DSPIC33EP64GS502-I/MX - 16-bit 70 MIPS DSC 64KB Flash | Microchip
N.º da peça: DSPIC33EP64GS502-I/MX ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
DSPIC33EP64GS502-I/MX Visão geral
A digital signal controller combines the computational throughput of a 16-bit microcontroller with the pipelined multiply-accumulate hardware of a DSP, sitting in the system hierarchy above general-purpose MCUs and below dedicated digital signal processors. In digital power conversion, the DSC closes high-speed control loops for switch-mode power supplies, power factor correction stages, and DC-DC converters, replacing analog control chips with firmware-based control.
Key features of the GS502 include an interconnected high-speed PWM module purpose-built for power topologies, a 12-bit Analog-to-Digital Converter, a 12-bit Digital-to-Analog Converter, and integrated analog comparators with programmable gain amplifier (PGA) front ends. These interconnected peripherals enable fast, deterministic fault response and direct PWM-trip interrupts without CPU intervention, which is essential for protecting MOSFETs and IGBTs during transient faults.
The architecture provides a single-cycle MAC, hardware divide support, and program memory partitioning for dual-boot designs; the device may be used unpartitioned (single block 0x000000-0x00B000) or split into two bootable partitions. Connectivity covers I2C, SPI, IrDA, UART, and USART serial interfaces, with ECAN also available on the family per Microchip product documentation. The device operates from a 3.3V supply in the industrial -40C to +85C temperature range denoted by the I suffix.
Typical applications include interleaved power factor correction (Microchip's 350W universal-input interleaved PFC reference design uses this device), digital SMPS control, LED drivers, battery chargers, and solar micro-inverters, where the high-speed PWM and fast ADC sampling directly reduce control-loop latency.
A key design consideration is the exposed thermal pad: connect it to a solid ground plane with an adequate via array for thermal dissipation and low-inductance grounding, and always fit the VCAP core regulator capacitor as specified in the datasheet.
This page synthesizes distributor pricing context, drop-in alternatives, pinout guidance, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas drop-in para DSPIC33EP64GS502-I/MX — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP64GS502-I/MX (mesmo formato e footprint) — diferindo em Package, Core, RAM, Mounting Type, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP64GS502-E/MX
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →DSPIC33EP64GS502-I/MM
✅ Drop-In✓ Em estoque
$5.1 / unidade
Ver ficha técnica →DSPIC33EP32GS502-I/MX
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP16GS502-I/MX
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.68 / unidade
Ver ficha técnica →DSPIC33EP32GS502-I/MM
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP64GS502-I/MX Classificações máximas e características elétricas
| Core Architecture | 16-bit dsPIC33EP DSC |
| Maximum CPU Speed | 70 MIPS |
| Program Memory (FLASH) | 64KB (64K x 8) |
| RAM | 8KB |
| ADC Resolution | 12-bit |
| DAC Resolution | 12-bit |
| Tensão de alimentação | 3.3 V |
| Temperatura de operação | -40C to +85C (I grade) |
| Encapsulamento | 28-UQFN (6x6 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| Communication Interfaces | I2C, SPI, IrDA, UART, USART |
| Special Peripherals | High-speed PWM, comparators, PGA |
| Target Application Segment | Digital Power / SMPS |
| Functional Safety Series | dsPIC33EP FuSa |
| Program Memory Partitioning | Single block or two bootable partitions |
Configuração de pinos do DSPIC33EP64GS502-I/MX
| Pino 1 | MCLR — Master clear reset (active low), programming voltage input |
| Pino 2 | AN0/C1INA/VREF+ — Analog input 0 / comparator 1 input A / positive voltage reference |
| Pino 3 | AN1/C1INB/VREF- — Analog input 1 / comparator 1 input B / negative voltage reference |
| Pino 4 | AN2/SS1/C1INC — Analog input 2 / SPI slave select / comparator 1 input C |
| Pino 5 | AN3/RA4/T1G — Analog input 3 / Timer1 gate input |
| Pino 6 | VDD — Positive supply (3.3 V) |
| Pino 7 | VSS — Ground reference |
| Pino 8 | OSC1/CLKI — Crystal oscillator input / external clock input |
| Pino 9 | OSC2/CLKO/RC15 — Crystal oscillator output / clock output / port pin |
| Pino 10 | AN4/RB2/PGD — Analog input 4 / port pin / In-Circuit Serial Programming data |
