DSPIC33EV128GM002-I/SP - 16-Bit 70 MIPS 5V DSC | Microchip
N.º da peça: DSPIC33EV128GM002-I/SP ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.42 | $4,42 |
| 10 | $3.98 | $39,80 |
| 100 | $3.54 | $354,00 |
| 500 | $3.18 | $1.590,00 |
| 1.000 | $2.86 | $2.860,00 |
DSPIC33EV128GM002-I/SP Visão geral
A digital signal controller combines the computational architecture of a digital signal processor with the integrated peripherals and deterministic control of a microcontroller. DSCs sit between general-purpose MCUs and dedicated DSPs in the embedded-systems hierarchy, providing single-cycle MAC (multiply-accumulate) instructions and DSP engine hardware while retaining flash memory, UART/SPI/I2C peripherals and interrupt-driven real-time control. The dsPIC33EV family extends the dsPIC33E core with 5V operation, which reduces board complexity in noisy industrial environments.
Key features include a 16-bit dsPIC33E core running at up to 70 MIPS, 128KB of self-programmable ECC Flash with error correction for reliability in harsh conditions, and dual DSP multiply-accumulate units with hardware division. The device integrates advanced analog and motor-control peripherals, including high-speed PWM with dedicated time base, SENT bus interface for automotive sensor communication, and peripheral pin select (PPS) allowing flexible remapping of digital peripherals onto I/O pins.
Architecturally, the dsPIC33EV GM family implements a modified Harvard pipeline with 24-bit instruction width and 16-bit data path, allowing simultaneous program and data fetches. ECC Flash protects against single-bit memory faults, a key requirement for functional-safety (FuSa) oriented designs, and the 5V tolerant I/O simplifies interfacing with 12V-domain automotive sensors through dividers.
Typical applications include automotive sensor and touch-control units, industrial motor drives using the high-resolution PWM, harsh-environment appliance control where 5V noise immunity is essential, and power-supply digital control loops exploiting the DSP engine for fast PID execution.
Design consideration: the SPDIP package is 0.1-inch-pitch through-hole, ideal for prototyping and retrofit service boards; for compact or automated-assembly production, pin-compatible SOIC (I/SO) and SSOP (I/SS) siblings of the same die should be evaluated.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, optimized for engineering selection workflows.
Alternativas drop-in para DSPIC33EV128GM002-I/SP — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EV128GM002-I/SP (mesmo formato e footprint) — diferindo em Package, Core Architecture, Functional Safety Support, Program Memory (Flash), RAM.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EV128GM002-H/SP
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33EV256GM002-I/SP
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EV64GM002-I/SP
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.1 / unidade
Ver ficha técnica →DSPIC33EV32GM002-I/SP
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.35 / unidade
Ver ficha técnica →DSPIC33EP64GP502-I/SP
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.55 / unidade
Ver ficha técnica →DSPIC33EV128GM002-I/SP Classificações máximas e características elétricas
| Core Architecture | 16-bit dsPIC33E DSC |
| Maximum CPU Speed | 70 MIPS |
| Program Memory (Flash) | 128KB (43K x 24) with ECC |
| RAM | 8KB |
| Operating Voltage | 5 V |
| Faixa de temperatura de operação | -40C to +85C (industrial) |
| Encapsulamento | 28-pin SPDIP (SP) |
| Tipo de montagem | Through Hole |
| Peripherals | PWM, SENT, Op Amps, Advanced Analog |
| Peripheral Pin Select (PPS) | Yes (RPn/RPIn remappable) |
| Functional Safety Support | FuSa-documented family |
| ECC Flash | Yes |
| Instruction Width | 24-bit |
| DSP Engine | Single-cycle MAC, hardware division |
Configuração de pinos do DSPIC33EV128GM002-I/SP
| Pino 1 | MCLR — Master clear reset input, active low |
| Pino 2 | AN0/VREF+/CN3/RB0 — Analog input 0 / positive voltage reference |
| Pino 3 | AN1/VREF-/CN2/RB1 — Analog input 1 / negative voltage reference |
| Pino 4 | PGED3/AN2/SS1/CN4/RB2 — Programming data 3 / analog input 2 / SPI slave select |
| Pino 5 | PGEC3/AN3/CVREF/CN5/RB3 — Programming clock 3 / analog input 3 / comparator reference |
| Pino 6 | PGD1/AN4/C1IN-/CN6/RB4 — Programming data 1 / analog input 4 / comparator input |
| Pino 7 | PGC1/AN5/C1IN+/CN7/RB5 — Programming clock 1 / analog input 5 / comparator input |
| Pino 8 | VSS — Ground reference |
