in family alternatives, and application guidance not found in the manufacturer datasheet alone.
Alternativas drop-in para DSPIC33EP16GS504T-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP16GS504T-I/ML (mesmo formato e footprint) — diferindo em Package, Packaging, Product Family, Core Architecture, Functional Safety Support.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP16GS504-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33EP16GS504T-E/ML
✅ Drop-In✓ Em estoque
$2.55 / unidade
Ver ficha técnica →DSPIC33EP32GS504-I/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.12 / unidade
Ver ficha técnica →DSPIC33EP64GS504-I/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.45 / unidade
Ver ficha técnica →DSPIC33EP128GS504-I/ML
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP16GS504T-I/ML Classificações máximas e características elétricas
| Core Architecture | 16-bit dsPIC33EP DSC |
| Maximum CPU Speed | 70 MIPS |
| Program Memory Size | 16KB (16K x 8) FLASH |
| RAM Size | 2K x 8 |
| Supply Voltage Range | 3 V to 3.6 V |
| I/O Pins | 35 |
| Encapsulamento | 44-QFN (8x8 mm), exposed pad |
| Tipo de montagem | Surface Mount |
| Number of Terminals | 44 |
| Product Family | dsPIC33EP16GS504 (SMPS & Digital Power Conversion) |
| Functional Safety Support | Yes (FuSa) per Microchip product page |
| Packaging | Tape & Reel (T suffix) |
Guia de Configuração de Pinos do DSPIC33EP16GS504T-I/ML 44-qfn (8x8 mm), exposed pad
Configuração de pinos para DSPIC33EP16GS504T-I/ML (pacote 44-qfn (8x8 mm), exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33EP16GS504T-I/ML.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33EP16GS504T-I/ML é adequado para 6 aplicaçãos: Interleaved Power Factor Correction (PFC), AC-DC Digital Power Supplies, DC-DC Converters and Point-of-Load Regulation, Solar Micro-Inverters, Battery Chargers, Digital LED Drivers.
Interleaved Power Factor Correction (PFC)
The DSPIC33EP16GS504T-I/ML fits interleaved PFC applications because the dsPIC33EPXXGS50X family was designed by Microchip specifically for multi-loop digital switch-mode power supplies, with a 70 MIPS core able to execute current-loop and voltage-loop compensation each switching cycle. Microchip's own Interleaved PFC reference design based on this family works over a universal AC input range and produces a single high-voltage DC output up to 350W of power. In use, the DSC samples inductor currents through its fast ADC, computes duty commands in firmware, and drives two interleaved PWM phases from the high-resolution PWM module, reducing input current ripple and spreading thermal stress. The trade-off versus an analog PFC controller is firmware development effort, repaid by programmability of transient response, protection thresholds, and startup sequencing.
Recomendado
AC-DC Digital Power Supplies
The DSPIC33EP16GS504T-I/ML suits AC-DC converter control because its 70 MIPS DSP core supports cycle-by-cycle peak current mode and voltage mode control with deterministic latency, while 16KB FLASH holds the full control stack including soft-start, burst mode, and fault protection. In a typical topology the DSC replaces a fixed-function PWM controller: the ADC samples the output sense divider and current shunt, firmware executes the compensator, and the high-resolution PWM stage drives the primary-side MOSFET gate driver. Because control parameters live in firmware, one PCB supports multiple output voltage SKUs and field-updatable transient profiles. The 3V to 3.6V supply requirement and 44-QFN footprint keep the controller section compact on the secondary or primary side. Engineers should budget the 2KB RAM carefully, reserving headroom for telemetry buffers and fault logs during development.
Recomendado
DC-DC Converters and Point-of-Load Regulation
The DSPIC33EP16GS504T-I/ML is appropriate for digitally controlled DC-DC bricks and point-of-load converters where telemetry and adaptive tuning are required. The 70 MIPS core closes current-mode loops at switching frequencies common in telecom and server front ends, while the SMPS-oriented peripherals of the GS50X family provide the high-resolution PWM steps needed for small duty cycles at high step-down ratios. Firmware-defined control allows PMBus-style configurability, phase shedding for light-load efficiency, and nonlinear transient response that analog controllers cannot match. The 35 I/O pins leave room for enable signaling, fault aggregation, and housekeeping GPIO alongside the PWM and ADC functions. The main design consideration is supply integrity: the 3V to 3.6V operating window demands a clean local 3.3V LDO, and the exposed pad of the 44-QFN must be soldered to a solid ground plane for both grounding and heat spreading.
Recomendado
Solar Micro-Inverters
The DSPIC33EP16GS504T-I/ML supports solar micro-inverter control loops combining MPPT, DC-DC boost regulation, and grid-synchronized inversion on one chip. MPPT algorithms iterate relatively slowly and fit comfortably in 16KB FLASH alongside the fast inner current loops handled at 70 MIPS. The dual-loop structure - slow outer MPPT voltage search plus fast inner current control - maps naturally onto the family's multi-loop SMPS architecture that Microchip documents for the dsPIC33EPXXGS50X series. Grid-tie operation requires precise phase tracking and anti-islanding logic, which the deterministic DSP core and interrupt structure support without the jitter of softer MCU alternatives. Designers should note the 3V to 3.6V supply limit when deriving controller power from high-voltage DC buses, typically via an auxiliary flyback winding and a 3.3V LDO, and should reserve firmware space for grid-standard compliance routines.
