DSPIC33EP256GP504T-I/ML - 16-bit 70MIPS DSC 256KB | Microchip
N.º da peça: DSPIC33EP256GP504T-I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5.6 | $5,60 |
| 10 | $5.05 | $50,50 |
| 100 | $4.55 | $455,00 |
| 500 | $4.15 | $2.075,00 |
| 1.000 | $3.9 | $3.900,00 |
DSPIC33EP256GP504T-I/ML Visão geral
A digital signal controller combines the compute architecture of a 16-bit microcontroller with DSP-grade multiply-accumulate instructions in a single core. In the power-management hierarchy, a DSC sits between general-purpose MCUs and dedicated DSPs, making dsPIC33E devices a common choice for embedded control loops that need both deterministic I/O handling and math-heavy processing such as digital filtering and fast PID.
Key features include a 70 MIPS dsPIC33E core (60 MHz instruction cycle clock), an enhanced 10-bit or 12-bit ADC capable of over 1 Msps sampling, two CAN 2.0B modules, multiple UART/SPI/I2C interfaces with IrDA and LINbus support, an on-chip Charge Time Measurement Unit (CTMU), and Peripheral Trigger Generator (PTG) for autonomous peripheral coordination. The general-purpose (GP) peripheral set suits mixed-signal control rather than motor-specific PWM timing.
Architecturally, the dsPIC33EP core uses a modified Harvard bus with 24-bit instruction words, hardware DSP multiply-accumulate, and a 16 x 16 working register file. Deep hardware stacking, vectored interrupts, and DMA on key peripherals reduce CPU overhead in deterministic real-time control. FLASH endurance and program-space ECC protect long-lifetime industrial deployments.
Typical applications include industrial automation nodes, CAN-based automotive subsystems (the E/ML temperature variant is AEC-Q100 qualified), digital power supplies, sensor fusion, and precision measurement instruments that exploit the CTMU and high-speed ADC.
Design consideration: the T suffix denotes tape-and-reel packaging, and the -I grade covers -40C to +85C; for automotive environments specify the -E variant (-40C to +125C, AEC-Q100).
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para DSPIC33EP256GP504T-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP256GP504T-I/ML (mesmo formato e footprint) — diferindo em Operating Temperature, Package, CTMU, Core, Op Amps.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP256MC504
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP128GP504
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP64GP504
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP32GP504
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP128MC504
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP64MC504
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP256GP504T-I/ML Classificações máximas e características elétricas
| Core | dsPIC33E (16-bit) |
| Max CPU Speed | 70 MIPS |
| Core Clock | 60 MHz |
| Program Memory (FLASH) | 256KB (85.5K x 24) |
| RAM | 16KB |
| Tensão de alimentação | 3.3 V |
| Encapsulamento | 44-QFN (8x8 mm), exposed pad |
| Tipo de montagem | Surface Mount |
| Connectivity | CANbus, I2C, IrDA, LINbus, SPI, UART/USART |
| Peripherals | CTMU, Op Amps, PTG, high-speed PWM |
| Temperatura de operação | -40C to +85C |
| Packaging | Tape & Reel (T suffix) |
| Series | dsPIC33EP256GP504 |
| Contagem de pinos | 44 |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do DSPIC33EP256GP504T-I/ML 44-qfn (8x8 mm), exposed pad
Configuração de pinos para DSPIC33EP256GP504T-I/ML (pacote 44-qfn (8x8 mm), exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33EP256GP504T-I/ML.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33EP256GP504T-I/ML é adequado para 6 aplicaçãos: Industrial Automation Nodes, Automotive CAN Subsystems, Digital Power Supplies, Precision Measurement Instruments, Motor Control Drivers, IoT and Embedded Sensing Systems.
Industrial Automation Nodes
The DSPIC33EP256GP504T-I/ML fits industrial automation nodes because its 70 MIPS 16-bit core executes deterministic control loops and its 256KB FLASH hosts complete fieldbus stacks. Dual CAN 2.0B modules plus UART/I2C/SPI allow the controller to bridge a plant CAN backbone with local sensors and actuators simultaneously. The Peripheral Trigger Generator coordinates ADC sampling with control-loop timing autonomously, reducing interrupt latency jitter - important for closed-loop positioning and process control. The -40C to +85C industrial temperature grade and exposed-pad QFN thermal design support cabinet-mounted electronics without heatsinking at typical 3.3V operating currents.
Recomendado
Automotive CAN Subsystems
In automotive subsystems, the -E temperature variant of this same device is AEC-Q100 qualified, confirming the silicon family's automotive fitness; the 44-QFN footprint and dual CAN modules make the GP504 well suited to body-control, sensor-hub, and gateway-lite functions. The LINbus-capable UART handles low-cost actuator networks while the CAN 2.0B module manages the main vehicle bus at up to 1 Mbps. With 256KB FLASH, both communication stacks plus diagnostics (UDS-style services) fit comfortably in 85.5K x 24 instruction words, and the 16KB RAM buffers message queues without external memory.
