DSPIC33EP64GS804T-I/ML - 70 MIPS Digital Power DSC 44-QFN | Microchip
부품 번호: DSPIC33EP64GS804T-I/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.2 | $6.20 |
| 10 | $5.6 | $56.00 |
| 100 | $4.95 | $495.00 |
| 500 | $4.5 | $2,250.00 |
| 1,000 | $4.05 | $4,050.00 |
DSPIC33EP64GS804T-I/ML 개요
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and control agility of a microcontroller, sitting within the broader hierarchy of embedded processors: DSC -> microcontroller family -> semiconductor. The dsPIC33EP GS family from Microchip is purpose-built for digital power conversion, where fast control loops must sample, compute, and update PWM outputs within microseconds.
Key features include interconnected high-speed PWM modules for multi-loop switch-mode power supply control, a high-speed ADC with programmable gain amplifier (PGA) front ends for direct small-signal connection, on-chip analog comparators for cycle-by-cycle current limiting, 4 DMA channels that offload data movement from the CPU, and 7 timers. The device also integrates a CAN module, barrel shifter, and boundary-scan (JTAG/ICSP) support, with functional safety (FuSa) documentation available per the DigiKey listing.
Architecturally, the CMOS dsPIC33EP core uses a modified Harvard bus structure with multiple internal buses, allowing simultaneous instruction fetch and data access that sustains single-cycle MAC and DSP-class instructions. This enables deterministic execution of control algorithms such as voltage-mode, average current-mode, and peak current-mode control in LLC, buck, boost, and PFC stages.
Typical applications include brick DC-DC converters (as shown in Microchip's EPC9143 1/16th-brick reference design converting 48 V nominal inputs to 5 V, 9 V, or 12 V outputs), AC-DC power supplies, solar inverters, battery chargers, and telecom rectifiers.
Design consideration: allocate the 3.3 V supply with clean analog grounding for the PGA and ADC paths; noisy switching-node coupling into the PGA inputs is the most common cause of ADC reading corruption in digital power layouts.
This page synthesizes verified distributor listings, drop-in same-family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: DSPIC33EP64GS804T-I/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EP64GS804T-I/ML (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Package, CAN Interface, Flash Partitioning, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EP64GS804-I/ML
✅ 드롭인✓ 재고 있음
$3.98 / 개
데이터시트 보기 →DSPIC33EP64GS804T-E/ML
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP128GS804T-I/ML
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$12.6 / 개
데이터시트 보기 →DSPIC33EP32GS804T-I/ML
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP64GS804T-I/ML 최대 정격 & 전기적 특성
| Core Architecture | 16-bit dsPIC33EP (CMOS) |
| Maximum CPU Speed | 70 MIPS |
| 최대 클록 주파수 | 60 MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| SRAM | 8 KB |
| DMA Channels | 4 |
| Timers | 7 |
| Communication Interfaces | CAN, UART, SPI, I2C |
| Analog Features | High-Speed ADC, PGA, Comparators |
| PWM | Interconnected High-Speed PWM (digital power optimized) |
| 공급 전압 | 3.3 V |
| 동작 온도 | -40C to +85C (I grade) |
| 패키지 | 44-QFN (8x8 mm), PQCC, 0.65 mm pitch |
| 실장 유형 | Surface Mount |
| Special Features | Barrel shifter, boundary scan, Functional Safety (FuSa) support |
| Target Application Class | SMPS & digital power conversion |
DSPIC33EP64GS804T-I/ML 44-qfn (8x8 mm), pqcc, 0.65 mm pitch 핀 구성 가이드
DSPIC33EP64GS804T-I/ML(44-qfn (8x8 mm), pqcc, 0.65 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EP64GS804T-I/ML.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33EP64GS804T-I/ML 적합 용도: 6 애플리케이션s: Brick DC-DC Converters, AC-DC Power Supplies and PFC Front Ends, Solar Inverters and MPPT Controllers, Battery Chargers and BMS Nodes, Telecom Rectifier Modules, Digital Lighting and Industrial Power Control.
Brick DC-DC Converters
The DSPIC33EP64GS804T-I/ML is a natural fit for isolated brick DC-DC converters used in data center, telecommunication, and automotive power systems. Microchip's EPC9143 reference design - a 1/16th-brick (33 x 22.9 mm) power module converting a nominal 48 V input to 5 V, 9 V, or 12 V outputs - demonstrates the architecture in production form. The interconnected high-speed PWM generates the phase-shifted or synchronous rectification drive signals, while the high-speed ADC with PGA samples output voltage and transformer current synchronously with PWM events. This deterministic trigger chain closes the control loop within a single switching period at hundreds of kHz, maintaining tight regulation and fast transient response that analog-only bricks cannot adapt across load ranges.
추천
AC-DC Power Supplies and PFC Front Ends
In switched-mode AC-DC supplies, the DSPIC33EP64GS804T-I/ML implements both the boost power factor correction stage and the downstream DC-DC stage with one controller. The 70 MIPS core sustains average current-mode PFC control at line frequencies and switching frequencies well above 100 kHz, while cycle-by-cycle comparators provide hardware overcurrent protection without CPU intervention. The PGA front end conditions small shunt signals directly, removing external amplifier stages. The CAN interface reports status to a system supervisor. Designers should route the ADC's PWM-triggered sampling away from switching-node noise, as synchronous sampling plus analog filtering is essential for clean current measurements in dense digital power layouts.
