DSPIC33EP32MC202-H/MM - 60MIPS Motor Control DSC | Microchip
N.º da peça: DSPIC33EP32MC202-H/MM ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.2 | $4,20 |
| 10 | $3.78 | $37,80 |
| 100 | $3.36 | $336,00 |
| 500 | $3.02 | $1.510,00 |
| 1.000 | $2.71 | $2.710,00 |
DSPIC33EP32MC202-H/MM Visão geral
A digital signal controller is a hybrid class of embedded processor that merges the control peripherals of a microcontroller (MCU) with the multiply-accumulate (MAC/DSP) engine of a digital signal processor (DSP). Within the power-management hierarchy, DSCs occupy the layer between general-purpose MCUs and dedicated motor-control ASICs, providing a single-chip solution for closed-loop control of motors and power converters.
Key features include the high-speed 16-bit dsPIC33E core with DSP instruction extensions, 32KB of self-programmable flash with ECC, 4KB of RAM, up to 21 general-purpose I/O pins, and connectivity via I2C, SPI, UART/USART with IrDA and LINbus support, plus a Quadrature Encoder Interface (QEI). Analog integration covers high-speed ADC channels, comparators, and on-chip op amps per the family datasheet, reducing external component count.
Technical depth: the MC202 variant adds dedicated motor-control PWM (MCPWM) with complementary outputs, dead-time insertion and fault protection, four DMA channels and five 16-bit timers, enabling sensorless FOC and trapezoidal control loops at high execution rates.
Typical applications include brushless DC and PMSM motor drives, digital power supplies and PFC stages, automotive actuators, and industrial inverters requiring AEC-Q100 qualification.
Design consideration: supply the core from the internal regulator with a low-ESR VCAP capacitor and budget flash endurance in self-write applications.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para DSPIC33EP32MC202-H/MM — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP32MC202-H/MM (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Core, Operating Voltage, Qualification.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP32MC202-I/MM
✅ Drop-In✓ Em estoque
$2.25 / unidade
Ver ficha técnica →DSPIC33EP64MC202-I/MM
✅ Drop-In✓ Em estoque
$2.29 / unidade
Ver ficha técnica →DSPIC33EP16MC202-I/MM
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP64MC202-H/MM
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP32GP502T-E/MM
✅ Drop-In✓ Em estoque
$2.98 / unidade
Ver ficha técnica →DSPIC33EP32MC202-H/MM Classificações máximas e características elétricas
| Core | 16-bit dsPIC33E DSC |
| Maximum CPU Speed | 60 MIPS |
| Flash Program Memory | 32 KB |
| RAM | 4 KB |
| Tensão de alimentação | 3.3 V (single supply) |
| I/O Pins | Up to 21 |
| Encapsulamento | 28-QFN-S (6x6 mm) exposed pad |
| Temperatura de operação | -40C to +125C (H grade) |
| Connectivity | I2C, SPI, UART/USART, IrDA, LINbus |
| Quadrature Encoder Interface | Yes (QEI) |
| Motor Control PWM | MCPWM with complementary outputs |
| DMA Channels | 4 |
| Timers | 5 x 16-bit |
| External Interrupts | 4 |
| Comparators | 3 |
| Qualification | AEC-Q100 automotive |
| Tipo de montagem | Surface Mount |
Guia de Configuração de Pinos do DSPIC33EP32MC202-H/MM 28-qfn-s (6x6 mm) exposed pad
Configuração de pinos para DSPIC33EP32MC202-H/MM (pacote 28-qfn-s (6x6 mm) exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33EP32MC202-H/MM.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33EP32MC202-H/MM é adequado para 6 aplicaçãos: Brushless DC and PMSM Motor Drives, Digital Power Supplies and PFC, Automotive Body and Actuator Control, Industrial Inverters and Drives, Embedded Sensing and Instrumentation, Smart Home and IoT Control Nodes.
Brushless DC and PMSM Motor Drives
The DSPIC33EP32MC202-H/MM is purpose-built for closed-loop motor control: the MCPWM module generates complementary PWM with programmable dead time and fault shutdown, while the QEI reads encoder feedback for position loops. Running at 60 MIPS with DSP MAC instructions, the core executes field-oriented control (FOC) current loops at PWM-matched rates well above 10 kHz. The 3.3V core with four DMA channels offloads ADC sample transfer, keeping ISR latency low for tight control bandwidth. Use this DSC between the gate-driver input and the current-sense ADC front end; its AEC-Q100 qualification also permits under-hood and automotive actuator placements at -40C to +125C.
Recomendado
Digital Power Supplies and PFC
Digital power conversion benefits directly from the 60 MIPS core, high-resolution MCPWM outputs, fast analog comparators and DMA-driven ADC sampling of the DSPIC33EP32MC202-H/MM. Peak-current-mode or average-current-mode control loops for boost PFC, LLC and buck stages are implemented in firmware with cycle-by-cycle comparator limiting as a hardware safety net. The 32KB flash with self-programming supports firmware-defined power-supply profiles and telemetry over the onboard UART/I2C. Compared with an analog controller, this DSC adds adaptive compensation, soft-start sequencing and digital status reporting in the same 28-QFN 6x6 mm footprint.
