DSPIC33EP64MC202-I/MM - 70MIPS DSC 64KB Flash QFN-28 | Microchip
N.º da peça: DSPIC33EP64MC202-I/MM ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.85 | $3,85 |
| 10 | $3.46 | $34,60 |
| 100 | $3.08 | $308,00 |
| 500 | $2.62 | $1.310,00 |
| 1.000 | $2.29 | $2.290,00 |
DSPIC33EP64MC202-I/MM Visão geral
A digital signal controller combines the computational throughput of a digital signal processor (DSP) with the peripheral integration and deterministic control behavior of a microcontroller (MCU). DSCs sit between general-purpose MCUs and dedicated DSP ICs in the embedded hierarchy, providing hardware multiply-accumulate (MAC), a barrel shifter, and fast interrupts alongside timers, PWM, and serial peripherals in one power-managed device.
Key features include a 70 MIPS dsPIC33E CPU core, 64 KB of self-programmable Flash with ECC-style write protection, 8 KB of RAM, 4 DMA channels, and a high-speed PWM module purpose-built for motor control. Up to 5 general-purpose timers and 2 serial communication interfaces support industrial protocols, while remappable peripheral pins (RPn) allow flexible pin assignment on the 28-pin QFN footprint.
Technically, the dsPIC33EP architecture uses an enhanced 16-bit pipeline with DSP engine, single-cycle MAC, and two address generation units, enabling deterministic execution of control loops. Operating frequencies up to 60 MHz (70 MIPS equivalent) support field-oriented control (FOC) update rates demanded by modern servo, BLDC, and PMSM drives.
Typical applications include precision BLDC/PMSM motor control, digital power conversion (DC-DC, PFC, inverters), and embedded sensing systems requiring DSP filtering close to the sensor.
Design consideration: the 28-QFN (MM) exposes an exposed thermal paddle that must be soldered to a grounded copper pour for both thermal and electrical performance; VDD/AVDD decoupling capacitors should be placed within 5 mm of the supply pins.
This page synthesizes distributor pricing, drop-in family alternatives, pinout guidance, and practical design notes not found in a single manufacturer source.
Alternativas drop-in para DSPIC33EP64MC202-I/MM — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP64MC202-I/MM (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Program Memory (Flash), Core Architecture, RAM.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
dsPIC33EP64MC202-E/MM
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33EP64MC202-H/MM
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33EP32MC202-I/MM
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.25 / unidade
Ver ficha técnica →DSPIC33EP128MC202-I/MM
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.9 / unidade
Ver ficha técnica →DSPIC33EP256MC202-I/MM
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.3 / unidade
Ver ficha técnica →DSPIC33EP64GP502-I/MM
✅ Drop-In✓ Em estoque
$2.2 / unidade
Ver ficha técnica →DSPIC33EP64MC202-I/MM Classificações máximas e características elétricas
| Core Architecture | 16-bit dsPIC33E DSC core |
| Max CPU Speed | 70 MIPS (60 MHz clock) |
| Program Memory (Flash) | 64 KB (22K x 24) |
| SRAM | 8 KB |
| DMA Channels | 4 |
| Timers | 5 |
| Operating Voltage | 3.0 V to 3.6 V |
| Temperatura de operação | -40C to +85C (I grade) |
| Encapsulamento | 28-QFN-S (6x6 mm), QFN family, surface mount |
| Tipo de montagem | Surface Mount (SMD) |
| PWM Module | High-Speed PWM for motor control |
| Serial Interfaces | 2 remappable UART/SPI/I2C (RPn PPS) |
| DSP Engine | Single-cycle MAC, barrel shifter |
| In-System Programming | ICSP, 2-wire (PGED/PGEC) |
| Contagem de pinos | 28 |
| Status RoHS | Compliant |
| Lifecycle | In Production (per MicrochipDirect) |
Configuração de pinos do DSPIC33EP64MC202-I/MM
| Pino 1 | MCLR — Master clear reset input / programming voltage (VIHH during ICSP) |
| Pino 2 | AN0/VREF+/RB0 — Analog input 0 / positive ADC reference / port B bit 0 |
| Pino 3 | AN1/VREF-/RB1 — Analog input 1 / negative ADC reference / port B bit 1 |
| Pino 4 | AN2/RB2 — Analog input 2 / port B bit 2 / ICSP data pin (PGED) |
| Pino 5 | AN3/RB3 — Analog input 3 / port B bit 3 / ICSP clock pin (PGEC) |
| Pino 6 | OSC1/RA2 — Primary oscillator input or I/O |
| Pino 7 | OSC2/RC15 — Primary oscillator output or I/O |
| Pino 8 | VDD — Digital power supply (3.0 V to 3.6 V) |
| Pino 9 | VSS — Digital ground |
| Pino 10 | AN4/RB4 — Analog input 4 / comparator input / port B bit 4 |
