DSPIC33EP64GS804T-I/ML - 70 MIPS Digital Power DSC 44-QFN | Microchip
N.º da peça: DSPIC33EP64GS804T-I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.2 | $6,20 |
| 10 | $5.6 | $56,00 |
| 100 | $4.95 | $495,00 |
| 500 | $4.5 | $2.250,00 |
| 1.000 | $4.05 | $4.050,00 |
DSPIC33EP64GS804T-I/ML Visão geral
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and control agility of a microcontroller, sitting within the broader hierarchy of embedded processors: DSC -> microcontroller family -> semiconductor. The dsPIC33EP GS family from Microchip is purpose-built for digital power conversion, where fast control loops must sample, compute, and update PWM outputs within microseconds.
Key features include interconnected high-speed PWM modules for multi-loop switch-mode power supply control, a high-speed ADC with programmable gain amplifier (PGA) front ends for direct small-signal connection, on-chip analog comparators for cycle-by-cycle current limiting, 4 DMA channels that offload data movement from the CPU, and 7 timers. The device also integrates a CAN module, barrel shifter, and boundary-scan (JTAG/ICSP) support, with functional safety (FuSa) documentation available per the DigiKey listing.
Architecturally, the CMOS dsPIC33EP core uses a modified Harvard bus structure with multiple internal buses, allowing simultaneous instruction fetch and data access that sustains single-cycle MAC and DSP-class instructions. This enables deterministic execution of control algorithms such as voltage-mode, average current-mode, and peak current-mode control in LLC, buck, boost, and PFC stages.
Typical applications include brick DC-DC converters (as shown in Microchip's EPC9143 1/16th-brick reference design converting 48 V nominal inputs to 5 V, 9 V, or 12 V outputs), AC-DC power supplies, solar inverters, battery chargers, and telecom rectifiers.
Design consideration: allocate the 3.3 V supply with clean analog grounding for the PGA and ADC paths; noisy switching-node coupling into the PGA inputs is the most common cause of ADC reading corruption in digital power layouts.
This page synthesizes verified distributor listings, drop-in same-family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas drop-in para DSPIC33EP64GS804T-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP64GS804T-I/ML (mesmo formato e footprint) — diferindo em Core Architecture, Package, CAN Interface, Flash Partitioning, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP64GS804-I/ML
✅ Drop-In✓ Em estoque
$3.98 / unidade
Ver ficha técnica →DSPIC33EP64GS804T-E/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33EP128GS804T-I/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$12.6 / unidade
Ver ficha técnica →DSPIC33EP32GS804T-I/ML
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP64GS804T-I/ML Classificações máximas e características elétricas
| Core Architecture | 16-bit dsPIC33EP (CMOS) |
| Maximum CPU Speed | 70 MIPS |
| Frequência máxima de clock | 60 MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| SRAM | 8 KB |
| DMA Channels | 4 |
| Timers | 7 |
| Communication Interfaces | CAN, UART, SPI, I2C |
| Analog Features | High-Speed ADC, PGA, Comparators |
| PWM | Interconnected High-Speed PWM (digital power optimized) |
| Tensão de alimentação | 3.3 V |
| Temperatura de operação | -40C to +85C (I grade) |
| Encapsulamento | 44-QFN (8x8 mm), PQCC, 0.65 mm pitch |
| Tipo de montagem | Surface Mount |
| Special Features | Barrel shifter, boundary scan, Functional Safety (FuSa) support |
| Target Application Class | SMPS & digital power conversion |
Guia de Configuração de Pinos do DSPIC33EP64GS804T-I/ML 44-qfn (8x8 mm), pqcc, 0.65 mm pitch
Configuração de pinos para DSPIC33EP64GS804T-I/ML (pacote 44-qfn (8x8 mm), pqcc, 0.65 mm pitch). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33EP64GS804T-I/ML.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33EP64GS804T-I/ML é adequado para 6 aplicaçãos: Brick DC-DC Converters, AC-DC Power Supplies and PFC Front Ends, Solar Inverters and MPPT Controllers, Battery Chargers and BMS Nodes, Telecom Rectifier Modules, Digital Lighting and Industrial Power Control.
Brick DC-DC Converters
The DSPIC33EP64GS804T-I/ML is a natural fit for isolated brick DC-DC converters used in data center, telecommunication, and automotive power systems. Microchip's EPC9143 reference design - a 1/16th-brick (33 x 22.9 mm) power module converting a nominal 48 V input to 5 V, 9 V, or 12 V outputs - demonstrates the architecture in production form. The interconnected high-speed PWM generates the phase-shifted or synchronous rectification drive signals, while the high-speed ADC with PGA samples output voltage and transformer current synchronously with PWM events. This deterministic trigger chain closes the control loop within a single switching period at hundreds of kHz, maintaining tight regulation and fast transient response that analog-only bricks cannot adapt across load ranges.
Recomendado
AC-DC Power Supplies and PFC Front Ends
In switched-mode AC-DC supplies, the DSPIC33EP64GS804T-I/ML implements both the boost power factor correction stage and the downstream DC-DC stage with one controller. The 70 MIPS core sustains average current-mode PFC control at line frequencies and switching frequencies well above 100 kHz, while cycle-by-cycle comparators provide hardware overcurrent protection without CPU intervention. The PGA front end conditions small shunt signals directly, removing external amplifier stages. The CAN interface reports status to a system supervisor. Designers should route the ADC's PWM-triggered sampling away from switching-node noise, as synchronous sampling plus analog filtering is essential for clean current measurements in dense digital power layouts.