| Pino 9 | OSC1/CLKI/CN30/RA2 — Oscillator crystal input / external clock input |
| Pino 10 | OSC2/CLKO/RC15 — Oscillator crystal output / clock output |
| Pino 11 | VDD — Positive power supply (5V) |
| Pino 12 | RP15/RC0 — Remappable peripheral pin 15 |
| Pino 13 | RP14/RC1 — Remappable peripheral pin 14 |
| Pino 14 | RP13/RC2 — Remappable peripheral pin 13 |
| Pino 15 | VSS — Ground reference |
| Pino 16 | RP12/RC3 — Remappable peripheral pin 12 |
| Pino 17 | RP11/T2CK/RC4 — Remappable peripheral pin / Timer 2 external clock |
| Pino 18 | RP10/RTCC/RC5 — Remappable peripheral pin / RTCC alarm output |
| Pino 19 | RP9/RB6 — Remappable peripheral pin 9 |
| Pino 20 | RP8/RB7 — Remappable peripheral pin 8 |
| Pino 21 | PGD3/RB8 — Programming data 3 / general-purpose I/O |
| Pino 22 | PGC3/RB9 — Programming clock 3 / general-purpose I/O |
| Pino 23 | RP7/RB10 — Remappable peripheral pin 7 |
| Pino 24 | RP6/RB11 — Remappable peripheral pin 6 |
| Pino 25 | RP5/RB12 — Remappable peripheral pin 5 |
| Pino 26 | RP4/RB13 — Remappable peripheral pin 4 |
| Pino 27 | RP3/RB14 — Remappable peripheral pin 3 |
| Pino 28 | VDD — Positive power supply (5V) |
Aplicações típicas
DSPIC33EV128GM002-I/SP é adequado para 6 aplicaçãos: Automotive Sensor Units, Industrial Motor Drives, Harsh-Environment Appliance Control, Digital Power Supply Control, Sensor Signal Conditioning Nodes, Embedded Prototyping and Education.
Automotive Sensor Units
The DSPIC33EV128GM002-I/SP fits automotive sensor and touch-control units because it combines a 5V-tolerant I/O architecture with the SENT (SAE J2716) serial interface required for single-wire automotive sensor links. The 128KB ECC Flash tolerates the bit-flip risk of electrically noisy vehicle environments, while the -40C to +85C industrial range covers most in-cabin and under-hood assist zones. Engineers typically use the on-chip op amps and advanced analog front end to condition resistive or capacitive sensor signals, then transmit digitized values over SENT to the body controller. The peripheral pin select (PPS) system lets the same board serve multiple sensor variants without respinning routing, shortening platform development cycles.
Recomendado
Industrial Motor Drives
Digital motor control benefits directly from this controller's 70 MIPS DSP core with single-cycle multiply-accumulate instructions, which executes field-oriented-control and PID loops well above typical PWM carrier frequencies. The dsPIC33EV GM family's high-resolution PWM modules with dedicated time bases generate complementary gate-drive signals for inverter bridges, while hardware dead-time insertion protects power stages. The 5V logic domain gives cleaner noise margins near switching power electronics than 3.3V controllers, and ECC Flash keeps firmware intact under motor-induced EMI. The 28-pin SPDIP version serves controller-card prototyping and low-volume drive retrofits; surface-mount siblings scale to volume production with the same code base.
Recomendado
Harsh-Environment Appliance Control
Appliances operating near motors, heaters, and switching supplies expose microcontrollers to conducted and radiated noise; the 5V operation of the DSPIC33EV128GM002-I/SP provides approximately double the noise margin of 3.3V alternatives, which is why Microchip positions the dsPIC33EV family for appliance control in harsh environments. ECC Flash prevents rare single-bit program-memory faults from producing field failures, and the industrial -40C to +85C range handles unconditioned kitchens, garages, and outdoor units. The on-chip op amps and advanced analog peripherals digitize temperature, pressure, and user-touch inputs directly, while the high-speed PWM drives heaters, fans, and pumps with proportional control.
Recomendado
Digital Power Supply Control
Switching power converters demand deterministic, high-rate control loops; the 70 MIPS core with hardware DSP engine executes compensator mathematics in a few microseconds, supporting loop bandwidths in the tens of kilohertz. The high-resolution PWM generates precisely timed gate pulses for buck, boost, and PFC topologies, and the SENT and analog peripherals support telemetry and fault reporting. The 5V supply simplifies direct interface with gate-driver logic levels common in offline converters. The SPDIP package accelerates bench bring-up of converter prototypes where hand rework of control firmware is frequent; the pin-compatible SOIC variant transfers the validated design to production PCBs unchanged.