Recomendado
Automotive Body and Actuator Control
With AEC-Q100 qualification and the extended -40C to +125C H temperature grade, the DSPIC33EP32MC202-H/MM fits automotive actuator nodes such as HVAC dampers, throttle bodies, pumps and window lifts. The LINbus and IrDA-capable UART covers low-cost in-vehicle networking, while the MCPWM and comparators drive brushed-DC actuators with current limiting. The 28-QFN-S 6x6 mm package minimizes PCB area in space-constrained modules, and the exposed thermal pad aids heat dissipation near the motor driver. Internal oscillator options reduce BOM cost where a crystal is unnecessary; CAN-capable designs pair the UART/SPI with an external CAN transceiver.
Recomendado
Industrial Inverters and Drives
Industrial variable-frequency drives and solar micro-inverters exploit the same peripheral strengths: complementary MCPWM with dead-time insertion for IGBT/MOSFET bridges, QEI for motor shaft feedback, and the 60 MIPS DSP engine for space-vector modulation math. Four DMA channels stream ADC results without CPU intervention, and five 16-bit timers support multi-rate control and communication tasks concurrently. The 32KB flash holds a full sensorless FOC stack plus Modbus/UART firmware. Operation from 3.3V simplifies interfacing with isolated gate drivers and industrial sensors, and the -40C to +125C range covers cabinet-mounted electronics in harsh factory environments.
Recomendado
Embedded Sensing and Instrumentation
The integrated high-speed ADC, three analog comparators, SPI and I2C ports make the DSPIC33EP32MC202-H/MM a compact host for sensor acquisition nodes and portable instruments. DSP MAC instructions accelerate FFT and digital filtering on sampled data, while 4KB RAM buffers measurement windows and the 32KB flash stores calibration tables and self-programmable configuration sets. UART with DMA streams results to a host or radio module at low CPU overhead, and the PTG (pulse train generator) capability automates simple excitation sequences. The 28-QFN 6x6 mm package suits handheld and DIN-rail instruments where board area and thermal profile are constrained.
Recomendado
Smart Home and IoT Control Nodes
For connected appliances, pumps, fans and smart lighting with motor loads, the DSPIC33EP32MC202-H/MM combines motor control and connectivity in one chip: MCPWM drives the motor stage while I2C/SPI/UART interface to sensors, displays and wireless modules. The 3.3V supply, low peripheral-count BOM and 28-QFN footprint suit compact appliance PCBs, and the -40C to +125C grade tolerates hot appliance interiors. Firmware-updatable flash enables over-the-air-adjacent update strategies via the UART boot loader. Pair with a Wi-Fi or BLE module over UART/SPI for cloud-connected energy and diagnostics reporting in smart-home ecosystems.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP32MC202-H/MM — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP32MC202-I/MM | DSPIC33EP64MC202-I/MM | DSPIC33EP16MC202-I/MM | DSPIC33EP32GP502T-E/MM |
|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Flash Memory | 32 KB | 32 KB | 64 KB | 16 KB | 32 KB |
| RAM | 4 KB | 4 KB | 4 KB | 2 KB | 4 KB |
| Motor-Control Peripherals (MCPWM/QEI) | Yes (MC family) | Yes (MC family) | Yes (MC family) | Yes (MC family) | No (GP family) |
Principais diferenciais
- Extended -40C to +125C AEC-Q100 temperature grade (vs DSPIC33EP32MC202-I/MM)
- Doubled flash capacity as a code-headroom upgrade (vs DSPIC33EP64MC202-I/MM)
- Dedicated motor-control peripheral set (vs DSPIC33EP32GP502T-E/MM)
Notas de projeto
The dsPIC33EP core is fed by an internal regulator: connect a low-ESR ceramic capacitor (approximately 10 uF plus 0.1 uF) from the VCAP/VDDCORE pin to ground, as specified in the family datasheet DS70000657J. Do not inject external current into VDDCORE. Provide a solid 3.3V rail with local 0.1 uF decoupling at each VDD pin and place AVDD/AVSS on a quiet analog supply with an RC filter for best ADC accuracy.
In the 28-QFN-S 6x6 mm package, the exposed die pad is the primary thermal and ground path - connect it to the ground plane with a 5x5 via array. Keep the MCPWM output traces short and matched to the gate drivers, and route the QEI encoder inputs away from PWM switching nodes to prevent noise-induced counting errors. Place the MCLR pull-up (4.7k-10k) close to pin 1 for reliable ICSP programming access.
Respect the Peripheral Pin Select (PPS) mapping rules: not all RPxx assignments are legal in every combination, so verify the PPS table in DS70000657J before finalizing firmware. Configure unused I/O as outputs driving low or as inputs with pull-ups to avoid floating-pin leakage. Watch the H-grade thermal budget: at +125C ambient, internal power dissipation from core and I/O must be checked against package theta-JA for the QFN, especially when driving heavy I/O loads.
For motor-control designs, insert RC snubbers or gate resistors sized to your MOSFET/IGBT stage and synchronize ADC sampling with the PWM using the MCPWM ADC-trigger feature; this places current samples away from switching transients and dramatically reduces feedback noise. Use the comparators for hardware cycle-by-cycle current limit so protection does not depend on software latency at 60 MIPS.
Informações de conformidade
AEC-Q100 qualification and automotive suitability per Hotenda/DigiKey listings. RoHS/lead-free per distributor listings; REACH, halogen-free and conflict-minerals declarations should be confirmed via official Microchip compliance documents.