Recomendado
Battery Chargers
The DSPIC33EP16GS504T-I/ML fits smart battery charger designs because constant-current/constant-voltage profiles, termination detection, and safety timers are all firmware artifacts of the digital control loop, and 16KB FLASH is ample for Li-ion, lead-acid, and LiFePO4 charging algorithms. The 70 MIPS core executes the charger's inner current loop each PWM cycle while slower supervisory logic handles temperature qualification, pre-charge conditioning, and fault recovery. The GS50X family's SMPS-oriented PWM and ADC peripherals synchronize sampling with the switching waveform, giving clean averaged current feedback essential for accurate CC regulation. The 35 I/O pins support LED status indicators, button interfaces, and pack-side communication. As an estimate-based caution, verify that self-heating of the 44-QFN stays within datasheet thermal limits at full charge current by calculating dissipation from measured VDD current rather than assuming worst-case margins.
Recomendado
Digital LED Drivers
The DSPIC33EP16GS504T-I/ML is well suited to high-power digital LED driver control where dimming curves, thermal foldback, and multi-channel phase-dimmed outputs are required. Its 70 MIPS core runs fast inner current loops for constant-current regulation while firmware implements flexible dimming profiles - 0-10V, PWM, or DALI-style protocols - that analog LED controllers cannot offer. The GS50X family's high-resolution PWM produces flicker-free dimming deep into low duty cycles, and the fast ADC synchronizes with PWM edges for accurate current sampling in buck, boost, or flyback LED topologies. With 16KB FLASH there is room for communication interfaces and fault diagnostics such as open-string and short-string detection. The industrial -I temperature grade and 44-QFN (8x8) package allow compact placement inside luminaire housings, though designers should confirm ambient ratings from the Microchip datasheet before final thermal design.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP16GS504T-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP16GS504-I/ML | DSPIC33EP16GS504T-E/ML | DSPIC33EP32GS504-I/ML | DSPIC33EP128GS504-I/ML |
|---|---|---|---|---|---|
| Package | QFN-44 (8x8 mm) | QFN-44 (8x8) - same | QFN-44 (8x8) - same | QFN-44 (8x8) - same | QFN-44 (8x8) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| FLASH Memory | 16KB (16K x 8) | 16KB | 16KB | 32KB | 128KB |
| Supply Voltage | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V |
| Temperature Grade | Industrial (-I) | Industrial (-I) | Extended (-E) | Industrial (-I) | Industrial (-I) |
| Functional Safety Support | Yes (FuSa) | Yes (FuSa) | Yes (FuSa) | Yes (FuSa family) | Yes (FuSa family) |
Principais diferenciais
- Purpose-built SMPS/Digital Power peripheral set (vs DSPIC33EP128MU504-H/PT)
- Same-footprint FLASH scaling path (vs DSPIC33EP16GS504-I/ML)
- Memory upgrade without respin (vs DSPIC33EP32GS504-I/ML)
- Cost-optimized entry point for digital power (vs DSPIC33EP128GS504-I/ML)
Notas de projeto
The DSPIC33EP16GS504T-I/ML operates from a 3V to 3.6V supply per distributor specification data. Derive the controller rail from a dedicated 3.3V LDO or regulator with tight load transient response, since the core running at 70 MIPS draws dynamic current proportional to clock activity. Place 100nF ceramic decoupling capacitors at every VDD pin within 2 mm of the pin, plus bulk 10uF near the device. On digital power boards, keep the controller ground reference separate from power-stage ground until a single-point star connection to avoid switching noise corrupting ADC readings.
The 44-QFN (8x8 mm) package has an exposed pad on the underside that must be soldered to a grounded copper pour - it is both the primary ground return and the main heat conduction path. Use a grid of thermal vias (typically 4x4) under the pad to tie into internal ground planes, and ensure the solder paste stencil follows the datasheet-recommended aperture pattern to avoid voiding. The 35 I/O pins are multiplexed with analog functions, so route ADC sense traces short and away from PWM gate-drive lines to preserve signal integrity on this mixed-signal DSC.
Do not treat the T suffix as a technical variant - it only denotes tape-and-reel packaging; the DSPIC33EP16GS504-I/ML tray version is electrically identical and useful for prototyping. Second, the 16KB FLASH fills quickly once communication stacks and diagnostics are added; start with the DSPIC33EP128GS504 in the same QFN-44 footprint if code size is uncertain, since it is pin-to-pin compatible. Third, the 3V to 3.6V window excludes 5V operation - level-shift any 5V signaling, and never connect 5V tolerance assumptions to I/O pins without verifying limits in the Microchip datasheet.
Informações de conformidade
Compliance status not stated in the retrieved distributor data; verify RoHS/REACH on Microchip's official product page or the distributor environmental datasheet before procurement.