Recomendado
Sensor Signal Conditioning Nodes
Distributed industrial sensor nodes benefit from this controller's integrated signal chain: on-chip operational amplifiers amplify mV-level bridge outputs, advanced analog converters digitize the result, and the DSP engine applies calibration and filtering without external analog components. The SENT interface exports calibrated values over a robust single-wire link, while the peripheral pin select system reassigns UART, SPI, or I2C pins to match each node's connector footprint. ECC Flash protects stored calibration constants in electrically noisy plant environments. The through-hole SPDIP package is convenient for DIN-rail carrier boards and maintenance-friendly field modules where technicians may replace controllers with hand tools.
Recomendado
Embedded Prototyping and Education
The 0.1-inch-pitch 28-pin SPDIP package makes this controller directly breadboard-compatible, which is why it is a strong choice for university labs, makers, and early hardware bring-up. The full dsPIC33EV feature set - 70 MIPS core, ECC Flash, PWM, SENT, PPS - is available without the access constraints of fine-pitch packages, and DIP sockets permit quick device swaps during firmware debugging. MPLAB X IDE and the XC16 compiler provide free software tooling. Once a prototype is validated, the same silicon in DSPIC33EV128GM002-I/SO or -I/SS packages moves the design to surface-mount production with unchanged firmware, eliminating the classic prototype-to-production gap.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EV128GM002-I/SP — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EV128GM002-H/SP | DSPIC33EV256GM002-I/SP | DSPIC33EV64GM002-I/SP | DSPIC33EP64GP502-I/SP |
|---|---|---|---|---|---|
| Package | 28-SPDIP (through-hole) | 28-SPDIP - same | 28-SPDIP - same | 28-SPDIP - same | 28-SPDIP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 128KB (43K x 24) ECC | 128KB (43K x 24) ECC | 256KB ECC | 64KB ECC | 64KB (no ECC) |
| RAM | 8KB | 8KB | 8KB | 8KB | 16KB |
| Operating Voltage | 5 V | 5 V | 5 V | 5 V | 3.0-3.6 V (EP family) |
| Temperature Range | -40C to +85C (industrial, -I) | -H qualification grade | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
Principais diferenciais
- ECC Flash for harsh-environment reliability (vs DSPIC33EP64GP502-I/SP)
- Native 5V operation (vs DSPIC33EP64GP502-I/SP)
- Upgrade path within the same footprint (vs DSPIC33EV64GM002-I/SP)
Notas de projeto
Decouple each VDD pin (11 and 28) with a 100nF ceramic capacitor placed within 5mm of the pin, plus bulk 4.7-10uF near the board entry, since the 70 MIPS core draws fast transient currents. Do not leave MCLR (pin 1) floating - pull it up through a 10k resistor to VDD for reliable power-on reset, and route it to the programming header for in-circuit reprogramming of the 128KB Flash. Estimate: with 5V supply and ~70mA typical active current (verify against the family data sheet electrical characteristics section), budget at least 350mW of regulator headroom.
On through-hole SPDIP boards, keep the crystal for OSC1/OSC2 (pins 9-10) within 10mm of the pins with short ground returns, and use the internal PLL with care when deriving the full 70 MIPS clock - verify the oscillator configuration word against the target frequency. Peripheral pin select (PPS) mapping is applied at reset; lock PPS registers after initialization in noise environments to prevent errant writes from remapping PWM or SENT outputs. Reserve two RPn pins for PGD/PGC programming access on all production boards for field firmware updates.
The 28-pin SPDIP footprint is breadboard-friendly, but breadboards introduce 10-30pF of stray capacitance per node, degrading oscillator startup and analog accuracy. For prototype validation of ADC and op-amp peripherals, use a small soldered carrier board or Microchip evaluation hardware instead of solderless breadboard. When migrating to the surface-mount DSPIC33EV128GM002-I/SO, the -I/SP footprint does not carry over: plan the production land pattern early, since the through-hole pitch (2.54mm) and SOIC pitch (1.27mm) are incompatible.
Informações de conformidade
Compliance details were not present in the provided Verified Web Data; consult the Microchip product page or distributor environmental data for current RoHS/REACH status. The -I (industrial) temperature grade is confirmed from the part number ordering code.