| Pino 11 | AN5/RB5 — Analog input 5 / comparator input / port B bit 5 |
| Pino 12 | VDD — Digital power supply (second VDD pin on QFN variant) |
| Pino 13 | VSS — Digital ground (second VSS pin on QFN variant) |
| Pino 14 | RP14/RC6 — Remappable peripheral pin / port C bit 6 |
| Pino 15 | RP13/RC5 — Remappable peripheral pin / port C bit 5 |
| Pino 16 | RP12/RC4 — Remappable peripheral pin / port C bit 4 |
| Pino 17 | RP11/RC3 — Remappable peripheral pin / port C bit 3 |
| Pino 18 | RP10/RC2 — Remappable peripheral pin / port C bit 2 |
| Pino 19 | RP9/RC1 — Remappable peripheral pin / port C bit 1 |
| Pino 20 | RP8/RC0 — Remappable peripheral pin / port C bit 0 |
| Pino 21 | VDD — Digital power supply (third VDD pin on QFN variant) |
| Pino 22 | VSS — Digital ground (third VSS pin on QFN variant) |
| Pino 23 | RB6 — Port B bit 6 / secondary PGED |
| Pino 24 | RB7 — Port B bit 7 / secondary PGEC |
| Pino 25 | RP29/RB15 — Remappable peripheral pin / port B bit 15 |
| Pino 26 | RP28/RB14 — Remappable peripheral pin / port B bit 14 |
| Pino 27 | AVSS — Analog ground |
| Pino 28 | AVDD — Analog power supply |
Aplicações típicas
DSPIC33EP64MC202-I/MM é adequado para 6 aplicaçãos: BLDC / PMSM Motor Control, Digital Power Conversion, Industrial Sensing Nodes, Embedded Motor-Driven Appliances, Portable and Battery-Powered Instruments, Embedded Control Upgrades / Retrofits.
BLDC / PMSM Motor Control
The DSPIC33EP64MC202-I/MM is purpose-built for precision motor control: its 70 MIPS dsPIC33E core executes field-oriented control (FOC) loops with single-cycle multiply-accumulate operations, while the high-speed PWM module generates complementary, dead-time-controlled drive signals for three-phase inverters. Four DMA channels stream ADC current-sense samples into RAM without CPU intervention, keeping the current loop deterministic. In a typical 24V or 48V BLDC drive, the DSC interfaces with a 3-phase gate driver (e.g., MIC4104-class) over the PWM outputs and reads Hall or encoder feedback on remappable RPn pins. Trade-off: with only 28 pins, advanced sensorless designs should prioritize the MC202's 12-bit ADC channels carefully, as pin multiplexing limits simultaneous PWM, UART, and encoder use.
Recomendado
Digital Power Conversion
For digital switch-mode power supplies - LLC, PFC stages, and synchronous buck converters - the 70 MIPS core closes voltage and current loops at tens of kHz with DSP-grade filtering. The high-speed PWM supports duty-cycle updates per cycle with phase-shift and complementary modes required by half-bridge topologies, and the 4 DMA channels move ADC results for over-current protection within microseconds. The 3.0 V to 3.6 V supply and 28-QFN 6x6 mm footprint fit compact controller islands on dense power boards. Designers should locate the analog AVDD/AVSS pins away from PWM ground-return currents and use the exposed paddle as a quiet analog ground reference to preserve ADC accuracy during high di/dt switching events.
Recomendado
Industrial Sensing Nodes
The DSPIC33EP64MC202-I/MM serves as a compact sensor hub in industrial environments: the 70 MIPS DSP engine runs FFT and FIR filtering on vibration, acoustic, or current-waveform data close to the transducer, detecting bearing faults or load anomalies before data leaves the node. Two remappable serial interfaces (UART/SPI/I2C via PPS) connect to Modbus RTU masters, external ADCs, or EEPROM. The 8 KB SRAM buffers sample windows, while the industrial -40C to +85C rating suits control cabinets. With 64 KB Flash there is room for a bootloader plus a full DSP processing pipeline; for larger datasets, pick the pin-identical dsPIC33EP128MC202-I/MM to double memory without PCB changes.
Recomendado
Embedded Motor-Driven Appliances
Appliance subsystems - fans, pumps, compressors - benefit from the MC202's combination of motor-control PWM and low pin count. A single 28-QFN device can run a sensorless BLDC fan with back-EMF sensing, handle user-interface I2C, and report status over UART to a main controller, replacing discrete ASIC + MCU pairs. The 60 MHz clock provides headroom for diagnostics such as rotor-lock detection and thermal derating algorithms. Designers should implement a safe-shutdown path: the MCLR pin and a comparator-based over-current input can halt PWM within microseconds. The exposed paddle QFN provides the thermal path needed in sealed housings with limited airflow, provided at least 2x2 mm of grounded copper pour is used.