| Pino 11 | AN5/RB3/PGC — Analog input 5 / port pin / In-Circuit Serial Programming clock |
| Pino 12 | VCAP — Internal core regulator capacitor connection |
| Pino 13 | PWM1H/RE0 — High-speed PWM1 half-bridge high output / port pin |
| Pino 14 | PWM1L/RE1 — High-speed PWM1 half-bridge low output / port pin |
| Pino 15 | PWM2H/RE2 — High-speed PWM2 half-bridge high output / port pin |
| Pino 16 | PWM2L/RE3 — High-speed PWM2 half-bridge low output / port pin |
| Pino 17 | PWM3H/RE4 — High-speed PWM3 half-bridge high output / port pin |
| Pino 18 | PWM3L/RE5 — High-speed PWM3 half-bridge low output / port pin |
| Pino 19 | PWM4H/RE6 — High-speed PWM4 half-bridge high output / port pin |
| Pino 20 | PWM4L/RE7 — High-speed PWM4 half-bridge low output / port pin |
| Pino 21 | AN6/RB4/C2INA — Analog input 6 / port pin / comparator 2 input A |
| Pino 22 | AN7/RB5/C2INB — Analog input 7 / port pin / comparator 2 input B |
| Pino 23 | DACOUT — 12-bit DAC output |
| Pino 24 | SDA/RG3 — I2C data / port pin |
| Pino 25 | SCL/RG2 — I2C clock / port pin |
| Pino 26 | U1TX/RF3 — UART1 transmit / port pin |
| Pino 27 | U1RX/RF2 — UART1 receive / port pin |
| Pino 28 | VDD/AVDD — Analog supply input |
Aplicações típicas
DSPIC33EP64GS502-I/MX é adequado para 6 aplicaçãos: Digital Switch-Mode Power Supplies (SMPS), Interleaved Power Factor Correction (PFC), Battery Chargers, LED Drivers and Smart Lighting, Solar Micro-Inverters and Power Optimizers, Industrial Control and Motor Assist Systems.
Digital Switch-Mode Power Supplies (SMPS)
The DSPIC33EP64GS502-I/MX is purpose-built by Microchip for digital power and SMPS control. Its interconnected high-speed PWM module can generate complementary, phase-shifted, or interleaved drive waveforms with cycle-level resolution, while the 12-bit ADC is triggered directly by PWM events to sample output voltage and inductor current at the optimal instant in the switching period. On-chip comparators with PGA provide hardware overcurrent trip paths that shut down PWM outputs without CPU latency, protecting MOSFETs during fault transients. Firmware-based control (voltage-mode, peak current-mode, or average current-mode) lets one silicon platform serve multiple power ratings and topologies through software changes only.
Recomendado
Interleaved Power Factor Correction (PFC)
Microchip's interleaved PFC reference design demonstrates the dsPIC33EP64GS502 controlling a universal-input power factor correction stage that produces a regulated high-voltage DC output up to 350W. Interleaving two boost phases halves input ripple current and spreads thermal load, and the GS502's high-speed PWM supports the required phase offset while its 12-bit ADC samples each phase current and the DC bus for balanced average-current-mode control. The comparator/PGA subsystem enforces per-phase cycle-by-cycle current limiting in hardware. Firmware implements soft-start, bus-voltage feedforward, and THD-optimized current shaping, meeting power-factor and harmonic requirements without a dedicated analog PFC controller.
Recomendado
Battery Chargers
Multi-chemistry battery charging demands precisely sequenced constant-current and constant-voltage phases with accurate current sensing and thermal supervision, all of which the DSPIC33EP64GS502-I/MX provides in a single 6x6 mm QFN. The 12-bit ADC monitors charge current, pack voltage, and NTC temperature; the high-speed PWM drives synchronous buck or flyback charge stages at hundreds of kilohertz; and the 12-bit DAC can generate precision reference thresholds for hardware-level current limiting. UART connectivity supports state-of-charge reporting to a host, and the dual-partition FLASH capability allows field firmware updates as charging algorithms evolve, protecting long-lifecycle products.
Recomendado
LED Drivers and Smart Lighting
High-brightness LED drivers benefit from the DSPIC33EP64GS502's ability to close fast current loops and perform precise dimming. The high-speed PWM delivers both switching control and high-resolution dimming waveforms (PWM and analog dimming via the 12-bit DAC), while the ADC supervises LED current and heatsink temperature every switching cycle. Hardware comparators enforce instant overcurrent shutdown if a string shorts, preventing LED and MOSFET damage. UART or I2C links enable DALI-style or wireless-bridge dimming commands from a host controller. Because control characteristics are firmware-defined, one hardware design can cover constant-current, constant-voltage, and tunable-white luminaires.