추천
Solar Inverters and MPPT Controllers
Grid-tied solar micro-inverters and MPPT charge controllers require simultaneous sampling of PV voltage/current and grid voltage/current with phase-locked control updates - precisely the workload the DSPIC33EP64GS804T-I/ML's interconnected PWM, high-speed ADC, and 4 DMA channels were designed for. DMA moves conversion results to RAM without CPU cycles, freeing the 70 MIPS core for MPPT algorithms and grid synchronization. The on-chip comparators implement hardware-level fault shutdown for grid abnormalities. The 64 KB Flash accommodates MPPT, inverter control, and communication stacks concurrently; designs needing additional algorithm headroom can move to the pin-compatible 128 KB Flash variant without PCB changes.
추천
Battery Chargers and BMS Nodes
Multi-chemistry battery chargers benefit from the DSPIC33EP64GS804T-I/ML's combination of precise analog measurement and programmable charge-profile control. The ADC/PGA measures cell voltage and current with gain set in firmware for different shunt values, the high-speed PWM drives buck or buck-boost charge stages, and comparators enforce instantaneous overcurrent limits. Seven timers support staged charge sequencing (pre-charge, constant current, constant voltage, termination) with hardware-timed transitions. The CAN interface integrates the charger into vehicle or industrial battery management networks. Charging algorithms stored in the 64 KB Flash can be updated in the field, and the -40C to +85C industrial rating suits automotive-adjacent environments.
추천
Telecom Rectifier Modules
Telecom -48 V rectifier modules combine PFC, LLC conversion, and CAN-based supervisory communication in one enclosure, matching the DSPIC33EP64GS804T-I/ML's feature set directly. The interconnected high-speed PWM drives both stages with independent loops, the high-speed ADC samples output current sharing signals, and the integrated CAN module connects to shelf management without external CAN controllers. The 8 KB RAM buffers telemetry while the 4 DMA channels stream measurement data continuously. Jotrin and YIC listings classify the part as a 16-bit MCU/DSC with 64 KB Flash in 44QFN, widely used in this communication-power segment where droop sharing and hot-swap behavior are firmware-defined.
추천
Digital Lighting and Industrial Power Control
Industrial power stages - LED drivers, induction heating, welders, and motor-driven SMPS loads - use the DSPIC33EP64GS804T-I/ML where adjustable switching frequency, phase management, and fast fault response matter. The interconnected high-speed PWM supports complementary outputs with programmable dead time, and boundary-scan support simplifies production test. The 44-QFN 8x8 mm footprint with 0.65 mm pitch fits compact industrial control boards, while 4 DMA channels keep analog sampling continuous during burst-mode operation. For factory-floor installations, the -40C to +85C industrial temperature rating and Microchip functional safety (FuSa) documentation support compliance-driven development processes used in automation equipment.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EP64GS804T-I/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EP64GS804-I/ML | DSPIC33EP64GS804T-E/ML | DSPIC33EP128GS804T-I/ML | DSPIC33EP32GS804T-I/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm), 0.65 mm pitch | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS (60 MHz) | 70 MIPS (60 MHz) | 70 MIPS (60 MHz) | 70 MIPS (60 MHz) | 70 MIPS (60 MHz) |
| Flash Program Memory | 64 KB | 64 KB | 64 KB | 128 KB | 32 KB |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C |
| Packaging Format | Tape & Reel (T suffix) | Tube/Tray | Tape & Reel | Tape & Reel | Tape & Reel |
| Primary Difference | Baseline 64 KB digital power DSC | Identical die, tube packaging | Extended temp +125C | Double Flash for larger firmware | Lower cost, half Flash |
주요 차별점
- Extended temperature option within same footprint (vs DSPIC33EP64GS804T-I/ML baseline)
- Flash headroom without redesign (vs DSPIC33EP32GS804T-I/ML)
- Purpose-built digital power analog subsystem (vs General-purpose dsPIC33EP64GP504)
설계 노트
Use a solid ground plane under the 44-QFN with the exposed pad soldered to a grid of thermal vias - this is both the primary heat removal path and the analog reference for the ADC/PGA. Keep PGA input traces short and away from PWM output traces; in digital power layouts the switching node commonly couples tens of millivolts into adjacent traces, corrupting current-mode samples. Decouple VDD with 0.1 uF ceramic caps at each power pin plus 4.7-10 uF bulk, per Microchip layout guidance in the dsPIC33EP family datasheet.
Exploit the PWM-to-ADC trigger interconnect rather than software-triggered sampling: hardware triggers eliminate control-loop jitter, which is essential for stable peak current-mode control at high switching frequencies. Set the PGA gain to keep shunt signals within the ADC input range with margin, and use synchronous sampling at the midpoint of the PWM off-time to avoid switching transients. Verify ADC sample timing against the datasheet conversion-time tables for your ADC clock configuration.
Do not confuse the -I/ML (-40C to +85C) and -E/ML (-40C to +125C) ordering codes when the end environment approaches 85C ambient; junction temperature inside an enclosed power supply typically runs 20-40C above ambient, so many designs actually require the E grade. Also note the T suffix only means tape-and-reel packaging - the die is identical to the tube version, so mixing them in a BOM is electrically safe but affects pick-and-place feeders.
규정 준수 정보
Compliance status not stated in the retrieved web data; verify on the Microchip product page or with the distributor before export-controlled or regulated deployments.