Recomendado
Solar Inverters and MPPT Controllers
Grid-tied solar micro-inverters and MPPT charge controllers require simultaneous sampling of PV voltage/current and grid voltage/current with phase-locked control updates - precisely the workload the DSPIC33EP64GS804T-I/ML's interconnected PWM, high-speed ADC, and 4 DMA channels were designed for. DMA moves conversion results to RAM without CPU cycles, freeing the 70 MIPS core for MPPT algorithms and grid synchronization. The on-chip comparators implement hardware-level fault shutdown for grid abnormalities. The 64 KB Flash accommodates MPPT, inverter control, and communication stacks concurrently; designs needing additional algorithm headroom can move to the pin-compatible 128 KB Flash variant without PCB changes.
Recomendado
Battery Chargers and BMS Nodes
Multi-chemistry battery chargers benefit from the DSPIC33EP64GS804T-I/ML's combination of precise analog measurement and programmable charge-profile control. The ADC/PGA measures cell voltage and current with gain set in firmware for different shunt values, the high-speed PWM drives buck or buck-boost charge stages, and comparators enforce instantaneous overcurrent limits. Seven timers support staged charge sequencing (pre-charge, constant current, constant voltage, termination) with hardware-timed transitions. The CAN interface integrates the charger into vehicle or industrial battery management networks. Charging algorithms stored in the 64 KB Flash can be updated in the field, and the -40C to +85C industrial rating suits automotive-adjacent environments.
Recomendado
Telecom Rectifier Modules
Telecom -48 V rectifier modules combine PFC, LLC conversion, and CAN-based supervisory communication in one enclosure, matching the DSPIC33EP64GS804T-I/ML's feature set directly. The interconnected high-speed PWM drives both stages with independent loops, the high-speed ADC samples output current sharing signals, and the integrated CAN module connects to shelf management without external CAN controllers. The 8 KB RAM buffers telemetry while the 4 DMA channels stream measurement data continuously. Jotrin and YIC listings classify the part as a 16-bit MCU/DSC with 64 KB Flash in 44QFN, widely used in this communication-power segment where droop sharing and hot-swap behavior are firmware-defined.
Recomendado
Digital Lighting and Industrial Power Control
Industrial power stages - LED drivers, induction heating, welders, and motor-driven SMPS loads - use the DSPIC33EP64GS804T-I/ML where adjustable switching frequency, phase management, and fast fault response matter. The interconnected high-speed PWM supports complementary outputs with programmable dead time, and boundary-scan support simplifies production test. The 44-QFN 8x8 mm footprint with 0.65 mm pitch fits compact industrial control boards, while 4 DMA channels keep analog sampling continuous during burst-mode operation. For factory-floor installations, the -40C to +85C industrial temperature rating and Microchip functional safety (FuSa) documentation support compliance-driven development processes used in automation equipment.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP64GS804T-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP64GS804-I/ML | DSPIC33EP64GS804T-E/ML | DSPIC33EP128GS804T-I/ML | DSPIC33EP32GS804T-I/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm), 0.65 mm pitch | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS (60 MHz) | 70 MIPS (60 MHz) | 70 MIPS (60 MHz) | 70 MIPS (60 MHz) | 70 MIPS (60 MHz) |
| Flash Program Memory | 64 KB | 64 KB | 64 KB | 128 KB | 32 KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C |
| Packaging Format | Tape & Reel (T suffix) | Tube/Tray | Tape & Reel | Tape & Reel | Tape & Reel |
| Primary Difference | Baseline 64 KB digital power DSC | Identical die, tube packaging | Extended temp +125C | Double Flash for larger firmware | Lower cost, half Flash |
Principais diferenciais
- Extended temperature option within same footprint (vs DSPIC33EP64GS804T-I/ML baseline)
- Flash headroom without redesign (vs DSPIC33EP32GS804T-I/ML)
- Purpose-built digital power analog subsystem (vs General-purpose dsPIC33EP64GP504)
Notas de projeto
Use a solid ground plane under the 44-QFN with the exposed pad soldered to a grid of thermal vias - this is both the primary heat removal path and the analog reference for the ADC/PGA. Keep PGA input traces short and away from PWM output traces; in digital power layouts the switching node commonly couples tens of millivolts into adjacent traces, corrupting current-mode samples. Decouple VDD with 0.1 uF ceramic caps at each power pin plus 4.7-10 uF bulk, per Microchip layout guidance in the dsPIC33EP family datasheet.
Exploit the PWM-to-ADC trigger interconnect rather than software-triggered sampling: hardware triggers eliminate control-loop jitter, which is essential for stable peak current-mode control at high switching frequencies. Set the PGA gain to keep shunt signals within the ADC input range with margin, and use synchronous sampling at the midpoint of the PWM off-time to avoid switching transients. Verify ADC sample timing against the datasheet conversion-time tables for your ADC clock configuration.
Do not confuse the -I/ML (-40C to +85C) and -E/ML (-40C to +125C) ordering codes when the end environment approaches 85C ambient; junction temperature inside an enclosed power supply typically runs 20-40C above ambient, so many designs actually require the E grade. Also note the T suffix only means tape-and-reel packaging - the die is identical to the tube version, so mixing them in a BOM is electrically safe but affects pick-and-place feeders.
Informações de conformidade
Compliance status not stated in the retrieved web data; verify on the Microchip product page or with the distributor before export-controlled or regulated deployments.