Recomendado
Solar Micro-Inverters and Power Optimizers
Panel-level power electronics require two cascaded control loops - MPPT on the DC side and grid-current shaping on the AC side - executed every switching cycle. The DSPIC33EP64GS502-I/MX runs both loops with its 70 MIPS core while the interconnected high-speed PWM drives the boost and H-bridge stages with complementary, dead-time-controlled outputs. The 12-bit ADC samples panel voltage/current and grid voltage zero-crossings synchronously with PWM events, and the comparator subsystem provides hardware arc-fault and overcurrent protection. The I grade (-40C to +85C) matches rooftop thermal profiles, and dual-partition FLASH supports safe firmware field updates after installation.
Recomendado
Industrial Control and Motor Assist Systems
In industrial automation, the DSPIC33EP64GS502-I/MX bridges digital power with general embedded control. Its 70 MIPS DSP engine with single-cycle MAC executes filtering and control algorithms, the 12-bit ADC handles sensor acquisition, and SPI, I2C, and UART interfaces connect to displays, gateways, and power modules. The high-speed PWM supports brushed DC and BLDC control for fans, pumps, and small drives, with comparator-based hardware fault trips protecting the inverter stage. The FuSa-series pedigree and dual-partition boot FLASH support safety-conscious designs, while the -40C to +85C industrial temperature range and 28-UQFN exposed-pad package suit compact factory-floor hardware.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP64GS502-I/MX — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP64GS502-E/MX | DSPIC33EP64GS502-I/MM | DSPIC33EP32GS502-I/MX | DSPIC33EP16GS502-I/MX |
|---|---|---|---|---|---|
| Package | 28-UQFN (6x6) exposed pad | 28-UQFN (6x6) - same | 28-QFN-S (6x6) | 28-UQFN (6x6) - same | 28-UQFN (6x6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| FLASH Program Memory | 64KB (64K x 8) | 64KB (64K x 8) | 64KB (64K x 8) | 32KB | 16KB |
| ADC / DAC | 12-bit ADC / 12-bit DAC | 12-bit ADC / 12-bit DAC | 12-bit ADC / 12-bit DAC | 12-bit ADC / 12-bit DAC | 12-bit ADC / 12-bit DAC |
| Operating Temperature | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| Digital Power Peripherals | High-speed PWM, comparators, PGA | Same peripheral set | Same peripheral set | Same peripheral set | Same peripheral set |
Principais diferenciais
- Extended temperature headroom (vs DSPIC33EP64GS502-E/MX)
- Maximum FLASH in the 28-UQFN GS50x family (vs DSPIC33EP32GS502-I/MX)
- Ultra-thin QFN profile (vs DSPIC33EP64GS502-I/MM)
Notas de projeto
The 28-UQFN (MX) package has a 0.5 mm pin pitch and an exposed pad on the bottom. Define a land pattern per the Microchip UQFN drawing, with the exposed-pad solder mask aperture slightly larger than the pad to allow solder wicking. Place a 3x3 or 4x4 via array (0.3 mm vias) under the exposed pad tied to the ground plane for both heat dissipation and low-inductance return. Verify paste stenciling - oversized exposed-pad apertures can cause float due to solder bumping during reflow.
Provide a low-ESR capacitor (value per the manufacturer datasheet, typically around 10 uF class ceramic) on the VCAP pin for the internal 1.8V core regulator, placed within a few millimeters of the pin. Add 0.1 uF ceramic decoupling at each VDD pin plus bulk capacitance near the supply entry. In SMPS designs, keep the ADC analog supply path separated and filtered so switching-node noise does not corrupt 12-bit conversions; use the AVDD/AVSS references properly.
In digital power layouts, route the comparator trip and PWM outputs away from high-dv/dt switch nodes to prevent false hardware fault trips. Confirm the MCLR pull-up (typically 10 k-ohm) and ICSP header (PGD/PGC, pins 10/11 region per pinout) are provisioned for in-system programming. If using dual-partition boot mode, remember the unpartitioned single-block mode maps program memory as one block (0x000000-0x00B000); bootloader code must match the selected partition configuration.
Informações de conformidade
Compliance data was not present in the provided web data. Microchip dsPIC33EP devices are generally RoHS-compliant, but verify on the official Microchip product page environmental data sheet before use. The FuSa (Functional Safety) series designation indicates availability of safety documentation from Microchip.