Recomendado
Digital Power Supplies
Digital power supplies benefit from the dsPIC33EP core's DSP multiply-accumulate capability, which executes PID and compensator filter taps in single-cycle MAC instructions at 70 MIPS. The high-speed ADC samples output voltage and current for fast inner loops, and the Peripheral Trigger Generator links PWM timing to sampling with zero CPU intervention, minimizing control-loop delay. The 44-QFN 8x8 package concentrates switching and analog ground on the exposed pad, simplifying low-inductance power stage layout. For designs needing dedicated high-resolution PWM with fault protection, the pin-compatible DSPIC33EP256MC504 variant offers an enhanced motor-control PWM engine on the same footprint.
Recomendado
Precision Measurement Instruments
The CTMU (Charge Time Measurement Unit) on the GP504 enables sub-nanosecond-resolution time and capacitance measurements, supporting touch sensing, ultrasonic flow, and resistance-temperature measurement without a dedicated front-end ASIC. The on-chip op amps buffer sensor signals before the high-speed ADC, shortening the analog signal chain and cutting BOM cost. With 256KB FLASH, calibration tables, nonlinear compensation curves, and a USB/UART reporting stack coexist in one device. The 3.3V rail and 44-QFN package suit handheld instruments where thermal budget and board area are constrained; the -I grade covers typical laboratory and field temperature ranges.
Recomendado
Motor Control Drivers
While the GP504 provides general-purpose PWM suitable for basic motor control, its drop-in sibling DSPIC33EP256MC504 shares the identical 44-QFN pinout and adds the high-speed motor-control PWM engine with complementary outputs, dead-time insertion, and fault inputs required for BLDC, PMSM, and ACIM drives. Designers can lay out one PCB and populate either variant: the GP504 for pumps and fans with simple six-step control, the MC504 for field-oriented control. The 70 MIPS DSP core computes Clarke/Park transforms and PI current loops well above typical 10-20 kHz PWM frequencies, leaving ample CPU margin for communication and protection logic.
Recomendado
IoT and Embedded Sensing Systems
For IoT sensing nodes, the GP504 combines 256KB FLASH for wireless module drivers and protocol handling with the CTMU-based touch interface for capacitive buttons, eliminating a separate touch controller. Multiple UARTs connect cellular or LoRa modules while SPI/I2C bus sensors locally; the 16KB RAM buffers telemetry payloads. Running at 70 MIPS yet supporting low-power sleep and idle modes, it can duty-cycle aggressively for battery-powered deployments. The compact 8x8 mm QFN conserves PCB area in dense sensor nodes, and the exposed ground pad provides a solid RF ground reference when placed near antenna-side modules such as LoRa or Wi-Fi companions.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP256GP504T-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP256MC504 | DSPIC33EP128GP504 | DSPIC33EP64GP504 | DSPIC33EP32GP504 | DSPIC33EP128MC504 |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm), exposed pad | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| FLASH Memory | 256KB (85.5K x 24) | 256KB | 128KB | 64KB | 32KB | 128KB |
| Peripheral Family | GP (CTMU, Op Amps, PTG, CAN) | MC (enhanced motor-control PWM) | GP - same | GP - same | GP - same | MC (enhanced motor-control PWM) |
| Relative Cost Position | Baseline (largest flash in family) | Comparable | Lower | Lower | Lowest | Lower |
Principais diferenciais
- Largest FLASH in the 44-QFN GP504 family (vs DSPIC33EP128GP504)
- General-purpose peripheral set with CTMU, op amps and PTG (vs DSPIC33EP256MC504)
- Cost-reduced drop-in path exists in the same footprint (vs DSPIC33EP32GP504)
Notas de projeto
The 44-QFN exposed pad is the primary ground connection - connect it to a solid VSS plane via an array of vias (typically 4-9) directly under the pad. Poor exposed-pad soldering is the most common QFN assembly defect; specify sufficient stencil aperture coverage (50-70%) and inspect with X-ray or verify electrically on first articles. Keep crystal/oscillator traces short and guard the analog pins feeding the on-chip op amps and ADC with a local analog ground island.
Decouple each VDD pin pair with 100 nF ceramic capacitors placed within 2 mm of the pins, plus one bulk 4.7-10 uF per supply domain. The dsPIC33EP core draws transient current bursts at 70 MIPS clock rates, so a shared low-impedance 3.3V rail with adequate bulk capacitance prevents brown-out resets during flash writes and core transitions. Verify VDDCORE decoupling per the family datasheet's power-supply section, and add an external brown-out supervisor if your application cannot tolerate the internal BOR thresholds.
Confirm temperature grade and package code before ordering: -I/ML covers -40C to +85C, while automotive projects require the -E/ML (AEC-Q100, -40C to +125C). The T suffix means tape-and-reel (minimum reel quantity applies) - prototypes typically need the tube-packaged DSPIC33EP256GP504-I/ML instead. Also verify PPS (peripheral pin select) assignments in firmware: on dsPIC33EP devices many digital peripherals map to multiple RPx pins, and incorrect PPS configuration is the leading cause of 'dead UART/CAN' first-bring-up issues.
Informações de conformidade
The -I/ML device is the industrial temperature grade; the -E/ML variant of the same die is AEC-Q100 qualified per Microchip USA product data. Full compliance certificates (RoHS/REACH CoC) should be requested from Microchip or the authorized distributor.