Recomendado
Portable and Battery-Powered Instruments
Hand-held instruments measuring current, vibration, or acoustics use the DSP engine for real-time signal conditioning while sipping power through the dsPIC33E power-managed modes. The 3.3 V single-supply operation matches a single lithium cell with a boost regulator, and low-power idle/Doze modes cut average current in duty-cycled logging applications. Two UART/SPI/I2C-capable remappable pins connect a display, RF module, or USB-UART bridge. The 6x6 mm QFN fits slim probe housings. Memory budget note: 64 KB Flash holds signal-processing firmware plus a simple UI; designs with datalogging to flash should add an external SPI flash such as the SST26VF064B rather than stretching internal memory.
Recomendado
Embedded Control Upgrades / Retrofits
Because the dsPIC33EP 28-pin family is pin-compatible across 32 KB to 256 KB Flash and across MC/GP peripheral families, the DSPIC33EP64MC202-I/MM is a strong retrofit choice: existing 28-QQN SSOP/QFN boards can be re-populated with more memory or temperature-extended variants without PCB redesign. Win Source notes the family pin compatibility enabling scalability across dsPIC33E and PIC24E products. Typical retrofit flow: keep the footprint, upgrade to dsPIC33EP256MC202-I/MM when firmware outgrows 64 KB, or swap to -E/MM for +125C environments. Keep the ICSP header in the original layout so MPLAB-based field updates remain possible across all family variants.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP64MC202-I/MM — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | dsPIC33EP64MC202-E/MM | DSPIC33EP64MC202-H/MM | dsPIC33EP32MC202-I/MM | dsPIC33EP256MC202-I/MM | DSPIC33EP64GP502-I/MM |
|---|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-PQCC (MM) - same footprint | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 64 KB (22K x 24) | 64 KB | 64 KB | 32 KB | 256 KB | 64 KB |
| CPU Speed | 70 MIPS (60 MHz) | 70 MIPS (60 MHz) | 60 MHz | 70 MIPS (60 MHz) | 70 MIPS (60 MHz) | 70 MIPS (60 MHz) |
| Operating Temperature | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| DMA Channels | 4 | 4 | 4 | 4 | 4 | 4 |
| Peripheral Family Emphasis | MC - High-speed PWM (motor control) | MC - same | MC - same | MC - same | MC - same | GP - general purpose |
Principais diferenciais
- Industrial grade at lowest cost within the 64 KB family (vs dsPIC33EP64MC202-E/MM)
- MC-family high-speed PWM emphasis (vs DSPIC33EP64GP502-I/MM)
- Balanced 64 KB memory point in a scalable pinout (vs dsPIC33EP256MC202-I/MM)
Notas de projeto
The 28-QFN-S (MM) package has an exposed paddle under the die that must be soldered to a grounded copper pour. Connect this pour to VSS with an array of thermal-relief vias (at least a 3x3 grid) - it is the primary thermal and ground return path. DigiKey classifies the package as 28-QFN-S 6x6; follow Microchip's QFN land-pattern guidelines with slightly oversized pads (0.55-0.6 mm) to promote solder wicking up the perimeter leads. Skip-reflow defects on the paddle cause intermittent ground faults that are difficult to diagnose in the field.
The device requires a single 3.0 V to 3.6 V rail for both VDD and AVDD. Place a 0.1 uF ceramic capacitor within 5 mm of each of the three VDD pins and one at AVDD, plus a 4.7-10 uF bulk capacitor near the device. Do not share the AVDD decoupling network with switching-regulator traces - the 12-bit ADC reference integrity depends on a quiet analog rail. Estimated: at 60 MHz the core draws on the order of tens of mA (per family datasheet current-vs-frequency curves), so a 100 mA LDO budget is typically sufficient for the DSC alone.
Remappable pins (PPS) are the most common source of bring-up failures on dsPIC33EP parts: input functions are selected by writing to the INPUTx registers while output mapping uses RPINRx/RPORx registers, and forgetting to unlock PPS with the required key sequence silences UART/PWM silently. Also verify MCLR is not left floating in production boards - use a 10k pull-up; and reserve PGED/PGEC (RB2/RB3-class pins) trace access on your PCB so the ICSP header remains usable. Finally, confirm the -I temperature grade meets your thermal environment before layout sign-off.
Informações de conformidade
RoHS compliance and lead-free status per LCSC and DigiKey listings. Formal REACH, halogen-free, and conflict-minerals declarations must be obtained from Microchip's environmental documentation portal.
